Formosa MS Super Fast Recovery Rectifiers SF8A05F THRU SF8A60F List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings .............................................................................. 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Tube packing.................................................................................... 4 Suggested thermal profiles for soldering processes............................. 5 High reliability test capabilities........................................................... 6 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 1 DS-222419 Issued Date 2008/02/10 Revised Date Revision Page. 2014/08/15 D 6 Formosa MS Super Fast Recovery Rectifiers SF8A05F THRU SF8A60F 8.0A Super Fast Recovery Rectifiers - 50V-600V Package outline ITO-220AC Features 0.406(10.3) 0.381(9.7) • Low forward voltage, high current capability • High surge current capability. • Super fast recovery time for switching mode application. • Low power loss . • Glass passivated chip junctions. • Lead-free parts meet environmental standards of 0.189(4.8) 0.165(4.2) 0.130(3.3) 0.099(2.5) 0.272(6.9) 0.248(6.3) 0.606(15.4) 0.583(14.8) 0.134(3.4) 0.118(3.0) MIL-STD-19500/228 • Suffix "-H" indicates Halogen free parts, ex. SF8A05F-H. 1 2 0.161(4.1)MAX Mechanical data 0.548(13.9) 0.512(13.0) 0.035(0.9) 0.011(0.3) • Epoxy : UL94-V0 rated flame retardant • Case : JEDEC ITO-220AC molded plastic body over passivated chip Method 208 guranteed PIN1 • Polarity: As marked • Mounting Position : Any • Weight : Approximated 1.70 gram Maximum ratings (AT .032(0.8)MAX 0.110(2.8) 0.091(2.3) • Lead : Axial leads, solderable per MIL-STD-202, PIN2 Dimensions in inches and (millimeters) T A=25 oC unless otherwise noted) SYMBOLS SF8A05F SF8A10F SF8A20F SF8A40F SF8A60F UNIT Maximum repetitive peak reverse voltage VRRM 50 100 200 400 600 V Maximum RMS voltage VRMS 35 70 140 280 420 V Maximum DC blocking voltage VDC 50 100 200 400 600 V PARAMETER Maximum average forward rectified current IO 8 A Peak forward surge current 8.3ms single half sine-wave(JEDEC method) IFSM 125 A Operating junction temperature range TJ -55 to +150 °C Storage temperature range TSTG -65 to +175 °C Electrical Characteristics (AT SYMBOLS PARAMETER Maximum forward voltage at IF=8A Maximum DC reverse current at rated DC blocking voltage T A=25 oC unless otherwise noted) SF8A05F VF at TJ =25°C at TJ =125°C Maximum reverse recovery time (Note 1) SF8A10F SF8A20F 0.98 SF8A40F SF8A60F UNIT 1.30 1.70 V IR 5.0 200 uA uA trr 35 ns Thermal Characteristics PARAMETER Typical thermal resistance junction to case SYMBOLS SF8A05F RθJC SF8A10F SF8A20F SF8A40F SF8A60F UNIT °C/W 2.5 Note 1: Reverse recovery time test condition, I F =0.5A, I R =1.0A, I RR =0.25A http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 2 DS-222419 Issued Date 2008/02/10 Revised Date Revision Page. 2014/08/15 D 6 Rating and characteristic curves (SF8A05F THRU SF8A60F) FIG.1-TYPICAL FORWARD CURRENT DERATING CURVE FIG.2-TYPICAL FORWARD CHARACTERISTICS V~ 20 0V 100 40 0V 50 10 4 2 0 0 20 40 60 80 100 120 140 160 180 200 CASE TEMPERATURE,(°C) 10 60 6 0V 8 INSTANTANEOUS FORWARD CURRENT,(A) AVERAGE FORWARD CURRENT,(A) 12 1.0 0.1 o Tj=25 C Pulse Width 300us 1% Duty Cycle .01 FIG.3-MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT 0 .2 .4 .6 .8 1.0 1.2 1.4 1.6 1.8 FORWARD VOLTAGE,(V) TJ=25°C 8.3ms Single Half Sine Wave 100 FIG.4 - TYPICAL REVERSE JEDEC method CHARACTERISTICS 75 50 25 REVERSE LEAKAGE CURRENT, (uA) PEAK FORWARD SURGE CURRENT,(A) 125 0 1 5 50 10 100 NUMBER OF CYCLES AT 60Hz FIG.5- TEST CIRCUIT DIAGRAM AND REVERSE Tj=125°C RECOVERY TIME CHARACTERISTICS trr 50W NONINDUCTIVE 10W NONINDUCTIVE ( ) 0 PULSE GENERATOR -0.25A (NOTE 2) (+) 25Vdc (approx.) D.U.T. ( ) 1W NONINDUCTIVE | | | | | | | | +0.5A PERCENT OF RATED PEAK REVERSE VOLTAGE,(%) (+) OSCILLISCOPE (NOTE 1) NOTES: 1. Rise Time= 7ns max., Input Impedance= 1 megohm.22pF. 2. Rise Time= 10ns max., Source Impedance= 50 ohms. -1.0A 1cm SET TIME BASE FOR 50 / 10ns / cm http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 3 DS-222419 Issued Date 2008/02/10 Revised Date Revision Page. 2014/08/15 D 6 Formosa MS Super Fast Recovery Rectifiers SF8A05F THRU SF8A60F Pinning information Pin Pin1 Pin2 Simplified outline Symbol PIN1 cathode anode 1 2 PIN2 Marking Type number Marking code SF8A05F SF8A10F SF8A20F SF8A40F SF8A60F SF8A05F SF8A10F SF8A20F SF8A40F SF8A60F Tube packing PACKAGE TUBE (pcs) ITO-220AC 50 TUBE SIZE (m/m) 525*32*7.0 BOX (pcs) INNER BOX (m/m) 1000 555*150*40 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 CARTON SIZE (m/m) 580*230*175 CARTON (pcs) 5,000 APPROX. GROSS WEIGHT (kg) 15.0 Document ID Page 4 DS-222419 Issued Date 2008/02/10 Revised Date Revision Page. 2014/08/15 D 6 Formosa MS Super Fast Recovery Rectifiers SF8A05F THRU SF8A60F Suggested thermal profiles for soldering processes 1.Lead free temperature profile wave-soldering 280 Peak soldering temperature not to exceed 260ºC 260 240 220 Temperature(°C) 200 180 160 140 120 Peak Max well time 5 Max 100 80 Cool Down Max gradient-4ºC/s Suggested gradient - 2ºC/s or less 60 40 20 Preheat Max gradient 2ºC/s 0 0 20 40 60 80 100 120 140 160 180 200 220 240 Time(Sec) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 5 DS-222419 Issued Date 2008/02/10 Revised Date Revision Page. 2014/08/15 D 6 Formosa MS Super Fast Recovery Rectifiers SF8A05F THRU SF8A60F High reliability test capabilities Item Test Conditions Reference O 1. Solder Resistance at 260 ± 5 C for 10 ± 2sec. immerse body into solder 1/16"±1/32" MIL-STD-750D METHOD-2031 2. Solderability at 245±5 OC for 5 sec. MIL-STD-202F METHOD-208 3. High Temperature Reverse Bias V R=80% rate at T J=150 OC for 168 hrs. MIL-STD-750D METHOD-1038 4. Forward Operation Life Rated average rectifier current at T A=25 OC for 500hrs. MIL-STD-750D METHOD-1027 T A = 25 OC, I F = I O On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. MIL-STD-750D METHOD-1036 5. Intermittent Operation Life 6. Pressure Cooker JESD22-A102 15P SIG at T A=121 OC for 4 hrs. MIL-STD-750D METHOD-1051 7. Temperature Cycling -55 OC to +125 OC dwelled for 30 min. and transferred for 5min. total 10 cycles. 8. Forward Surge 8.3ms single half sine-wave , one surge. MIL-STD-750D METHOD-4066-2 9. Humidity at T A=85 OC, RH=85% for 1000hrs. MIL-STD-750D METHOD-1021 10. High Temperature Storage Life at 175 OC for 1000 hrs. MIL-STD-750D METHOD-1031 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 6 DS-222419 Issued Date 2008/02/10 Revised Date Revision Page. 2014/08/15 D 6