Formosa MS Chip Silicon Rectifier FM201 THRU FM207 List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Suggested solder pad layout............................................................. 4 Packing information.......................................................................... 5 Reel packing.................................................................................... 6 Suggested thermal profiles for soldering processes............................. 6 High reliability test capabilities........................................................... 7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date Revised Date Revision Page. DS-121107 2008/02/10 2010/03/09 D 7 Formosa MS Chip Silicon Rectifier FM201 THRU FM207 2.0A Surface Mount General Purpose Rectifiers - 50V-1000V Package outline Features SMA • Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. 0.196(4.9) 0.180(4.5) • Low profile surface mounted application in order to • • • • • 0.012(0.3) Typ. optimize board space. High current capability. High surge capability. Glass passivated chip junction. Lead-free parts meet environmental standards of MIL-STD-19500 /228 Suffix "-H" indicates Halogen-free parts, ex. FM201-H. 0.106(2.7) 0.091(2.3) Mechanical data 0.068(1.7) 0.060(1.5) • Epoxy:UL94-V0 rated flame retardant • Case : Molded plastic, DO-214AC / SMA • Terminals : Solder plated, solderable per 0.032(0.8) Typ. MIL-STD-750, Method 2026 0.032 (0.8) Typ. Dimensions in inches and (millimeters) • Polarity : Indicated by cathode band • Mounting Position : Any • Weight : Approximated 0.05 gram Maximum ratings and Electrical Characteristics (AT PARAMETER T A=25 oC unless otherwise noted) CONDITIONS Forward rectified current See Fig.2 Forward surge current 8.3ms single half sine-wave superimposed on rate load (JEDEC methode) V R = V RRM T J = 25 OC Reverse current V R = V RRM T J = 125 OC Diode junction capacitance f=1MHz and applied 4V DC reverse voltage Storage temperature SYMBOLS *1 V RRM (V) V RMS*2 (V) *3 VR (V) 50 50 100 70 100 FM203 200 140 200 FM204 400 280 400 FM205 600 420 600 FM206 800 560 800 FM207 1000 700 1000 FM202 UNIT IO 2.0 A I FSM 50 A http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 *4 VF (V) Operating temperature T J, ( OC) MIN. TYP. 5.0 IR μA 125 30 CJ T STG 35 FM201 MAX. Symbol pF O +175 -65 C *1 Repetitive peak reverse voltage *2 RMS voltage *3 Continuous reverse voltage 1.10 -55 to +150 Page 2 *4 Maximum forward voltage@I F=2.0A Document ID Issued Date Revised Date Revision Page. DS-121107 2008/02/10 2010/03/09 D 7 Rating and characteristic curves (FM201 THRU FM207) FIG.1-TYPICAL FORWARD FIG.2-TYPICAL FORWARD CURRENT DERATING CURVE CHARACTERISTICS AVERAGE FORWARD CURRENT,(A) 10 1 2.4 2.0 1.6 1.2 P.C.B. Mounted on 0.2" x 0.2" (5 mm x 5 mm) Copper Pad Areas 0.8 0.4 0 0 20 40 60 TJ=25 C 80 100 120 140 160 180 200 LEAD TEMPERATURE,(°C) Pulse Width 300us 1% Duty Cycle .1 FIG.4-MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT .01 .6 .8 1.0 1.2 1.4 1.6 1.8 2.0 FORWARD VOLTAGE,(V) FIG.3 - TYPICAL REVERSE CHARACTERISTICS PEAK FORWAARD SURGE CURRENT,(A) INSTANTANEOUS FORWARD CURRENT,(A) 100 50 40 8.3ms Single Half TJ=25 C Sine Wave 30 JEDEC method 20 10 0 1 100 5 50 10 100 10 FIG.5-TYPICAL JUNCTION CAPACITANCE TJ=125 C 175 1.0 TJ=25 C .1 .01 0 JUNCTION CAPACITANCE,(pF) REVERSE LEAKAGE CURRENT, (m A) NUMBER OF CYCLES AT 60Hz NUMBER OF CYCLES AT 60Hz 150 125 100 75 50 25 20 40 60 80 100 120 140 PERCENTAGE RATED PEAK REVERSE VOLTAGE 0 .01 .05 .1 .5 1 5 10 50 100 REVERSE VOLTAGE,(V) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 3 Document ID Issued Date Revised Date Revision Page. DS-121107 2008/02/10 2010/03/09 D 7 Formosa MS Chip Silicon Rectifier FM201 THRU FM207 Pinning information Pin Pin1 Pin2 Simplified outline cathode anode 1 Symbol 2 1 2 Marking Type number Marking code FM201 FM202 FM203 FM204 FM205 FM206 FM207 A21 A22 A23 A24 A25 A26 A27 Suggested solder pad layout C A B Dimensions in inches and (millimeters) PACKAGE A B C SMA 0.110 (2.80) 0.063 (1.60) 0.087 (2.20) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 4 Document ID Issued Date Revised Date Revision Page. DS-121107 2008/02/10 2010/03/09 D 7 Formosa MS Chip Silicon Rectifier FM201 THRU FM207 Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SMA Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 2.80 5.00 1.90 1.50 330.00 50.00 178.00 62.00 13.00 1.75 5.50 4.00 4.00 2.00 0.23 12.00 18.00 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date Revised Date Revision Page. DS-121107 2008/02/10 2010/03/09 D 7 Formosa MS Chip Silicon Rectifier FM201 THRU FM207 Reel packing PACKAGE REEL SIZE REEL (pcs) COMPONENT SPACING (m/m) BOX (pcs) INNER BOX (m/m) REEL DIA, (m/m) CARTON SIZE (m/m) CARTON (pcs) APPROX. GROSS WEIGHT (kg) SMA 7" 2,000 4.0 20,000 183*170*183 178 382*356*387 160,000 16.0 SMA 13" 7,500 4.0 15,000 337*337*37 330 350*330*360 120,000 14.2 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) 150 oC 200 oC 60~120sec Tsmax to T L -Ramp-upRate <3 oC/sec Time maintained above: -Temperature(T L ) -Time(t L ) 217 oC 60~260sec 255 oC-0/+5 oC Peak Temperature(T P ) Time within 5 oC of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <6 oC/sec Time 25 oC to Peak Temperature <6minutes http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 6 Document ID Issued Date Revised Date Revision Page. DS-121107 2008/02/10 2010/03/09 D 7 Formosa MS Chip Silicon Rectifier FM201 THRU FM207 High reliability test capabilities Item Test Conditions Reference O 1. Solder Resistance at 260 ± 5 C for 10 ± 2sec. immerse body into solder 1/16"±1/32" MIL-STD-750D METHOD-2031 2. Solderability at 245±5 OC for 5 sec. MIL-STD-202F METHOD-208 3. High Temperature Reverse Bias V R=80% rate at T J=150 OC for 168 hrs. MIL-STD-750D METHOD-1038 4. Forward Operation Life Rated average rectifier current at T A=25 OC for 500hrs. MIL-STD-750D METHOD-1027 T A = 25 OC, I F = I O On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. MIL-STD-750D METHOD-1036 5. Intermittent Operation Life 6. Pressure Cooker 7. Temperature Cycling JESD22-A102 15P SIG at T A=121 OC for 4 hrs. MIL-STD-750D METHOD-1051 -55 OC to +125 OC dwelled for 30 min. and transferred for 5min. total 10 cycles. 0 OC for 5 min. rise to 100 OC for 5 min. total 10 cycles. MIL-STD-750D METHOD-1056 9. Forward Surge 8.3ms single half sine-wave superimposed on rated load, one surge. MIL-STD-750D METHOD-4066-2 10. Humidity at T A=85 OC, RH=85% for 1000hrs. MIL-STD-750D METHOD-1021 11. High Temperature Storage Life at 175 OC for 1000 hrs. MIL-STD-750D METHOD-1031 8. Thermal Shock http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 7 Document ID Issued Date Revised Date Revision Page. DS-121107 2008/02/10 2010/03/09 D 7