Formosa MS Chip Fast Efficient Rectifiers FEGFM305 List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Suggested solder pad layout............................................................. 4 Packing information.......................................................................... 5 Reel packing.................................................................................... 6 Suggested thermal profiles for soldering processes............................. 6 High reliability test capabilities........................................................... 7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date DS-121546 2013/04/30 Revised Date - Revision A Page. 7 Formosa MS Chip Fast Efficient Rectifiers FEGFM305 3.0A Sufrace Mount Fast Efficient Rectifiers-600V Package outline Features SMC • Batch process design, excellent power dissipation offers • • • • • • better reverse leakage current and thermal resistance. Low profile surface mounted application in order to optimize board space. High current & surge capability. Low forward dropdown voltage Glass passivated chip junction. Lead-free parts meet environmental standards of MIL-STD-19500 /228 Suffix "-H" indicates Halogen free parts, ex. FEGFM305-H. 0.272(6.9) 0.248(6.3) 0.012(0.3) Typ. 0.189(4.8) 0.165(4.2) 0.098(2.5) 0.075(1.9) Mechanical data • Epoxy:UL94-V0 rated flame retardant • Case : Molded plastic, DO-214AB / SMC • Terminals : Solder plated, solderable per 0.048(1.2) Typ. MIL-STD-750, Method 2026 0.048 (1.2) Typ. Dimensions in inches and (millimeters) • Polarity : Indicated by cathode band • Mounting Position : Any • Weight : Approximated 0.19 gram Maximum ratings and Electrical Characteristics (AT PARAMETER T A=25 oC unless otherwise noted) CONDITIONS Forward rectified current See Fig.2 Forward surge current 8.3ms single half sine-wave (JEDEC methode) V R = V RRM T J = 25 OC Reverse current UNIT IO 3.0 A I FSM 100 A MIN. TYP. 5.0 IR V R = V RRM T J = 125 OC Diode junction capacitance MAX. Symbol f=1MHz and applied 4V DC reverse voltage Storage temperature CJ T STG μA 100 pF 50 +175 -65 O C *1 Repetitive peak reverse voltage SYMBOLS FEGFM305 *1 V RRM (V) 600 V RMS*2 (V) 420 *3 VR (V) *4 VF (V) *5 t rr (ns) 600 1.30 35 Operating temperature T J, ( OC) -55 to +150 *2 RMS voltage *3 Continuous reverse voltage *4 Maximum forward voltage@I F=3.0A Note 1. Reverse recovery time test condition, I F =0.5A, I R =1.0A, I RR =0.25A *5 Maximum Reverse recovery time, note 1 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 2 Document ID Issued Date DS-121546 2013/04/30 Revised Date - Revision A Page. 7 Rating and characteristic curves (FEGFM305) FIG.2-TYPICAL FORWARD CURRENT DERATING CURVE CHARACTERISTICS 10 AVERAGE FORWARD CURRENT,(A) INSTANTANEOUS FORWARD CURRENT,(A) FIG.1-TYPICAL FORWARD 1.0 0.1 3.0 2.5 2.0 1.5 1.0 0.5 0 0.4 0.6 0.8 1.0 1.2 1.4 1.6 10W NONINDUCTIVE ( ) D.U.T. PULSE GENERATOR (NOTE 2) ( ) 100 125 150 175 PEAK FORWARD SURGE CURRENT,(A) RECOVERY TIME CHARACTERISTICS 25Vdc (approx.) 75 FIG.4-MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT FIG.3- TEST CIRCUIT DIAGRAM AND REVERSE (+) 50 1.8 INSTANTANEOUS FORWARD VOLTAGE,(V) 50W NONINDUCTIVE 25 LEAD TEMPERATURE (°C) TJ=25°C PULSE WIDTH=300us 1% DUTY CYCLE 0.01 P.C.B. Mounted on 0.32" x 0.32" (8 mm x 8 mm) Copper Pad Areas (+) 1W NONINDUCTIVE OSCILLISCOPE (NOTE 1) NUMBER OF CYCLES AT 60Hz NOTES: 1. Rise Time= 7ns max., Input Impedance= 1 megohm.22pF. 2. Rise Time= 10ns max., Source Impedance= 50 ohms. FIG.5-TYPICAL JUNCTION CAPACITANCE TJ=25 C f=1.0MHZ Vsig = 50mVp-p JUNCTION CAPACITANCE,(pF) trr | | | | | | | | +0.5A 0 -0.25A -1.0A 1cm SET TIME BASE FOR 10 / 20ns / cm REVERSE VOLTAGE,(V) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 3 Document ID Issued Date DS-121546 2013/04/30 Revised Date - Revision A Page. 7 Formosa MS Chip Fast Efficient Rectifiers FEGFM305 Pinning information Pin Pin1 Pin2 Simplified outline cathode anode 1 Symbol 2 1 2 Marking Type number Marking code FEGFM305 FE35 Suggested solder pad layout C A B Dimensions in inches and (millimeters) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 PACKAGE A B C SMC 0.189 (4.80) 0.063 (1.60) 0.158 (4.00) Page 4 Document ID Issued Date DS-121546 2013/04/30 Revised Date - Revision A Page. 7 Formosa MS Chip Fast Efficient Rectifiers FEGFM305 Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SMC Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 5.10 7.20 2.50 1.50 330.00 50.00 178.00 62.00 13.00 1.75 5.50 8.00 4.00 2.00 0.23 12.00 18.00 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date DS-121546 2013/04/30 Revised Date - Revision A Page. 7 Formosa MS Chip Fast Efficient Rectifiers FEGFM305 Reel packing PACKAGE SMC REEL SIZE 13" REEL (pcs) COMPONENT SPACING (m/m) BOX (pcs) INNER BOX (m/m) REEL DIA, (m/m) 3,000 8.0 6,000 337*337*37 330 CARTON SIZE (m/m) 350*330*360 APPROX. GROSS WEIGHT (kg) CARTON (pcs) 17.2 48,000 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) 150 oC 200 oC 60~120sec Tsmax to T L -Ramp-upRate <3 oC/sec Time maintained above: -Temperature(T L ) -Time(t L ) 217 oC 60~260sec 255 oC-0/+5 oC Peak Temperature(T P ) Time within 5 oC of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <6 oC/sec Time 25 oC to Peak Temperature <6minutes http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 6 Document ID Issued Date DS-121546 2013/04/30 Revised Date - Revision A Page. 7 Formosa MS Chip Fast Efficient Rectifiers FEGFM305 High reliability test capabilities Item Test Conditions Reference O 1. Solder Resistance at 260 ± 5 C for 10 ± 2sec. immerse body into solder 1/16"±1/32" MIL-STD-750D METHOD-2031 2. Solderability at 245±5 OC for 5 sec. MIL-STD-202F METHOD-208 3. High Temperature Reverse Bias V R=80% rate at T J=150 OC for 168 hrs. MIL-STD-750D METHOD-1038 4. Forward Operation Life Rated average rectifier current at T A=25 OC for 500hrs. MIL-STD-750D METHOD-1027 T A = 25 OC, I F = I O On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. MIL-STD-750D METHOD-1036 5. Intermittent Operation Life 6. Pressure Cooker JESD22-A102 15P SIG at T A=121 OC for 4 hrs. MIL-STD-750D METHOD-1051 7. Temperature Cycling -55 OC to +125 OC dwelled for 30 min. and transferred for 5min. total 10 cycles. 8. Forward Surge 8.3ms single half sine-wave , one surge. MIL-STD-750D METHOD-4066-2 9. Humidity at T A=85 OC, RH=85% for 1000hrs. MIL-STD-750D METHOD-1021 10. High Temperature Storage Life at 175 OC for 1000 hrs. MIL-STD-750D METHOD-1031 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 7 Document ID Issued Date DS-121546 2013/04/30 Revised Date - Revision A Page. 7