Formosa MS Small Signal Schottky Diode BAS70WS List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Suggested solder pad layout............................................................. 4 Packing information.......................................................................... 5 Reel packing.................................................................................... 6 Suggested thermal profiles for soldering processes............................. 6 High reliability test capabilities........................................................... 7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date DS-22160G 2008/02/10 Revised Date 2010/03/10 Revision Page. B 7 Formosa MS Small Signal Schottky Diode BAS70WS 70mA Surface Mount Small Signal Schottky Diodes-70V Package outline SOD-323F 0.016(0.40) 0.010(0.25) • Low current rectification and high speed switching. • S mall surface mount type. • Up to 70mA current capability. • Low forward voltage drop (V F = 1.00V typ. @15mA) • Silicon epitaxial planar chip, metal silicon junction. • Lead-free parts for green partner, exceeds environmental 0.053(1.35) 0.045(1.15) Features 0.071(1.80) 0.063(1.60) standards of MIL-STD-19500 /228 0.039(1.00) 0.031(0.80) 0.003(0.08) 0.016(0.40) • High speed ( trr < 5 ns ) • Suffix "-H" indicates Halogen-free parts, ex. ΒΑS70WS-H. Mechanical data 0.106(2.70) 0.091(2.30) • Epoxy:UL94-V0 rated flame retardant • Case : Molded plastic, SOD-323F • Terminals : Solder plated, solderable per Dimensions in inches and (millimeters) MIL-STD-750, Method 2026 • Polarity : Indicated by cathode band • Mounting Position : Any • Weight : Approximated 0.005 gram Maximum ratings and Electrical Characteristics (AT T =25 C unless otherwise noted) o A PARAMETER CONDITIONS Symbol MIN. TYP. MAX. UNIT V RRM 70 V VR I FSM 70 100 V mA Forward current IF 70 mA Power Dissipation PD 200 mW RθJA 625 Repetitive peak reverse voltage Reverse voltage Repetitive peak forward current Thermal Resistance @ t <1.0s Junction to Ambient o C/W Junction temperature TJ -55 +125 o C Storage temperature T STG -65 +125 o C I F = 1.0 mA VF 0.41 V I F = 15 mA VF 1.00 V Reverse current V R = 50 V IR 100 nA Diode capacitance V R = 0 V, f = 1MHz CD 2 pF Reverse recovery time I F = 10 mA, V R = 10mA, I RR = 0.1 X I R, RL=100Ω trr 5 ns Forward voltage http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 2 Document ID Issued Date DS-22160G 2008/02/10 Revised Date 2010/03/10 Revision Page. B 7 Rating and characteristic curves for each diode (BAS70WS) IR (μA) 10 0 VR (V) Fig . 1 Forward current as a function of forward voltage ; typical values . http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 3 Document ID Issued Date DS-22160G 2008/02/10 Revised Date 2010/03/10 Revision Page. B 7 Formosa MS Small Signal Schottky Diode BAS70WS Pinning information Pin Pin1 Pin2 Simplified outline cathode anode Symbol 2 1 1 2 Marking Type number Marking code BAS70WS K73 Suggested solder pad layout C A B Dimensions in inches and (millimeters) PACKAGE A B C SOD-323F 0.059 (1.50) 0.039 (1.00) 0.051 (1.30) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 4 Document ID Issued Date DS-22160G 2008/02/10 Revised Date 2010/03/10 Revision Page. B 7 Formosa MS Small Signal Schottky Diode BAS70WS Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SOD-323F Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 1.46 2.95 1.25 1.50 178.00 62.00 13.00 1.75 3.50 4.00 4.00 2.00 0.23 8.00 11.40 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date DS-22160G 2008/02/10 Revised Date 2010/03/10 Revision Page. B 7 Formosa MS Small Signal Schottky Diode BAS70WS Reel packing PACKAGE REEL SIZE SOD-323F 7" REEL (pcs) COMPONENT SPACING (m/m) 3,000 4.0 BOX (pcs) 30,000 INNER BOX (m/m) 183*183*123 REEL DIA, (m/m) 178 CARTON SIZE (m/m) CARTON (pcs) 382*262*387 240,000 APPROX. GROSS WEIGHT (kg) 8.0 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) 150 oC 200 oC 60~120sec Tsmax to T L -Ramp-upRate <3 oC/sec Time maintained above: -Temperature(T L ) -Time(t L ) 217 oC 60~260sec 255 oC-0/+5 oC Peak Temperature(T P ) Time within 5 oC of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <6 oC/sec Time 25 oC to Peak Temperature <6minutes http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 6 Document ID Issued Date DS-22160G 2008/02/10 Revised Date 2010/03/10 Revision Page. B 7 Formosa MS Small Signal Schottky Diode BAS70WS High reliability test capabilities Item Test Conditions Reference O 1. Solder Resistance at 260 ± 5 C for 10 ± 2sec. immerse body into solder 1/16"±1/32" MIL-STD-750D METHOD-2031 2. Solderability at 245±5 OC for 5 sec. MIL-STD-202F METHOD-208 3. High Temperature Reverse Bias V R=80% rate at T J=125 OC for 168 hrs. MIL-STD-750D METHOD-1038 4. Forward Operation Life Rated average rectifier current at T A=25 OC for 500hrs. MIL-STD-750D METHOD-1027 T A = 25 OC, I F = I O On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. MIL-STD-750D METHOD-1036 5. Intermittent Operation Life 6. Pressure Cooker JESD22-A102 15P SIG at T A=121 OC for 4 hrs. 7. Temperature Cycling -55 OC to +125 OC dwelled for 30 min. and transferred for 5min. total 10 cycles. 8. Thermal Shock 0 OC for 5 min. rise to 100 OC for 5 min. total 10 cycles. MIL-STD-750D METHOD-1056 9. Forward Surge Peak forward surge current @ t < 1.0s MIL-STD-750D METHOD-4066-2 10. Humidity at T A=85 OC, RH=85% for 1000hrs. MIL-STD-750D METHOD-1021 11. High Temperature Storage Life at 175 OC for 1000 hrs. MIL-STD-750D METHOD-1031 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 7 MIL-STD-750D METHOD-1051 Document ID Issued Date DS-22160G 2008/02/10 Revised Date 2010/03/10 Revision Page. B 7