MF432 1300 nm - 1550 nm, 2.5 GHz PIN Photodiode Data Sheet December 2004 Ordering Information MF432 MF432 MF432 MF432 MF432 MF432 TO-46 Package ST Housing SC Housing SMA Housing FC Housing Pig-Tail including 1 Meter of 10/125mm fibre and SC connector ° -40 C to +85 °C ST SC SMA FC PT Note: The rated Responsivity applies to all options. Features Description • • • • Tested to Bellcore TA-NWT-000983, this very high speed and low capacitance InGaAs PIN Photodiode is ideal for datacom, telecom and general purpose applications. Its double-lens optical system is designed for single-mode fiber as well as for multimode fiber with core diameter up to 62.5 µm and when used in the Pigtail-3A package, the optical return loss is very high. 1300-1550 nm PIN Photodiode 2.5 GHz Bandwidth Designed for Single-mode and Multi-mode Fiber Tested to Bellcore TA-NWT-000983 Applications • • • • ATM-SDH/Sonet 155, 622 and 2488 Mbps FDDI ESCON General Purpose CATHODE ANODE CASE ANODE CATHODE Bottom View Figure 1 - Pin Diagram Figure 2 - Functional Schematic 1 Zarlink Semiconductor Inc. Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc. Copyright 2003-2004, Zarlink Semiconductor Inc. All Rights Reserved. MF432 Data Sheet Optical and Electrical Characteristics - (Case Temperature -40 to +85oC) Parameter Symbol Min. Typ. Responsivity (Figures 3 and 4) (Table 1) R 0.7 0.8 0.8 1.0 Bandwidth fc 2.5 Capacitance (Figure 4) C Dark Current ld Max. 0.8 Unit Test Condition A/W λ = 1300 nm λ = 1550 nm GHz RL = 50Ω 1.2 pF f = 1 MHz 3 80 nA TCase = 25oC TCase = 85oC Note: Operating Conditions: Fiber: Single-mode 10/125 µm to multimode 62.5/125 µm. V R = 5 V Absolute Maximum Ratings Parameter Symbol Limit Storage Temperature Tstg -55 to +125°C Operating Temperature Top -40 to +85°C Reverse Voltage VR 20 V Soldering Temperature (2 mm from the case for 10 sec.) Tsld 260°C VESD +/-100 V ESD Resistance Thermal Characteristics Parameter Symbol dld/dTj Thermal Resistance - Dark Current Min. Typ. Max. Unit 5 100 %/°C Typical Responsivity Core Diameter/Cladding Diameter Numerical Aperture 10/125 µm 0.11 50/125 µm 0.20 62.5/125 µm 0.275 1300 0.8 A/W 0.8 A/W 0.8 A/W 1500 1.0 A/W 1.0 A/W 1.0 A/W 2 Zarlink Semiconductor Inc. MF432 Data Sheet 100 r 90 80 z r - optimal ØC = 62.5 µm Relative Responsivity (%) 70 60 50 40 30 20 10 0 0.5 0.75 1 1.25 1.5 1.75 2 2.25 2.5 2.75 3 z - Axial Displacem ent of Fiber (m m ) Figure 3 - z - Axial Displacement of Fiber r 100 90 z z - optimal ØC = 62.5 µm Relative Responsivity (%) 80 70 60 50 40 30 20 10 0 0 10 20 30 40 50 60 70 80 rr- -Radial ent of of Fiber (m (µm) m) RadialDisplacem Displacement Fiber Figure 4 - r - Radial Displacement of Fiber 3 Zarlink Semiconductor Inc. 90 100 MF432 Data Sheet Relative Responsivity (%) 100 90 80 70 60 50 40 30 20 10 0 800 900 1000 1100 1200 1300 1400 1500 1600 1700 Wavelength (nm) Wavelength (nm) Figure 5 - Relative Responsivity vs. Wavelength 2 1.75 Capacitance (pF) 1.5 1.25 1 0.75 0.5 0.25 0 0 1 2 3 4 5 6 7 8 Reverse Voltage (V) Figure 6 - Capacitance vs. Reverse Voltage 4 Zarlink Semiconductor Inc. 9 10 BOTTOM VIEW ( 10 : 1 ) SIDE VIEW 13,46`0,76 3,8 2,54 0,6 0,03 (3x) n0,45 + - 0,05 (3x) n1,17 + - 0,04 n4,7 0 R2,7 45° R0,2 max (4x) 0,3 max glass overmould (2x) R0,4 max 2` 0, 3 3, 6 1, 0 Lens n1.5`0.05 NOTES:1. All dimensions in mm. 2. General tol. ISO-2768-mK. 3. Coating: Case: Ni 1,5-2,5 µm. Header: Ni 2-3 µm / Au min 1,32 µm. Package code © Zarlink Semiconductor 2002. All rights reserved. ISSUE 1 ACN JS004 076R1 A DATE 22-MAR-03 APPRD. TD/BE Previous package codes TB Drawing type Package drawing, TO-46 with lens Title JS004076 For more information about all Zarlink products visit our Web Site at www.zarlink.com Information relating to products and services furnished herein by Zarlink Semiconductor Inc. or its subsidiaries (collectively “Zarlink”) is believed to be reliable. However, Zarlink assumes no liability for errors that may appear in this publication, or for liability otherwise arising from the application or use of any such information, product or service or for any infringement of patents or other intellectual property rights owned by third parties which may result from such application or use. Neither the supply of such information or purchase of product or service conveys any license, either express or implied, under patents or other intellectual property rights owned by Zarlink or licensed from third parties by Zarlink, whatsoever. Purchasers of products are also hereby notified that the use of product in certain ways or in combination with Zarlink, or non-Zarlink furnished goods or services may infringe patents or other intellectual property rights owned by Zarlink. This publication is issued to provide information only and (unless agreed by Zarlink in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. The products, their specifications, services and other information appearing in this publication are subject to change by Zarlink without notice. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user’s responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. Manufacturing does not necessarily include testing of all functions or parameters. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to Zarlink’s conditions of sale which are available on request. Purchase of Zarlink’s I2C components conveys a licence under the Philips I2C Patent rights to use these components in and I2C System, provided that the system conforms to the I2C Standard Specification as defined by Philips. Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc. Copyright Zarlink Semiconductor Inc. All Rights Reserved. TECHNICAL DOCUMENTATION - NOT FOR RESALE