ZSSC3170

Data Sheet
Rev. 2.50 / December 2014
ZSSC3170
Automotive Sensor Signal Conditioner
with LIN and PWM Interface
Automotive ICs
Adaptable and Rugged
ZSSC3170
Automotive Sensor Signal Conditioner with LIN & PWM Interface
Brief Description
Benefits
The ZSSC3170 is a CMOS integrated circuit for highly
accurate amplification and sensor specific correction
of bridge sensor signals. Featuring a maximum analog
gain of 420, as well as extended offset compensation
capabilities, the ZSSC3170 is adjustable to nearly all
resistive bridge sensor types.

Digital compensation of offset, sensitivity, temperature
drift, and nonlinearity is accomplished via a 16-bit
RISC microcontroller. Conditioning coefficients are
stored in an EEPROM certified for automotive applications.

Measured values are provided by one of the digital
LIN or PWM interfaces. Each interface can support
end-of-line calibration using the sensor output. Noise
sensitivity is greatly reduced because the calibration
equipment and the ZSSC3170 are mated digitally.
Available Support






Physical Characteristics



Features










Complies with LIN specifications 1.3 / 2.0 / 2.1
Configurable LIN publisher frame content
Data conversion rate of up to 430Hz fully utilizes
the maximum LIN channel capacity of 20kbit/s
PWM high-side and low-side switches, support for
LIN communication for end-of-line calibration
Digital compensation of offset, gain, temperature
nd
rd
effects up to 2 order, and nonlinearity up to 3
order. Compensation of temperature sensor offset,
nd
gain, and nonlinearity up to 2 order.
Internal or external temperature reference
Media temperature sensing by diode or RTD
Load dump protection of the LIN pin up to ±40V
Accuracy
±0.25% FSO @ -20 to 85°C
±0.50% FSO @ -40 to 125°C
±1.00% FSO @ -40 to 150°C
3 EEPROM words available for optional user data
Evaluation Kit
Application Notes
Calculation Tools





Supply voltage: 7 to 18 V
Current consumption in Sleep Mode: ≤ 100μA
Input span: 1.8 to 267 mV/V
ADC resolution: 13 to 14 bit
Output resolution: up to 12-bit (LIN and PWM)
Operating temperature range: -40 to 125°C
Extended operating temperature range: ≤150°C
Package: SSOP20, DFN20, or die
ZSSC3170 Basic Circuit
LIN
GND
VBAT
ZSSC3170
For quick and easy evaluation and support for
calibrating prototypes, ZMDI offers the ZSSC3170
SSC Evaluation Kit, which includes evaluation hardware, SSOP20 samples, and software.

Measurand and temperature signal available via
one output pin
Compatible with nearly all resistive bridge inputs
No external trimming components required
Single-pass calibration minimizes calibration costs
End-of-line calibration using sensor output
Optimized for automotive environments with
special protection circuitry, excellent electromagnetic compatibility, and numerous diagnostic
features
For more information, contact ZMDI via [email protected].
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50 — December 10, 2014. All rights reserved. The material contained herein may not be reproduced, adapted, merged,
translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
ZSSC3170
Automotive Sensor Signal Conditioner with LIN & PWM Interface
ZSSC3170 Block Diagram
VDDA
SCL
I2CTM*
Control Registers
Ext. Temp.
Diode
SDA
VBR_T
Sensor
Bridge
HOUT
Temp. Sens.
Select
VTN1
VBN
MUX
Gain
Factor
Offset
Shift
ADC
Mode
PGA
PWM
RAM
LOUT
ADC
CMC
LIN
LIN
Protection &
Power
Management
VB

Ext. RTD
VBP
Analog Front-End (AFE)
VTN2
VBR_B
VSSA
EEPROM
Internal
Temp.
Sensor
Digital Block
VSSE
Interfaces
ZSSC3170
* I2C™ is a trademark of NXP.
Applications
LIN Pressure Sensor with Temperature Sensor
LIN
11 LIN
12 LOUT
13 n.c.
VSSE
9
VB
8
14
VBN
15
VBR_B
HOUT 7
16
VBP
17
VTN 1
18
VBR_T
VSSA 3
19
VTN2
VDDA
20
n.c.
ZSSC3170
Sensor Bridge
With Integrated
Temperature Diode
C3
220pF
VSS 10
GND
VBAT
C2
220nF
R1
10W
VDD
6
SCL
5
SCL
SDA
4
SDA
RTD Media
Temperature
Sensor

R2
2
n.c. 1
C1
100nF
Ordering Information (See section 7 of the data sheet for additional options.)
Product Sales Code
Description
Package
ZSSC3170EE1B
ZSSC3170 Die — Temperature range: -40°C to +150°C
Unsawn on Wafer, 2450 pcs.
ZSSC3170EE1C
ZSSC3170 Die — Temperature range: -40°C to +150°C
Sawn on Wafer Frame, 2450 pcs.
ZSSC3170EE2
ZSSC3170— SSOP20 — Temperature range: -40°C to +150°C
Add R for 13” reel, 2000 pcs.
Add T for tube, 660 pcs.
ZSSC3170EE3R
ZSSC3170 DFN20 – Temperature Range -40°C to +150°C
Tape & Reel - 13"
ZSSC3170EA1B
ZSSC3170 Die — Temperature range: -40°C to +125°C
Unsawn on Wafer, 2450 pcs.
ZSSC3170EA1C
ZSSC3170 Die — Temperature range: -40°C to +125°C
Sawn on Wafer Frame, 2450 pcs.
ZSSC3170EA3R
ZSSC3170 DFN20 – Temperature Range -40°C to +125°C
Tape & Reel - 13"
ZSSC3170KIT
ZSSC3170 Evaluation Kit and 5 SSOP20 samples
Kit
Sales and Further Information
www.zmdi.com
[email protected]
Zentrum Mikroelektronik
Dresden AG
Global Headquarters
Grenzstrasse 28
01109 Dresden, Germany
ZMD America, Inc.
1525 McCarthy Blvd., #212
Milpitas, CA 95035-7453
USA
Central Office:
Phone +49.351.8822.0
Fax
+49.351.8822.600
USA Phone +855.275.9634
Phone +408.883.6310
Fax
+408.883.6358
European Technical Support
Phone +49.351.8822.7.772
Fax
+49.351.8822.87.772
DISCLAIMER: This information applies to a product under development. Its characteristics and specifications are subject to change without notice.
Zentrum Mikroelektronik Dresden AG (ZMD AG) assumes no obligation regarding future manufacture unless otherwise agreed to in writing. The
information furnished hereby is believed to be true and accurate. However, under no circumstances shall ZMD AG be liable to any customer,
licensee, or any other third party for any special, indirect, incidental, or consequential damages of any kind or nature whatsoever arising out of or
in any way related to the furnishing, performance, or use of this technical data. ZMD AG hereby expressly disclaims any liability of ZMD AG to any
customer, licensee or any other third party, and any such customer, licensee and any other third party hereby waives any liability of ZMD AG for
any damages in connection with or arising out of the furnishing, performance or use of this technical data, whether based on contract, warranty,
tort (including negligence), strict liability, or otherwise.
European Sales (Stuttgart)
Phone +49.711.674517.55
Fax
+49.711.674517.87955
Zentrum Mikroelektronik
Dresden AG, Japan Office
2nd Floor, Shinbashi Tokyu Bldg.
4-21-3, Shinbashi, Minato-ku
Tokyo, 105-0004
Japan
ZMD FAR EAST, Ltd.
3F, No. 51, Sec. 2,
Keelung Road
11052 Taipei
Taiwan
Phone +81.3.6895.7410
Fax
+81.3.6895.7301
Phone +886.2.2377.8189
Fax
+886.2.2377.8199
Zentrum Mikroelektronik
Dresden AG, Korea Office
U-space 1 Building
Unit B, 906-1
660, Daewangpangyo-ro
Bundang-gu, Seongnam-si
Gyeonggi-do, 463-400
Korea
Phone +82.31.950.7679
Fax
+82.504.841.3026
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50 — December 10, 2014
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner.
ZSSC3170
Automotive Sensor Signal Conditioner with LIN & PWM Interface
Contents
1
2
ZSSC3170 Characteristics ............................................................................................................ 6
1.1
1.2
Absolute Maximum Ratings ..................................................................................................... 6
Operating Conditions............................................................................................................... 7
1.3
Electrical Parameters .............................................................................................................. 7
1.4
Interface Characteristics ........................................................................................................ 12
1.5
EEPROM .............................................................................................................................. 12
Circuit Description ....................................................................................................................... 13
2.1
2.2
Signal Flow and Block Diagram ............................................................................................. 13
Application Modes ................................................................................................................. 14
2.3
Analog Front End (AFE) ........................................................................................................ 15
2.3.1
2.3.2
2.3.3
2.4
Temperature Measurement ................................................................................................... 18
2.5
System Control and Conditioning Calculation ........................................................................ 19
2.5.1
Operating Modes ............................................................................................................. 19
2.5.2
Start-Up Phase ................................................................................................................ 19
2.5.3
Measurement Cycle ......................................................................................................... 20
2.5.4
Conditioning Calculation .................................................................................................. 21
2.6
3
4
Programmable Gain Amplifier (PGA) ............................................................................... 15
Offset Compensation ....................................................................................................... 15
Analog-to-Digital Converter ............................................................................................. 16
Signal Outputs....................................................................................................................... 21
2.6.1
PWM Outputs HOUT and LOUT ...................................................................................... 21
2.6.2
LIN Output ....................................................................................................................... 22
2.7
Digital Test and Calibration Interface ..................................................................................... 22
2.8
Diagnostic and Failsafe Features, Watchdog, and Error Detection ........................................ 22
2.9
High Voltage, Reverse Polarity, and Short Circuit Protection ................................................. 22
Application Circuit Examples and External Components ............................................................. 23
3.1
Application Circuit Examples ................................................................................................. 23
3.2
Dimensioning of External Components.................................................................................. 24
Pinout and Package Options ....................................................................................................... 25
4.1
4.2
Die Pad Definitions and Configuration ................................................................................... 25
SSOP20 Package ................................................................................................................. 26
4.3
DFN20 Package .................................................................................................................... 28
Data Sheet
December 10, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
4 of 32
ZSSC3170
Automotive Sensor Signal Conditioner with LIN & PWM Interface
5
ESD Protection and EMC Specification ....................................................................................... 29
6
Reliability and RoHS Conformity ................................................................................................. 29
7
Ordering Information ................................................................................................................... 29
8
Related Documents ..................................................................................................................... 30
9
Glossary ...................................................................................................................................... 30
10 Document Revision History ......................................................................................................... 32
List of Figures
Figure 2.1 Block Diagram of ZSSC3170 .......................................................................................... 13
Figure 2.2 Measurement Cycle ........................................................................................................ 20
Figure 3.1 Application Circuit in PWM Mode with Low-Side Switch .................................................. 23
Figure 3.2 Application Circuit in PWM Mode with High-Side Switch ................................................. 23
Figure 3.3 Application Circuit in LIN Mode........................................................................................ 24
Figure 4.1 Die Pad Configuration ..................................................................................................... 25
Figure 4.2 SSOP20 Package Drawing ............................................................................................. 27
Figure 4.3 DFN20 Package Drawing ................................................................................................ 28
List of Tables
Table 1.1
Table 1.2
Absolute Maximum Ratings ............................................................................................... 6
Operating Conditions......................................................................................................... 7
Table 1.3
Electrical Parameters ........................................................................................................ 7
Table 1.4
Interface Characteristics .................................................................................................. 12
Table 1.5
EEPROM ........................................................................................................................ 12
Table 2.1
Configuration for Application Modes ................................................................................ 14
Table 2.2
Adjustable Gain Stages, Corresponding Sensor Signal Spans, and Common Mode Ranges
........................................................................................................................................ 15
Table 2.3
Bridge Sensor Offset Shift Ranges .................................................................................. 16
Table 2.4
A/D Resolution and Conversion Time in PWM Modes ..................................................... 17
Table 2.5
A/D Resolution and Conversion Time in LIN Modes ........................................................ 17
Table 3.1
Dimensioning of External Components for Application Examples .................................... 24
Table 4.1
Die Pad Definitions for ZSSC3170 .................................................................................. 25
Table 4.2
Pin Definition of SSOP20 Package .................................................................................. 26
Data Sheet
December 10, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
5 of 32
ZSSC3170
Automotive Sensor Signal Conditioner with LIN & PWM Interface
1
ZSSC3170 Characteristics
1.1 Absolute Maximum Ratings
The absolute maximum ratings are stress ratings only. The device might not function or be operable above the
recommended operating conditions given in section 1.2. Stresses exceeding the absolute maximum ratings might
also damage the device. In addition, extended exposure to stresses above the recommended operating
conditions might affect device reliability. ZMDI does not recommend designing to the “Absolute Maximum
Ratings.”
Parameters are valid without time limit unless otherwise noted.
Table 1.1
Absolute Maximum Ratings
No.
Parameter
Symbol
1.1.1
External Supply Voltage —
1), 2)
PWM Mode
VBATPWM
1.1.2
Supply Voltage on VB Pin—
1), 2)
PWM Mode
VBPWM
1.1.3
External Supply Voltage —
1), 2)
LIN Mode
VBATLIN
1.1.4
Supply Voltage on VB Pin—
1) 2)
LIN Mode
1.1.5
Voltage at HOUT and
1) 2)
LOUT Pins
1.1.6
Voltage at LIN pin
1) 2)
Unit
V
To VSSE
-0.3
18
V
To VSS (external GND)
-18
40
V
VBLIN
To VSS
-0.3
40
V
VHOUT,
VLOUT
To VSSE
-18
18
V
To VSS
-40
40
V
VDDA
To VSSA
-0.3
6.5
V
VDD
To VSSA
-0.3
6.5
V
To VSSA
-0.3
VDDA
+0.3
V
-40
150
C
-40
170
C
1.1.8
Digital Supply Voltage
1.1.9
Voltage at all other Analog or
3)
Digital Pins
VAIO,
VDIO
1.1.10
Storage Temperature
TSTOR
1.1.11
Extended Storage Temperature
TSTRG_EXT
t < 10h
1)
Refer to ZSSC3170_HighVoltageProt_Rev_X.xy.pdf for detailed specifications.
2)
Refer to section 3.1 for the application circuit.
3)
No measurement in mass production; parameter is guaranteed by design and/or quality monitoring.
December 10, 2014
Max
18
Analog Supply Voltage
Data Sheet
Typ
-18
1.1.7
3)
Min
To VSSE (external GND)
VLIN
3)
Conditions
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
6 of 32
ZSSC3170
Automotive Sensor Signal Conditioner with LIN & PWM Interface
1.2 Operating Conditions
Parameters are valid for the full operating temperature range without time limit unless otherwise noted.
Table 1.2
Operating Conditions
No.
Parameter
1.2.1
Supply Voltage
Symbol
Conditions
Min
Typ
Max
Unit
VB
Voltage at pin VB to VSSE
8.2
12
16.5
V
7
12
18
V
-40
125
C
1)
1)
1.2.2
Supply Voltage - LIN Mode
1.2.3
Ambient Temperature
1.2.4
Extended Ambient Temperature
(ZSSC3170EExx only)
TAMB_EXT
1000h @ +150°C
125
150
C
1.2.5
Ambient Temperature
EEPROM Programming
TAMB_EEP
See section 1.5.
-40
150
C
1.2.6
Bridge Resistance
2
25
kW
1)
2)
VBLIN
Voltage at pin VB to VSS
TAMB
2)
RBR
Refer to ZSSC3170_HighVoltageProt_Rev*.pdf for detailed specification.
No measurement in mass production; parameter is guaranteed by design and / or quality monitoring.
1.3 Electrical Parameters
If not otherwise specified, all parameter limits are valid within operating conditions defined in section 1.2 and without time limit. All voltages are related to VSSA, if not otherwise specified.
Note: Refer to the important notes at the end of the table (page 11).
Table 1.3
Electrical Parameters
No.
Parameter
Conditions
Min
Typ
Max
Unit
7
mA
40
100
µA
5
6
V
Supply Current and Internal Supply Voltages
1.3.1
1.3.1.1
Symbol
Supply Current
IS
Excluding bridge supply
current; excluding PWM
current; oscillator adjusted
(typical 2 MHz)
LIN Sleep Mode without
current over LIN wire; PWM
output pins not connected;
VBLIN = 14.4V for max. value
VLIN=VBLIN
1.3.1.2
Supply Current
LIN Sleep Mode
1.3.1.3
Internal Supply Voltage
(generated internally)
VVDA
VVDA = VVDDA - VVSSA
at RBR ≥ 2kW (see 1.2.6)
4.3
1.3.1.4
Supply Voltage Sensor
Bridge (internally at VDDA
and VSSA)
VVBR
VVBR = VVBR_T - VVBR_B
at RBR ≥ 2kW (see 1.2.6)
VVDA –
0.3V
Data Sheet
December 10, 2014
IS_LINSLP
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
VVDA
7 of 32
ZSSC3170
Automotive Sensor Signal Conditioner with LIN & PWM Interface
No.
Parameter
Symbol
Conditions
Typ
Max
Unit
275
mV/V
388
%
VIN_SPAN
-2
2
nA
0.29
0.65
VVBR
1300
ppm
FS/mV
40
A
0
1.5
V
1200
4500
ppm
FS/
(mV/V)
V
Analog Front End (see section 2.3)
1.3.2
1.3.2.1
Input Voltage Range
1.3.2.2
Maximum Bridge Sensor
Offset Compensation
1.3.2.3
Bridge Input Current
1)
Difference
IIN_DIFF
TAMB = -25°C to 85°C
1.3.2.4
Common Mode Input
Voltage Range
VIN_CM
Dependent on selected gain,
XZC off (see Table 2.2);
see 1.3.1.4 for VVBR
1.3.3
VIN_SPAN
OC
Analog gain: 2.8 to 420
1
Depending on selected gain
(see Table 2.3)
Temperature Measurement (see section 2.4)
1.3.3.1
External Temperature
Diode Channel Gain
ATSED
1.3.3.2
External Temperature
Diode Bias Current
ITSED
1.3.3.3
External Temperature
1)
Diode Input Range
VTSED
1.3.3.4
External Temperature
Resistor Channel Gain
ATSER
1.3.3.5
External Temperature
1)
Resistor Input Range
VTSER
Relative to VVDDA-VVSSA
1.3.3.6
Internal Temperature
Diode Sensitivity
STTSI
Raw values, without
conditioning calculation
FS = Full Scale
300
10
Relative to VVBR_T
20
70%
100%
VVDDA-VVSSA
VVDDA-VVSSA
700
2700
ppm
FS/K
20
100
kW
12
nF
1.2
nF
1000
W
Sensor Diagnostic Tasks
1.3.4
1.3.4.1
Min
Sensor Connection Loss
Resistance Threshold
1.3.4.2
Maximum Input
Capacitance for
Sensor Connection Check
1.3.4.3
Maximum Input
Capacitance for Sensor
Connection Check with
Sensor Short Check and
Sensor Aging Check
Enabled
1.3.4.4
Sensor Input Short
Resistance Threshold
Data Sheet
December 10, 2014
RSCCTH
CSCC
CSCCSSC/SAC
RSSCTH
Maximum: 10nF + 20%
If Sensor Short Check is
enabled, the Sensor
Connection Check HighCapacitances Mode must
also be enabled.
(Also see 1.3.4.3.)
Maximum: 1nF + 20%
For using Sensor Short
Check and Sensor Aging
Check at the same time.
50
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
8 of 32
ZSSC3170
Automotive Sensor Signal Conditioner with LIN & PWM Interface
No.
Parameter
Symbol
Conditions
1)
1.3.5.1
ADC Resolution
1.3.5.2
DNL
1.3.5.3
INL
1.3.5.4
ADC Input Range
Max
Unit
14
Bit
1)
rADC
DNLADC
rADC = 14-bit, fOSC = 2MHz,
best fit, complete AFE;
see 1.3.5.4 for ADCINP_R.
0.95
LSB
INLADC
rADC = 14-bit, fOSC = 2MHz,
best fit, complete AFE;
see 1.3.5.4 for ADCINP_R.
8
LSB
90
%
VVBR
ADCINP_R
See 1.3.1.4 for VVBR.
10
PWM Output (Pins HOUT and LOUT)
1.3.6
1.3.6.1
Output High Level – HSS;
HOUT Pin
VHSS_H
ISOURCE = 15mA,
VB  8.8V to VSSE
1.3.6.2
Output Low Level – LSS;
LOUT Pin
VLSS_L
ISINK = 12mA to VSSE
1.3.6.3
Leakage Current
LOUT Pin
1.3.6.4
Rise Time HSS
Slew Rate HSS
1.3.6.6
Typ
A/D Conversion (see section 2.3.3)
1.3.5
1.3.6.5
Min
V
0.5V
V
ILEAK_LOUT
Sink; high level at LOUT
50
µA
1)
tHSS_RISE
VHOUT = 0.5V4V
15
µs
1)
SRHSS
VHOUT = 0.5V4V
2
V/µs
tLSS_FALL
VLOUT = 4V0.5V
15
µs
SRLSS
VLOUT = 4V0.5V
-2
V/µs
rPWM_FS
D = 1% to 99 %
11
Bit
Adjustable with 8-bit
resolution
1
1)
Fall Time LSS
4
1.3.6.7
Slew Rate LSS
1.3.6.8
PWM Full-Scale
1)
Resolution
1.3.6.9
Duty Cycle
1)
1)
D
99
%
2.0
V
1
VB
2)
LIN Interface – Main Parameters
(All voltages related to VSS; RVBAT_LIN Power Supply Line Resistance = 500Ω)
1.3.7
1.3.7.1
Output Low Level
Transmitter
VLIN_L
1.3.7.2
Output High Level
Transmitter
VLIN_H
Driver off
0.9
1.3.7.3
Output Current
ILIN_L
Sink; driver on
40
90
200
mA
1.3.7.4
Pull-Up Resistance
In series with diode to VB
20
30
47
kW
-40°C ≤ TAMB ≤ 125°C;
VLIN  VB; 7V  VB  18V;
7V  VLIN  18V; driver off
3
20
µA
125°C ≤ TAMB ≤ 150°C;
VLIN  VB; 7V  VB  18V;
7V  VLIN  18V; driver off
3
50
µA
1.3.7.5
Input Current LIN
Recessive,
Overvoltage at LIN
Data Sheet
December 10, 2014
RLIN_PU
ILINPASrec
0.6
1.2
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
9 of 32
ZSSC3170
Automotive Sensor Signal Conditioner with LIN & PWM Interface
No.
Parameter
Symbol
Conditions
Min
1.3.7.6
Input Current LIN
Dominant
ILINPASdom
VLIN = 0V; VB = 12V;
driver off
-1
1.3.7.7
Input Current LIN
Recessive,
No GND for Bus
ILIN_NOGND
0V  VLIN  18V;
VGND = VVB; VB = 12V
-1
1.3.7.8
Input Current LIN
No GND for Bus
2)
ILIN_LOSTVB
3
50
µA
1.3
3
V/µs
0.4
VB
Rising and falling edges,
transmit and receive
1.3.7.11
Input High Level Receiver
VRECH
1.3.7.12
Input Hysteresis Receiver
VRECHYS
VRECHYS = VRECH - VRECL
0.08
1.3.7.13
Input Center Point
Receiver
VBUS_CNT
VBUS_CNT = (VRECL + VRECH)/2
0.475
D1
THRec(max) = 0.744 * VB;
THDom(max) = 0.581 * VB;
VB = 7.0 to 18V; tBit = 50µs;
D1 = tBUS_rec(min)/(2 * tBit)
(See ZSSC3170 LIN
Interface Description
Rev. 2.0 for details.)
0.396
D2
THRec(min) = 0.422 * VB;
THDom(min) = 0.284 * VB;
VB = 7.6 to 18V; tBit = 50µs;
D1 = tBUS_rec(max)/(2 * tBit)
(See ZSSC3170 LIN
Interface Description
Rev. 2.0 for details.)
D3
THRec(max) = 0.778 * VB;
THDom(max) = 0.616 * VB;
VB = 7.0 to 18V; tBit = 96µs;
D3 = tBUS_rec(min)/(2 * tBit)
(See ZSSC3170 LIN
Interface Description
Rev. 2.0 for details.)
Duty Cycle 3
Data Sheet
December 10, 2014
mA
125°C ≤ TAMB ≤ 150°C;
VGND = VSUP = 0V;
0V  VLIN  18V
VRECL
1.3.7.16
1
µA
Input Low Level Receiver
Duty Cycle 2
mA
20
1.3.7.10
1.3.7.15
Unit
3
Slew Rate
Duty Cycle 1
Max
-40°C ≤ TAMB ≤ 125°C;
VGND = VSUP = 0V;
0V  VLIN  18V
1.3.7.9
1.3.7.14
SRLIN
Typ
0.5
0.6
VB
0.5
0.12
VB
0.525
VB
-
0.581
0.417
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
-
-
10 of 32
ZSSC3170
Automotive Sensor Signal Conditioner with LIN & PWM Interface
No.
1.3.7.17
Parameter
Duty Cycle 4
Symbol
Conditions
D4
THRec(min) = 0.389 * VB;
THDom(min) = 0.251 * VB;
VB = 7.6 to 18V; tBit = 96µs;
D4 = tBUS_rec(max)/(2 * tBit)
(See ZSSC3170 LIN
Interface Description
Rev. 2.0 for details.)
1.3.8
Typ
Max
Unit
0.590
-
Until first valid output;
fOSC = 2MHz
30
ms
fOSC = 2.2MHz; 14-bit
resolution; LIN Mode;
100% final value
(see Table 2.5)
3.6
ms
fOSC = 1.8MHz; 14-bit
resolution; PWM Mode;
100% final value
(see Table 2.4)
20
ms
System Response
1)
1.3.8.1
Start-Up Time
1.3.8.2
Response Time
LIN_Mode;
Typical LIN
3)
Configuration
1.3.8.3
Response Time PWM
Mode; Typical PWM
4)
Configuration
1.3.8.4
Min
tSTART
tRESP_
LIN_2_14_5
5), 6)
Overall Error AFE
(
fOSC = 2MHz, XZC off;
no sensor related errors;
relative to digital value)
tRESP_
PWM_2_14_2
FAFE_85
TAMB: -20°C to 85°C
0.25
%FS
FAFE_125
TAMB: -40°C to 125°C
0.5
%FS
FAFE_150
TAMB: -40°C to 150°C
1.0
%FS
1)
No measurement in mass production; parameter is guaranteed by design and/or quality observation.
2)
For complete specification, see ZSSC3170_LIN_Interface_Description_Rev_X.xy.pdf.
3)
2-step A/D conversion (ADCORD=1), 14-bit resolution (ADCRES=1), resolution 2nd conversion step 5-bit (ADCMODE=11)
4)
2-step A/D conversion (ADCORD=1), 14-bit resolution (ADCRES=1), resolution 2nd conversion step 2-bit (ADCMODE=00)
5)
Deviation from ideal line including INL, gain, offset, and temperature errors.
6)
With XZC active: additional total error of max. 25ppm/K at XZC = 31. Error decreases linearly at XZC < 31.
Data Sheet
December 10, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
11 of 32
ZSSC3170
Automotive Sensor Signal Conditioner with LIN & PWM Interface
1.4 Interface Characteristics
Table 1.4
Interface Characteristics
No.
Parameter
Symbol
1)
Input High Level
VI2C_IN_H
1)
Input Low Level
1.4.1.3
Output Low Level
1.4.1.4
SDA Load Capacity
1.4.1.5
SCL Clock Frequency
Max
Unit
0.8
VDDA
0.2
VDDA
0.15
VDDA
CSDA
400
pF
fSCL
400
kHz
100
kW
1
V
VI2C_OUT_L
1)
1)
1)
Internal Pull-Up Resistor
1.4.2
1)
Open drain output current:
< 2mA
RI2C
25
One-Wire Interface at HOUT and LOUT (LIN Protocol)
1.4.2.1
Input Low Level
1.4.2.2
Input High Level
1.4.2.3
Start Window
1)
Typ
VI2C_IN_L
1.4.1.2
1.4.1.6
Min
I C™ Interface
1.4.1
1.4.1.1
Conditions
2
1)
1)
1)
VOWI_IN_L
VOWI_IN_H
tSTART_WIN
4
V
At fOSC = 2MHz
30
ms
Max
Unit
No measurement in mass production; parameter is guaranteed by design and/or quality observation.
1.5 EEPROM
Table 1.5
EEPROM
No.
Parameter
Symbol
Conditions
TAMB < 85°C
1000
nEEP_WRI_150
TAMB < 150°C
100
Write Cycles
1.5.2
Read Cycles
nEEP_RD
1.5.3
Data Retention
tEEP_RET
100000h@55°C
+ 27000h@125°C
+ 3000h@150°C
1.5.4
Programming Time
tEEP_WRI
Per written word,
at fOSC = 2MHz
December 10, 2014
Typ
nEEP_WRI_85
1.5.1
Data Sheet
Min
8 * 10
15
12
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50
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the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
8
a
ms
12 of 32
ZSSC3170
Automotive Sensor Signal Conditioner with LIN & PWM Interface
2
Circuit Description
2.1 Signal Flow and Block Diagram
The signal path of the ZSSC3170 consists of the analog front end (AFE), the digital signal processing block, and
interfaces including protection circuitry. Based on a differential structure, the bridge inputs VBP and VBN are
handled by two signal lines each with a dynamic range symmetrical to the common mode potential (analog
ground equal to VDDA/2). Therefore it is possible to amplify positive and negative input signals within the
common mode range of the signal input.
Figure 2.1 Block Diagram of ZSSC3170
VDDA
I2CTM*
Control Registers
Ext. Temp.
Diode
SCL
SDA
VBR_T
Sensor
Bridge
HOUT
Temp. Sens.
Select
VTN1
VBN
MUX
Gain
Factor
Offset
Shift
PGA
ADC
Mode
ADC
RAM
PWM
LOUT
CMC
LIN
LIN
Protection &
Power
Management
VB

Ext. RTD
VBP
Analog Front-End (AFE)
VTN2
VBR_B
VSSA
EEPROM
Internal
Temp.
Sensor
Digital Block
VSSE
Interfaces
ZSSC3170
* I2C™ is a trademark of NXP.
The multiplexer (MUX) transmits the signals from either the bridge sensor or the selected temperature sensors to
the analog-to-digital converter (ADC) in a defined sequence. The temperature sensor can either be an external or
internal diode or an external thermistor (RTD), selected by EEPROM configuration. In LIN Mode, temperature
output is available. For this temperature measurement, the same temperature sensor can be used as for
calibration temperature, or a second temperature sensor input can be selected. The differential signal from the
bridge sensor is pre-amplified by the programmable gain amplifier (PGA). The ADC converts bridge sensor and
temperature signals into digital values.
The digital signal conditioning takes place in the calibration microcontroller (CMC) using a ROM-resident
conditioning formula and sensor-specific coefficients stored in the EEPROM during calibration. The configuration
data and the correction parameters can be programmed into the EEPROM by digital communication at the output
2
pins or at the I C™ interface. Depending on the programmed output configuration, the corrected sensor signal is
output as a PWM signal (high-side switch or low-side switch) or as a digital value within a LIN frame. During the
2
calibration procedure, the I C™ interface can provide measurement values as well.
Data Sheet
December 10, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
13 of 32
ZSSC3170
Automotive Sensor Signal Conditioner with LIN & PWM Interface
2.2 Application Modes
For each application, a configuration set must be established (generally prior to calibration) by programming the
on-chip EEPROM for the following modes:
Table 2.1
Configuration for Application Modes
Bridge Sensor Channel
Input Voltage Range
Select gain stage of the AFE with respect to the maximum sensor signal span and
the zero point of the ADC.
Bridge Sensor Offset
Compensation (XZC)
Activate the analog sensor offset compensation if required; e.g., if the sensor offset
voltage is close to or larger than the sensor span.
Resolution/Response Time
Select appropriate resolution of the ADC. Settings will influence sampling rate, signal
integration time, and therefore sensitivity to noise and disturbances.
Temperature Measurement
Temperature Measurement for the
Correction of the Bridge Signal
Select temperature sensor to calibrate temperature related errors.
Temperature Measurement for the
Temperature Output in LIN Mode
Select temperature sensor for temperature measurement.
Output Signal
Output Mode
Select PWM or LIN according to application requirements.
LIN Mode
Select LIN compatibility to specification package LIN2.1, LIN2.0, or LIN1.3.
PWM Mode
Select switch type: high-side switch (HSS) or low-side switch (LSS).
Data Sheet
December 10, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
14 of 32
ZSSC3170
Automotive Sensor Signal Conditioner with LIN & PWM Interface
2.3 Analog Front End (AFE)
The analog front end (AFE) consists of the signal multiplexer (MUX), the programmable gain amplifier (PGA) and
the analog-to-digital converter (ADC).
2.3.1
Programmable Gain Amplifier (PGA)
Table 2.2 shows the adjustable gains, corresponding sensor signal spans, and common mode range limits. See
section 2.3.2 for details for XZC.
Table 2.2
Adjustable Gain Stages, Corresponding Sensor Signal Spans, and Common Mode Ranges
Overall
Gain
aIN
Maximum Input
Voltage Range
1)
VIN_SPAN [mV/V]
Gain
Amp1
Gain
Amp2
420
1.8
30
7
280
2.7
30
210
3.6
140
Gain
Amp3
Input Common Mode Range
2)
VIN_CM [%VDDA]
XZC off
XZC on
2
29 to 65
45 to 55
4.66
2
29 to 65
45 to 55
15
7
2
29 to 65
45 to 55
5.4
15
4.66
2
29 to 65
45 to 55
105
7.1
7.5
7
2
29 to 65
45 to 55
70
10.7
7.5
4.66
2
29 to 65
45 to 55
52.5
14.3
3.75
7
2
29 to 65
45 to 55
35
21.4
3.75
4.66
2
29 to 65
45 to 55
26.3
28.5
3.75
3.5
2
29 to 65
45 to 55
14
53.75
1
7
2
29 to 65
45 to 55
9.3
80
1
4.66
2
29 to 65
45 to 55
7
107
1
3.5
2
29 to 65
45 to 55
2.8
267
1
1.4
2
32 to 57
Not applicable
1)
Recommended internal signal range: maximum 80% supply voltage. Range is defined by 80% of supply voltage divided by selected gain.
2)
At maximum input signal (with XZC: +300% offset).
2.3.2
Offset Compensation
The ZSSC3170 supports two methods of sensor offset compensation:
 Digital offset correction is processed during the digital signal conditioning by the calibration microcontroller
(CMC).
 Bridge sensor offset compensation (XZC) is achieved by adding a compensation voltage at the analog
signal path that removes coarse offset. XZC is needed for large offset values that would otherwise
overdrive the analog signal path, and it can be adjusted by 6 EEPROM bits. Depending on the gain
adjustment, XZC can handle offset values of up to 300% of the sensor signal range.
Data Sheet
December 10, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
15 of 32
ZSSC3170
Automotive Sensor Signal Conditioner with LIN & PWM Interface
Table 2.3
Bridge Sensor Offset Shift Ranges
Overall Gain
aIN
Maximum Input
Voltage Range
VIN_SPAN (mV/V)
Offset Shift
per Step
(%Full Span)
420
1.8
12.5
7.8
388
280
2.7
7.6
7.1
237
210
3.6
12.5
15.5
388
140
5.4
7.6
14.2
237
105
7.1
12.5
31
388
70
10.7
7.6
28
237
52.5
14.3
12.5
62
388
35
21.4
7.6
57
237
26.3
28.5
5.2
52
161
14
53.6
12.5
233
388
10
80
7.6
207
237
7
107
5.2
194
161
2.8
267
0.83
78
26
2.3.3
Approximate
Approximate
Maximum Offset Shift Maximum Offset Shift
(mV/V)
(%VIN_SPAN)
Analog-to-Digital Converter
The analog-to-digital converter (ADC) is designed in full differential switched capacitor technology with a
selectable resolution of 13 or 14 bits. The ADC can operate in first or second order configuration. The conversion
is largely insensitive to short-term and long-term instabilities of the clock frequency.
 MSB segment conversion: In this first step of the A/D conversion, the measurement value is integrated
over the complete conversion time ensuring a high degree of noise suppression. To extend the integration
phase to the maximum, this fraction of the complete conversion time is selected to be as long as possible
corresponding to the time available.
 LSB segment conversion: To achieve a higher resolution, the residual value of the first step is converted
in a subsequent step by a second converter. In first-order configuration, the second step is skipped (singlestep conversion).
Data Sheet
December 10, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
16 of 32
ZSSC3170
Automotive Sensor Signal Conditioner with LIN & PWM Interface
Table 2.4
Mode
A/D Resolution and Conversion Time in PWM Modes
A/D Resolution
Total
(bit)
A/D Resolution
MSB Segment
Conversion
(bit)
A/D Resolution
LSB Segment
Conversion
(bit)
A/D Conversion
Mode
1)
ADC MODE
PWM Cycle Time
(fOSC = 1.8MHz)
(ms)
14
12
2
00
19.9
14
11
3
01
10.8
14
10
4
10
6.3
14
9
5
11
4.0
13
11
2
00
10.8
13
10
3
01
6.3
13
9
4
10
4.0
13
8
5
11
2.8
14
14
n/a
n/a
37.5
13
13
n/a
n/a
19.3
PWM /
ADC
1)
2 step
PWM /
ADC
1 step
1)
See ZSSC3170_FunctionalDescription_Rev_X.xy.pdf for details.
Table 2.5
Mode
A/D Resolution and Conversion Time in LIN Modes
2)
A/D Resolution
Total
(bit)
A/D Resolution
MSB Segment
Conversion
(bit)
A/D Resolution
LSB Segment
Conversion
(bit)
A/D Conversion
Mode
1)
ADC MODE
Response Time
in LIN Mode
(fOSC = 2.2MHz)
(ms)
14
12
2
00
16.3
14
11
3
01
8.9
14
10
4
10
5.2
14
9
5
11
3.3
13
11
2
00
8.9
13
10
3
01
5.2
13
9
4
10
3.3
13
8
5
11
2.4
14
14
n/a
n/a
61.5
13
13
n/a
n/a
31.7
LIN /
ADC
2 step
LIN /
ADC
1 step
1)
See ZSSC3170_FunctionalDescription_Rev_X.xy.pdf for details.
2)
Total response time.
Data Sheet
December 10, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50
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the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
17 of 32
ZSSC3170
Automotive Sensor Signal Conditioner with LIN & PWM Interface
Equation (1) describes the conversion result:


VADC _ IN

Z ADC  2r  
V


RS
ADC
_
REF
ADC


(1)
Where
ZADC
r
VADC_IN
VADC_REF
RSADC
A/D conversion result
A/D resolution in bits
Differential input voltage of ADC
Differential reference voltage of ADC
1
1
1
1
ADC range shift adjustable by EEPROM configuration (RSADC = /16, /8, /4, /2 )
By selecting different values of RSADC, the user can match the sensor input signal to the optimum input voltage
range of the ADC. The ADC reference voltage VADC_REF is defined as the difference between the bridge supply
potentials at pins VBR_T and VBR_B. The theoretical ADC input voltage range ADC INP_R is equal to this ADC
reference voltage.
A major constraint required for achieving the specified precision as well as the stability and nonlinearity
parameters of the AFE is to use a maximum ADC input voltage range of 10% to 90% of ADC INP_R within the
application. This is of special importance for ensuring the specified parameters for the entire operating
temperature range as well as all possible sensor bridge tolerances. The validity of these conditions is not checked
by the ZSSC3170’s failsafe functions and therefore must be ensured by the customer-specific configuration.
2.4 Temperature Measurement
The following temperature sensors are supported by ZSSC3170 for both temperature and calibration temperature
measurement:
 Internal pn-diode
 External pn-diode; anode to pin VBR_T
 External resistive half-bridge with the thermistor connected in the upper branch
In PWM Mode, the conditioning calculation for the bridge sensor signal is based on values of the selected
temperature sensor.
In LIN Mode, two temperature measurements are executed using either two different sensors or one sensor for
both measurements. The temperature output value is the result of a conditioning calculation including offset
nd
compensation, gain correction, and 2 order nonlinearity compensation. The conditioning coefficients are stored
in the EEPROM.
Data Sheet
December 10, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
18 of 32
ZSSC3170
Automotive Sensor Signal Conditioner with LIN & PWM Interface
2.5 System Control and Conditioning Calculation
The system control performs the following tasks:
 Sequencing of the start-up phase
 Control of measurement cycle based on EEPROM configuration data
 16-bit conditioning calculation for each measurement signal based on EEPROM conditioning coefficients
and ROM-resident signal conditioning algorithm
 Processing of communication requests received at the serial interfaces
 Control of calibration mode
 Processing of diagnostic and failsafe tasks
For a detailed description, refer to ZSSC3170_FunctionalDescription_Rev_X.xy.pdf.
2.5.1
Operating Modes
Three main modes are implemented in the integrated state machine:
 Normal Operation Mode (NOM) with continuous signal conditioning
 Command Mode (CM), which provides access to all internal registers and provides the basis for
configuration and calibration of the ZSSC3170
 Diagnostic Mode (DM), which indicates detected error conditions
2.5.2
Start-Up Phase
The start-up phase consists of the following time periods:
 Settling of the internal voltage supply represented by the voltage VDDA-VSSA. At the end of this period,
the power-on-reset circuit (POR) switches off the reset signal.
 System start, readout of EEPROM, and signature check.
 Processing of the signal conditioning start routine containing bridge sensor signal and temperature
measurements, associated auto-zero measurements, and the conditioning calculation itself. Within this
period, the output pins are ready to receive special LIN frames resulting in entering the Command Mode
(CM). This start window is active for up to 30ms.
The ZSSC3170 switches into Normal Operation Mode (NOM) after the start window is passed. It proceeds with
the cyclic processing of the measurement and conditioning tasks.
Data Sheet
December 10, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
19 of 32
ZSSC3170
Automotive Sensor Signal Conditioner with LIN & PWM Interface
2.5.3
Measurement Cycle
Depending on the EEPROM settings, the multiplexer selects the following inputs in a defined sequence:





Pre-amplified sensor bridge signal
Temperature sensor defined by EEPROM configuration for calibration temperature
Temperature sensor defined by EEPROM configuration for temperature measurement
Auto-zero signal
Diagnostic signals
The CMC controls the complete measurement cycle following a basic flow shown in Figure 2.2.
All necessary measurements for bridge sensor and temperature signal are executed once after power-on within
the start-up routine. This initial phase is followed by continuous processing of the complete measurement cycle.
The sensor connection check (SCC), sensor short check (SSC), and sensor aging check (SAC) for diagnostic
tasks (see section 2.8) are continuously executed within the regular measurement cycle even if the processing of
the diagnostic function is disabled by the EEPROM configuration.
For details, refer to ZSSC3170_FunctionalDescription_Rev_X.xy.pdf.
Figure 2.2 Measurement Cycle
Start Routine
Bridge Sensor Signal Auto-Zero
Bridge Sensor Signal Measurement
Calibration Temperature Auto-Zero
Bridge Sensor Signal Measurement
Calibration Temperature Measurement
Bridge Sensor Signal Measurement
Temperature Auto-Zero
Bridge Sensor Signal Measurement
Temperature Measurement
Bridge Sensor Signal Measurement
Sensor Aging Check
Bridge Sensor Signal Measurement
Sensor Connection Check /
Sensor Short Check, Positive Biased
Bridge Sensor Signal Measurement
Sensor Connection Check /
Sensor Short Check, Negative Biased
Bridge Sensor Signal Measurement
Data Sheet
December 10, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50
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the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
20 of 32
ZSSC3170
Automotive Sensor Signal Conditioner with LIN & PWM Interface
2.5.4
Conditioning Calculation
After digital auto-zero correction of the bridge sensor measurement value, the interim result is further processed
nd
based on the correction formula. Offset and gain with temperature effects up to 2 order and non-linearity up to
rd
3 order can be compensated for, resulting in a positive 15-bit bridge sensor result value normalized to the range
of [0;1].
In LIN Mode, the digital measurement value of the temperature is processed based on a proprietary correction
nd
formula as well. Offset, gain, and non-linearity up to 2 order can be compensated for yielding a positive 15-bit
temperature value normalized to the range of [0;1].
2.6 Signal Outputs
ZSSC3170 provides three signal outputs:
 LIN – LIN Interface revision 2.1/2.0 with compatibility to revision 1.3
 HOUT – PWM high-side switch (HSS)
 LOUT – PWM low-side switch (LSS)
For the respective application, one signal output must be selected and configured as the active output. Idle
outputs must be not connected.
To enter the Command Mode (CM), communication can be established at each of the three output pins. A
dedicated command must be sent during the start window immediately after power-on (duration tSTART_WN; see
specification 1.4.2.3). The communication protocol at all pins is based on the LIN Data Link Layer. Note that
communication at the HOUT pin uses the inverted signal levels of the LIN frame. In LIN Mode, communication at
the LIN pin is always possible during Normal Operation Mode (NOM).
To enable communication within the start window, the output drivers are set to tri-state during this time. The
outputs HOUT and LOUT are connected to internal pull-up resistors to ensure the necessary resistive stage. For
the LIN transceiver, an internal pull-up resistor is implemented by default (according to the LIN Specification
Package, Physical Layer section).
If not switched into CM before expiration of the 30ms start window, depending on the configuration, the
ZSSC3170 will start to provide a PWM signal or can respond to communication requests of the LIN master.
The function set of the signal outputs is specified in detail in the following documents:
ZSSC3170_FunctionalDescription_Rev_X.xy.pdf and ZSSC3170_LIN_Interface_Description_Rev_X.xy.pdf.
Note: LIN Sleep Mode must be disabled for proper PWM operation.
2.6.1
PWM Outputs HOUT and LOUT
In PWM Mode, the output signal is provided at the pins HOUT or LOUT accordingly.
The outputs are protected from short circuit overload by current limiters and time monitoring. Driving the signal
lines with slew-rate-limited edges reduces electromagnetic emission. At the HOUT pin, a voltage higher than the
maximum supply voltage can be tolerated. The notably low leakage current of LOUT is designed to cover the
requirements of some unique electronic control units (ECU).
Data Sheet
December 10, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
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ZSSC3170
Automotive Sensor Signal Conditioner with LIN & PWM Interface
2.6.2
LIN Output
The output of the integrated LIN transceiver at the LIN pin is compatible with the LIN revisions 2.1, 2.0 and 1.3.
For details, refer to the document ZSSC3170_LIN_Interface_Description_Rev_X.yx.pdf. For LIN Physical Layer
Conformance Tests, the control pins of the integrated LIN transceiver can be accessed separately in a LIN
Conformance Test Mode.
2.7 Digital Test and Calibration Interface
2
Beyond the digital communication features accessed via the output pins, the ZSSC3170 provides an I C™ com2
patible test and calibration interface with slave functionality. For a detailed description of the I C™ interface, refer
to the document ZSSC3170_FunctionalDescription_Rev_X.xy.pdf.
2.8 Diagnostic and Failsafe Features, Watchdog, and Error Detection
The ZSSC3170 detects various possible failures. An identified failure is indicated by the ZSSC3170 entering the
Diagnostic Mode (DM). With PWM active, the respective output is switched to the resistive mode. In LIN Mode,
depending on the error classification, the correlated status bits are activated. A watchdog continuously monitors
the operations of the CMC and the running measurement loop. The operation of the internal clock oscillator is
monitored by the oscillator failure detection. A check of the sensor bridge for broken or shorted wires is performed
continuously (the sensor connection check (SCC) and the sensor short check (SSC)). The common mode voltage
of the sensor (CMV) is monitored continuously (sensor aging check (SAC)). A check for a broken chip (BCC) can
be applied in the start-up phase after power-on. RAM, ROM, EEPROM, registers, and the arithmetic unit are
monitored continuously. Refer to the ZSSC3170_FunctionalDescription_Rev_X.xy.pdf for a detailed description.
2.9 High Voltage, Reverse Polarity, and Short Circuit Protection
The ZSSC3170 is designed for a direct 12V supply, which can be provided by a vehicle power system. Internal
sub-assemblies are supplied and protected by integrated voltage regulators and limiters. Specific protection
circuits allow tolerance of permanent reverse polarity at supply and output pins. These functions are described in
detail in the document ZSSC3170_HighVoltageProt_Rev_X.xy.pdf. When operated in the application circuits
shown in section 3, the protection features of the ZSSC3170 are guaranteed without time limit.
Data Sheet
December 10, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
22 of 32
ZSSC3170
Automotive Sensor Signal Conditioner with LIN & PWM Interface
3
Application Circuit Examples and External Components
3.1 Application Circuit Examples
Note: Pad locations shown in the following figures are approximate. For specific pad locations, refer to the
ZSSC3170 Technical Note – Pad Coordinates, Die Dimensions, and Package Dimensions (see section 8).
Figure 3.1 Application Circuit in PWM Mode with Low-Side Switch
Temperature
Sensor
Sensor
Bridge
ZSSC3170 Application Circuit
PWM Mode with Low-Side Switch
11
10
LIN
LOUT
VBN
12
13 VBR_B
VBP
VTN1
VTN2
14 VBR_B
15
16
18
19
VBR_T
17 VBR_T
n.c.
3
4
5
6
7
8
SDA
SCL
VDD
HOUT
VB
VSSE
VSS
2
VSSA
9
1
VDDA
ZSSC3170 Die
VSS
n.c.
D1
VBAT
R1 27Ω
LSS
SDA SCL VDD
C1
100nF
C3
2.2nF
C2
220nF
GND
Figure 3.2 Application Circuit in PWM Mode with High-Side Switch
Sensor
Bridge
n.c.
n.c.
VBN
LOUT
LIN
11
10
ZSSC3170 Application Circuit
PWM Mode with High-Side Switch
12
13 VBR_B
14 VBR_B
VBP
15
VTN2
VTN1
16
18
19
VBR_T
17 VBR_T
Temperature
Sensor
ZSSC3170 Die
3
4
5
6
7
8
SDA
SCL
VDD
HOUT
VB
VSSE
VSS
2
VSSA
9
1
VDDA
VSS
D1
VBAT
R1 27Ω
HSS
SDA SCL VDD
C1
100nF
C3
4.7nF
C2
470nF
GND
Data Sheet
December 10, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
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ZSSC3170
Automotive Sensor Signal Conditioner with LIN & PWM Interface
Figure 3.3 Application Circuit in LIN Mode
Temperature
Sensor
Sensor
Bridge
ZSSC3170 Application Circuit
LIN Mode
10
11
LIN
LOUT
VBN
12
13 VBR_B
VBP
14 VBR_B
15
VTN1
16
VBR_T
17 VBR_T
18
19
VTN2
n.c.
VSS
9
8
VSSE
5
VDD
7
4
SCL
VB
3
SDA
6
2
VSSA
HOUT
1
VDDA
ZSSC3170 Die
n.c.
D1
VBAT
R1 10Ω
LIN
SDA SCL VDD
C1
100nF
C3
220pF
C2
220nF
GND
3.2 Dimensioning of External Components
For application circuits, refer to Figure 3.1, Figure 3.2, and Figure 3.3.
Table 3.1
No.
Dimensioning of External Components for Application Examples
Component
Symbol
Condition
Min
Typ
Max
Unit
3.2.1
Capacitor
C1
All modes
100
nF
3.2.2
Capacitor
C2
HSS
470
nF
3.2.3
Capacitor
C2
LSS, LIN
220
nF
3.2.4
Capacitor
C3
HSS
4.7
nF
3.2.5
Capacitor
C3
LSS
2.2
nF
3.2.6
Capacitor
C3
LIN
220
pF
3.2.7
Resistor
R1
LIN
10
W
3.2.8
Resistor
R1
LSS, HSS
27
W
3.2.9
Diode
D1
All modes
Standard Si diode
The capacitor values are examples and must be adapted to the requirements of the specific application, in
particular to the EMC requirements. In the LIN application, the voltage drop over the series connection of D1 and
R1 must not exceed 1V at maximum supply current. For overvoltage pulses at VBAT, R1 serves as a current
limiter.
Data Sheet
December 10, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
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ZSSC3170
Automotive Sensor Signal Conditioner with LIN & PWM Interface
4
Pinout and Package Options
4.1 Die Pad Definitions and Configuration
Table 4.1
Die Pad Definitions for ZSSC3170
Die Pad
Name
1
VDDA
Positive Analog Supply Voltage
Power supply
2
VSSA
Negative Analog Supply Voltage
Ground
3
SDA
I²C™ Data I/O
Analog I/O, internal pull-up
4
SCL
I²C™ Clock
Analog input, internal pull-up
5
VDD
Positive Digital Supply Voltage
Power supply
6
HOUT
PWM High-Side Switch
High voltage I/O
7
VB
Positive External Supply Voltage
High voltage I/O
8
VSSE
External Ground (PWM Modes)
High voltage I/O
9
VSS
Ground (LIN Mode)
Ground
10
LIN
LIN
LIN high voltage I/O
11
LOUT
PWM Low-Side Switch
High voltage I/O
Negative Input Sensor Bridge
Analog input
Negative (Bottom) Bridge Supply Voltage
Analog I/O
12
VBN
13 / 14
VBR_B
Description
Notes
15
VBP
Positive Input Sensor Bridge
Analog input
16
VTN1
Temperature Sensor 1
Analog I/O
17 / 18
VBR_T
Positive (Top) Bridge Supply Voltage
Analog I/O
19
VTN2
Temperature Sensor 2
Analog I/O
The two-fold implementation of the bridge supply bond pads enables direct bonding from the ZSSC3170 pads to
supply pads on the sensor die.
Figure 4.1 Die Pad Configuration
For exact bond pad positions, refer to
ZSSC3170_DicePackagePin_Rev_X.xy.pdf.
The backside of the die is electrically
connected to the potential VSS and VSSA
within the package.
Drawing not true to scale.
Data Sheet
December 10, 2014
1
VSSA
2
SDA
3
SCL
4
VDD
5
HOUT
6
VB
7
VSSE
8
ZSSC3170
VDDA
10
VSS
19
VTN2
18
17
VBR_T
VBR_T
16
VTN1
15
VBP
14
13
VBR_B
VBR_B
12
VBN
11
LOUT
LIN
9
DIE
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50
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the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
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ZSSC3170
Automotive Sensor Signal Conditioner with LIN & PWM Interface
4.2 SSOP20 Package
An SSOP20 Green Package (5.3mm body, 0.65mm lead pitch) is one of the two standard delivery forms available
for packaged parts.
Table 4.2
Pin Definition of SSOP20 Package
SSOP20 Pin
Name
Description
Notes
1
n.c.
2
VDDA
Positive Analog Supply Voltage
Power supply
3
VSSA
Negative Analog Supply Voltage
Ground
4
SDA
I²C™ Data I/O
Analog I/O, internal pull-up
5
SCL
I²C™ Clock
Analog input, internal pull-up
6
VDD
Positive Digital Supply Voltage
Power supply
7
HOUT
PWM High-Side Switch
High voltage I/O
8
VB
Positive External Supply Voltage
High voltage I/O
9
VSSE
External Ground (PWM Modes)
High voltage I/O
10
VSS
Ground (LIN Mode)
Ground
11
LIN
LIN
LIN high voltage I/O
12
LOUT
PWM Low-Side Switch
High voltage I/O
Negative Input Sensor Bridge
Analog input
Negative (Bottom) Bridge Supply Voltage
Analog I/O
14
VBN
15
VBR_B
No connection
16
VBP
Positive Input Sensor Bridge
Analog input
17
VTN1
Temperature Sensor 1
Analog I/O
18
VBR_T
Positive (Top) Bridge Supply Voltage
Analog I/O
19
VTN2
Temperature Sensor 2
Analog I/O
20
n.c.
Data Sheet
December 10, 2014
No connection
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50
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the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
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ZSSC3170
Automotive Sensor Signal Conditioner with LIN & PWM Interface
Figure 4.2 SSOP20 Package Drawing
Note: Drawing is not true to scale. CAD models can be downloaded from ZMDI’s www.zmdi.com/ssc-tools web page.
Data Sheet
December 10, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
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ZSSC3170
Automotive Sensor Signal Conditioner with LIN & PWM Interface
4.3 DFN20 Package
A DFN20 Green Package (6x5 mm body, 0.5mm lead pitch) with wettable flanks is one of the two standard
delivery forms available for packaged parts.
The pin definitions for the DFN20 package are the same as for the SSOP20 package described in Table 4.2.
Figure 4.3 DFN20 Package Drawing
Note: Drawing is not true to scale. CAD models can be downloaded from ZMDI’s www.zmdi.com/ssc-tools web page.
Data Sheet
December 10, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
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ZSSC3170
Automotive Sensor Signal Conditioner with LIN & PWM Interface
5
ESD Protection and EMC Specification
All pins have an ESD protection of >2000V according to the Human Body Model (HBM). In addition, the pins
VDDE, VSSE, VSS, HOUT, and LOUT have an ESD protection of >4000V and the pin LIN has an ESD protection
of >8000V (system level).
The level of ESD protection has been tested with devices in SSOP20 packages during the product qualification.
The ESD test follows the Human Body Model with 1.5kOhm/100pF based on MIL883, Method 3015.7 (except the
LIN pin tests). The ESD test of the LIN pin follows the system level specification with 330Ω/150 pF (according to
DIN EN 61000-4-2).
The EMC performance regarding external disturbances as well as EMC emission is documented in
ZSSC3170_HighVoltageProt_Rev_X.xy.pdf.
6
Reliability and RoHS Conformity
The ZSSC3170 is qualified according to the AEC-Q100 standard, operating temperature grade 0.
The ZSSC3170 complies with the RoHS directive and does not contain hazardous substances.
The complete RoHS declaration update can be downloaded at www.zmdi.com/quality.
7
Ordering Information
Product Sales Code
Description
Package
ZSSC3170EE1B
ZSSC3170 Die — Temperature range: -40°C to +150°C
Unsawn on Wafer, 2450 pcs.
ZSSC3170EE1C
ZSSC3170 Die — Temperature range: -40°C to +150°C
Sawn on Wafer Frame, 2450 pcs.
ZSSC3170EE2R
ZSSC3170— SSOP20 — Temperature range: -40°C to +150°C
13” Reel, 2000 pcs.
ZSSC3170EE2T
ZSSC3170— SSOP20 — Temperature range: -40°C to +150°C
Tube, 660 pcs.
ZSSC3170EE3R
ZSSC3170 DFN20 – Temperature Range -40°C to +150°C
Tape & Reel - 13"
ZSSC3170EA1B
ZSSC3170 Die — Temperature range: -40°C to +125°C
Unsawn on Wafer, 2450 pcs.
ZSSC3170EA1C
ZSSC3170 Die — Temperature range: -40°C to +125°C
Sawn on Wafer Frame, 2450 pcs.
ZSSC3170EA2R
ZSSC3170— SSOP20 — Temperature range: -40°C to +125°C
13” Reel, 2000 pcs.
ZSSC3170EA2T
ZSSC3170— SSOP20 — Temperature range: -40°C to +125°C
Tube, 660 pcs.
ZSSC3170EA3R
ZSSC3170 DFN20 – Temperature Range -40°C to +125°C
Tape & Reel - 13"
ZSSC3170KIT
ZSSC3170 Evaluation Kit and 5 SSOP20 Samples
Kit
Data Sheet
December 10, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
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ZSSC3170
Automotive Sensor Signal Conditioner with LIN & PWM Interface
8
Related Documents
X.xy refers to the current version of the document.
Document
File Name
ZSSC3170 Evaluation Kit Description
ZSSC3170_Evaluation_Kit_Description_Rev_X.xy.pdf
ZSSC3170 Functional Description
ZSSC3170_FunctionalDescription_Rev_X.xy.pdf
ZSSC3170 High Voltage Protection Description *
ZSSC3170_HighVoltageProt_Rev_X.xy.pdf
ZSSC3170 LIN Interface Description *
ZSSC3170_LIN_Interface_Description_Rev_X.xy.pdf
ZSSC3170 Application Note – LIN and PWM Operation
ZSSC3170_AN_LIN_and_PWM_Operation_Rev_X.xy.pdf
ZSSC3170 Technical Note – Pad Coordinates, Die
Dimensions, and Package Dimensions**
ZSSC3170_DicePackagePin_Rev_X.xy.pdf
Visit the ZSSC3170 product page www.zmdi.com/zssc3170 on ZMDI’s website www.zmdi.com or contact your
nearest sales office for the latest version of these documents.
* Note: Documents marked with an asterisk (*) require a free customer login account. To set up an account, click
on Login in the upper right corner of www.zmdi.com and follow the instructions.
** Note: Documents marked with double asterisks (**) are available on request only; see page 32 for contact
information.
9
Glossary
Term
Description
ADC
Analog-to-Digital Converter
AEC
Automotive Electronics Council
AFE
Analog Front-End
Amp
Amplifier
BCC
Broken Chip Check (diagnostic task)
CM
Command Mode
CMC
Calibration Micro Controller (optimized micro controller architecture for ZMDI signal conditioners)
CMV
Common Mode Voltage (of the sensor bridge signal)
DM
Diagnostic Mode
DNL
Differential Nonlinearity
EEPROM
Electrically Erasable Programmable Read Only Memory
EMC
Electromagnetic Compatibility
ESD
Electrostatic Discharge
FSO
Full Scale Output
Data Sheet
December 10, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50
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the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
30 of 32
ZSSC3170
Automotive Sensor Signal Conditioner with LIN & PWM Interface
Term
Description
HSS
High-Side Switch (open-drain output; connects to positive supply when active)
I/O
Input/Output
I²C™
Inter-Integrated Circuit (serial two-wire data bus, trademark of NXP.)
INL
Integral Nonlinearity
LIN
Local Interconnect Network (international communication standard)
LSB
Least Significant Bit
LSS
Low-Side Switch (open-drain output; connects to ground when active)
MSB
Most Significant Bit
MUX
Multiplexer
NOM
Normal Operation Mode
P
Bridge Sensor Signal (e.g., pressure)
PGA
Programmable Gain Amplifier
POR
Power-On Reset (defined start-up procedure until nominal supply voltage is reached)
PWM
Pulse Width Modulation
Rev.
Revision
RISC
Reduced Instruction Set Computing
RoHS
Restrictions of Hazardous Substances
ROM
Read Only Memory
RTD
Resistance Temperature Detector
SAC
Sensor Aging Check (diagnostic measurement task)
SCC
Sensor Connection Check (diagnostic measurement task)
SSC
Sensor Short Check (diagnostic measurement task);
Sensor Signal Conditioner
T
Temperature
XZC
Extended Zero Compensation (bridge sensor offset compensation)
Data Sheet
December 10, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
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ZSSC3170
Automotive Sensor Signal Conditioner with LIN & PWM Interface
10 Document Revision History
Revision
Date
Description
1.00
April 5, 2009
First release.
1.30
September 20, 2010
Full revision.
2.00
January 17, 2011
Silicon revision from C to D. Minor edits.
2.10
April 4, 2013
Silicon revision from D to E. Update for contact information and imagery on cover
and headers. Minor edits.
2.20
July 5, 2013
SSOP20 is now only available for evaluation purposes as samples in the Evaluation
Kit.
2.30
September 16, 2013
Revision to recommendation in footnote 1 in Table 2.2.
PWM operation and LIN Sleep mode incompatibility note added in section 2.6.
Waffle pack option is no longer available; removed from part order table
(ZSSC3170EE1D and ZSSC3170EA1D).
References to SSOP-20 package for samples removed.
Minor edits for clarity.
2.40
January 22, 2014
SSOP20 is now available again.
Update for imagery for cover.
2.50
December 10, 2014
DFN20 package added.
Update for Table 1.2 conditions for specification 1.2.4.
Update for external temperature resistor input range specification 1.3.3.5.
Correction for Table 4.2.
Update for block diagram on page 3 and in Figure 2.1.
Contact information and related documents section updated.
Sales and Further Information
www.zmdi.com
[email protected]
Zentrum Mikroelektronik
Dresden AG
Global Headquarters
Grenzstrasse 28
01109 Dresden, Germany
ZMD America, Inc.
1525 McCarthy Blvd., #212
Milpitas, CA 95035-7453
USA
Central Office:
Phone +49.351.8822.0
Fax
+49.351.8822.600
USA Phone +855.275.9634
Phone +408.883.6310
Fax
+408.883.6358
European Technical Support
Phone +49.351.8822.7.772
Fax
+49.351.8822.87.772
DISCLAIMER: This information applies to a product under development. Its characteristics and specifications are subject to change without notice.
Zentrum Mikroelektronik Dresden AG (ZMD AG) assumes no obligation regarding future manufacture unless otherwise agreed to in writing. The
information furnished hereby is believed to be true and accurate. However, under no circumstances shall ZMD AG be liable to any customer,
licensee, or any other third party for any special, indirect, incidental, or consequential damages of any kind or nature whatsoever arising out of or
in any way related to the furnishing, performance, or use of this technical data. ZMD AG hereby expressly disclaims any liability of ZMD AG to any
customer, licensee or any other third party, and any such customer, licensee and any other third party hereby waives any liability of ZMD AG for
any damages in connection with or arising out of the furnishing, performance or use of this technical data, whether based on contract, warranty,
tort (including negligence), strict liability, or otherwise.
European Sales (Stuttgart)
Phone +49.711.674517.55
Fax
+49.711.674517.87955
Data Sheet
December 10, 2014
Zentrum Mikroelektronik
Dresden AG, Japan Office
2nd Floor, Shinbashi Tokyu Bldg.
4-21-3, Shinbashi, Minato-ku
Tokyo, 105-0004
Japan
ZMD FAR EAST, Ltd.
3F, No. 51, Sec. 2,
Keelung Road
11052 Taipei
Taiwan
Phone +81.3.6895.7410
Fax
+81.3.6895.7301
Phone +886.2.2377.8189
Fax
+886.2.2377.8199
Zentrum Mikroelektronik
Dresden AG, Korea Office
U-space 1 Building
Unit B, 906-1
660, Daewangpangyo-ro
Bundang-gu, Seongnam-si
Gyeonggi-do, 463-400
Korea
Phone +82.31.950.7679
Fax
+82.504.841.3026
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
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