1/4 Structure Silicon Monolithic Integrated Circuit Product Name IrDA Controller LSI built-in Ir remote control Model name BU92747GUW Outer Dimension Figure 1 Outer Dimensions Features ・Data transfer speed (bps) IrDA SIR: 2.4kbps, 9.6kbps, 19.2kbps, 38.4kbps, 57.6kbps and 115.2kbps IrDA MIR: 0.576Mbps, 1.152Mbps IrDA FIR: 4Mbps IrSimple ・Interface 16-bit data bus , Address A0-3 ・Built-in 2560 × 2byte FIFO buffer (for transmission and reception) ・Accessible as a memory device connected to the bus ・Power down mode setting possible for transmission and reception ・Input clock of 48MHz for external input clock and crystal input clock ・Ir remote control function Serial 2-lines SDA, and SCL *This LSI chip is not subject to radiation-proof design. ●Absolute Maximum Rating Ta=25°C unless otherwise stated Item Symbol Minimum Maximum *1 Supply voltage VDD -0.3 2.5 Interface supply voltage1*1 VIO1 -0.3 4.5 Interface supply voltage2*1 VIO2 -0.3 4.5 *1 Input voltage VIN -0.3 VIO1, 2+0.3 Power dissipation*2 Pd 800 Operating temperature range TOPR -40 85 Storage temperature range TSTG -55 125 *1 It applies to all pins based on the GND pin. *2 measured value with conformity substrate to SEMI (114.3mm×76.2mm×1.6mm、4layer) 8.0mW/℃ decrease over Ta=25℃ use ●Operation Range Item Supply voltage Interface supply voltage1 Interface supply voltage2*3 Symbol VDD VIO1 VIO2 Minimum 1.62 1.62 1.62 Standard 1.8 1.8 1.8 *3 VIO2 is connected with XIN/CLK48M, XOUT, PWDN, NIRQ and RESET. Status of this document The Japanese version of this document is the formal specification. A customer may use this translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document, formal version takes priority. REV. A Maximum 1.98 3.6 3.6 Unit V V V V mW °C °C Unit V V V 2/4 ●Electrical Characteristics (DC Characteristics) Ta=25°C, VDD=1.8V, VIO1=1.8V, VIO2=1.8V and GND=0V unless otherwise stated Standard value Item Symbol Unit MIN TYP MAX Dissipation current 1 IDD1 0.1 10 µA Dissipation current 2 IDD2 10 30 mA Digital high-level input voltage VIH 0.75 × VIO V Digital low-level input voltage VIL 0.25 × VIO V 10 µA Digital high-level input current IIH 100 µA Digital low-level input current IIL 10 µA Digital high-level output voltage VOH VIO-0.6 - - V Digital low-level output voltage VOL - - 0.6 V Remarks For input with no output load = 0V For XIN = 48MHz Input voltage level 1.8V Input voltage level 1.8V TEST1-3 Input voltage level GND INTR, D0-15, IrDAPWDOWN, IrTX, IrRC, NIRQ, CTLA IOH=-1mA INTR, D0-15, IrDAPWDOWN, IrTX, IrRC, SDA, NIRQ, CTLA IOL=1mA ●Pin Description Pin name I/O Condition of after reset IrRX EXTIR I I - IrTX O L D0-15 A0-3 I/O I Input - CS I - RD WR I I - INTR O H RESET I - PWDN I - IrRC O L CTLA SCL SDA O I I/O L Input NIRQ O H XIN/CLK48M I O I - O H - - XOUT TEST1-3 IrDA PWDOWN VDD VIO1 VIO2 GND Pin Function IrDA Receive Input Pin Signal Input Pin in SM2="H" (Input Signal is outputted to IrTX or IrRC) IrDA and remote control Transmission Output Pin Transmission IrDA when RC_EN= "L" Transmission remote control when RC_EN="H", RC_MODE="H" Data I/O Pin Address Input Pin Chip Select Pin. Low (L) Active The read/write signal goes “Active” in a Low period. Read Signal Input Pin. Low (L) Active Write Signal Input Pin. Low (L) Active CPU Interrupt Request Output Pin (IrDA controller) The signal goes “Low” when an interrupt condition takes place. Reset Input Pin. Low (L) Active The signal causes the internal register settings, etc. to be initialized. Power Down Mode Setting. Low (L) Active When set to Low (L), this signal causes the wait status and sets the low dissipation current mode. After the power down mode is removed, RESET=L must set to Low until crystal clock oscillation becomes stable (about 2 or 3 ms). After that RESET must set to High. Take it into consideration that this period depends on the crystal in use. Remote control transmission Output pin Transmission remote control when RC_EN= "H", RC_MODE= "L" Control Signal Output Pin Serial clock Serial data I/O Pin CPU Interrupt Request Output Pin (Ir remote control) The signal goes “Low” when an interrupt condition takes place. Crystal IN / External CLK Input Crystal OUT (N.C when external input clock is used) Test pins (These pins must be GND during normal operation.) IrDA module control signal output pin These pins must be OPEN for IrDA modules having no power-down pin. Power supply pin Interface power supply voltage1 Interface power supply voltage2 Ground pin REV. A Circuit Diagram B B A C B B B B A B B A A F G A E E D A - 3/4 ●Equivalent Circuit Diagram PWDN XIN A B D C XOUT E F G ●Outer Dimensions Figure1 Outer Dimensions(VBGA048W040) 4.0±0.1 7 6 5 4 3 2 1 4.0±0.1 P = 0.5×6 0.5 1 PIN MARK U747W 0.10 0.9MAX 48-φ0.295±0.05 M S AB ○ 0.05○ 0.5 P = 0.5×6 0.5±0.1 A S 0.08 B 0.5±0.1 Lot No. Ａ B Ｃ D E F G (unit : mm) number of balls : 48 S S VBGA048W040 Land Matrix Table Land Land Pin Name Matrix No. Matrix No. A1 PWDN C1 A2 XOUT C2 A3 SCL C3 A4 IrRC C4 A5 IrTX C5 A6 IrRX C6 A7 GND C7 VIO2 NIRQ RESET (NC) EXTIR VIO1 RD Land Matrix No. E1 E2 E3 E4 E5 E6 E7 Pin Name Pin Name A2 A1 A0 D15 D14 D13 D12 (NC) (NC) D1 VIO1 F1 D11 B2 B3 B4 B5 B6 B7 XIN SDA CTLA IrDAPWDN VDD WR D2 D3 D4 D5 D6 D7 A3 TEST1 TEST2 TEST3 INTR CS F2 F3 F4 F5 F6 F7 VDD D10 D9 D8 D7 D6 REV. A Land Matrix No. G1 G2 G3 G4 G5 G6 G7 Pin Name GND D5 D4 D3 D2 D1 D0 4/4 ●Notes for use (1) Absolute maximum ratings Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range may result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when such damage is suffered. A physical safety measure such as a fuse should be implemented when use of the IC in a special mode where the absolute maximum ratings may be exceeded is anticipated. (2) Mutual impedance Use short and wide wiring tracks for the power supply and ground to keep the mutual impedance as small as possible .Use a capacitor to keep ripple to a minimum. (3) GND potential Ensure a minimum GND pin potential in all operating conditions. (4) Short circuit mode between terminals and wrong mounting In order to mount the IC on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can destroy the IC. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the GND terminal, the IC can destroy (5) Setting of heat Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. (6) Actions in strong magnetic field Use caution when using the IC in the presence of a strong magnetic field as doing so may cause the IC to malfunction. (7) Ground Wiring Pattern When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external components, either. (8) When power is first supplied the CMOS IC, it is possible that the internal logic may be unstable and rush current may flow instantaneously. Therefore, give special consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of connections. (9) For ICs with more than one power, it is possible than rush current many flow instantaneously due to the internal powering sequence and delays. Therefore, give special consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of wiring. REV. A Appendix Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM CO.,LTD. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact your nearest sales office. ROHM Customer Support System www.rohm.com Copyright © 2008 ROHM CO.,LTD. THE AMERICAS / EUROPE / ASIA / JAPAN Contact us : webmaster@ rohm.co. jp 21 Saiin Mizosaki-cho, Ukyo-ku, Kyoto 615-8585, Japan TEL : +81-75-311-2121 FAX : +81-75-315-0172 Appendix1-Rev3.0