Chip Fast Recovery Rectifiers Formosa MS FFM201-L THRU FFM207-L List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Suggested solder pad layout............................................................. 4 Packing information.......................................................................... 5 Reel packing.................................................................................... 6 Suggested thermal profiles for soldering processes............................. 6 High reliability test capabilities........................................................... 7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date Revised Date Revision Page. DS-121207 2008/02/10 2015/06/02 F 7 Chip Fast Recovery Rectifiers Formosa MS FFM201-L THRU FFM207-L 2.0A Surface Mount Fast Recovery Rectifiers-50-1000V Package outline Features SMA-L • Batch process design, excellent power dissipation offers • • • • • • • better reverse leakage current and thermal resistance. Low profile surface mounted application in order to optimize board space. High current capability. Fast switching for high efficiency. High surge current capability. Glass passivated chip junction. Lead-free parts meet RoHS requirments. Suffix "-H" indicates Halogen-free parts, ex. FFM201-L-H. 0.209(5.3) 0.185(4.7) 0.012(0.3) Typ. 0.114(2.9) 0.091(2.3) Mechanical data 0.080(2.0) 0.063(1.6) • Epoxy:UL94-V0 rated flame retardant • Case : Molded plastic, DO-214AC / SMA-L • Terminals : Solder plated, solderable per 0.032(0.8) Typ. 0.032 (0.8) Typ. MIL-STD-750, Method 2026 Dimensions in inches and (millimeters) • Polarity : Indicated by cathode band • Mounting Position : Any • Weight : Approximated 0.05 gram Maximum ratings and Electrical Characteristics (AT PARAMETER o T A=25 C unless otherwise noted) CONDITIONS Forward rectified current See Fig.2 Forward surge current 8.3ms single half sine-wave (JEDEC methode) MAX. UNIT IO 2.0 A I FSM 50 A Symbol MIN. TYP. O V R = V RRM T J = 25 C Reverse current 5.0 IR O V R = V RRM T J = 125 C Diode junction capacitance f=1MHz and applied 4V DC reverse voltage Storage temperature V RMS*2 (V) *3 VR (V) FFM201-L 50 35 50 FFM202-L 100 70 100 FFM203-L 200 140 200 FFM204-L 400 280 400 FFM205-L 600 420 600 FFM206-L 800 560 800 FFM207-L 1000 700 1000 *4 VF (V) Operating temperature T J, ( OC) *5 t rr (ns) μA 40 CJ T STG *1 V RRM (V) SYMBOLS 100 pF +175 -65 O C *1 Repetitive peak reverse voltage *2 RMS voltage 150 *3 Continuous reverse voltage 1.30 -55 to +150 250 *4 Maximum forward voltage@I F=2.0A *5 Maximum Reverse recovery time, note 1 500 Note 1. Reverse recovery time test condition, I F =0.5A, I R =1.0A, I RR =0.25A http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 2 DS-121207 Issued Date 2008/02/10 Revised Date Revision Page. 2015/06/02 F 7 Rating and characteristic curves (FFM201-L THRU FFM207-L) FIG.1-TYPICAL FORWARD FIG.2-TYPICAL FORWARD CURRENT DERATING CURVE AVERAGE FORWARD CURRENT,(A) 20 6.0 2.0 2.4 2.0 1.6 1.2 P.C.B. Mounted on 0.2 " x 0.2 " (5 mm x 5 mm) Copper Pad Areas 0.8 0.4 0 0 20 40 TJ=25 C 60 80 100 120 140 160 180 200 LEAD TEMPERATURE (°C) Pulse Width 300us 1% Duty Cycle 0.2 .02 .6 .8 1.0 1.2 1.4 1.6 1.8 2.0 FORWARD VOLTAGE,(V) FIG.3- TEST CIRCUIT DIAGRAM AND REVERSE RECOVERY TIME CHARACTERISTICS 50W NONINDUCTIVE 10W NONINDUCTIVE ( ) (+) D.U.T. 25Vdc (approx.) PULSE GENERATOR (NOTE 2) ( ) PEAK FORWAARD SURGE CURRENT,(A) FIG.4-MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT 50 40 Sine Wave 30 JEDEC method 20 10 0 1 5 2. Rise Time= 10ns max., Source Impedance= 50 ohms. | | | | | | | | 0 -0.25A 100 FIG.5-TYPICAL JUNCTION CAPACITANCE NOTES: 1. Rise Time= 7ns max., Input Impedance= 1 megohm.22pF. +0.5A 50 10 NUMBER OF CYCLES AT 60Hz OSCILLISCOPE (NOTE 1) trr 8.3ms Single Half TJ=25 C (+) 1W NONINDUCTIVE 70 JUNCTION CAPACITANCE,(pF) INSTANTANEOUS FORWARD CURRENT,(A) CHARACTERISTICS 60 50 40 30 20 10 0 -1.0A 1cm .01 SET TIME BASE FOR .05 .1 .5 1 5 10 50 100 Revised Date Revision Page. 2015/06/02 F 7 REVERSE VOLTAGE,(V) 50 / 10ns / cm http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 3 DS-121207 Issued Date 2008/02/10 Chip Fast Recovery Rectifiers Formosa MS FFM201-L THRU FFM207-L Pinning information Pin Pin1 Pin2 Simplified outline cathode anode 1 Symbol 2 1 2 Marking Type number Marking code FFM201-L FFM202-L FFM203-L FFM204-L FFM205-L FFM206-L FFM207-L F21 F22 F23 F24 F25 F26 F27 Suggested solder pad layout C A B Dimensions in inches and (millimeters) PACKAGE A B C SMA-L 0.110 (2.80) 0.059 (1.50) 0.110 (2.80) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 4 Document ID Issued Date Revised Date Revision Page. DS-121207 2008/02/10 2015/06/02 F 7 Chip Fast Recovery Rectifiers Formosa MS FFM201-L THRU FFM207-L Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SMA-L Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 2.90 5.50 2.10 1.50 330.00 50.00 178.00 62.00 13.00 1.75 5.50 4.00 4.00 2.00 0.23 12.00 18.00 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date Revised Date Revision Page. DS-121207 2008/02/10 2015/06/02 F 7 Chip Fast Recovery Rectifiers Formosa MS FFM201-L THRU FFM207-L Reel packing PACKAGE REEL SIZE REEL (pcs) COMPONENT SPACING (m/m) BOX (pcs) 7" 2,000 4.0 20,000 7" 2,000 4.0 10,000 REEL DIA, (m/m) CARTON SIZE (m/m) 183*155*183 178 382*356*392 160,000 15.5 180*180*80 178 440*410*220 100,000 13.0 INNER BOX (m/m) CARTON (pcs) APPROX. GROSS WEIGHT (kg) SMA-L Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) o 150 C o 200 C 60~120sec Tsmax to T L -Ramp-upRate o <3 C /sec Time maintained above: -Temperature(T L ) -Time(t L ) o 217 C 60~260sec o o 255 C- 0/ + 5 C Peak Temperature(T P ) o Time within 5 C of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <6 C /sec o o Time 25 C to Peak Temperature http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 <6minutes Document ID Page 6 DS-121207 Issued Date 2008/02/10 Revised Date Revision Page. 2015/06/02 F 7 Chip Fast Recovery Rectifiers Formosa MS FFM201-L THRU FFM207-L High reliability test capabilities Item Test Conditions Reference O MIL-STD-750D METHOD-2031 O MIL-STD-202F METHOD-208 1. Solder Resistance at 260 ± 5 C for 10 ± 2sec. immerse body into solder 1/16" ± 1/32" 2. Solderability at 245 ± 5 C for 5 sec. 3. High Temperature Reverse Bias V R=80% rate at T J=150 C for 168 hrs. 4. Forward Operation Life Rated average rectifier current at T A=25 C for 500hrs. MIL-STD-750D METHOD-1038 O MIL-STD-750D METHOD-1027 O O 5. Intermittent Operation Life 6. Pressure Cooker T A = 25 C, I F = I O On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. MIL-STD-750D METHOD-1036 JESD22-A102 O 15P SIG at T A=121 C for 4 hrs. O MIL-STD-750D METHOD-1051 O 7. Temperature Cycling -55 C to +125 C dwelled for 30 min. and transferred for 5min. total 10 cycles. 8. Forward Surge 8.3ms single half sine-wave , one surge. 9. Humidity at T A=85 C , RH=85% for 1000hrs. 10. High Temperature Storage Life at 175 C for 1000 hrs. MIL-STD-750D METHOD-4066-2 MIL-STD-750D METHOD-1021 O http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 MIL-STD-750D METHOD-1031 O Document ID Page 7 DS-121207 Issued Date 2008/02/10 Revised Date Revision Page. 2015/06/02 F 7