Formosa MS FFM201-L THRU FFM207-L

Chip Fast Recovery Rectifiers
Formosa MS
FFM201-L THRU FFM207-L
List
List................................................................................................. 1
Package outline............................................................................... 2
Features.......................................................................................... 2
Mechanical data............................................................................... 2
Maximum ratings ............................................................................. 2
Rating and characteristic curves........................................................ 3
Pinning information........................................................................... 4
Marking........................................................................................... 4
Suggested solder pad layout............................................................. 4
Packing information.......................................................................... 5
Reel packing.................................................................................... 6
Suggested thermal profiles for soldering processes............................. 6
High reliability test capabilities........................................................... 7
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 1
Document ID
Issued Date
Revised Date
Revision
Page.
DS-121207
2008/02/10
2015/06/02
F
7
Chip Fast Recovery Rectifiers
Formosa MS
FFM201-L THRU FFM207-L
2.0A Surface Mount Fast
Recovery Rectifiers-50-1000V
Package outline
Features
SMA-L
• Batch process design, excellent power dissipation offers
•
•
•
•
•
•
•
better reverse leakage current and thermal resistance.
Low profile surface mounted application in order to
optimize board space.
High current capability.
Fast switching for high efficiency.
High surge current capability.
Glass passivated chip junction.
Lead-free parts meet RoHS requirments.
Suffix "-H" indicates Halogen-free parts, ex. FFM201-L-H.
0.209(5.3)
0.185(4.7)
0.012(0.3) Typ.
0.114(2.9)
0.091(2.3)
Mechanical data
0.080(2.0)
0.063(1.6)
• Epoxy:UL94-V0 rated flame retardant
• Case : Molded plastic, DO-214AC / SMA-L
• Terminals : Solder plated, solderable per
0.032(0.8) Typ.
0.032 (0.8) Typ.
MIL-STD-750, Method 2026
Dimensions in inches and (millimeters)
• Polarity : Indicated by cathode band
• Mounting Position : Any
• Weight : Approximated 0.05 gram
Maximum ratings and Electrical Characteristics (AT
PARAMETER
o
T A=25 C unless otherwise noted)
CONDITIONS
Forward rectified current
See Fig.2
Forward surge current
8.3ms single half sine-wave (JEDEC methode)
MAX.
UNIT
IO
2.0
A
I FSM
50
A
Symbol
MIN.
TYP.
O
V R = V RRM T J = 25 C
Reverse current
5.0
IR
O
V R = V RRM T J = 125 C
Diode junction capacitance
f=1MHz and applied 4V DC reverse voltage
Storage temperature
V RMS*2
(V)
*3
VR
(V)
FFM201-L
50
35
50
FFM202-L
100
70
100
FFM203-L
200
140
200
FFM204-L
400
280
400
FFM205-L
600
420
600
FFM206-L
800
560
800
FFM207-L
1000
700
1000
*4
VF
(V)
Operating
temperature
T J, ( OC)
*5
t rr
(ns)
μA
40
CJ
T STG
*1
V RRM
(V)
SYMBOLS
100
pF
+175
-65
O
C
*1 Repetitive peak reverse voltage
*2 RMS voltage
150
*3 Continuous reverse voltage
1.30
-55 to +150
250
*4 Maximum forward voltage@I F=2.0A
*5 Maximum Reverse recovery time, note 1
500
Note 1. Reverse recovery time test condition, I F =0.5A, I R =1.0A, I RR =0.25A
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Page 2
DS-121207
Issued Date
2008/02/10
Revised Date
Revision
Page.
2015/06/02
F
7
Rating and characteristic curves (FFM201-L THRU FFM207-L)
FIG.1-TYPICAL FORWARD
FIG.2-TYPICAL FORWARD CURRENT DERATING CURVE
AVERAGE FORWARD CURRENT,(A)
20
6.0
2.0
2.4
2.0
1.6
1.2
P.C.B. Mounted on
0.2 " x 0.2 " (5 mm x 5 mm)
Copper Pad Areas
0.8
0.4
0
0
20
40
TJ=25 C
60
80
100
120
140
160
180
200
LEAD TEMPERATURE (°C)
Pulse Width 300us
1% Duty Cycle
0.2
.02
.6
.8
1.0
1.2
1.4
1.6
1.8
2.0
FORWARD VOLTAGE,(V)
FIG.3- TEST CIRCUIT DIAGRAM AND REVERSE
RECOVERY TIME CHARACTERISTICS
50W
NONINDUCTIVE
10W
NONINDUCTIVE
( )
(+)
D.U.T.
25Vdc
(approx.)
PULSE
GENERATOR
(NOTE 2)
( )
PEAK FORWAARD SURGE CURRENT,(A)
FIG.4-MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
50
40
Sine Wave
30
JEDEC method
20
10
0
1
5
2. Rise Time= 10ns max., Source Impedance= 50 ohms.
|
|
|
|
|
|
|
|
0
-0.25A
100
FIG.5-TYPICAL JUNCTION CAPACITANCE
NOTES: 1. Rise Time= 7ns max., Input Impedance= 1 megohm.22pF.
+0.5A
50
10
NUMBER OF CYCLES AT 60Hz
OSCILLISCOPE
(NOTE 1)
trr
8.3ms Single Half
TJ=25 C
(+)
1W
NONINDUCTIVE
70
JUNCTION CAPACITANCE,(pF)
INSTANTANEOUS FORWARD CURRENT,(A)
CHARACTERISTICS
60
50
40
30
20
10
0
-1.0A
1cm
.01
SET TIME BASE FOR
.05
.1
.5
1
5
10
50
100
Revised Date
Revision
Page.
2015/06/02
F
7
REVERSE VOLTAGE,(V)
50 / 10ns / cm
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Page 3
DS-121207
Issued Date
2008/02/10
Chip Fast Recovery Rectifiers
Formosa MS
FFM201-L THRU FFM207-L
Pinning information
Pin
Pin1
Pin2
Simplified outline
cathode
anode
1
Symbol
2
1
2
Marking
Type number
Marking code
FFM201-L
FFM202-L
FFM203-L
FFM204-L
FFM205-L
FFM206-L
FFM207-L
F21
F22
F23
F24
F25
F26
F27
Suggested solder pad layout
C
A
B
Dimensions in inches and (millimeters)
PACKAGE
A
B
C
SMA-L
0.110 (2.80)
0.059 (1.50)
0.110 (2.80)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 4
Document ID
Issued Date
Revised Date
Revision
Page.
DS-121207
2008/02/10
2015/06/02
F
7
Chip Fast Recovery Rectifiers
Formosa MS
FFM201-L THRU FFM207-L
Packing information
P0
P1
d
E
F
B
A
W
P
D2
D1
T
C
W1
D
unit:mm
Item
Symbol
Tolerance
SMA-L
Carrier width
Carrier length
Carrier depth
Sprocket hole
13" Reel outside diameter
13" Reel inner diameter
7" Reel outside diameter
7" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
Sprocket hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
A
B
C
d
D
D1
D
D1
D2
E
F
P
P0
P1
T
W
W1
0.1
0.1
0.1
0.1
2.0
min
2.0
min
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.3
1.0
2.90
5.50
2.10
1.50
330.00
50.00
178.00
62.00
13.00
1.75
5.50
4.00
4.00
2.00
0.23
12.00
18.00
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 5
Document ID
Issued Date
Revised Date
Revision
Page.
DS-121207
2008/02/10
2015/06/02
F
7
Chip Fast Recovery Rectifiers
Formosa MS
FFM201-L THRU FFM207-L
Reel packing
PACKAGE
REEL SIZE
REEL
(pcs)
COMPONENT
SPACING
(m/m)
BOX
(pcs)
7"
2,000
4.0
20,000
7"
2,000
4.0
10,000
REEL
DIA,
(m/m)
CARTON
SIZE
(m/m)
183*155*183
178
382*356*392
160,000
15.5
180*180*80
178
440*410*220
100,000
13.0
INNER
BOX
(m/m)
CARTON
(pcs)
APPROX.
GROSS WEIGHT
(kg)
SMA-L
Suggested thermal profiles for soldering processes
1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25%
2.Reflow soldering of surface-mount devices
Critical Zone
TL to TP
Tp
TP
Ramp-up
TL
TL
Tsmax
Temperature
Tsmin
tS
Preheat
Ramp-down
25
t25o C to Peak
Time
3.Reflow soldering
Profile Feature
Soldering Condition
Average ramp-up rate(T L to T P )
o
<3 C /sec
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(t s )
o
150 C
o
200 C
60~120sec
Tsmax to T L
-Ramp-upRate
o
<3 C /sec
Time maintained above:
-Temperature(T L )
-Time(t L )
o
217 C
60~260sec
o
o
255 C- 0/ + 5 C
Peak Temperature(T P )
o
Time within 5 C of actual Peak
Temperature(t P )
10~30sec
Ramp-down Rate
<6 C /sec
o
o
Time 25 C to Peak Temperature
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
<6minutes
Document ID
Page 6
DS-121207
Issued Date
2008/02/10
Revised Date
Revision
Page.
2015/06/02
F
7
Chip Fast Recovery Rectifiers
Formosa MS
FFM201-L THRU FFM207-L
High reliability test capabilities
Item Test
Conditions
Reference
O
MIL-STD-750D
METHOD-2031
O
MIL-STD-202F
METHOD-208
1. Solder Resistance
at 260 ± 5 C for 10 ± 2sec.
immerse body into solder 1/16" ± 1/32"
2. Solderability
at 245 ± 5 C for 5 sec.
3. High Temperature Reverse Bias
V R=80% rate at T J=150 C for 168 hrs.
4. Forward Operation Life
Rated average rectifier current at T A=25 C for 500hrs.
MIL-STD-750D
METHOD-1038
O
MIL-STD-750D
METHOD-1027
O
O
5. Intermittent Operation Life
6. Pressure Cooker
T A = 25 C, I F = I O
On state: power on for 5 min.
off state: power off for 5 min.
on and off for 500 cycles.
MIL-STD-750D
METHOD-1036
JESD22-A102
O
15P SIG at T A=121 C for 4 hrs.
O
MIL-STD-750D
METHOD-1051
O
7. Temperature Cycling
-55 C to +125 C dwelled for 30 min.
and transferred for 5min. total 10 cycles.
8. Forward Surge
8.3ms single half sine-wave , one surge.
9. Humidity
at T A=85 C , RH=85% for 1000hrs.
10. High Temperature Storage Life
at 175 C for 1000 hrs.
MIL-STD-750D
METHOD-4066-2
MIL-STD-750D
METHOD-1021
O
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
MIL-STD-750D
METHOD-1031
O
Document ID
Page 7
DS-121207
Issued Date
2008/02/10
Revised Date
Revision
Page.
2015/06/02
F
7