Flash + Controller Part Numbering System aka e-MMC and custom card part numbers MT FC 2G A A M2 - xx ES Micron Technology Production Status FC = Flash + Controller FP = Flash + Controller w/PCB Blank = Production ES = Engineering Sample MS = Mechanical Sample NAND Density 2G = 2GB 4G = 4GB 8G = 8GB 16G = 16GB Operating Temperature Range Blank = 0°C to +70°C WT = Standard (–25°C to +85°C) IT = Industrial (–40°C to +85°C) AIT = Industrial (–40°C to +85°C + HR certified test flow) 32G = 32GB 64G = 64GB BA = BGA adapter BG = BGA IC guide NAND Component Mark 0 A B C D E F G H J K L M Device No silicon in package 2Gb, x8 1.8V 4Gb x8 3.3V 8Gb x8 3.3V 8Gb x8 3.3V 8Gb x8 3.3V 4Gb x8/x16 16Gb x8 3.3.V 32Gb x8 3.3V 64Gb x8 3.3V 32Gb x8 3.3V 32Gb x8 3.3V 16Gb x8 3.3V Controller ID Mark 0 A B C D E F G H I J K L M N P Q R S T W X Y Controller ID No silicon in package Rev 1 Rev 2 Rev 3 Rev 4 Rev 5 Rev 6 Rev 7 Rev 8 Rev 9 Rev 10 Rev 11 Rev 12 Rev 13 Rev 14 Rev 15 Rev 16 Rev 17 Rev 18 Rev 19 Rev 20 Rev 21 Rev 22 Rev. 8-13-12 © 2012 Micron Technology, Inc. Micron and the Micron logo are trademarks and/or service marks of Micron Technology, Inc. Products and specifications are subject to change without notice. Special Options Blank = No special options Package Code (all packages are Pb-free) DE = 153-ball LFBGA 11.5x13x1.4 DG = 169-ball LFBGA 12x16x1.5 DH = 169-ball LFBGA 12x18x1.4 DI = 169-ball TFBGA 12x16x1.2 DK = 169-ball LFBGA 12x16x1.4 DL = 169-ball TFBGA 12x18x1.2 DM = 153-ball TFBGA 11.5x13x1.2 DN = 169-ball LFBGA 14x18x1.4 DP = 169-ball LFBGA 14x18x1.7 DQ = 100-ball LBGA 14x18x1.4 DV = 169-ball VFBGA 12x16x1.0 EA = 153-ball WFBGA 11.5x13x0.8 EC = 169-ball WFBGA 14x18x0.8 ED = 169-ball VFBGA 14x18x1.0 EF = 169-ball TFBGA 14x18x1.2 EG = 169-ball WFBGA 12x16x0.8 EJ = 169-ball 169 ball LFBGA 14x18x1 14x18x1.3 3