Chip Low Leakage Schottky Barrier Rectifier KLFM07540-U Formosa MS List List................................................................................................. 1 Package outline............................................................................... 2 Features......................................................................................... 2 Mechanical data.............................................................................. 2 Maximum ratings ............................................................................ 2 Electrical characteristics ................................................................. 2 Rating and characteristic curves....................................................... 3 Pinning information.......................................................................... 4 Marking........................................................................................... 4 Suggested solder pad layout............................................................. 4 Packing information......................................................................... 5 Reel packing................................................................................... 6 Suggested thermal profiles for soldering processes............................ 6 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date Revised Date Revision Page. DS-121677 2012/01/16 2013/09/27 F 6 Chip Low Leakage Schottky Barrier Rectifier Formosa MS KLFM07540-U 0.75A Surface Mount Low Leakage Schottky Barrier Rectifier- 40V Features Package outline • Dual Flat No-lead. 0603 Small body outline dimensions: 0.067” X 0.032” (1.7mm X 0.80mm). 0.071(1.80) 0.063(1.60) • Low leakage current. • Suffix “-H” indicates Halogen free part, ex. KLFM07540-U-H . 0.033(0.85) 0.029(0.75) Mechanical data • Epoxy: UL94-V0 rated flame retardant • Case: Molded plastic,0603 • Terminals: Golden Plated terminals, 0.016(0.40)Typ. 0.014(0.35) Typ. solderable per MIL-STD-750,Method 2026 • Polarity: Indicated by cathode band • Mounting Position: Any • Weight: Approximated 0.002gram 0.022(0.55) 0.018(0.45) 0.0236(0.60) Typ. Dimensions in inches and (millimeters) Maximum ratings (at T =25 C unless otherwise noted) o A PARAMETER CONDITIONS Repetitive peak reverse voltage Average forward rectified current Forward surge current Non-Repetitive Peak Forward Surge Current at t=8.3ms Operating junction temperature range Storage temperature range Symbol MAX. UNIT V RRM 40 V IO 0.75 A I FSM 3.0 A MIN. TYP. TJ -55 +125 O C T STG -55 +125 O C Symbol MIN. Electrical characteristics (at T =25 C unless otherwise noted) o A PARAMETER CONDITIONS Forward voltage I F = 10mA DC I F = 100mA DC I F = 200mA DC I F = 750mA DC Reverse current V R = 30V,T J = 25 C IR Diode junction capacitance f = 1MHz and applied 10V DC reverse voltage CD http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 VF O Page 2 TYP. MAX. 0.29 0.37 0.41 0.55 0.4 17 0.7 UNIT V 10 uA 20 pF Document ID Issued Date Revised Date Revision Page. DS-121677 2012/01/16 2013/09/27 F 6 Rating and characteristic curves (KLFM07540-U) FIG.1- FORWARD CHARACTERISTICS FIG.2- REVERSE CHARACTERISTICS 1000 1000 O O REVERSE CURRENT (uA) FORWARD CURRENT (mA) T A =25 C 100 10 T J =25 C 100 10 1 0.1 1 0 0.2 0.1 0.3 0.4 0.5 0.6 0.7 0 0.8 FORWARD VOLTAGE (V) 30 40 REVERSE VOLTAGE (V) FIG.3- TERMINALS CHARACTERISTICS FIG.4- POWER RATING DERATING CURVE 100 120 f=1MHz O T A =25 C Mounting on glass epoxy PCBs 100 80 POWER RATING(%) CAPACITANCE BETWEEN TERMINALS (pF) 20 10 60 40 20 80 60 40 20 0 0 0 2 4 6 8 10 12 14 16 18 20 0 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 25 50 75 100 125 150 O REVERSE VOLTAGE(V) AMBIENT TEMPERATURE( C) Page 3 Document ID Issued Date Revised Date Revision Page. DS-121677 2012/01/16 2013/09/27 F 6 Chip Low Leakage Schottky Barrier Rectifier Formosa MS KLFM07540-U Pinning information Pin1 Pin2 Symbol Simplified outline Pin cathode anode 1 2 1 2 Marking Marking code Type number Example Cathode band Marking code KLFM07540-U C C Suggested solder pad layout C A B Dimensions in inches and (millimeters) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 PACKAGE A B C 0603 0.032 (0.80) 0.028 (0.70) 0.036 (0.90) Page 4 Document ID Issued Date Revised Date Revision Page. DS-121677 2012/01/16 2013/09/27 F 6 Chip Low Leakage Schottky Barrier Rectifier Formosa MS KLFM07540-U Packing information P0 P1 d E F C C B A W P D2 D1 T C W1 D unit:mm Symbol Tolerance Carrier width Carrier length A 0.1 1.00 B 0.1 1.80 Carrier depth C 0.1 0.65 Sprocket hole d 0.1 D D1 D D1 D2 2.0 min 2.0 min 0.5 1.50 178.00 62.00 13.00 Item 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position 0603 E 0.1 1.75 Punch hole position F 0.05 3.50 Punch hole pitch P 0.1 4.00 Sprocket hole pitch P0 0.1 4.00 Embossment center Overall tape thickness P1 0.05 2.00 T 0.1 0.23 Tape width W 0.1 8.00 Reel width W1 1.0 11.40 Note:Devices are packed in accor dance with EIA standar 481-D and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date Revised Date Revision Page. DS-121677 2012/01/16 2013/09/27 F 6 Chip Low Leakage Schottky Barrier Rectifier Formosa MS KLFM07540-U Reel packing PACKAGE 0603 REEL SIZE 7" REEL (pcs) COMPONENT SPACING (m/m) 5000 4.0 REEL DIA, (m/m) CARTON SIZE (m/m) CARTON (pcs) INNER BOX (m/m) (pcs) APPROX. GROSS WEIGHT (kg) 50,000 195*195*150 178 460*400*420 400,000 7.5 BOX Suggested thermal profiles for soldering processes o o 1.Storage environment: Temperature=5 C ~40 C Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition o Average ramp-up rate(T L to T P ) <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) 150 C o 200 C 60~120sec o Tsmax to T L -Ramp-upRate o <3 C /sec Time maintained above: -Temperature(T L ) -Time(t L ) o 217 C 60~260sec o o 255 C- 0/ + 5 C Peak Temperature(T P ) o Time within 5 C of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <6 C /sec o o Time 25 C to Peak Temperature http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 <6minutes Page 6 Document ID Issued Date Revised Date Revision Page. DS-121677 2012/01/16 2013/09/27 F 6