XC6190 Series
ETR02031-003
Push Button Reboot Controller
■GENERAL DESCRIPTION
The XC6190 series are timer reset ICs that supply a reboot signal to the system when “L” voltage is input into the
SW1, SW2 pins for a set time (reboot delay time) using two switches (physical buttons).
On type A, the reboot delay time (TDL) can be set as desired by changing the external resistance RT within the range 1s to 20s.
On type B, TDL is fixed internally. When the TS pin is set to “H” level, the delay time is 12.5s. When the TS pin is set to “L”
level, the delay time is 7.5s.
After the reboot signal (TRSTB) is output for 0.4s (TYP), the IC automatically returns to the steady state.
Quiescent current in standby mode is a very small 0.01μA (TYP.), and this contributes to a longer battery drive
time. The small USPN-6 and USPN-6B01 packages enable reduction of mounting space.
The UVLO function is equipped as a protective function to prevent malfunctioning of the IC.
■FEATURES
■APPLICATIONS
Input Voltage Range
Low power Consumption
Output Configuration
●Wearable Devices
●Portable Music Players
●Portable Video Game Players
RSTB Pin SINK Current
Reboot Delay Time (Type A)
●Wireless Headsets
●Mobile Communication Devices
Reboot Delay Time (Type B)
●Smart Phones, Feature Phones
●Various applications equipped with buttons
Reboot Time
Operating Ambient Temperature
Package
Environmentally Friendly
: 1.75V ~ 6.0V
: 0.01μA (Stand-by, TYP.)
: Nch open drain (XC6190AN/BN)
CMOS output (XC6190AC/BC)
: 30mA (VRSTBL=0.3V.)
: 1s ~ 20s (Adjustable by the external resistor)
*12.5s ±5% (RT=200kΩ)
: 7.5s ±5% (TS=GND)
12.5s ±5% (TS=VIN)
: 0.4s±5%
: -40℃ ~ +85℃
: USPN-6, USPN-6B01
: RoHS Compliant, Pb Free
■TYPICAL APPLICATION CIRCUIT
Other
VIN
Other
RPUL
XC6190AN15xx
RSTB
SW2
Battery
Button1
RT
Button2
VIN
L
SW1
SW1
MPU/CPU
RESETB
XC6190BN15xx
RSTB
SW2
Battery
Button1
VSS
RPUL
L
SW1
SW1
TS
Button2
MPU/CPU
RESETB
VSS
RT
A type: Two-Button Solution
B type: Two-Button Solution
*1) On the XC6190AN15xx, XC6190BN25xx, connect a capacitor of at least 0.01μF between VIN-GND near the IC as needed.
*2) On the XC6190AC15xx, XC6190BC25xx, connect a capacitor of at least 0.01μF between VIN-GND near the IC.
(Note) The following products are under development.
XC6190AC158R-G
1/21
XC6190 Series
■BLOCK DIAGRAM
1) XC6190AN15xx
* The above diodes are electrostatic protection diodes and parasitic diodes.
2) XC6190AC15xx
* The above diodes are electrostatic protection diodes and parasitic diodes.
(Note) The following products are under development.
XC6190AC158R-G
2/21
XC6190
Series
■BLOCK DIAGRAM
3) XC6190BN25xx
VIN
SW1a
UVLO
aRSTB
SW2a
Reboot Delay
Counter
Reboot
Counter
OSC
OSC_IREF
aTS
VSS
* The above diodes are electrostatic protection diodes and parasitic diodes.
4) XC6190BC25xx
VIN
SW1a
UVLO
aRSTB
SW2a
Reboot Delay
Counter
Reboot
Counter
OSC
OSC_IREF
aTS
VSS
* The above diodes are electrostatic protection diodes and parasitic diodes.
(Note) The following products are under development.
XC6190AC158R-G
3/21
XC6190 Series
■PRODUCT CLASSIFICATION
●Ordering Information
XC6190①②③④⑤⑥-⑦(*1)
DESIGNATOR
ITEM
①
TYPE
②
Output Configuration
③
Reboot delay time
④
Reboot delay time accuracy
⑤⑥-⑦
Packages (Order Unit)
(*1)
DESCRIPTION
A
Reboot delay time set by the External RT.
B
Reboot delay time internal fix.
N
N-ch open drain output
C
CMOS output
1
Type A : 12.5s (External RT=200kΩ)
2
Type B : 7.5s(VTS=L), 12.5s(VTS=H)
5
±5%
7R-G
USPN-6 (5,000 / Reel)
8R-G
USPN-6B01 (5,000 / Reel)
The “-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant.
(Note) The following products are under development.
XC6190AC158R-G
4/21
SYMBOL
XC6190
Series
■PIN CONFIGURATION
XC6190AN15xx / XC6190AC15xx
SW2
6
1 RSTB
RT
5
VIN
4
SW2
6
1
RSTB
2 VSS
RT
5
2
VSS
3 SW1
VIN
4
3
SW1
USPN-6
(BOTTOM VIEW)
USPN-6B01
(BOTTOM VIEW)
XC6190BN25xx / XC6190BC25xx
SW2
6
1 RSTB
TS
5
VIN
4
SW2
6
1
RSTB
2 VSS
TS
5
2
VSS
3 SW1
VIN
4
3
SW1
USPN-6B01
(BOTTOM VIEW)
USPN-6
(BOTTOM VIEW)
■PIN ASSIGNMENT
PIN NUMBER
PIN NAME
FUNCTIONS
1
RSTB
Reboot Signal Output Pin
2
2
VSS
Ground Pin
3
3
SW1
Switch Signal(1) Input Pin
4
4
VIN
Power Input Pin
5
5
RT
Type A : TDL adjusting resistor connection Pin
TS
Type B : TDL selection Pin
6
6
SW2
Switch Signal(2) Input Pin
USPN-6B01
USPN-6
1
(Note) The following products are under development.
XC6190AC158R-G
5/21
XC6190 Series
■FUNCTION TABLE
PIN
BIAS
CONDITION
STATUS
H
Standby Mode
L
Active Mode
OPEN
Standby Mode
H
Standby Mode
L
Active Mode
OPEN
Standby Mode
H(*4)
TDL=12.5s
L(*5)
TDL=7.5s
OPEN
Undefined State(*3)
SW1
SW2
TS(*2)
(*1)
When either the SW1 pin or the SW2 pin is H-level, the IC enters Standby Mode.
(*2)
Short-circuited the TS pin to VIN or GND.
(*3)
Leaving the TS pin open is prohibited as it will cause unstable operation.
(*4)
TS pin “H” level is VIN level.
(*5)
TS pin “L” level is GND level.
■ABSOLUTE MAXIMUM RATINGS
Ta=25℃
PARAMETER
SYMBOL
RATINGS
UNITS
VIN Pin Voltage
VIN
-0.3 ～ +7.0
V
SW1 Pin Voltage
VSW1
-0.3 ～ +7.0
V
SW2 Pin Voltage
VSW2
-0.3 ～ +7.0
RT Pin Voltage
TS pin Voltage
VRT
VTS
V
-0.3 ～ VIN+0.3 or +7.0
(*1)(*2)
V
-0.3 ～ VIN+0.3 or +7.0
(*1)(*3)
V
(*4)
-0.3 ～ +7.0
V
RSTB Pin Voltage
VRSTB
RSTB Pin SINK Current
ISINK
40
mA
ISOURCE
40(*5)
mA
RSTB Pin SOURCE Current
Power
Dissipation
USPN-6
USPN-6B01
Pd
-0.3～VIN+0.3 or +7.0 (*1)(*5)
600
600
mW
Operating Ambient
Temperature
Topr
-40 ～ +85
℃
Storage Temperature
Tstg
-55 ～ +125
℃
Each voltage rating is based on the reference VSS.
(*1)
The maximum value is the lower of either VIN + 0.3 or +7.0V.
(*2)
Apply to Type A.
(*3)
Apply to Type B.
(*4)
Apply to XC6190AN15xx and XC6190BN25xx.
(*5)
Apply to XC6190AC15xx and XC6190BC25xx.
(Note) The following products are under development.
XC6190AC158R-G
6/21
XC6190
Series
■ELECTRICAL CHARACTERISTICS
XC6190 AN15xx / XC6190AC15xx
PARAMETER
SYMBOL
Input Voltage Range
VIN
UVLO
Release Voltage
UVLO
Detect Voltage(*1)
Quiescent Current
VUVLOR
VUVLO
Ta=25℃
CONDITIONS
VIN=SWEEP (step up),
VSW1 =GND, VSW2=GND
VIN=SWEEP (step down),
VSW1 =GND, VSW2=GND
MIN
TYP
MAX
UNIT
CIRCUIT
1.75
-
6.00
V
①
-
1.55
1.65
V
①
1.35
1.47
-
V
①
-
0.01
0.10
μA
①
17
50
93
μA
①
IQ
VIN=6.0V,
Operating Current(*2)
IDD
VIN=6.0V, VSW1=GND,
VSW2=GND
Reboot
Delay Time(*3)
TDL
VSW1=GND, VSW2=GND
11.875
12.500
13.125
s
②
Reboot Time(*4)
TRSTB
VSW1=GND, VSW2=GND
*After TDL
0.38
0.40
0.42
s
②
RSTB Pin
SINK Current
ISINK
VRSTB=0.3V
30
-
mA
①
RSTB Pin
SOURCE Current
ISOURCE
XC6190AC15xx
VRSTB=VIN-0.3V
20
-
-
mA
①
SW1 Pin
“H” Voltage
VSW1H
VIN=6.0V
1.0
-
6.0
V
①
SW1 Pin
“L” Voltage
VSW1L
VIN=6.0V
GND
-
0.3
V
①
ISW1H
VIN=6.0V, VSW1=6.0V
-0.1
-
0.1
μA
①
ISW1L
VIN=6.0V, VSW1=GND
3.5
7.5
16.0
μA
①
SW2 Pin
“H” Voltage
VSW2H
VIN=6.0V
1.0
-
6.0
V
①
SW2 Pin
“L” Voltage
VSW2L
VIN=6.0V
GND
-
0.3
V
①
ISW2H
VIN=6.0V, VSW2=6.0V
-0.1
-
0.1
μA
①
ISW2L
VIN=6.0V, VSW2=GND
3.5
7.5
16.0
μA
①
SW1 Pin
“H” Current
SW1 Pin
“L” Current
SW2 Pin
“H” Current
SW2 Pin
“L” Current
Unless otherwise stated, the reference is GND, VIN=3.7V, RT=200kΩ SW1=open, SW2=open
(*1)
The UVLO detect voltage is less than the UVLO release voltage.
(*2)
Quiescent current until the reboot signal is output in the circuit operation state with the SW1, SW2 pin at “L” level
(*3)
Time from change of both SW1 and SW2 pin voltages to “L” level until the RSTB pin outputs “L” level (*5).
(*4)
Time from change of RSTB pin to “L” level until RSTB pin changes to “H” level (*6).
(*5)
RSTB pin “L” level is as follows: AN type: Applied voltage × 0.1 , AC type: VIN × 0.1
(*6)
RSTB pin ”H” level is as follows: AN type: Applied voltage × 0.9 , AC type: VIN × 0.9
(Note) The following products are under development.
XC6190AC158R-G
7/21
XC6190 Series
■ELECTRICAL CHARACTERISTICS (Continued)
XC6190 BN25xx / XC6190BC25xx
PARAMETER
SYMBOL
Input Voltage Range
VIN
UVLO
Release Voltage
UVLO
Detect Voltage(*1)
Quiescent Current
VUVLOR
VUVLO
Ta=25℃
CONDITIONS
VIN=SWEEP (step up),
VSW1 =GND, VSW2=GND
VIN=SWEEP (step down),
VSW1 =GND, VSW2=GND
MIN
TYP
MAX
UNIT
CIRCUIT
1.75
-
6.00
V
③
-
1.55
1.65
V
③
1.35
1.47
-
V
③
-
0.01
0.10
μA
③
15.0
45.0
87.5
μA
③
IQ
VIN=6.0V
Operating Current(*2)
IDD
VIN=6.0V, VSW1=GND,
VSW2=GND
Reboot
Delay Time1(*3)
TDL1
VSW1=GND, VSW2=GND
11.875
12.500
13.125
s
④
Reboot
Delay Time2(*3)
TDL2
VSW1=GND, VSW2=GND,
VTS=GND
7.125
7.500
7.875
s
④
Reboot Time(*4)
TRSTB
VSW1=GND, VSW2=GND
*After TDL
0.38
0.40
0.42
s
④
RSTB Pin
SINK Current
ISINK
VRSTB=0.3V
30
-
-
mA
③
RSTB Pin
SOURCE Current
ISOURCE
XC6190BC25xx
VRSTB=VIN-0.3V
20
-
-
mA
③
SW1 Pin
“H” Voltage
VSW1H
VIN=6.0V
1.0
-
6.0
V
③
SW1 Pin
“L” Voltage
VSW1L
VIN=6.0V
GND
-
0.3
V
③
ISW1H
VIN=6.0V, VSW1=6.0V
-0.1
-
0.1
μA
③
ISW1L
VIN=6.0V, VSW1=GND
3.5
7.5
16.0
μA
③
SW2 Pin
“H” Voltage
VSW2H
VIN=6.0V
1.0
-
6.0
V
③
SW2 Pin
“L” Voltage
VSW2L
VIN=6.0V
GND
-
0.3
V
③
ISW2H
VIN=6.0V, VSW2=6.0V
-0.1
-
0.1
μA
③
ISW2L
VIN=6.0V, VSW2=GND
3.5
7.5
16.0
μA
③
SW1 Pin
“H” Current
SW1 Pin
“L” Current
SW2 Pin
“H” Current
SW2 Pin
“L” Current
Unless otherwise stated, the reference is GND, VIN=3.7V, VTS=VIN , SW1=open, SW2=open
(*1)
The UVLO detect voltage is less than the UVLO release voltage.
(*2)
Quiescent current until the reboot signal is output in the circuit operation state with the SW1, SW2 pin at “L” level
(*3)
Time from change of both SW1 and SW2 pin voltages to “L” level until the RSTB pin outputs “L” level (*5).
(*4)
Time from change of RSTB pin to “L” level until RSTB pin changes to “H” level (*6).
(*5)
RSTB pin “L” level is as follows:
(*6)
RSTB pin ”H” level is as follows: BN type: Applied voltage × 0.9 , BC type: VIN × 0.9
BN type: Applied voltage × 0.1 , BC type: VIN × 0.1
(Note) The following products are under development.
XC6190AC158R-G
8/21
XC6190
Series
■TEST CIRCUIT(A Type)
1) Circuit ①
A
V
VIN
V
A
SW1
A
SW2
RSTB
A
XC6190A
RT
V
V
V
VSS
RT=200kΩ
CIN=0.01μF
2) Circuit ②
RPULL =1kΩ
Check
Waveform 1
Check
Waveform 2
VIN
SW1
RSTB
Switch
*XC6190AN15xx: Switch conditions: Close
*XC6190AC15xx: Switch conditions: Open
SW2
XC6190A
RT
Check
Waveform 3
VSS
RT=200kΩ
CIN=0.01μF
3) CIN
PRODUCT NAME
DESCRIPTION
XC6190AN15xx
Connect at least CIN = 0.01μF between VIN pin - GND near the IC as needed.
XC6190AC15xx
Connect at least CIN = 0.01μF between VIN pin – GND near the IC.
(Note) The following products are under development.
XC6190AC158R-G
9/21
XC6190 Series
■TEST CIRCUIT (Continued) (B Type)
1) Circuit ③
A
V
VIN
V
V
A
SW1
A
SW2
RSTB
A
XC6190B
TS
V
V
VSS
CIN=0.01μF
2) Circuit ④
Switch1
Check
Waveform 1
Check
Waveform 2
RPULL=1kΩ
VIN
SW1
RSTB
Switch3
*XC6190BN25xx: Switch conditions: Close
*XC6190BC25xx: Switch conditions: Open
SW2
XC6190B
TS
Check
Waveform 3
VSS
Switch2
CIN=0.01μF
3) CIN
PRODUCT NAME
DESCRIPTION
XC6190BN25xx
Connect at least CIN = 0.01μF between VIN pin - GND near the IC as needed.
XC6190BC25xx
Connect at least CIN = 0.01μF between VIN pin – GND near the IC.
(Note) The following products are under development.
XC6190AC158R-G
10/21
XC6190
Series
■ OPERATION EXPLANATION
The XC6190 series supplies a reboot signal (TRSTB below) to the system by inputting “L” voltage into the SW1, SW2 pins for
the set time (reboot delay time) using two switches (buttons)
On the XC6190AN15xx and XC6190AC15xx, a reboot delay time (TDL below) is set by connecting a resistance (RT below)
to the RT pin.
TDL is determined by the following calculation formula:
RT(kΩ) = { TDL(s) – 0.097 } / 0.062015 * Can be set within the range 1s to 20s.
e.g.) When TDL=12.5s, RT=200kΩ
On the XC6190BN25xx and XC6190BC25xx, TDL is determined by the internal circuitry. When the TS pin is shorted to VIN,
TDL = 12.5s (TYP.), and when the TS pin is shorted to GND, TDL = 7.5s（TYP.).
Even if the TS pin voltage changes from VIN to GND while “L” voltage is input to the SW1 pin and SW2 pin, the value set
prior to the change is maintained.
VIN
Lower than VUVLOR
(Standby mode)
Lower than VUVLO.
(Standby mode)
VUVLOR
VUVLO
0V
TRSTB
TRSTB
VRSTB
0V
TDL
VSW1
0V
TDL
VSW2
0V
TDL
TDL
PUSH BUTTON
PUSH BUTTON
TDL
TDL
PUSH BUTTON
PUSH BUTTON
TDL
TDL
PUSH BUTTON
PUSH BUTTON
PUSH BUTTON
Fig.1＿XC6190 Timing Chart
Details of each circuit part are as follows.
<SW1 pin, SW2 pin>
By inputting “L” voltage into both of these pins during the TDL interval, the reboot signal is output from the RSTB pin.
Both pins are pulled up to VIN by internal resistances, and thus the pin voltage when OPEN is VIN level.
The UVLO circuit is activated by inputting “L” voltage into both the SW1 pin and SW2 pin.
<RT pin: Type A>
RT is connected to this pin to set TDL.
<TS pin: Type B>
This pin is used to set TDL. When the TS pin is shorted to VIN, TDL is set to TDL ＝ 12.5s(TYP.). When the TS pin is shorted
to GND, TDL is set to TDL ＝ 7.5s (TYP.).
Even if the TS pin voltage is changed after “L” voltage is input into both the SW1 and SW2 pins and the internal circuit
starts operation, the value set prior to the change is maintained.
(Note) The following products are under development.
XC6190AC158R-G
11/21
XC6190 Series
■OPERATION EXPLANATION (Continued)
<UVLO>
This circuit prevents malfunctioning of the IC and allows internal circuit operation.
When it is detected that “L” voltage is input into both the SW1 and SW2 pins, the VIN pin voltage is monitored.
When the VIN pin voltage is higher than the UVLO release voltage, the UVLO circuit outputs a signal that allows internal
circuit operation.
When the VIN pin voltage is lower than the UVLO detect voltage, the UVLO circuit outputs a signal that puts the internal
circuitry in the standby state.
When “H” voltage is input into the SW1 pin or SW2 pin (or both), the UVLO circuit does not operate and the internal
circuitry enters the standby state.
<OSC IREF>
This is a current reference circuit for the OSC circuit.
The reference current of the XC6190AN15xx and XC6190AC15xx is set by RT connected to the RT pin.
The reference current of the XC6190BN25xx and XC6190BC25xx is fixed in the internal circuitry.
<OSC>
This is the reference oscillation circuit that uses the reference current of the OSC IREF circuit.
This circuit outputs an oscillation pulse signal that activates the Reboot Delay Counter and Reboot Counter.
< Reboot Delay Counter>
This circuit counts the oscillation pulse signal generated by the OSC circuit and generates the TDL.
When the count ends, the circuit outputs a signal that puts the RSTB pin voltage at “L” level and a signal that starts the
Reboot Counter.
If a signal from the UVLO circuit that changes the state to the standby state is detected during the count, the count returns
to the initial state.
<Reboot Counter>
By counting the oscillation pulse signal generated by the OSC circuit, the reboot time (TRSTB) is generated. The counting
starts when it detects the start signal that is output from the Reboot Delay Counter.
If “H” voltage is input into the SW1 pin or SW2 pin (or both) during the count, the internal circuit does not change to the
standby state until the count ends.
If a change-to-standby signal from the UVLO circuit is detected during the count, the count returns to the initial state.
When the count ends on the XC6190AN15xx and XC6190BN25xx, the circuit outputs a signal that puts the RSTB pin in
the high-impedance state.
When the count ends on the XC6190AC15xx and XC6190BC25xx, the circuit outputs a signal that puts the RSTB pin at
“H” level.
<Output driver>
The XC6190AN15xx and XC6190BN25xx are N-ch open drain output drivers. These drivers are in the OFF state when
the Reboot Counter is not operating.
The XC6190AC15xx and XC6190BC25xx are CMOS output drivers. These drivers are in the “H” level state when the
Reboot Counter is not operating.
Once the reboot signal output has taken place, “H” voltage must be input into the SW1 pin and SW2 pin (or both) in order
to execute the reboot signal output again. After “H” voltage has been input, the reboot signal is output from the RSTB pin
when “L” voltage is input into both the SW1 and SW2 pins and then TDL elapses.
(Note) The following products are under development.
XC6190AC158R-G
12/21
XC6190
Series
■ NOTE ON USE
1.
For temporary, transitional voltage drop or voltage rising phenomenon, the IC is liable to malfunction should the
ratings be exceeded.
2.
Please use this IC within the specified operating ranges.
3.
On the XC6190AN15xx and XC6190BN25xx, sufficiently reinforce the VIN – GND line, as power noise may cause
malfunctioning of the internal counter circuit. If necessary, connect a capacitor of at least 0.01μF between VIN-GND
near the IC.
On the XC6190AC15xx and XC6190BC25xx, connect a capacitor of at least 0.01μF between VIN-GND near the IC.
4.
Connection of any component other than a resistor to the RT pin is prohibited on the XC6190Axxxxx-G. This may
cause malfunctioning.
Connect the external resistance (RT) between RT pin – GND near the IC.
5.
When the mid voltage between “L” and “H” voltage is input into SW pin 1 and 2, the start-up and stop of the IC
malfunction.
So please pay attention to the external components so that the mid voltage between “L” and “H” is not
input excessively and continuously to SW pin1 and 2.
6.
When using for an application other than a push-button application, design the timing to include deviations and test
sufficiently with the actual device before use.
7.
Torex places an importance on improving our products and their reliability.
We request that users incorporate fail-safe designs and post-aging protection treatment when using Torex products
in their systems.
(Note) The following products are under development.
XC6190AC158R-G
13/21
XC6190 Series
■TYPICAL PERFORMANCE CHARACTERISTICS
(1) Quiescent Current vs. Input Voltage
(2) Quiescent Current vs. Ambient Temperature
(3) Operating Current vs. Input Voltage :Type A
(4) Operating Current vs. Ambient Temperature :Type A
(5) Operating Current vs. Input Voltage :Type B
(6) Operating Current vs. Ambient Temperature :Type B
(Note) The following products are under development.
XC6190AC158R-G
14/21
XC6190
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(7) UVLO Release, Detect Voltage vs. Ambient Temperature
(8) SW1 Pin ”H” , “L” Voltage vs. Ambient Temperature
(9) SW1 Pin “L” Current vs. Ambient Temperature
(10) SW2 Pin ”H” , “L” Voltage vs. Ambient Temperature
(11) SW2 Pin “L” Current vs. Ambient Temperature
(Note) The following products are under development.
XC6190AC158R-G
15/21
XC6190 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(12) RSTB Pin SINK Current vs. Ambient Temperature
(13) RSTB Pin SOURCE Current vs. Ambient Temperature
(14) Reboot Delay Time vs. Ambient Temperature :Type A
(15) Reboot Time vs. Ambient Temperature :Type A
(16) Reboot Time vs. RT Resistance Value :Type A
(Note) The following products are under development.
XC6190AC158R-G
16/21
XC6190
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(17) Reboot Delay Time 1 vs. Ambient Temperature :Type B
(18) Reboot Delay Time 2 vs. Ambient Temperature :Type B
(19) Reboot Time vs. Ambient Temperature :Type B
(Note) The following products are under development.
XC6190AC158R-G
17/21
XC6190 Series
■PACKAGING INFORMATION
●USPN-6 (unit: mm)
1.3±0.05
1.3±0.05
+0.02
0.38 -0.03
1pin INDENT
1
2
3
6
5
4
0.25±0.05
0.475±0.05
0.2±0.05
(0.45)
●USPN-6 reference pattern layout (unit: mm)
●USPN-6 reference metal mask design (unit: mm)
0.2
0.25
0.2
0.2
0.2
6
5
4
6
5
4
0.25
0.4
0.65
0.5
0.25
0.15
1
0.45
2
0.45
3
0.15
(Note) The following products are under development.
XC6190AC158R-G
18/21
0.1
1
0.45
2 0.45 3
0.1
XC6190
Series
■PACKAGING INFORMATION (Continued)
●USPN-6B01 (unit: mm)
1.0±0.05
1.45±0.05
0.4 MAX
1pin INDENT
(0.5)
(0.5)
2
3
(0.6)
6
5
4
0.2±0.05
●USPN-6B01 reference metal mask design (unit:mm)
0.25
0.35
0.4
●USPN-6B01 reference pattern layout (unit: mm)
0.35
0.3±0.05
(0.3)
1
0.25
0.5
0.2
0.5
(Note) The following products are under development.
XC6190AC158R-G
19/21
XC6190 Series
■MARKING RULE
●USPN-6 / USPN-6B01
MARK ① represents product series
④
②
⑤
③
2
①
1
3
6
MARK
PRODUCT SERIES
A
XC6190******-G
5
4
MARK ②
Standard product : Represents product type and output configuration
MARK
TYPE
OUTPUT
CONFIGURATION
PRODUCT SERIES
1
A
N
XC6190AN****-G
2
A
C
XC6190AC****-G
3
B
N
XC6190BN****-G
4
B
C
XC6190BC****-G
MARK ③
Standard product : represents reboot delay time
MARK
DELAY TYPE
PRODUCT SERIES
1
1
XC6190**1***-G
2
2
XC6190**2***-G
MARK ④ & ⑤ represent production lot number
01～09、0A～0Z、11～9Z、A1～A9、AA～AZ、B1～ZZ
(G, I, J, O, Q, W excluded and no character inversion used)
(Note) The following products are under development.
XC6190AC158R-G
20/21
XC6190
Series
1. The products and product specifications contained herein are subject to change without
notice to improve performance characteristics.
Consult us, or our representatives
before use, to confirm that the information in this datasheet is up to date.
2. We assume no responsibility for any infringement of patents, patent rights, or other
rights arising from the use of any information and circuitry in this datasheet.
3. Please ensure suitable shipping controls (including fail-safe designs and aging
protection) are in force for equipment employing products listed in this datasheet.
4. The products in this datasheet are not developed, designed, or approved for use with
such equipment whose failure of malfunction can be reasonably expected to directly
endanger the life of, or cause significant injury to, the user.
(e.g. Atomic energy; aerospace; transport; combustion and associated safety
equipment thereof.)
5. Please use the products listed in this datasheet within the specified ranges.
Should you wish to use the products under conditions exceeding the specifications,
please consult us or our representatives.
6. We assume no responsibility for damage or loss due to abnormal use.
7. All rights reserved. No part of this datasheet may be copied or reproduced without the
prior permission of TOREX SEMICONDUCTOR LTD.
21/21