Legacy NAND Flash Part Numbering System

Legacy NAND Flash Part Numbering System
Micron's part numbering system is available at www.micron.com/support/designsupport/documents/png
Legacy NAND Flash*
MT
29F
2G
08
A
A
A
WP - xx
xx xx xx
Micron Technology
ES : A
Design Revision (shrink)
A = 1st design revision
Single-Supply Flash
29F = NAND Flash
Production Status
29H = High Speed NAND
Blank = Production
ES = Engineering samples
QS = Qualification samples
MS = Mechanical samples
Density
1G = 1Gb
2G = 2Gb
4G = 4Gb
8G = 8Gb
16G = 16Gb
32G = 32Gb
64G = 64Gb
128G = 128Gb
256G = 256Gb
Operating Temperature Range
Blank = Commercial (0°C to +70°C)
ET = Extended (–40°C to +85°C)
WT = Wireless (–25°C to +85°C)
Block Option (Reserved for use)
Blank = Standard device
Device Width
08 = 8 bits
16 = 16 bits
Flash Performance
Blank = Full specification
Classification
15 = 133 MT/s
12 = 166 MT/s
Speed Grade (MT29H Only)
Mark
A
B
D
E
F
G
J
K
L
M
Q
R
T
U
V
Die
1
1
2
2
2
3
4
4
4
4
8
8
16
8
16
nCE
0
1
1
2
2
3
2
2
4
4
4
2
8
4
8
RnB
0
1
1
2
2
3
2
2
4
4
4
2
4
4
4
I/O Channels
1
1
1
2
1
3
1
2
4
2
4
2
2
2
4
Operating Voltage Range
A = 3.3V (2.70–3.60V), VccQ 3.3V (2.70–3.60V)
B = 1.8V (1.70–1.95V)
C = 3.3V (2.70–3.60V), VccQ 1.8V (1.70–1.95V)
*This numbering system is no longer used for Micron NAND flash. See the NAND Part Numbering System for the modern numbering guide.
Rev. 3/25/2014
© 2014 Micron Technology, Inc.
Micron and the Micron logo are trademarks of Micron Technology, Inc.
Products and specifications are subject to change without notice.
Dates are estimates only.
Package Code (dimensions in mm)
WP = 48-pin TSOP I (CPL version) (Pb-free)
WC = 48-pin TSOP I (OCPL version) (Pb-free)
H1 = 100-ball VFBGA (Pb-free), 12 x 18 x 1.0
H2 = 100-ball TFBGA (Pb-free), 12 x 18 x 1.2
HC = 63-ball VFBGA, 10.5 x 13 x 1.0
C2 = 52-pad ULGA, 12 x 17 x 0.4 (use TBD)
C3 = 52-pad ULGA, 12 x 17 x 0.65
C4 = 52-pad VLGA, 12 x 17 x 1.0 (SDP/DDP/QDP)
C5 = 52-pad VLGA, 14 x 18 x 1.0 (SDP/DDP/QDP)
C6 = 52-pad LLGA, 14 x 18 x 1.47 (8DP, QDP, DDP)
C7 = 48-pad LLGA, 12 x 20 x 1.47 (8DP)
SWC = 48-pin Stacked TSOP (OCPL version) (Pb-free)
SWP = 48-pin Stacked TSOP (CPL version) (Pb-free)
Generation (M29 only)/Feature Set
A = 1st set of device features
B = 2nd set of device features (rev only if different than 1st set)
C = 3rd set of device features (rev only if different)
D = 4th set of device features (rev onlH4 = 63-ball VFBGA, 9 x 11 x 1.0
etc.