Data Sheet Rev. 2.50 / December 2014 ZSSC3170 Automotive Sensor Signal Conditioner with LIN and PWM Interface Automotive ICs Adaptable and Rugged ZSSC3170 Automotive Sensor Signal Conditioner with LIN & PWM Interface Brief Description Benefits The ZSSC3170 is a CMOS integrated circuit for highly accurate amplification and sensor specific correction of bridge sensor signals. Featuring a maximum analog gain of 420, as well as extended offset compensation capabilities, the ZSSC3170 is adjustable to nearly all resistive bridge sensor types. Digital compensation of offset, sensitivity, temperature drift, and nonlinearity is accomplished via a 16-bit RISC microcontroller. Conditioning coefficients are stored in an EEPROM certified for automotive applications. Measured values are provided by one of the digital LIN or PWM interfaces. Each interface can support end-of-line calibration using the sensor output. Noise sensitivity is greatly reduced because the calibration equipment and the ZSSC3170 are mated digitally. Available Support Physical Characteristics Features Complies with LIN specifications 1.3 / 2.0 / 2.1 Configurable LIN publisher frame content Data conversion rate of up to 430Hz fully utilizes the maximum LIN channel capacity of 20kbit/s PWM high-side and low-side switches, support for LIN communication for end-of-line calibration Digital compensation of offset, gain, temperature nd rd effects up to 2 order, and nonlinearity up to 3 order. Compensation of temperature sensor offset, nd gain, and nonlinearity up to 2 order. Internal or external temperature reference Media temperature sensing by diode or RTD Load dump protection of the LIN pin up to ±40V Accuracy ±0.25% FSO @ -20 to 85°C ±0.50% FSO @ -40 to 125°C ±1.00% FSO @ -40 to 150°C 3 EEPROM words available for optional user data Evaluation Kit Application Notes Calculation Tools Supply voltage: 7 to 18 V Current consumption in Sleep Mode: ≤ 100μA Input span: 1.8 to 267 mV/V ADC resolution: 13 to 14 bit Output resolution: up to 12-bit (LIN and PWM) Operating temperature range: -40 to 125°C Extended operating temperature range: ≤150°C Package: SSOP20, DFN20, or die ZSSC3170 Basic Circuit LIN GND VBAT ZSSC3170 For quick and easy evaluation and support for calibrating prototypes, ZMDI offers the ZSSC3170 SSC Evaluation Kit, which includes evaluation hardware, SSOP20 samples, and software. Measurand and temperature signal available via one output pin Compatible with nearly all resistive bridge inputs No external trimming components required Single-pass calibration minimizes calibration costs End-of-line calibration using sensor output Optimized for automotive environments with special protection circuitry, excellent electromagnetic compatibility, and numerous diagnostic features For more information, contact ZMDI via [email protected]. © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50 — December 10, 2014. All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. ZSSC3170 Automotive Sensor Signal Conditioner with LIN & PWM Interface ZSSC3170 Block Diagram VDDA SCL I2CTM* Control Registers Ext. Temp. Diode SDA VBR_T Sensor Bridge HOUT Temp. Sens. Select VTN1 VBN MUX Gain Factor Offset Shift ADC Mode PGA PWM RAM LOUT ADC CMC LIN LIN Protection & Power Management VB Ext. RTD VBP Analog Front-End (AFE) VTN2 VBR_B VSSA EEPROM Internal Temp. Sensor Digital Block VSSE Interfaces ZSSC3170 * I2C™ is a trademark of NXP. Applications LIN Pressure Sensor with Temperature Sensor LIN 11 LIN 12 LOUT 13 n.c. VSSE 9 VB 8 14 VBN 15 VBR_B HOUT 7 16 VBP 17 VTN 1 18 VBR_T VSSA 3 19 VTN2 VDDA 20 n.c. ZSSC3170 Sensor Bridge With Integrated Temperature Diode C3 220pF VSS 10 GND VBAT C2 220nF R1 10W VDD 6 SCL 5 SCL SDA 4 SDA RTD Media Temperature Sensor R2 2 n.c. 1 C1 100nF Ordering Information (See section 7 of the data sheet for additional options.) Product Sales Code Description Package ZSSC3170EE1B ZSSC3170 Die — Temperature range: -40°C to +150°C Unsawn on Wafer, 2450 pcs. ZSSC3170EE1C ZSSC3170 Die — Temperature range: -40°C to +150°C Sawn on Wafer Frame, 2450 pcs. ZSSC3170EE2 ZSSC3170— SSOP20 — Temperature range: -40°C to +150°C Add R for 13” reel, 2000 pcs. Add T for tube, 660 pcs. ZSSC3170EE3R ZSSC3170 DFN20 – Temperature Range -40°C to +150°C Tape & Reel - 13" ZSSC3170EA1B ZSSC3170 Die — Temperature range: -40°C to +125°C Unsawn on Wafer, 2450 pcs. ZSSC3170EA1C ZSSC3170 Die — Temperature range: -40°C to +125°C Sawn on Wafer Frame, 2450 pcs. ZSSC3170EA3R ZSSC3170 DFN20 – Temperature Range -40°C to +125°C Tape & Reel - 13" ZSSC3170KIT ZSSC3170 Evaluation Kit and 5 SSOP20 samples Kit Sales and Further Information www.zmdi.com [email protected] Zentrum Mikroelektronik Dresden AG Global Headquarters Grenzstrasse 28 01109 Dresden, Germany ZMD America, Inc. 1525 McCarthy Blvd., #212 Milpitas, CA 95035-7453 USA Central Office: Phone +49.351.8822.0 Fax +49.351.8822.600 USA Phone +855.275.9634 Phone +408.883.6310 Fax +408.883.6358 European Technical Support Phone +49.351.8822.7.772 Fax +49.351.8822.87.772 DISCLAIMER: This information applies to a product under development. Its characteristics and specifications are subject to change without notice. Zentrum Mikroelektronik Dresden AG (ZMD AG) assumes no obligation regarding future manufacture unless otherwise agreed to in writing. The information furnished hereby is believed to be true and accurate. However, under no circumstances shall ZMD AG be liable to any customer, licensee, or any other third party for any special, indirect, incidental, or consequential damages of any kind or nature whatsoever arising out of or in any way related to the furnishing, performance, or use of this technical data. ZMD AG hereby expressly disclaims any liability of ZMD AG to any customer, licensee or any other third party, and any such customer, licensee and any other third party hereby waives any liability of ZMD AG for any damages in connection with or arising out of the furnishing, performance or use of this technical data, whether based on contract, warranty, tort (including negligence), strict liability, or otherwise. European Sales (Stuttgart) Phone +49.711.674517.55 Fax +49.711.674517.87955 Zentrum Mikroelektronik Dresden AG, Japan Office 2nd Floor, Shinbashi Tokyu Bldg. 4-21-3, Shinbashi, Minato-ku Tokyo, 105-0004 Japan ZMD FAR EAST, Ltd. 3F, No. 51, Sec. 2, Keelung Road 11052 Taipei Taiwan Phone +81.3.6895.7410 Fax +81.3.6895.7301 Phone +886.2.2377.8189 Fax +886.2.2377.8199 Zentrum Mikroelektronik Dresden AG, Korea Office U-space 1 Building Unit B, 906-1 660, Daewangpangyo-ro Bundang-gu, Seongnam-si Gyeonggi-do, 463-400 Korea Phone +82.31.950.7679 Fax +82.504.841.3026 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50 — December 10, 2014 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. ZSSC3170 Automotive Sensor Signal Conditioner with LIN & PWM Interface Contents 1 2 ZSSC3170 Characteristics ............................................................................................................ 6 1.1 1.2 Absolute Maximum Ratings ..................................................................................................... 6 Operating Conditions............................................................................................................... 7 1.3 Electrical Parameters .............................................................................................................. 7 1.4 Interface Characteristics ........................................................................................................ 12 1.5 EEPROM .............................................................................................................................. 12 Circuit Description ....................................................................................................................... 13 2.1 2.2 Signal Flow and Block Diagram ............................................................................................. 13 Application Modes ................................................................................................................. 14 2.3 Analog Front End (AFE) ........................................................................................................ 15 2.3.1 2.3.2 2.3.3 2.4 Temperature Measurement ................................................................................................... 18 2.5 System Control and Conditioning Calculation ........................................................................ 19 2.5.1 Operating Modes ............................................................................................................. 19 2.5.2 Start-Up Phase ................................................................................................................ 19 2.5.3 Measurement Cycle ......................................................................................................... 20 2.5.4 Conditioning Calculation .................................................................................................. 21 2.6 3 4 Programmable Gain Amplifier (PGA) ............................................................................... 15 Offset Compensation ....................................................................................................... 15 Analog-to-Digital Converter ............................................................................................. 16 Signal Outputs....................................................................................................................... 21 2.6.1 PWM Outputs HOUT and LOUT ...................................................................................... 21 2.6.2 LIN Output ....................................................................................................................... 22 2.7 Digital Test and Calibration Interface ..................................................................................... 22 2.8 Diagnostic and Failsafe Features, Watchdog, and Error Detection ........................................ 22 2.9 High Voltage, Reverse Polarity, and Short Circuit Protection ................................................. 22 Application Circuit Examples and External Components ............................................................. 23 3.1 Application Circuit Examples ................................................................................................. 23 3.2 Dimensioning of External Components.................................................................................. 24 Pinout and Package Options ....................................................................................................... 25 4.1 4.2 Die Pad Definitions and Configuration ................................................................................... 25 SSOP20 Package ................................................................................................................. 26 4.3 DFN20 Package .................................................................................................................... 28 Data Sheet December 10, 2014 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 4 of 32 ZSSC3170 Automotive Sensor Signal Conditioner with LIN & PWM Interface 5 ESD Protection and EMC Specification ....................................................................................... 29 6 Reliability and RoHS Conformity ................................................................................................. 29 7 Ordering Information ................................................................................................................... 29 8 Related Documents ..................................................................................................................... 30 9 Glossary ...................................................................................................................................... 30 10 Document Revision History ......................................................................................................... 32 List of Figures Figure 2.1 Block Diagram of ZSSC3170 .......................................................................................... 13 Figure 2.2 Measurement Cycle ........................................................................................................ 20 Figure 3.1 Application Circuit in PWM Mode with Low-Side Switch .................................................. 23 Figure 3.2 Application Circuit in PWM Mode with High-Side Switch ................................................. 23 Figure 3.3 Application Circuit in LIN Mode........................................................................................ 24 Figure 4.1 Die Pad Configuration ..................................................................................................... 25 Figure 4.2 SSOP20 Package Drawing ............................................................................................. 27 Figure 4.3 DFN20 Package Drawing ................................................................................................ 28 List of Tables Table 1.1 Table 1.2 Absolute Maximum Ratings ............................................................................................... 6 Operating Conditions......................................................................................................... 7 Table 1.3 Electrical Parameters ........................................................................................................ 7 Table 1.4 Interface Characteristics .................................................................................................. 12 Table 1.5 EEPROM ........................................................................................................................ 12 Table 2.1 Configuration for Application Modes ................................................................................ 14 Table 2.2 Adjustable Gain Stages, Corresponding Sensor Signal Spans, and Common Mode Ranges ........................................................................................................................................ 15 Table 2.3 Bridge Sensor Offset Shift Ranges .................................................................................. 16 Table 2.4 A/D Resolution and Conversion Time in PWM Modes ..................................................... 17 Table 2.5 A/D Resolution and Conversion Time in LIN Modes ........................................................ 17 Table 3.1 Dimensioning of External Components for Application Examples .................................... 24 Table 4.1 Die Pad Definitions for ZSSC3170 .................................................................................. 25 Table 4.2 Pin Definition of SSOP20 Package .................................................................................. 26 Data Sheet December 10, 2014 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 5 of 32 ZSSC3170 Automotive Sensor Signal Conditioner with LIN & PWM Interface 1 ZSSC3170 Characteristics 1.1 Absolute Maximum Ratings The absolute maximum ratings are stress ratings only. The device might not function or be operable above the recommended operating conditions given in section 1.2. Stresses exceeding the absolute maximum ratings might also damage the device. In addition, extended exposure to stresses above the recommended operating conditions might affect device reliability. ZMDI does not recommend designing to the “Absolute Maximum Ratings.” Parameters are valid without time limit unless otherwise noted. Table 1.1 Absolute Maximum Ratings No. Parameter Symbol 1.1.1 External Supply Voltage — 1), 2) PWM Mode VBATPWM 1.1.2 Supply Voltage on VB Pin— 1), 2) PWM Mode VBPWM 1.1.3 External Supply Voltage — 1), 2) LIN Mode VBATLIN 1.1.4 Supply Voltage on VB Pin— 1) 2) LIN Mode 1.1.5 Voltage at HOUT and 1) 2) LOUT Pins 1.1.6 Voltage at LIN pin 1) 2) Unit V To VSSE -0.3 18 V To VSS (external GND) -18 40 V VBLIN To VSS -0.3 40 V VHOUT, VLOUT To VSSE -18 18 V To VSS -40 40 V VDDA To VSSA -0.3 6.5 V VDD To VSSA -0.3 6.5 V To VSSA -0.3 VDDA +0.3 V -40 150 C -40 170 C 1.1.8 Digital Supply Voltage 1.1.9 Voltage at all other Analog or 3) Digital Pins VAIO, VDIO 1.1.10 Storage Temperature TSTOR 1.1.11 Extended Storage Temperature TSTRG_EXT t < 10h 1) Refer to ZSSC3170_HighVoltageProt_Rev_X.xy.pdf for detailed specifications. 2) Refer to section 3.1 for the application circuit. 3) No measurement in mass production; parameter is guaranteed by design and/or quality monitoring. December 10, 2014 Max 18 Analog Supply Voltage Data Sheet Typ -18 1.1.7 3) Min To VSSE (external GND) VLIN 3) Conditions © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 6 of 32 ZSSC3170 Automotive Sensor Signal Conditioner with LIN & PWM Interface 1.2 Operating Conditions Parameters are valid for the full operating temperature range without time limit unless otherwise noted. Table 1.2 Operating Conditions No. Parameter 1.2.1 Supply Voltage Symbol Conditions Min Typ Max Unit VB Voltage at pin VB to VSSE 8.2 12 16.5 V 7 12 18 V -40 125 C 1) 1) 1.2.2 Supply Voltage - LIN Mode 1.2.3 Ambient Temperature 1.2.4 Extended Ambient Temperature (ZSSC3170EExx only) TAMB_EXT 1000h @ +150°C 125 150 C 1.2.5 Ambient Temperature EEPROM Programming TAMB_EEP See section 1.5. -40 150 C 1.2.6 Bridge Resistance 2 25 kW 1) 2) VBLIN Voltage at pin VB to VSS TAMB 2) RBR Refer to ZSSC3170_HighVoltageProt_Rev*.pdf for detailed specification. No measurement in mass production; parameter is guaranteed by design and / or quality monitoring. 1.3 Electrical Parameters If not otherwise specified, all parameter limits are valid within operating conditions defined in section 1.2 and without time limit. All voltages are related to VSSA, if not otherwise specified. Note: Refer to the important notes at the end of the table (page 11). Table 1.3 Electrical Parameters No. Parameter Conditions Min Typ Max Unit 7 mA 40 100 µA 5 6 V Supply Current and Internal Supply Voltages 1.3.1 1.3.1.1 Symbol Supply Current IS Excluding bridge supply current; excluding PWM current; oscillator adjusted (typical 2 MHz) LIN Sleep Mode without current over LIN wire; PWM output pins not connected; VBLIN = 14.4V for max. value VLIN=VBLIN 1.3.1.2 Supply Current LIN Sleep Mode 1.3.1.3 Internal Supply Voltage (generated internally) VVDA VVDA = VVDDA - VVSSA at RBR ≥ 2kW (see 1.2.6) 4.3 1.3.1.4 Supply Voltage Sensor Bridge (internally at VDDA and VSSA) VVBR VVBR = VVBR_T - VVBR_B at RBR ≥ 2kW (see 1.2.6) VVDA – 0.3V Data Sheet December 10, 2014 IS_LINSLP © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. VVDA 7 of 32 ZSSC3170 Automotive Sensor Signal Conditioner with LIN & PWM Interface No. Parameter Symbol Conditions Typ Max Unit 275 mV/V 388 % VIN_SPAN -2 2 nA 0.29 0.65 VVBR 1300 ppm FS/mV 40 A 0 1.5 V 1200 4500 ppm FS/ (mV/V) V Analog Front End (see section 2.3) 1.3.2 1.3.2.1 Input Voltage Range 1.3.2.2 Maximum Bridge Sensor Offset Compensation 1.3.2.3 Bridge Input Current 1) Difference IIN_DIFF TAMB = -25°C to 85°C 1.3.2.4 Common Mode Input Voltage Range VIN_CM Dependent on selected gain, XZC off (see Table 2.2); see 1.3.1.4 for VVBR 1.3.3 VIN_SPAN OC Analog gain: 2.8 to 420 1 Depending on selected gain (see Table 2.3) Temperature Measurement (see section 2.4) 1.3.3.1 External Temperature Diode Channel Gain ATSED 1.3.3.2 External Temperature Diode Bias Current ITSED 1.3.3.3 External Temperature 1) Diode Input Range VTSED 1.3.3.4 External Temperature Resistor Channel Gain ATSER 1.3.3.5 External Temperature 1) Resistor Input Range VTSER Relative to VVDDA-VVSSA 1.3.3.6 Internal Temperature Diode Sensitivity STTSI Raw values, without conditioning calculation FS = Full Scale 300 10 Relative to VVBR_T 20 70% 100% VVDDA-VVSSA VVDDA-VVSSA 700 2700 ppm FS/K 20 100 kW 12 nF 1.2 nF 1000 W Sensor Diagnostic Tasks 1.3.4 1.3.4.1 Min Sensor Connection Loss Resistance Threshold 1.3.4.2 Maximum Input Capacitance for Sensor Connection Check 1.3.4.3 Maximum Input Capacitance for Sensor Connection Check with Sensor Short Check and Sensor Aging Check Enabled 1.3.4.4 Sensor Input Short Resistance Threshold Data Sheet December 10, 2014 RSCCTH CSCC CSCCSSC/SAC RSSCTH Maximum: 10nF + 20% If Sensor Short Check is enabled, the Sensor Connection Check HighCapacitances Mode must also be enabled. (Also see 1.3.4.3.) Maximum: 1nF + 20% For using Sensor Short Check and Sensor Aging Check at the same time. 50 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 8 of 32 ZSSC3170 Automotive Sensor Signal Conditioner with LIN & PWM Interface No. Parameter Symbol Conditions 1) 1.3.5.1 ADC Resolution 1.3.5.2 DNL 1.3.5.3 INL 1.3.5.4 ADC Input Range Max Unit 14 Bit 1) rADC DNLADC rADC = 14-bit, fOSC = 2MHz, best fit, complete AFE; see 1.3.5.4 for ADCINP_R. 0.95 LSB INLADC rADC = 14-bit, fOSC = 2MHz, best fit, complete AFE; see 1.3.5.4 for ADCINP_R. 8 LSB 90 % VVBR ADCINP_R See 1.3.1.4 for VVBR. 10 PWM Output (Pins HOUT and LOUT) 1.3.6 1.3.6.1 Output High Level – HSS; HOUT Pin VHSS_H ISOURCE = 15mA, VB 8.8V to VSSE 1.3.6.2 Output Low Level – LSS; LOUT Pin VLSS_L ISINK = 12mA to VSSE 1.3.6.3 Leakage Current LOUT Pin 1.3.6.4 Rise Time HSS Slew Rate HSS 1.3.6.6 Typ A/D Conversion (see section 2.3.3) 1.3.5 1.3.6.5 Min V 0.5V V ILEAK_LOUT Sink; high level at LOUT 50 µA 1) tHSS_RISE VHOUT = 0.5V4V 15 µs 1) SRHSS VHOUT = 0.5V4V 2 V/µs tLSS_FALL VLOUT = 4V0.5V 15 µs SRLSS VLOUT = 4V0.5V -2 V/µs rPWM_FS D = 1% to 99 % 11 Bit Adjustable with 8-bit resolution 1 1) Fall Time LSS 4 1.3.6.7 Slew Rate LSS 1.3.6.8 PWM Full-Scale 1) Resolution 1.3.6.9 Duty Cycle 1) 1) D 99 % 2.0 V 1 VB 2) LIN Interface – Main Parameters (All voltages related to VSS; RVBAT_LIN Power Supply Line Resistance = 500Ω) 1.3.7 1.3.7.1 Output Low Level Transmitter VLIN_L 1.3.7.2 Output High Level Transmitter VLIN_H Driver off 0.9 1.3.7.3 Output Current ILIN_L Sink; driver on 40 90 200 mA 1.3.7.4 Pull-Up Resistance In series with diode to VB 20 30 47 kW -40°C ≤ TAMB ≤ 125°C; VLIN VB; 7V VB 18V; 7V VLIN 18V; driver off 3 20 µA 125°C ≤ TAMB ≤ 150°C; VLIN VB; 7V VB 18V; 7V VLIN 18V; driver off 3 50 µA 1.3.7.5 Input Current LIN Recessive, Overvoltage at LIN Data Sheet December 10, 2014 RLIN_PU ILINPASrec 0.6 1.2 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 9 of 32 ZSSC3170 Automotive Sensor Signal Conditioner with LIN & PWM Interface No. Parameter Symbol Conditions Min 1.3.7.6 Input Current LIN Dominant ILINPASdom VLIN = 0V; VB = 12V; driver off -1 1.3.7.7 Input Current LIN Recessive, No GND for Bus ILIN_NOGND 0V VLIN 18V; VGND = VVB; VB = 12V -1 1.3.7.8 Input Current LIN No GND for Bus 2) ILIN_LOSTVB 3 50 µA 1.3 3 V/µs 0.4 VB Rising and falling edges, transmit and receive 1.3.7.11 Input High Level Receiver VRECH 1.3.7.12 Input Hysteresis Receiver VRECHYS VRECHYS = VRECH - VRECL 0.08 1.3.7.13 Input Center Point Receiver VBUS_CNT VBUS_CNT = (VRECL + VRECH)/2 0.475 D1 THRec(max) = 0.744 * VB; THDom(max) = 0.581 * VB; VB = 7.0 to 18V; tBit = 50µs; D1 = tBUS_rec(min)/(2 * tBit) (See ZSSC3170 LIN Interface Description Rev. 2.0 for details.) 0.396 D2 THRec(min) = 0.422 * VB; THDom(min) = 0.284 * VB; VB = 7.6 to 18V; tBit = 50µs; D1 = tBUS_rec(max)/(2 * tBit) (See ZSSC3170 LIN Interface Description Rev. 2.0 for details.) D3 THRec(max) = 0.778 * VB; THDom(max) = 0.616 * VB; VB = 7.0 to 18V; tBit = 96µs; D3 = tBUS_rec(min)/(2 * tBit) (See ZSSC3170 LIN Interface Description Rev. 2.0 for details.) Duty Cycle 3 Data Sheet December 10, 2014 mA 125°C ≤ TAMB ≤ 150°C; VGND = VSUP = 0V; 0V VLIN 18V VRECL 1.3.7.16 1 µA Input Low Level Receiver Duty Cycle 2 mA 20 1.3.7.10 1.3.7.15 Unit 3 Slew Rate Duty Cycle 1 Max -40°C ≤ TAMB ≤ 125°C; VGND = VSUP = 0V; 0V VLIN 18V 1.3.7.9 1.3.7.14 SRLIN Typ 0.5 0.6 VB 0.5 0.12 VB 0.525 VB - 0.581 0.417 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. - - 10 of 32 ZSSC3170 Automotive Sensor Signal Conditioner with LIN & PWM Interface No. 1.3.7.17 Parameter Duty Cycle 4 Symbol Conditions D4 THRec(min) = 0.389 * VB; THDom(min) = 0.251 * VB; VB = 7.6 to 18V; tBit = 96µs; D4 = tBUS_rec(max)/(2 * tBit) (See ZSSC3170 LIN Interface Description Rev. 2.0 for details.) 1.3.8 Typ Max Unit 0.590 - Until first valid output; fOSC = 2MHz 30 ms fOSC = 2.2MHz; 14-bit resolution; LIN Mode; 100% final value (see Table 2.5) 3.6 ms fOSC = 1.8MHz; 14-bit resolution; PWM Mode; 100% final value (see Table 2.4) 20 ms System Response 1) 1.3.8.1 Start-Up Time 1.3.8.2 Response Time LIN_Mode; Typical LIN 3) Configuration 1.3.8.3 Response Time PWM Mode; Typical PWM 4) Configuration 1.3.8.4 Min tSTART tRESP_ LIN_2_14_5 5), 6) Overall Error AFE ( fOSC = 2MHz, XZC off; no sensor related errors; relative to digital value) tRESP_ PWM_2_14_2 FAFE_85 TAMB: -20°C to 85°C 0.25 %FS FAFE_125 TAMB: -40°C to 125°C 0.5 %FS FAFE_150 TAMB: -40°C to 150°C 1.0 %FS 1) No measurement in mass production; parameter is guaranteed by design and/or quality observation. 2) For complete specification, see ZSSC3170_LIN_Interface_Description_Rev_X.xy.pdf. 3) 2-step A/D conversion (ADCORD=1), 14-bit resolution (ADCRES=1), resolution 2nd conversion step 5-bit (ADCMODE=11) 4) 2-step A/D conversion (ADCORD=1), 14-bit resolution (ADCRES=1), resolution 2nd conversion step 2-bit (ADCMODE=00) 5) Deviation from ideal line including INL, gain, offset, and temperature errors. 6) With XZC active: additional total error of max. 25ppm/K at XZC = 31. Error decreases linearly at XZC < 31. Data Sheet December 10, 2014 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 11 of 32 ZSSC3170 Automotive Sensor Signal Conditioner with LIN & PWM Interface 1.4 Interface Characteristics Table 1.4 Interface Characteristics No. Parameter Symbol 1) Input High Level VI2C_IN_H 1) Input Low Level 1.4.1.3 Output Low Level 1.4.1.4 SDA Load Capacity 1.4.1.5 SCL Clock Frequency Max Unit 0.8 VDDA 0.2 VDDA 0.15 VDDA CSDA 400 pF fSCL 400 kHz 100 kW 1 V VI2C_OUT_L 1) 1) 1) Internal Pull-Up Resistor 1.4.2 1) Open drain output current: < 2mA RI2C 25 One-Wire Interface at HOUT and LOUT (LIN Protocol) 1.4.2.1 Input Low Level 1.4.2.2 Input High Level 1.4.2.3 Start Window 1) Typ VI2C_IN_L 1.4.1.2 1.4.1.6 Min I C™ Interface 1.4.1 1.4.1.1 Conditions 2 1) 1) 1) VOWI_IN_L VOWI_IN_H tSTART_WIN 4 V At fOSC = 2MHz 30 ms Max Unit No measurement in mass production; parameter is guaranteed by design and/or quality observation. 1.5 EEPROM Table 1.5 EEPROM No. Parameter Symbol Conditions TAMB < 85°C 1000 nEEP_WRI_150 TAMB < 150°C 100 Write Cycles 1.5.2 Read Cycles nEEP_RD 1.5.3 Data Retention tEEP_RET 100000h@55°C + 27000h@125°C + 3000h@150°C 1.5.4 Programming Time tEEP_WRI Per written word, at fOSC = 2MHz December 10, 2014 Typ nEEP_WRI_85 1.5.1 Data Sheet Min 8 * 10 15 12 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 8 a ms 12 of 32 ZSSC3170 Automotive Sensor Signal Conditioner with LIN & PWM Interface 2 Circuit Description 2.1 Signal Flow and Block Diagram The signal path of the ZSSC3170 consists of the analog front end (AFE), the digital signal processing block, and interfaces including protection circuitry. Based on a differential structure, the bridge inputs VBP and VBN are handled by two signal lines each with a dynamic range symmetrical to the common mode potential (analog ground equal to VDDA/2). Therefore it is possible to amplify positive and negative input signals within the common mode range of the signal input. Figure 2.1 Block Diagram of ZSSC3170 VDDA I2CTM* Control Registers Ext. Temp. Diode SCL SDA VBR_T Sensor Bridge HOUT Temp. Sens. Select VTN1 VBN MUX Gain Factor Offset Shift PGA ADC Mode ADC RAM PWM LOUT CMC LIN LIN Protection & Power Management VB Ext. RTD VBP Analog Front-End (AFE) VTN2 VBR_B VSSA EEPROM Internal Temp. Sensor Digital Block VSSE Interfaces ZSSC3170 * I2C™ is a trademark of NXP. The multiplexer (MUX) transmits the signals from either the bridge sensor or the selected temperature sensors to the analog-to-digital converter (ADC) in a defined sequence. The temperature sensor can either be an external or internal diode or an external thermistor (RTD), selected by EEPROM configuration. In LIN Mode, temperature output is available. For this temperature measurement, the same temperature sensor can be used as for calibration temperature, or a second temperature sensor input can be selected. The differential signal from the bridge sensor is pre-amplified by the programmable gain amplifier (PGA). The ADC converts bridge sensor and temperature signals into digital values. The digital signal conditioning takes place in the calibration microcontroller (CMC) using a ROM-resident conditioning formula and sensor-specific coefficients stored in the EEPROM during calibration. The configuration data and the correction parameters can be programmed into the EEPROM by digital communication at the output 2 pins or at the I C™ interface. Depending on the programmed output configuration, the corrected sensor signal is output as a PWM signal (high-side switch or low-side switch) or as a digital value within a LIN frame. During the 2 calibration procedure, the I C™ interface can provide measurement values as well. Data Sheet December 10, 2014 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 13 of 32 ZSSC3170 Automotive Sensor Signal Conditioner with LIN & PWM Interface 2.2 Application Modes For each application, a configuration set must be established (generally prior to calibration) by programming the on-chip EEPROM for the following modes: Table 2.1 Configuration for Application Modes Bridge Sensor Channel Input Voltage Range Select gain stage of the AFE with respect to the maximum sensor signal span and the zero point of the ADC. Bridge Sensor Offset Compensation (XZC) Activate the analog sensor offset compensation if required; e.g., if the sensor offset voltage is close to or larger than the sensor span. Resolution/Response Time Select appropriate resolution of the ADC. Settings will influence sampling rate, signal integration time, and therefore sensitivity to noise and disturbances. Temperature Measurement Temperature Measurement for the Correction of the Bridge Signal Select temperature sensor to calibrate temperature related errors. Temperature Measurement for the Temperature Output in LIN Mode Select temperature sensor for temperature measurement. Output Signal Output Mode Select PWM or LIN according to application requirements. LIN Mode Select LIN compatibility to specification package LIN2.1, LIN2.0, or LIN1.3. PWM Mode Select switch type: high-side switch (HSS) or low-side switch (LSS). Data Sheet December 10, 2014 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 14 of 32 ZSSC3170 Automotive Sensor Signal Conditioner with LIN & PWM Interface 2.3 Analog Front End (AFE) The analog front end (AFE) consists of the signal multiplexer (MUX), the programmable gain amplifier (PGA) and the analog-to-digital converter (ADC). 2.3.1 Programmable Gain Amplifier (PGA) Table 2.2 shows the adjustable gains, corresponding sensor signal spans, and common mode range limits. See section 2.3.2 for details for XZC. Table 2.2 Adjustable Gain Stages, Corresponding Sensor Signal Spans, and Common Mode Ranges Overall Gain aIN Maximum Input Voltage Range 1) VIN_SPAN [mV/V] Gain Amp1 Gain Amp2 420 1.8 30 7 280 2.7 30 210 3.6 140 Gain Amp3 Input Common Mode Range 2) VIN_CM [%VDDA] XZC off XZC on 2 29 to 65 45 to 55 4.66 2 29 to 65 45 to 55 15 7 2 29 to 65 45 to 55 5.4 15 4.66 2 29 to 65 45 to 55 105 7.1 7.5 7 2 29 to 65 45 to 55 70 10.7 7.5 4.66 2 29 to 65 45 to 55 52.5 14.3 3.75 7 2 29 to 65 45 to 55 35 21.4 3.75 4.66 2 29 to 65 45 to 55 26.3 28.5 3.75 3.5 2 29 to 65 45 to 55 14 53.75 1 7 2 29 to 65 45 to 55 9.3 80 1 4.66 2 29 to 65 45 to 55 7 107 1 3.5 2 29 to 65 45 to 55 2.8 267 1 1.4 2 32 to 57 Not applicable 1) Recommended internal signal range: maximum 80% supply voltage. Range is defined by 80% of supply voltage divided by selected gain. 2) At maximum input signal (with XZC: +300% offset). 2.3.2 Offset Compensation The ZSSC3170 supports two methods of sensor offset compensation: Digital offset correction is processed during the digital signal conditioning by the calibration microcontroller (CMC). Bridge sensor offset compensation (XZC) is achieved by adding a compensation voltage at the analog signal path that removes coarse offset. XZC is needed for large offset values that would otherwise overdrive the analog signal path, and it can be adjusted by 6 EEPROM bits. Depending on the gain adjustment, XZC can handle offset values of up to 300% of the sensor signal range. Data Sheet December 10, 2014 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 15 of 32 ZSSC3170 Automotive Sensor Signal Conditioner with LIN & PWM Interface Table 2.3 Bridge Sensor Offset Shift Ranges Overall Gain aIN Maximum Input Voltage Range VIN_SPAN (mV/V) Offset Shift per Step (%Full Span) 420 1.8 12.5 7.8 388 280 2.7 7.6 7.1 237 210 3.6 12.5 15.5 388 140 5.4 7.6 14.2 237 105 7.1 12.5 31 388 70 10.7 7.6 28 237 52.5 14.3 12.5 62 388 35 21.4 7.6 57 237 26.3 28.5 5.2 52 161 14 53.6 12.5 233 388 10 80 7.6 207 237 7 107 5.2 194 161 2.8 267 0.83 78 26 2.3.3 Approximate Approximate Maximum Offset Shift Maximum Offset Shift (mV/V) (%VIN_SPAN) Analog-to-Digital Converter The analog-to-digital converter (ADC) is designed in full differential switched capacitor technology with a selectable resolution of 13 or 14 bits. The ADC can operate in first or second order configuration. The conversion is largely insensitive to short-term and long-term instabilities of the clock frequency. MSB segment conversion: In this first step of the A/D conversion, the measurement value is integrated over the complete conversion time ensuring a high degree of noise suppression. To extend the integration phase to the maximum, this fraction of the complete conversion time is selected to be as long as possible corresponding to the time available. LSB segment conversion: To achieve a higher resolution, the residual value of the first step is converted in a subsequent step by a second converter. In first-order configuration, the second step is skipped (singlestep conversion). Data Sheet December 10, 2014 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 16 of 32 ZSSC3170 Automotive Sensor Signal Conditioner with LIN & PWM Interface Table 2.4 Mode A/D Resolution and Conversion Time in PWM Modes A/D Resolution Total (bit) A/D Resolution MSB Segment Conversion (bit) A/D Resolution LSB Segment Conversion (bit) A/D Conversion Mode 1) ADC MODE PWM Cycle Time (fOSC = 1.8MHz) (ms) 14 12 2 00 19.9 14 11 3 01 10.8 14 10 4 10 6.3 14 9 5 11 4.0 13 11 2 00 10.8 13 10 3 01 6.3 13 9 4 10 4.0 13 8 5 11 2.8 14 14 n/a n/a 37.5 13 13 n/a n/a 19.3 PWM / ADC 1) 2 step PWM / ADC 1 step 1) See ZSSC3170_FunctionalDescription_Rev_X.xy.pdf for details. Table 2.5 Mode A/D Resolution and Conversion Time in LIN Modes 2) A/D Resolution Total (bit) A/D Resolution MSB Segment Conversion (bit) A/D Resolution LSB Segment Conversion (bit) A/D Conversion Mode 1) ADC MODE Response Time in LIN Mode (fOSC = 2.2MHz) (ms) 14 12 2 00 16.3 14 11 3 01 8.9 14 10 4 10 5.2 14 9 5 11 3.3 13 11 2 00 8.9 13 10 3 01 5.2 13 9 4 10 3.3 13 8 5 11 2.4 14 14 n/a n/a 61.5 13 13 n/a n/a 31.7 LIN / ADC 2 step LIN / ADC 1 step 1) See ZSSC3170_FunctionalDescription_Rev_X.xy.pdf for details. 2) Total response time. Data Sheet December 10, 2014 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 17 of 32 ZSSC3170 Automotive Sensor Signal Conditioner with LIN & PWM Interface Equation (1) describes the conversion result: VADC _ IN Z ADC 2r V RS ADC _ REF ADC (1) Where ZADC r VADC_IN VADC_REF RSADC A/D conversion result A/D resolution in bits Differential input voltage of ADC Differential reference voltage of ADC 1 1 1 1 ADC range shift adjustable by EEPROM configuration (RSADC = /16, /8, /4, /2 ) By selecting different values of RSADC, the user can match the sensor input signal to the optimum input voltage range of the ADC. The ADC reference voltage VADC_REF is defined as the difference between the bridge supply potentials at pins VBR_T and VBR_B. The theoretical ADC input voltage range ADC INP_R is equal to this ADC reference voltage. A major constraint required for achieving the specified precision as well as the stability and nonlinearity parameters of the AFE is to use a maximum ADC input voltage range of 10% to 90% of ADC INP_R within the application. This is of special importance for ensuring the specified parameters for the entire operating temperature range as well as all possible sensor bridge tolerances. The validity of these conditions is not checked by the ZSSC3170’s failsafe functions and therefore must be ensured by the customer-specific configuration. 2.4 Temperature Measurement The following temperature sensors are supported by ZSSC3170 for both temperature and calibration temperature measurement: Internal pn-diode External pn-diode; anode to pin VBR_T External resistive half-bridge with the thermistor connected in the upper branch In PWM Mode, the conditioning calculation for the bridge sensor signal is based on values of the selected temperature sensor. In LIN Mode, two temperature measurements are executed using either two different sensors or one sensor for both measurements. The temperature output value is the result of a conditioning calculation including offset nd compensation, gain correction, and 2 order nonlinearity compensation. The conditioning coefficients are stored in the EEPROM. Data Sheet December 10, 2014 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 18 of 32 ZSSC3170 Automotive Sensor Signal Conditioner with LIN & PWM Interface 2.5 System Control and Conditioning Calculation The system control performs the following tasks: Sequencing of the start-up phase Control of measurement cycle based on EEPROM configuration data 16-bit conditioning calculation for each measurement signal based on EEPROM conditioning coefficients and ROM-resident signal conditioning algorithm Processing of communication requests received at the serial interfaces Control of calibration mode Processing of diagnostic and failsafe tasks For a detailed description, refer to ZSSC3170_FunctionalDescription_Rev_X.xy.pdf. 2.5.1 Operating Modes Three main modes are implemented in the integrated state machine: Normal Operation Mode (NOM) with continuous signal conditioning Command Mode (CM), which provides access to all internal registers and provides the basis for configuration and calibration of the ZSSC3170 Diagnostic Mode (DM), which indicates detected error conditions 2.5.2 Start-Up Phase The start-up phase consists of the following time periods: Settling of the internal voltage supply represented by the voltage VDDA-VSSA. At the end of this period, the power-on-reset circuit (POR) switches off the reset signal. System start, readout of EEPROM, and signature check. Processing of the signal conditioning start routine containing bridge sensor signal and temperature measurements, associated auto-zero measurements, and the conditioning calculation itself. Within this period, the output pins are ready to receive special LIN frames resulting in entering the Command Mode (CM). This start window is active for up to 30ms. The ZSSC3170 switches into Normal Operation Mode (NOM) after the start window is passed. It proceeds with the cyclic processing of the measurement and conditioning tasks. Data Sheet December 10, 2014 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 19 of 32 ZSSC3170 Automotive Sensor Signal Conditioner with LIN & PWM Interface 2.5.3 Measurement Cycle Depending on the EEPROM settings, the multiplexer selects the following inputs in a defined sequence: Pre-amplified sensor bridge signal Temperature sensor defined by EEPROM configuration for calibration temperature Temperature sensor defined by EEPROM configuration for temperature measurement Auto-zero signal Diagnostic signals The CMC controls the complete measurement cycle following a basic flow shown in Figure 2.2. All necessary measurements for bridge sensor and temperature signal are executed once after power-on within the start-up routine. This initial phase is followed by continuous processing of the complete measurement cycle. The sensor connection check (SCC), sensor short check (SSC), and sensor aging check (SAC) for diagnostic tasks (see section 2.8) are continuously executed within the regular measurement cycle even if the processing of the diagnostic function is disabled by the EEPROM configuration. For details, refer to ZSSC3170_FunctionalDescription_Rev_X.xy.pdf. Figure 2.2 Measurement Cycle Start Routine Bridge Sensor Signal Auto-Zero Bridge Sensor Signal Measurement Calibration Temperature Auto-Zero Bridge Sensor Signal Measurement Calibration Temperature Measurement Bridge Sensor Signal Measurement Temperature Auto-Zero Bridge Sensor Signal Measurement Temperature Measurement Bridge Sensor Signal Measurement Sensor Aging Check Bridge Sensor Signal Measurement Sensor Connection Check / Sensor Short Check, Positive Biased Bridge Sensor Signal Measurement Sensor Connection Check / Sensor Short Check, Negative Biased Bridge Sensor Signal Measurement Data Sheet December 10, 2014 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 20 of 32 ZSSC3170 Automotive Sensor Signal Conditioner with LIN & PWM Interface 2.5.4 Conditioning Calculation After digital auto-zero correction of the bridge sensor measurement value, the interim result is further processed nd based on the correction formula. Offset and gain with temperature effects up to 2 order and non-linearity up to rd 3 order can be compensated for, resulting in a positive 15-bit bridge sensor result value normalized to the range of [0;1]. In LIN Mode, the digital measurement value of the temperature is processed based on a proprietary correction nd formula as well. Offset, gain, and non-linearity up to 2 order can be compensated for yielding a positive 15-bit temperature value normalized to the range of [0;1]. 2.6 Signal Outputs ZSSC3170 provides three signal outputs: LIN – LIN Interface revision 2.1/2.0 with compatibility to revision 1.3 HOUT – PWM high-side switch (HSS) LOUT – PWM low-side switch (LSS) For the respective application, one signal output must be selected and configured as the active output. Idle outputs must be not connected. To enter the Command Mode (CM), communication can be established at each of the three output pins. A dedicated command must be sent during the start window immediately after power-on (duration tSTART_WN; see specification 1.4.2.3). The communication protocol at all pins is based on the LIN Data Link Layer. Note that communication at the HOUT pin uses the inverted signal levels of the LIN frame. In LIN Mode, communication at the LIN pin is always possible during Normal Operation Mode (NOM). To enable communication within the start window, the output drivers are set to tri-state during this time. The outputs HOUT and LOUT are connected to internal pull-up resistors to ensure the necessary resistive stage. For the LIN transceiver, an internal pull-up resistor is implemented by default (according to the LIN Specification Package, Physical Layer section). If not switched into CM before expiration of the 30ms start window, depending on the configuration, the ZSSC3170 will start to provide a PWM signal or can respond to communication requests of the LIN master. The function set of the signal outputs is specified in detail in the following documents: ZSSC3170_FunctionalDescription_Rev_X.xy.pdf and ZSSC3170_LIN_Interface_Description_Rev_X.xy.pdf. Note: LIN Sleep Mode must be disabled for proper PWM operation. 2.6.1 PWM Outputs HOUT and LOUT In PWM Mode, the output signal is provided at the pins HOUT or LOUT accordingly. The outputs are protected from short circuit overload by current limiters and time monitoring. Driving the signal lines with slew-rate-limited edges reduces electromagnetic emission. At the HOUT pin, a voltage higher than the maximum supply voltage can be tolerated. The notably low leakage current of LOUT is designed to cover the requirements of some unique electronic control units (ECU). Data Sheet December 10, 2014 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 21 of 32 ZSSC3170 Automotive Sensor Signal Conditioner with LIN & PWM Interface 2.6.2 LIN Output The output of the integrated LIN transceiver at the LIN pin is compatible with the LIN revisions 2.1, 2.0 and 1.3. For details, refer to the document ZSSC3170_LIN_Interface_Description_Rev_X.yx.pdf. For LIN Physical Layer Conformance Tests, the control pins of the integrated LIN transceiver can be accessed separately in a LIN Conformance Test Mode. 2.7 Digital Test and Calibration Interface 2 Beyond the digital communication features accessed via the output pins, the ZSSC3170 provides an I C™ com2 patible test and calibration interface with slave functionality. For a detailed description of the I C™ interface, refer to the document ZSSC3170_FunctionalDescription_Rev_X.xy.pdf. 2.8 Diagnostic and Failsafe Features, Watchdog, and Error Detection The ZSSC3170 detects various possible failures. An identified failure is indicated by the ZSSC3170 entering the Diagnostic Mode (DM). With PWM active, the respective output is switched to the resistive mode. In LIN Mode, depending on the error classification, the correlated status bits are activated. A watchdog continuously monitors the operations of the CMC and the running measurement loop. The operation of the internal clock oscillator is monitored by the oscillator failure detection. A check of the sensor bridge for broken or shorted wires is performed continuously (the sensor connection check (SCC) and the sensor short check (SSC)). The common mode voltage of the sensor (CMV) is monitored continuously (sensor aging check (SAC)). A check for a broken chip (BCC) can be applied in the start-up phase after power-on. RAM, ROM, EEPROM, registers, and the arithmetic unit are monitored continuously. Refer to the ZSSC3170_FunctionalDescription_Rev_X.xy.pdf for a detailed description. 2.9 High Voltage, Reverse Polarity, and Short Circuit Protection The ZSSC3170 is designed for a direct 12V supply, which can be provided by a vehicle power system. Internal sub-assemblies are supplied and protected by integrated voltage regulators and limiters. Specific protection circuits allow tolerance of permanent reverse polarity at supply and output pins. These functions are described in detail in the document ZSSC3170_HighVoltageProt_Rev_X.xy.pdf. When operated in the application circuits shown in section 3, the protection features of the ZSSC3170 are guaranteed without time limit. Data Sheet December 10, 2014 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 22 of 32 ZSSC3170 Automotive Sensor Signal Conditioner with LIN & PWM Interface 3 Application Circuit Examples and External Components 3.1 Application Circuit Examples Note: Pad locations shown in the following figures are approximate. For specific pad locations, refer to the ZSSC3170 Technical Note – Pad Coordinates, Die Dimensions, and Package Dimensions (see section 8). Figure 3.1 Application Circuit in PWM Mode with Low-Side Switch Temperature Sensor Sensor Bridge ZSSC3170 Application Circuit PWM Mode with Low-Side Switch 11 10 LIN LOUT VBN 12 13 VBR_B VBP VTN1 VTN2 14 VBR_B 15 16 18 19 VBR_T 17 VBR_T n.c. 3 4 5 6 7 8 SDA SCL VDD HOUT VB VSSE VSS 2 VSSA 9 1 VDDA ZSSC3170 Die VSS n.c. D1 VBAT R1 27Ω LSS SDA SCL VDD C1 100nF C3 2.2nF C2 220nF GND Figure 3.2 Application Circuit in PWM Mode with High-Side Switch Sensor Bridge n.c. n.c. VBN LOUT LIN 11 10 ZSSC3170 Application Circuit PWM Mode with High-Side Switch 12 13 VBR_B 14 VBR_B VBP 15 VTN2 VTN1 16 18 19 VBR_T 17 VBR_T Temperature Sensor ZSSC3170 Die 3 4 5 6 7 8 SDA SCL VDD HOUT VB VSSE VSS 2 VSSA 9 1 VDDA VSS D1 VBAT R1 27Ω HSS SDA SCL VDD C1 100nF C3 4.7nF C2 470nF GND Data Sheet December 10, 2014 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 23 of 32 ZSSC3170 Automotive Sensor Signal Conditioner with LIN & PWM Interface Figure 3.3 Application Circuit in LIN Mode Temperature Sensor Sensor Bridge ZSSC3170 Application Circuit LIN Mode 10 11 LIN LOUT VBN 12 13 VBR_B VBP 14 VBR_B 15 VTN1 16 VBR_T 17 VBR_T 18 19 VTN2 n.c. VSS 9 8 VSSE 5 VDD 7 4 SCL VB 3 SDA 6 2 VSSA HOUT 1 VDDA ZSSC3170 Die n.c. D1 VBAT R1 10Ω LIN SDA SCL VDD C1 100nF C3 220pF C2 220nF GND 3.2 Dimensioning of External Components For application circuits, refer to Figure 3.1, Figure 3.2, and Figure 3.3. Table 3.1 No. Dimensioning of External Components for Application Examples Component Symbol Condition Min Typ Max Unit 3.2.1 Capacitor C1 All modes 100 nF 3.2.2 Capacitor C2 HSS 470 nF 3.2.3 Capacitor C2 LSS, LIN 220 nF 3.2.4 Capacitor C3 HSS 4.7 nF 3.2.5 Capacitor C3 LSS 2.2 nF 3.2.6 Capacitor C3 LIN 220 pF 3.2.7 Resistor R1 LIN 10 W 3.2.8 Resistor R1 LSS, HSS 27 W 3.2.9 Diode D1 All modes Standard Si diode The capacitor values are examples and must be adapted to the requirements of the specific application, in particular to the EMC requirements. In the LIN application, the voltage drop over the series connection of D1 and R1 must not exceed 1V at maximum supply current. For overvoltage pulses at VBAT, R1 serves as a current limiter. Data Sheet December 10, 2014 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 24 of 32 ZSSC3170 Automotive Sensor Signal Conditioner with LIN & PWM Interface 4 Pinout and Package Options 4.1 Die Pad Definitions and Configuration Table 4.1 Die Pad Definitions for ZSSC3170 Die Pad Name 1 VDDA Positive Analog Supply Voltage Power supply 2 VSSA Negative Analog Supply Voltage Ground 3 SDA I²C™ Data I/O Analog I/O, internal pull-up 4 SCL I²C™ Clock Analog input, internal pull-up 5 VDD Positive Digital Supply Voltage Power supply 6 HOUT PWM High-Side Switch High voltage I/O 7 VB Positive External Supply Voltage High voltage I/O 8 VSSE External Ground (PWM Modes) High voltage I/O 9 VSS Ground (LIN Mode) Ground 10 LIN LIN LIN high voltage I/O 11 LOUT PWM Low-Side Switch High voltage I/O Negative Input Sensor Bridge Analog input Negative (Bottom) Bridge Supply Voltage Analog I/O 12 VBN 13 / 14 VBR_B Description Notes 15 VBP Positive Input Sensor Bridge Analog input 16 VTN1 Temperature Sensor 1 Analog I/O 17 / 18 VBR_T Positive (Top) Bridge Supply Voltage Analog I/O 19 VTN2 Temperature Sensor 2 Analog I/O The two-fold implementation of the bridge supply bond pads enables direct bonding from the ZSSC3170 pads to supply pads on the sensor die. Figure 4.1 Die Pad Configuration For exact bond pad positions, refer to ZSSC3170_DicePackagePin_Rev_X.xy.pdf. The backside of the die is electrically connected to the potential VSS and VSSA within the package. Drawing not true to scale. Data Sheet December 10, 2014 1 VSSA 2 SDA 3 SCL 4 VDD 5 HOUT 6 VB 7 VSSE 8 ZSSC3170 VDDA 10 VSS 19 VTN2 18 17 VBR_T VBR_T 16 VTN1 15 VBP 14 13 VBR_B VBR_B 12 VBN 11 LOUT LIN 9 DIE © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 25 of 32 ZSSC3170 Automotive Sensor Signal Conditioner with LIN & PWM Interface 4.2 SSOP20 Package An SSOP20 Green Package (5.3mm body, 0.65mm lead pitch) is one of the two standard delivery forms available for packaged parts. Table 4.2 Pin Definition of SSOP20 Package SSOP20 Pin Name Description Notes 1 n.c. 2 VDDA Positive Analog Supply Voltage Power supply 3 VSSA Negative Analog Supply Voltage Ground 4 SDA I²C™ Data I/O Analog I/O, internal pull-up 5 SCL I²C™ Clock Analog input, internal pull-up 6 VDD Positive Digital Supply Voltage Power supply 7 HOUT PWM High-Side Switch High voltage I/O 8 VB Positive External Supply Voltage High voltage I/O 9 VSSE External Ground (PWM Modes) High voltage I/O 10 VSS Ground (LIN Mode) Ground 11 LIN LIN LIN high voltage I/O 12 LOUT PWM Low-Side Switch High voltage I/O Negative Input Sensor Bridge Analog input Negative (Bottom) Bridge Supply Voltage Analog I/O 14 VBN 15 VBR_B No connection 16 VBP Positive Input Sensor Bridge Analog input 17 VTN1 Temperature Sensor 1 Analog I/O 18 VBR_T Positive (Top) Bridge Supply Voltage Analog I/O 19 VTN2 Temperature Sensor 2 Analog I/O 20 n.c. Data Sheet December 10, 2014 No connection © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 26 of 32 ZSSC3170 Automotive Sensor Signal Conditioner with LIN & PWM Interface Figure 4.2 SSOP20 Package Drawing Note: Drawing is not true to scale. CAD models can be downloaded from ZMDI’s www.zmdi.com/ssc-tools web page. Data Sheet December 10, 2014 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 27 of 32 ZSSC3170 Automotive Sensor Signal Conditioner with LIN & PWM Interface 4.3 DFN20 Package A DFN20 Green Package (6x5 mm body, 0.5mm lead pitch) with wettable flanks is one of the two standard delivery forms available for packaged parts. The pin definitions for the DFN20 package are the same as for the SSOP20 package described in Table 4.2. Figure 4.3 DFN20 Package Drawing Note: Drawing is not true to scale. CAD models can be downloaded from ZMDI’s www.zmdi.com/ssc-tools web page. Data Sheet December 10, 2014 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 28 of 32 ZSSC3170 Automotive Sensor Signal Conditioner with LIN & PWM Interface 5 ESD Protection and EMC Specification All pins have an ESD protection of >2000V according to the Human Body Model (HBM). In addition, the pins VDDE, VSSE, VSS, HOUT, and LOUT have an ESD protection of >4000V and the pin LIN has an ESD protection of >8000V (system level). The level of ESD protection has been tested with devices in SSOP20 packages during the product qualification. The ESD test follows the Human Body Model with 1.5kOhm/100pF based on MIL883, Method 3015.7 (except the LIN pin tests). The ESD test of the LIN pin follows the system level specification with 330Ω/150 pF (according to DIN EN 61000-4-2). The EMC performance regarding external disturbances as well as EMC emission is documented in ZSSC3170_HighVoltageProt_Rev_X.xy.pdf. 6 Reliability and RoHS Conformity The ZSSC3170 is qualified according to the AEC-Q100 standard, operating temperature grade 0. The ZSSC3170 complies with the RoHS directive and does not contain hazardous substances. The complete RoHS declaration update can be downloaded at www.zmdi.com/quality. 7 Ordering Information Product Sales Code Description Package ZSSC3170EE1B ZSSC3170 Die — Temperature range: -40°C to +150°C Unsawn on Wafer, 2450 pcs. ZSSC3170EE1C ZSSC3170 Die — Temperature range: -40°C to +150°C Sawn on Wafer Frame, 2450 pcs. ZSSC3170EE2R ZSSC3170— SSOP20 — Temperature range: -40°C to +150°C 13” Reel, 2000 pcs. ZSSC3170EE2T ZSSC3170— SSOP20 — Temperature range: -40°C to +150°C Tube, 660 pcs. ZSSC3170EE3R ZSSC3170 DFN20 – Temperature Range -40°C to +150°C Tape & Reel - 13" ZSSC3170EA1B ZSSC3170 Die — Temperature range: -40°C to +125°C Unsawn on Wafer, 2450 pcs. ZSSC3170EA1C ZSSC3170 Die — Temperature range: -40°C to +125°C Sawn on Wafer Frame, 2450 pcs. ZSSC3170EA2R ZSSC3170— SSOP20 — Temperature range: -40°C to +125°C 13” Reel, 2000 pcs. ZSSC3170EA2T ZSSC3170— SSOP20 — Temperature range: -40°C to +125°C Tube, 660 pcs. ZSSC3170EA3R ZSSC3170 DFN20 – Temperature Range -40°C to +125°C Tape & Reel - 13" ZSSC3170KIT ZSSC3170 Evaluation Kit and 5 SSOP20 Samples Kit Data Sheet December 10, 2014 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 29 of 32 ZSSC3170 Automotive Sensor Signal Conditioner with LIN & PWM Interface 8 Related Documents X.xy refers to the current version of the document. Document File Name ZSSC3170 Evaluation Kit Description ZSSC3170_Evaluation_Kit_Description_Rev_X.xy.pdf ZSSC3170 Functional Description ZSSC3170_FunctionalDescription_Rev_X.xy.pdf ZSSC3170 High Voltage Protection Description * ZSSC3170_HighVoltageProt_Rev_X.xy.pdf ZSSC3170 LIN Interface Description * ZSSC3170_LIN_Interface_Description_Rev_X.xy.pdf ZSSC3170 Application Note – LIN and PWM Operation ZSSC3170_AN_LIN_and_PWM_Operation_Rev_X.xy.pdf ZSSC3170 Technical Note – Pad Coordinates, Die Dimensions, and Package Dimensions** ZSSC3170_DicePackagePin_Rev_X.xy.pdf Visit the ZSSC3170 product page www.zmdi.com/zssc3170 on ZMDI’s website www.zmdi.com or contact your nearest sales office for the latest version of these documents. * Note: Documents marked with an asterisk (*) require a free customer login account. To set up an account, click on Login in the upper right corner of www.zmdi.com and follow the instructions. ** Note: Documents marked with double asterisks (**) are available on request only; see page 32 for contact information. 9 Glossary Term Description ADC Analog-to-Digital Converter AEC Automotive Electronics Council AFE Analog Front-End Amp Amplifier BCC Broken Chip Check (diagnostic task) CM Command Mode CMC Calibration Micro Controller (optimized micro controller architecture for ZMDI signal conditioners) CMV Common Mode Voltage (of the sensor bridge signal) DM Diagnostic Mode DNL Differential Nonlinearity EEPROM Electrically Erasable Programmable Read Only Memory EMC Electromagnetic Compatibility ESD Electrostatic Discharge FSO Full Scale Output Data Sheet December 10, 2014 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 30 of 32 ZSSC3170 Automotive Sensor Signal Conditioner with LIN & PWM Interface Term Description HSS High-Side Switch (open-drain output; connects to positive supply when active) I/O Input/Output I²C™ Inter-Integrated Circuit (serial two-wire data bus, trademark of NXP.) INL Integral Nonlinearity LIN Local Interconnect Network (international communication standard) LSB Least Significant Bit LSS Low-Side Switch (open-drain output; connects to ground when active) MSB Most Significant Bit MUX Multiplexer NOM Normal Operation Mode P Bridge Sensor Signal (e.g., pressure) PGA Programmable Gain Amplifier POR Power-On Reset (defined start-up procedure until nominal supply voltage is reached) PWM Pulse Width Modulation Rev. Revision RISC Reduced Instruction Set Computing RoHS Restrictions of Hazardous Substances ROM Read Only Memory RTD Resistance Temperature Detector SAC Sensor Aging Check (diagnostic measurement task) SCC Sensor Connection Check (diagnostic measurement task) SSC Sensor Short Check (diagnostic measurement task); Sensor Signal Conditioner T Temperature XZC Extended Zero Compensation (bridge sensor offset compensation) Data Sheet December 10, 2014 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 31 of 32 ZSSC3170 Automotive Sensor Signal Conditioner with LIN & PWM Interface 10 Document Revision History Revision Date Description 1.00 April 5, 2009 First release. 1.30 September 20, 2010 Full revision. 2.00 January 17, 2011 Silicon revision from C to D. Minor edits. 2.10 April 4, 2013 Silicon revision from D to E. Update for contact information and imagery on cover and headers. Minor edits. 2.20 July 5, 2013 SSOP20 is now only available for evaluation purposes as samples in the Evaluation Kit. 2.30 September 16, 2013 Revision to recommendation in footnote 1 in Table 2.2. PWM operation and LIN Sleep mode incompatibility note added in section 2.6. Waffle pack option is no longer available; removed from part order table (ZSSC3170EE1D and ZSSC3170EA1D). References to SSOP-20 package for samples removed. Minor edits for clarity. 2.40 January 22, 2014 SSOP20 is now available again. Update for imagery for cover. 2.50 December 10, 2014 DFN20 package added. Update for Table 1.2 conditions for specification 1.2.4. Update for external temperature resistor input range specification 1.3.3.5. Correction for Table 4.2. Update for block diagram on page 3 and in Figure 2.1. Contact information and related documents section updated. Sales and Further Information www.zmdi.com [email protected] Zentrum Mikroelektronik Dresden AG Global Headquarters Grenzstrasse 28 01109 Dresden, Germany ZMD America, Inc. 1525 McCarthy Blvd., #212 Milpitas, CA 95035-7453 USA Central Office: Phone +49.351.8822.0 Fax +49.351.8822.600 USA Phone +855.275.9634 Phone +408.883.6310 Fax +408.883.6358 European Technical Support Phone +49.351.8822.7.772 Fax +49.351.8822.87.772 DISCLAIMER: This information applies to a product under development. Its characteristics and specifications are subject to change without notice. Zentrum Mikroelektronik Dresden AG (ZMD AG) assumes no obligation regarding future manufacture unless otherwise agreed to in writing. The information furnished hereby is believed to be true and accurate. However, under no circumstances shall ZMD AG be liable to any customer, licensee, or any other third party for any special, indirect, incidental, or consequential damages of any kind or nature whatsoever arising out of or in any way related to the furnishing, performance, or use of this technical data. ZMD AG hereby expressly disclaims any liability of ZMD AG to any customer, licensee or any other third party, and any such customer, licensee and any other third party hereby waives any liability of ZMD AG for any damages in connection with or arising out of the furnishing, performance or use of this technical data, whether based on contract, warranty, tort (including negligence), strict liability, or otherwise. European Sales (Stuttgart) Phone +49.711.674517.55 Fax +49.711.674517.87955 Data Sheet December 10, 2014 Zentrum Mikroelektronik Dresden AG, Japan Office 2nd Floor, Shinbashi Tokyu Bldg. 4-21-3, Shinbashi, Minato-ku Tokyo, 105-0004 Japan ZMD FAR EAST, Ltd. 3F, No. 51, Sec. 2, Keelung Road 11052 Taipei Taiwan Phone +81.3.6895.7410 Fax +81.3.6895.7301 Phone +886.2.2377.8189 Fax +886.2.2377.8199 Zentrum Mikroelektronik Dresden AG, Korea Office U-space 1 Building Unit B, 906-1 660, Daewangpangyo-ro Bundang-gu, Seongnam-si Gyeonggi-do, 463-400 Korea Phone +82.31.950.7679 Fax +82.504.841.3026 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 2.50 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 32 of 32