Formosa MS SMD Bridge Rectifier LBS05 THRU LBS10 List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Suggested solder pad layout............................................................. 4 Packing information.......................................................................... 5 Reel packing .................................................................................... 6 Suggested thermal profiles for soldering processes............................. 6 High reliability test capabilities........................................................... 7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date Revised Date Revision Page. DS-241172 2011/07/25 2012/04/05 B 7 Formosa MS SMD Bridge Rectifier LBS05 THRU LBS10 1.0A Miniature Glass Passivated Single-Phase Surface Mount Bridge Rectifiers-50V-1000V Package outline LMBS Features • Low profile surface mounted application in order to optimize board space. • Rating to 1000V PRV • Ideal for printed circuit board • Reliable low cost construction utilizing molded plastic technique results in inexpensive product • Lead tin plated copper • Suffix "-H" indicates Halogen-free part, ex.LBS05-H. Mechanical data • Epoxy:UL94-V0 rated flame retardant • Case : Molded plastic, LMBS • Terminals : Solder plated, solderable per MIL-STD-202, Method 208 Dimensions in inches and (millimeters) • Polarity : marked on body • Mounting Position : Any • Weight : Approximated 0.080 gram Maximum ratings and Electrical Characteristics (AT PARAMETER T A=25 oC unless otherwise noted) CONDITIONS Forward rectified current at TA=40°C Mounted on P.C. board Forward surge current 8.3ms single half sine-wave superimposed on rate load (JEDEC methode) V R = V RRM T J = 25 OC Reverse current V R = V RRM T J = 125 OC Rating for fusing (t < 8.3 ms) V RMS*2 (V) *3 VR (V) LBS05 50 35 50 LBS1 100 70 100 LBS2 200 140 200 LBS4 400 280 400 LBS6 600 420 600 LBS8 800 560 800 LBS10 1000 700 1000 *4 VF (V) UNIT 1.0 A I FSM 30 A 5.0 IR μA 500 O 80 C/W A 2s 3.7 It *1 V RRM (V) MAX. IO T STG http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 TYP. 2 Storage temperature SYMBOLS MIN. R θJA Junction to ambient Thermal resistance Symbol O +150 -55 C Operating temperature T J, ( OC) *1 Repetitive peak reverse voltage *2 RMS voltage 1.10 -55 to +150 *3 Continuous reverse voltage *4 Maximum forward voltage@I F=1.0A Page 2 Document ID Issued Date Revised Date Revision Page. DS-241172 2011/07/25 2012/04/05 B 7 Rating and characteristic curves (LBS05 THRU LBS10) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 3 Document ID Issued Date Revised Date Revision Page. DS-241172 2011/07/25 2012/04/05 B 7 Formosa MS SMD Bridge Rectifier LBS05 THRU LBS10 Pinning information Simplified outline Symbol Marking Type number LBS05 LBS1 LBS2 LBS4 LBS6 LBS8 LBS10 Marking code ABS05 ABS1 ABS2 ABS4 ABS6 ABS8 ABS10 Example 1.For Halogen Device 2.For Halogen-free Device Marking code ABS8 1st line: Marking code ABS8 ― 2nd line: ― indicate Halogen-Free. Suggested solder pad layout A D B C Dimensions in inches and (millimeters) PACKAGE LMBS http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 A 0.031 (0.80)MIN B C D 0.024 (0.60)MIN 0.157(4.00)REF 0.244 (6.20)MAX Page 4 Document ID Issued Date Revised Date Revision Page. DS-241172 2011/07/25 2012/04/05 B 7 Formosa MS SMD Bridge Rectifier LBS05 THRU LBS10 Packing information C D D1 D2 W1 unit:mm Item Symbol Tolerance Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 t W W1 0.1 0.1 0.1 0.05 2.0 min 2.0 min 0.5 0.1 0.05 0.1 0.1 0.05 0.1 0.3 1.0 LMBS 5.31 6.68 1.60 1.55 330.00 50.00 13.00 1.75 5.50 8.00 4.00 2.00 0.30 12.00 12~14.4 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date Revised Date Revision Page. DS-241172 2011/07/25 2012/04/05 B 7 Formosa MS SMD Bridge Rectifier LBS05 THRU LBS10 Reel packing PACKAGE REEL SIZE 13" LMBS REEL (pcs) COMPONENT SPACING (m/m) 5,000 8.0 BOX (pcs) 10,000 INNER BOX (m/m) REEL DIA, (m/m) 360*340*45 330 CARTON SIZE (m/m) CARTON (pcs) APPROX. GROSS WEIGHT (kg) 80,000 14.0 380*365*400 Suggested thermal profiles for soldering processes o o 1.Storage environment: Temperature=5 C ~40 C Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) 150 oC 200 oC 60~120sec Tsmax to T L -Ramp-upRate <3 oC/sec Time maintained above: -Temperature(T L ) -Time(t L ) 217 oC 60~260sec 255 oC-0/+5 oC Peak Temperature(T P ) Time within 5 oC of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <6 C/sec Time 25 oC to Peak Temperature <6minutes http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 o Page 6 Document ID Issued Date Revised Date Revision Page. DS-241172 2011/07/25 2012/04/05 B 7 Formosa MS SMD Bridge Rectifier LBS05 THRU LBS10 High reliability test capabilities Item Test Conditions Reference O 1. Solder Resistance at 260 ± 5 C for 10 ± 2sec. immerse body into solder 1/16"±1/32" MIL-STD-750D METHOD-2031 2. Solderability at 245±5 OC for 5 sec. MIL-STD-202F METHOD-208 3. High Temperature Reverse Bias V R=80% rate at T J=150 OC for 168 hrs. MIL-STD-750D METHOD-1038 4. Forward Operation Life Rated average rectifier current at T A=25 OC for 500hrs. MIL-STD-750D METHOD-1027 T A = 25 OC, I F = I O On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. MIL-STD-750D METHOD-1036 5. Intermittent Operation Life 6. Pressure Cooker JESD22-A102 15P SIG at T A=121 OC for 4 hrs. 7. Temperature Cycling -55 OC to +125 OC dwelled for 30 min. and transferred for 5min. total 10 cycles. 8. Thermal Shock 0 OC for 5 min. rise to 100 OC for 5 min. total 10 cycles. MIL-STD-750D METHOD-1056 9. Forward Surge 8.3ms single half sine-wave superimposed on rated load, one surge. MIL-STD-750D METHOD-4066-2 10. Humidity at T A=85 OC, RH=85% for 1000hrs. MIL-STD-750D METHOD-1021 11. High Temperature Storage Life at 175 OC for 1000 hrs. MIL-STD-750D METHOD-1031 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 7 MIL-STD-750D METHOD-1051 Document ID Issued Date Revised Date Revision Page. DS-241172 2011/07/25 2012/04/05 B 7