HMC Component Part Numbering System The part numbering system is available at www.micron.com/numbering Hybrid Memory Cube MT 43 A 4G 04 01 00 NGF- S15 ES :A Micron Technology Die Revision Designator Product Family 43 = HMC Production Status ES = Engineering sample MS = Mechanical sample Blank = Production DRAM Voltage A = 1.2V VDD CMOS DRAM Die Density per Layer 4G = 4 Gigabits 8G = 8 Gigabits 16G = 16 Gigabits Number of DRAM Die in Package Logic Design Designator Sequential Number for Product Variations Operating Temperatures Blank = Standard temperature Special Options Blank = No special options Link Description Electical & Physical Link Specification -S15 -U10 Package Codes Codes NFA NFH NGF NGK Rev. 20-Oct-2014 © 2014 Micron Technology, Inc. Rev. 11-Apr-2014 Micron and the Micron logo are trademarks of Micron Technology, Inc. Products and specifications are subject to change without notice. Dates are estimates only. y SerDes I/O Interface 15 Gbps 10 Gbps Package Description (mm) BGA (896-ball 4 DRAM high, 31 x 31 x 4.2) BGA (896-ball 8 DRAM high, 31 x 31 x 4.2) FBGA (666-ball 4 DRAM high, 16 x 19.5 x 4.1) FBGA (666-ball 8 DRAM high, 16 x 19.5 x 4.1)