ROHM BU92747GUW

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Structure
Silicon Monolithic Integrated Circuit
Product Name
IrDA Controller LSI built-in Ir remote control
Model name
BU92747GUW
Outer Dimension
Figure 1 Outer Dimensions
Features
・Data transfer speed (bps)
IrDA SIR: 2.4kbps, 9.6kbps, 19.2kbps, 38.4kbps, 57.6kbps and 115.2kbps
IrDA MIR: 0.576Mbps, 1.152Mbps
IrDA FIR: 4Mbps
IrSimple
・Interface
16-bit data bus , Address A0-3
・Built-in 2560 × 2byte FIFO buffer (for transmission and reception)
・Accessible as a memory device connected to the bus
・Power down mode setting possible for transmission and reception
・Input clock of 48MHz for external input clock and crystal input clock
・Ir remote control function
Serial 2-lines SDA, and SCL
*This LSI chip is not subject to radiation-proof design.
●Absolute Maximum Rating
Ta=25°C unless otherwise stated
Item
Symbol
Minimum
Maximum
*1
Supply voltage
VDD
-0.3
2.5
Interface supply voltage1*1
VIO1
-0.3
4.5
Interface supply voltage2*1
VIO2
-0.3
4.5
*1
Input voltage
VIN
-0.3
VIO1, 2+0.3
Power dissipation*2
Pd
800
Operating temperature range
TOPR
-40
85
Storage temperature range
TSTG
-55
125
*1 It applies to all pins based on the GND pin.
*2 measured value with conformity substrate to SEMI (114.3mm×76.2mm×1.6mm、4layer)
8.0mW/℃ decrease over Ta=25℃ use
●Operation Range
Item
Supply voltage
Interface supply voltage1
Interface supply voltage2*3
Symbol
VDD
VIO1
VIO2
Minimum
1.62
1.62
1.62
Standard
1.8
1.8
1.8
*3 VIO2 is connected with XIN/CLK48M, XOUT, PWDN, NIRQ and RESET.
Status of this document
The Japanese version of this document is the formal specification.
A customer may use this translation version only for a reference to help reading the formal version.
If there are any differences in translation version of this document, formal version takes priority.
REV. A
Maximum
1.98
3.6
3.6
Unit
V
V
V
V
mW
°C
°C
Unit
V
V
V
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●Electrical Characteristics (DC Characteristics)
Ta=25°C, VDD=1.8V, VIO1=1.8V, VIO2=1.8V and GND=0V unless otherwise stated
Standard value
Item
Symbol
Unit
MIN
TYP
MAX
Dissipation current 1
IDD1
0.1
10
µA
Dissipation current 2
IDD2
10
30
mA
Digital high-level input voltage
VIH
0.75 × VIO
V
Digital low-level input voltage
VIL
0.25 × VIO
V
10
µA
Digital high-level input current
IIH
100
µA
Digital low-level input current
IIL
10
µA
Digital high-level output voltage
VOH
VIO-0.6
-
-
V
Digital low-level output voltage
VOL
-
-
0.6
V
Remarks
For input with no output load = 0V
For XIN = 48MHz
Input voltage level 1.8V
Input voltage level 1.8V
TEST1-3
Input voltage level GND
INTR, D0-15, IrDAPWDOWN,
IrTX, IrRC, NIRQ, CTLA
IOH=-1mA
INTR, D0-15, IrDAPWDOWN,
IrTX, IrRC, SDA, NIRQ, CTLA
IOL=1mA
●Pin Description
Pin name
I/O
Condition
of after
reset
IrRX
EXTIR
I
I
-
IrTX
O
L
D0-15
A0-3
I/O
I
Input
-
CS
I
-
RD
WR
I
I
-
INTR
O
H
RESET
I
-
PWDN
I
-
IrRC
O
L
CTLA
SCL
SDA
O
I
I/O
L
Input
NIRQ
O
H
XIN/CLK48M
I
O
I
-
O
H
-
-
XOUT
TEST1-3
IrDA
PWDOWN
VDD
VIO1
VIO2
GND
Pin Function
IrDA Receive Input Pin
Signal Input Pin in SM2="H" (Input Signal is outputted to IrTX or IrRC)
IrDA and remote control Transmission Output Pin
Transmission IrDA when RC_EN= "L"
Transmission remote control when RC_EN="H", RC_MODE="H"
Data I/O Pin
Address Input Pin
Chip Select Pin. Low (L) Active
The read/write signal goes “Active” in a Low period.
Read Signal Input Pin. Low (L) Active
Write Signal Input Pin. Low (L) Active
CPU Interrupt Request Output Pin (IrDA controller)
The signal goes “Low” when an interrupt condition takes place.
Reset Input Pin. Low (L) Active
The signal causes the internal register settings, etc. to be initialized.
Power Down Mode Setting. Low (L) Active
When set to Low (L), this signal causes the wait status and sets the low
dissipation current mode. After the power down mode is removed,
RESET=L must set to Low until crystal clock oscillation becomes stable
(about 2 or 3 ms). After that RESET must set to High.
Take it into consideration that this period depends on the crystal in use.
Remote control transmission Output pin
Transmission remote control when RC_EN= "H", RC_MODE= "L"
Control Signal Output Pin
Serial clock
Serial data I/O Pin
CPU Interrupt Request Output Pin (Ir remote control)
The signal goes “Low” when an interrupt condition takes place.
Crystal IN / External CLK Input
Crystal OUT (N.C when external input clock is used)
Test pins (These pins must be GND during normal operation.)
IrDA module control signal output pin
These pins must be OPEN for IrDA modules having no power-down pin.
Power supply pin
Interface power supply voltage1
Interface power supply voltage2
Ground pin
REV. A
Circuit
Diagram
B
B
A
C
B
B
B
B
A
B
B
A
A
F
G
A
E
E
D
A
-
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●Equivalent Circuit Diagram
PWDN
XIN
A
B
D
C
XOUT
E
F
G
●Outer Dimensions
Figure1 Outer Dimensions(VBGA048W040)
4.0±0.1
7 6 5 4 3 2 1
4.0±0.1
P = 0.5×6
0.5
1 PIN MARK
U747W
0.10
0.9MAX
48-φ0.295±0.05
M S AB
○ 0.05○
0.5
P = 0.5×6
0.5±0.1
A
S
0.08
B
0.5±0.1
Lot No.
A
B
C
D
E
F
G
(unit : mm)
number of balls : 48
S
S
VBGA048W040 Land Matrix Table
Land
Land
Pin Name
Matrix No.
Matrix No.
A1
PWDN
C1
A2
XOUT
C2
A3
SCL
C3
A4
IrRC
C4
A5
IrTX
C5
A6
IrRX
C6
A7
GND
C7
VIO2
NIRQ
RESET
(NC)
EXTIR
VIO1
RD
Land
Matrix No.
E1
E2
E3
E4
E5
E6
E7
Pin Name
Pin Name
A2
A1
A0
D15
D14
D13
D12
(NC)
(NC)
D1
VIO1
F1
D11
B2
B3
B4
B5
B6
B7
XIN
SDA
CTLA
IrDAPWDN
VDD
WR
D2
D3
D4
D5
D6
D7
A3
TEST1
TEST2
TEST3
INTR
CS
F2
F3
F4
F5
F6
F7
VDD
D10
D9
D8
D7
D6
REV. A
Land
Matrix No.
G1
G2
G3
G4
G5
G6
G7
Pin Name
GND
D5
D4
D3
D2
D1
D0
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●Notes for use
(1) Absolute maximum ratings
Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range
may result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open
mode) when such damage is suffered. A physical safety measure such as a fuse should be implemented when
use of the IC in a special mode where the absolute maximum ratings may be exceeded is anticipated.
(2) Mutual impedance
Use short and wide wiring tracks for the power supply and ground to keep the mutual impedance
as small as possible .Use a capacitor to keep ripple to a minimum.
(3) GND potential
Ensure a minimum GND pin potential in all operating conditions.
(4) Short circuit mode between terminals and wrong mounting
In order to mount the IC on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous
mounting can destroy the IC. Furthermore, if a short circuit occurs due to foreign matters entering between
terminals or between the terminal and the power supply or the GND terminal, the IC can destroy
(5) Setting of heat
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating
conditions.
(6) Actions in strong magnetic field
Use caution when using the IC in the presence of a strong magnetic field as doing so may cause the IC to
malfunction.
(7) Ground Wiring Pattern
When using both small signal and large current GND patterns, it is recommended to isolate the two ground
patterns, placing a single ground point at the application's reference point so that the pattern wiring resistance
and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be
careful not to change the GND wiring pattern of any external components, either.
(8) When power is first supplied the CMOS IC, it is possible that the internal logic may be unstable and rush current
may flow instantaneously.
Therefore, give special consideration to power coupling capacitance, power wiring, width of GND wiring, and
routing of connections.
(9) For ICs with more than one power, it is possible than rush current many flow instantaneously due to the internal
powering sequence and delays.
Therefore, give special consideration to power coupling capacitance, power wiring, width of GND wiring, and
routing of wiring.
REV. A
Appendix
Notes
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Appendix1-Rev3.0