Flash + Controller Part Numbering System

Flash + Controller Part Numbering System
aka e-MMC and custom card part numbers
MT
FC
2G
A
A
M2
-
xx
ES
Micron Technology
Production Status
FC = Flash + Controller
FP = Flash + Controller w/PCB
Blank = Production
ES = Engineering Sample
MS = Mechanical Sample
NAND Density
2G = 2GB
4G = 4GB
8G = 8GB
16G = 16GB
Operating Temperature Range
Blank = 0°C to +70°C
WT = Standard (–25°C to +85°C)
IT = Industrial (–40°C to +85°C)
AIT = Industrial (–40°C to +85°C + HR certified test flow)
32G = 32GB
64G = 64GB
BA = BGA adapter
BG = BGA IC guide
NAND Component
Mark
0
A
B
C
D
E
F
G
H
J
K
L
M
Device
No silicon in package
2Gb, x8 1.8V
4Gb x8 3.3V
8Gb x8 3.3V
8Gb x8 3.3V
8Gb x8 3.3V
4Gb x8/x16
16Gb x8 3.3.V
32Gb x8 3.3V
64Gb x8 3.3V
32Gb x8 3.3V
32Gb x8 3.3V
16Gb x8 3.3V
Controller ID
Mark
0
A
B
C
D
E
F
G
H
I
J
K
L
M
N
P
Q
R
S
T
W
X
Y
Controller ID
No silicon in package
Rev 1
Rev 2
Rev 3
Rev 4
Rev 5
Rev 6
Rev 7
Rev 8
Rev 9
Rev 10
Rev 11
Rev 12
Rev 13
Rev 14
Rev 15
Rev 16
Rev 17
Rev 18
Rev 19
Rev 20
Rev 21
Rev 22
Rev. 8-13-12
© 2012 Micron Technology, Inc.
Micron and the Micron logo are trademarks and/or service marks of Micron Technology, Inc.
Products and specifications are subject to change without notice.
Special Options
Blank = No special options
Package Code (all packages are Pb-free)
DE = 153-ball LFBGA 11.5x13x1.4
DG = 169-ball LFBGA 12x16x1.5
DH = 169-ball LFBGA 12x18x1.4
DI = 169-ball TFBGA 12x16x1.2
DK = 169-ball LFBGA 12x16x1.4
DL = 169-ball TFBGA 12x18x1.2
DM = 153-ball TFBGA 11.5x13x1.2
DN = 169-ball LFBGA 14x18x1.4
DP = 169-ball LFBGA 14x18x1.7
DQ = 100-ball LBGA 14x18x1.4
DV = 169-ball VFBGA 12x16x1.0
EA = 153-ball WFBGA 11.5x13x0.8
EC = 169-ball WFBGA 14x18x0.8
ED = 169-ball VFBGA 14x18x1.0
EF = 169-ball TFBGA 14x18x1.2
EG = 169-ball WFBGA 12x16x0.8
EJ = 169-ball
169 ball LFBGA 14x18x1
14x18x1.3
3