Chip Ultra Fast Rectifiers Formosa MS MURS140-BS THRU MURS160-BS List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Suggested solder pad layout............................................................. 4 Packing information.......................................................................... 5 Reel packing.................................................................................... 6 Suggested thermal profiles for soldering processes............................. 6 High reliability test capabilities........................................................... 7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date DS-121302 2012/04/13 Revised Date Revision Page. - A 7 Chip Ultra Fast Rectifiers Formosa MS MURS140-BS THRU MURS160-BS 1.0A Surface Mount Ultra Fast Rectifiers- 400V-600V Package outline Features • Fast switching speed . • Low profile surface mounted application in order to SMB-S optimize board space. 0.220(5.6) 0.205(5.2) • Surface mount package ideally suited for automatic insertion . • Low power loss, high efficiency . • High forward surge current capability . • Glass passivated chip junction. • Lead-free parts meet RoHS requirments. • Suffix "-H" indicates Halogen free parts, ex. ΜURS140-ΒS-H. 0.020(0.5) Typ. 0.083(2.1) 0.138(3.5) 0.122(3.1) 0.075(1.9) Mechanical data • Epoxy:UL94-V0 rated flame retardant • Case : Molded plastic, DO-214AA /SMB-S • Terminals : Solder plated, solderable per 0.067(1.7) 0.060(1.5) MIL-STD-750, Method 2026 0.040(1.0) Typ. • Polarity : Indicated by cathode band • Mounting Position : Any • Weight : Approximated 0.072 gram 0.040 (1.0) Typ. Dimensions in inches and (millimeters) Maximum ratings and Electrical Characteristics (AT PARAMETER o T A=25 C unless otherwise noted) CONDITIONS Forward rectified current See Fig.2 Forward surge current 8.3ms single half sine-wave (JEDEC methode) Symbol MIN. TYP. 1.0 A I FSM 30 A Thermal resistance Diode junction capacitance 5.0 IR O V R = V RRM T J = 125 C R θJA 46 Junction to case (Note 2) R θJC 30 CJ 20 Storage temperature T STG μA 150 Junction to ambient (Note 2) f=1MHz and applied 4V DC reverse voltage UNIT IO O V R = V RRM T J = 25 C Reverse current MAX. O pF +175 -65 C/W O C *1 Repetitive peak reverse voltage SYMBOLS MURS140-BS MURS160-BS *1 *2 *3 V RRM (V) V RMS (V) VR (V) 400 280 400 600 420 600 *4 Operating temperature T J, ( OC) *5 VF (V) trr (ns) 1.25 50 -55 to +150 Note 1. Reverse recovery time test condition, I F =0.5A, I R =1.0A, I RR =0.25A 2 . Mounted on FR - 4 PCB Copper , minimum recommended pad layout. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 2 *2 RMS voltage *3 Continuous reverse voltage *4 Maximum forward voltage@I F=1.0A *5 Maximum Reverse recovery time, note 1 Document ID Issued Date DS-121302 2012/04/13 Revised Date Revision Page. - A 7 Rating and characteristic curves (MURS140-BS THRU MURS160-BS) FIG.2-TYPICAL FORWARD CURRENT DERATING CURVE FIG.1-TYPICAL FORWARD AVERAGE FORWARD CURRENT,(A) 1 0.1 TJ =25°C Pulse Width=300 us 1%Duty Cucle 1.2 1.0 0.8 0.6 0.4 0.2 0 0 20 40 60 80 100 120 140 160 180 200 LEAD TEMPERATURE (°C) 0.01 0. 2 0. 4 0. 6 0 .8 1. 0 1 .2 1. 4 1. 6 1. 8 FIG.4-MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT FIG.3- TEST CIRCUIT DIAGRAM AND REVERSE RECOVERY TIME CHARACTERISTICS 50W NONINDUCTIVE 10W NONINDUCTIVE ( ) (+) D.U.T. 25Vdc (approx.) PULSE GENERATOR (NOTE 2) ( ) PEAK FORWAARD SURGE CURRENT,(A) FORWARD VOLTAGE,(V) 50 40 30 8.3ms Single Half TJ=25 C Sine Wave 20 JEDEC method 10 0 1 5 (+) 1W NONINDUCTIVE 50 10 100 NUMBER OF CYCLES AT 60Hz OSCILLISCOPE (NOTE 1) NOTES: 1. Rise Time= 7ns max., Input Impedance= 1 megohm.22pF. 2. Rise Time= 10ns max., Source Impedance= 50 ohms. FIG.5-TYPICAL JUNCTION CAPACITANCE 140 trr JUNCTION CAPACITANCE,(pF) INSTANTANEOUS FORWARD CURRENT,(A) CHARACTERISTICS 10 | | | | | | | | +0.5A 0 -0.25A -1.0A 120 100 80 60 40 20 1cm SET TIME BASE FOR 50 / 10ns / cm 0 .01 .05 .1 .5 1 5 10 50 100 REVERSE VOLTAGE,(V) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 3 Document ID Issued Date DS-121302 2012/04/13 Revised Date Revision Page. - A 7 Chip Ultra Fast Rectifiers Formosa MS MURS140-BS THRU MURS160-BS Pinning information Pin Pin1 Pin2 Simplified outline cathode anode 1 Symbol 1 2 2 Marking Type number Marking code MURS140-BS MURS160-BS U1G U1J Suggested solder pad layout C A B Dimensions in inches and (millimeters) PACKAGE A B C SMB-S 0.078 (2.00) 0.059 (1.50) 0.110 (2.80) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 4 Document ID Issued Date DS-121302 2012/04/13 Revised Date Revision Page. - A 7 Chip Ultra Fast Rectifiers Formosa MS MURS140-BS THRU MURS160-BS Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SMB-S Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 3.81 5.74 2.24 1.50 330.00 50.00 178.00 62.00 13.00 1.75 5.50 8.00 4.00 2.00 0.23 12.00 18.00 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date DS-121302 2012/04/13 Revised Date Revision Page. - A 7 Chip Ultra Fast Rectifiers Formosa MS MURS140-BS THRU MURS160-BS Reel packing PACKAGE REEL SIZE SMB-S 13" REEL (pcs) COMPONENT SPACING (m/m) BOX (pcs) INNER BOX (m/m) REEL DIA, (m/m) 4,000 8.0 8,000 337*337*37 330 CARTON SIZE (m/m) APPROX. GROSS WEIGHT (kg) CARTON (pcs) 350*330*360 16.9 64,000 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55% ± 25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) o 150 C o 200 C 60~120sec Tsmax to T L -Ramp-upRate o <3 C /sec Time maintained above: -Temperature(T L ) -Time(t L ) o 217 C 60~260sec o o 255 C- 0/ + 5 C Peak Temperature(T P ) o Time within 5 C of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <6 C /sec o o Time 25 C to Peak Temperature http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 <6minutes Page 6 Document ID Issued Date DS-121302 2012/04/13 Revised Date Revision Page. - A 7 Chip Ultra Fast Rectifiers Formosa MS MURS140-BS THRU MURS160-BS High reliability test capabilities Item Test Conditions Reference O MIL-STD-750D METHOD-2031 O MIL-STD-202F METHOD-208 1. Solder Resistance at 260 ± 5 C for 10 ± 2sec. immerse body into solder 1/16" ± 1/32" 2. Solderability at 245 ± 5 C for 5 sec. 3. High Temperature Reverse Bias V R=80% rate at T J=150 C for 168 hrs. 4. Forward Operation Life Rated average rectifier current at T A=25 C for 500hrs. MIL-STD-750D METHOD-1038 O MIL-STD-750D METHOD-1027 O O 5. Intermittent Operation Life 6. Pressure Cooker T A = 25 C, I F = I O On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. MIL-STD-750D METHOD-1036 JESD22-A102 O 15P SIG at T A=121 C for 4 hrs. O MIL-STD-750D METHOD-1051 O 7. Temperature Cycling -55 C to +125 C dwelled for 30 min. and transferred for 5min. total 10 cycles. 8. Forward Surge 8.3ms single half sine-wave , one surge. 9. Humidity at T A=85 C , RH=85% for 1000hrs. 10. High Temperature Storage Life at 175 C for 1000 hrs. MIL-STD-750D METHOD-4066-2 MIL-STD-750D METHOD-1021 O http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 MIL-STD-750D METHOD-1031 O Page 7 Document ID Issued Date DS-121302 2012/04/13 Revised Date Revision Page. - A 7