CEH2310 N-Channel Enhancement Mode Field Effect Transistor FEATURES 30V, 6.2A , RDS(ON) = 33mΩ @VGS = 10V. RDS(ON) = 38mΩ @VGS = 4.5V. RDS(ON) = 50mΩ @VGS = 2.5V. RDS(ON) = 60mΩ @VGS = 1.8V. D(1,2,5,6,) High dense cell design for extremely low RDS(ON). Rugged and reliable. Lead-free plating ; RoHS compliant. TSOP-6 package. 6 5 4 G(3) 1 2 3 S(4) TSOP-6 ABSOLUTE MAXIMUM RATINGS TA = 25 C unless otherwise noted Symbol Limit Drain-Source Voltage VDS 30 Units V Gate-Source Voltage VGS ±12 V ID 6.2 A IDM 25 A PD 2.0 W TJ,Tstg -55 to 150 C Symbol Limit Units RθJA 62.5 C/W Parameter Drain Current-Continuous Drain Current-Pulsed a Maximum Power Dissipation Operating and Store Temperature Range Thermal Characteristics Parameter Thermal Resistance, Junction-to-Ambient b Rev 2. 2012.Jan. http://www.cetsemi.com Details are subject to change without notice . 1 CEH2310 Electrical Characteristics Parameter TA = 25 C unless otherwise noted Symbol Test Condition Min Drain-Source Breakdown Voltage BVDSS VGS = 0V, ID = 250µA 30 Zero Gate Voltage Drain Current IDSS VDS = 30V, VGS = 0V Gate Body Leakage Current IGSS VGS = ±12V, VDS = 0V VGS(th) VGS = VDS, ID = 250µA Typ Max Units 1 µA ±100 nA Off Characteristics V On Characteristics Gate Threshold Voltage Static Drain-Source On-Resistance RDS(on) 1 V VGS = 10V, ID = 5.8A 0.4 27 33 mΩ VGS = 4.5V, ID = 5A 28 38 mΩ VGS = 2.5V, ID = 2A VGS = 1.8V, ID = 1A 31 38 50 60 mΩ mΩ Dynamic Characteristics d Input Capacitance Ciss Output Capacitance Coss Reverse Transfer Capacitance Crss VDS = 15V, VGS = 0V, f = 1.0 MHz 735 pF 90 pF 65 pF Switching Characteristics d Turn-On Delay Time td(on) Turn-On Rise Time tr Turn-Off Delay Time td(off) VDD = 15V, ID = 4.8A, VGS = 10V, RGEN = 3Ω 10 20 ns 3 6 ns 40 80 ns Turn-Off Fall Time tf 2 4 ns Total Gate Charge Qg 9 12 nC Gate-Source Charge Qgs Gate-Drain Charge Qgd VDS = 15V, ID = 4.8A, VGS = 4.5V 1 nC 2 nC Drain-Source Diode Characteristics and Maximun Ratings Drain-Source Diode Forward Current b IS Drain-Source Diode Forward Voltage c VSD VGS = 0V, IS = 1A Notes : a.Repetitive Rating : Pulse width limited by maximum junction temperature. b.Surface Mounted on FR4 Board, t < 5 sec. c.Pulse Test : Pulse Width < 300µs, Duty Cycle < 2%. d.Guaranteed by design, not subject to production testing. 2 2 A 1 V CEH2310 ID, Drain Current (A) 4 2 0 0.2 0.4 0.6 0.8 TJ=125 C -55 C 0.5 1.0 1.5 2.0 2.5 3.0 VGS, Gate-to-Source Voltage (V) Figure 1. Output Characteristics Figure 2. Transfer Characteristics Ciss 300 Coss 150 Crss 0 3 6 9 12 15 2.2 1.9 ID=5.8A VGS=10V 1.6 1.3 1.0 0.7 0.4 -100 -50 0 50 100 150 200 VDS, Drain-to-Source Voltage (V) TJ, Junction Temperature( C) Figure 3. Capacitance Figure 4. On-Resistance Variation with Temperature VDS=VGS IS, Source-drain current (A) ID=250µA 1.1 1.0 0.9 0.8 0.7 0.6 -50 0 VDS, Drain-to-Source Voltage (V) 450 1.2 3 0 600 1.3 6 1.0 750 0 9 VGS=1.0V 900 C, Capacitance (pF) 25 C 6 0 VTH, Normalized Gate-Source Threshold Voltage 12 VGS=10,8,6,4,2V RDS(ON), Normalized RDS(ON), On-Resistance(Ohms) ID, Drain Current (A) 8 -25 0 25 50 75 100 125 150 VGS=0V 10 1 10 0 10 -1 0.4 0.6 0.8 1.0 1.2 1.4 TJ, Junction Temperature( C) VSD, Body Diode Forward Voltage (V) Figure 5. Gate Threshold Variation with Temperature Figure 6. Body Diode Forward Voltage Variation with Source Current 3 5 V =15V DS ID=4.8A 4 ID, Drain Current (A) VGS, Gate to Source Voltage (V) CEH2310 3 2 1 0 0 2 4 6 8 10 10 2 10 1 10 0 10 -1 10 -2 1ms 10ms RDS(ON)Limit 100ms DC TA=25 C TJ=150 C Single Pulse 10 -2 10 -1 10 0 10 1 10 Qg, Total Gate Charge (nC) VDS, Drain-Source Voltage (V) Figure 7. Gate Charge Figure 8. Maximum Safe Operating Area VDD t on V IN RL D VGS RGEN toff tr td(on) td(off) tf 90% 90% VOUT VOUT 10% INVERTED 10% G 90% S VIN 50% 50% 10% PULSE WIDTH Figure 10. Switching Waveforms Figure 9. Switching Test Circuit r(t),Normalized Effective Transient Thermal Impedance 10 0 D=0.5 10 0.2 -1 0.1 0.05 10 PDM 0.02 0.01 -2 t1 1. RθJA (t)=r (t) * RθJA 2. RθJA=See Datasheet 3. TJM-TA = P* RθJA (t) 4. Duty Cycle, D=t1/t2 Single Pulse 10 -3 10 -4 t2 10 -3 10 -2 10 -1 10 0 Square Wave Pulse Duration (sec) Figure 11. Normalized Thermal Transient Impedance Curve 4 10 1 10 2 2