AR6A thru AR6M Pb Free Plating Product ® Pb AR6A thru AR6M 6.0 Ampere Glass Passivated Avalanche Rectifier Diodes DO-201AD Unit: inch(mm) Features .375(9.5) Mechanical Data Cases: Molded plastic Epoxy: UL 94V-0 rate flame retardant Lead: Pure tin plated, lead free., solderable per MIL-STD-202, Method 208 guaranteed Polarity: Color band denotes cathode High temperature soldering guaranteed: 260 oC /10 seconds/.375”,(9.5mm) lead lengths at 5 lbs.,(2.3kg) tension Weight: 1.9 gram approximately .210(5.3) .188(4.8) 1.0(25.4)MIN. .052(1.3) .048(1.2) 1.0(25.4)MIN. Glass passivated chip junction. High efficiency, Low VF High current capability High reliability High surge current capability Low power loss .285(7.2) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Rating at 25oC ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%. SYMBOL AR6A AR6B AR6D AR6F AR6J AR6K AR6M UNIT Maximum Recurrent Peak Reverse Voltage VRRM 50 100 200 300 600 800 1000 V Maximum RMS Voltage VRMS 35 70 140 210 420 560 700 V VDC 50 100 200 300 600 800 1000 V Maximum DC Blocking Voltage Maximum Average Forward Rectified o Current TA=75 C I(AV) 6.0 A IFSM 200 A VF 1.1 V 1.0 uA 10 uA Peak Forward Surge Current, 8.3ms single Half sine-wave superimposed on rated load (JEDEC method) Maximum Instantaneous Forward Voltage @ 6.0 A o Maximum DC Reverse Current @TJ=25 C o At Rated DC Blocking Voltage @TJ=125 C IR Typical junction Capacitance (Note 1) CJ Typical Thermal Resistance (Note 2) Operating Junction and Storage Temperature Range R JA TJ,TSTG 50 20 -65 to +150 pF o C/W o C NOTES : (1) Thermal Resistance junction to ambient. (2) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts DC. Rev.06 © 2006 Thinki Semiconductor Co.,Ltd. Page 1/2 http://www.thinkisemi.com/ AR6A thru AR6M ® FIG.2 - MAXIMUM NON-REPETITIVE PEAK FORWARD SURGE CURRENT FIG.1- MAXIMUM FORWARD CURRENT DERATING CURVE 6 Single PhaseHalf Wave 60Hz Resistive of Inductive Load Ground plane 1" x 1" Copper surface area PC BOARD Recommanded 5 4 PEAK FORWARD SURGE CURRENT, AMPERES IFSM(A) AVERAGE FORWARD CURRENT AMPERES 6.5 3 PC Board PC Board 2 Mounting 1 Standard PC Board Mounting 0 0 20 40 60 80 100 120 140 160 180 200 o AMBIENT TEMPERATURE. ( C) 200 170 8.3ms Single Half Sine Wave JEDEC Method 140 110 90 60 30 0 1 2 10 20 100 Number of Cycles NUMBER OF CYCLES AT 60Hz FIG.4 - TYPICAL REVERSE CHARACTERISTICS 10 100 INSTANTANEOUS REVERSE CURRENT, MICROAMPERES IINSTANTANEOUS FORWARD CURRENT, AMPERES FIG.3 - TYPICAL INSTANTANEOUS FORWARD CHARACTERISTICS 1.0 0.1 o TJ=25 C PULSE WIDTH=300uS 1% DUTY CYCLE 0.01 0.2 0.4 0.6 0.8 1.0 1.2 1.4 o TJ=125 C 10 1 o TJ=25 C 0.1 0.01 1.6 0 INSTANTANEOUS FORWARD VOLTAGE, VOLTS 20 40 60 80 100 PERCENT OF RATED PEAK REVERSE VOLTAGE,% FIG.5 - TYPICAL JUNCTION CAPACITANCE JUNCTION CAPACITANCE, pF 1000 o TJ = 25 C f = 1.0 MHZ Vsig = 50mVp-p 100 10 0.1 1.0 4.0 10 100 REVERSE VOLTAGE, VOLTS Rev.06 © 2006 Thinki Semiconductor Co.,Ltd. Page 2/2 http://www.thinkisemi.com/