BOURNS TISP4240M3BJR

*R
oH
VE S CO
AV R M
AI SIO PL
LA N IA
BL S NT
E
TISP4070M3BJ THRU TISP4115M3BJ,
TISP4125M3BJ THRU TISP4220M3BJ,
TISP4240M3BJ THRU TISP4400M3BJ
BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
TISP4xxxM3BJ Overvoltage Protector Series
TISP4xxxM3BJ Overview
This TISP® device series protects central office, access and customer premise equipment against overvoltages on the telecom line. The
TISP4xxxM3BJ is available in a wide range of voltages and has a medium current capability. These protectors have been specified mindful of
the following standards and recommendations: GR-1089-CORE, FCC Part 68, UL1950, EN 60950, IEC 60950, ITU-T K.20, K.21 and K.45. The
TISP4350M3BJ meets the FCC Part 68 “B” ringer voltage requirement (VDRM = ±275 V) and survives the Type B impulse tests. For FCC Part
68 ADSL applications, the TISP4360H3BJ is recommended. The TISP4360H3BJ has an extra 15 V in working level (VDRM = ±290 V) to avoid
clipping the ADSL signal during ringing peaks. The TISP4xxxM3BJ series is housed in a surface mount SMB (DO-214AA) package.
Summary Electrical Characteristics
Part #
TISP4070M3
TISP4080M3
TISP4095M3
TISP4115M3
TISP4125M3
TISP4145M3
TISP4165M3
TISP4180M3
TISP4200M3
TISP4220M3
TISP4240M3
TISP4250M3
TISP4265M3
TISP4290M3
TISP4300M3
TISP4350M3
TISP4360M3
TISP4395M3
TISP4400M3
VDRM
V
58
65
75
90
100
120
135
145
155
160
180
190
200
220
230
275
290
320
300
V(BO)
V
70
80
95
115
125
145
165
180
200
220
240
250
265
290
300
350
360
395
400
VT @ IT
V
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
IDRM
µA
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
I(BO)
mA
600
600
600
600
600
600
600
600
600
600
600
600
600
600
600
600
600
600
600
IT
A
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
IH
mA
150
150
150
150
150
150
150
150
150
150
150
150
150
150
150
150
150
150
150
Co @ -2 V
pF
72
72
72
72
52
52
52
52
52
52
42
42
42
42
42
42
42
42
42
Functionally
Replaces
P0640SA†
P0720SA†
P0900SA†
P1100SA†
ITSM
A
1 cycle 60 Hz
32
di/dt
A/µs
2/10 Wavefront
300
P1300SA†
P1500SA
P1800SA
P2300SA†
P2600SA†
P3100SA
P3500SA†
† Bourns part has an improved protection voltage
Summary Current Ratings
ITSP
A
Parameter
Waveshape
Value
2/10
300
1.2/50, 8/20
220
10/160
120
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
NOVEMBER 1997 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
5/320
100
10/560
75
10/1000
50
TISP4xxxM3BJ Overvoltage Protector Series
ITU-T K.20/21/44/45 rating ............... 4 kV 10/700, 100 A 5/310
SMBJ Package (Top View)
Ion-Implanted Breakdown Region
Precise and Stable Voltage
Low Voltage Overshoot under Surge
Device
VDRM
2 T(A)
R(B) 1
V(BO)
V
V
‘4070
58
70
‘4080
65
80
‘4095
75
95
‘4115
90
115
‘4125
100
125
‘4145
120
145
‘4165
135
165
‘4180
145
180
‘4200
155
200
R
‘4220
160
220
‘4240
180
240
T erminals T and R correspond to the
alternative line designators of A and B
‘4250
190
250
‘4265
200
265
‘4290
220
290
‘4300
230
300
‘4350
275
350
‘4360
290
‘4395
320
‘4400
300
400
MDXXBGE
Device Symbol
T
SD4XAA
Rated for International Surge Wave Shapes
ITSP
Wave Shape
Standard
2/10 µs
GR-1089-CORE
300
360
8/20 µs
IEC 61000-4-5
220
395
10/160 µs
FCC Part 68
120
10/700 µs
ITU-T K.20/21/45
100
10/560 µs
FCC Part 68
75
10/1000 µs
GR-1089-CORE
50
A
Low Differential Capacitance .................................39 pF max.
®
............................................ UL Recognized Component
Description
These devices are designed to limit overvoltages on the telephone line. Overvoltages are normally caused by a.c. power system or lightning
flash disturbances which are induced or conducted on to the telephone line. A single device provides 2-point protection and is typically used
for the protection of 2-wire telecommunication equipment (e.g. between the Ring and Tip wires for telephones and modems). Combinations of
devices can be used for multi-point protection (e.g. 3-point protection between Ring, Tip and Ground).
The protector consists of a symmetrical voltage-triggered bidirectional thyristor. Overvoltages are initially clipped by breakdown clamping until
the voltage rises to the breakover level, which causes the device to crowbar into a low-voltage on state. This low-voltage on state causes the
current resulting from the overvoltage to be safely diverted through the device. The high crowbar holding current prevents d.c. latchup as the
diverted current subsides.
How To Order
Device
Package
TISP 4xxxM3BJ BJ (J-Bend DO-214AA/SMB)
Carrier
For Standard
Termination Finish
Order As
For Lead Free
Termination Finish
Order As
Embossed Tape Reeled
TISP4xxxM3BJR
TISP4xxxM3BJR-S
Bulk Pack
TISP 4xxxM3BJ
TISP 4xxxM3BJ-S
Insert xxx value corresponding to protection voltages of 070, 080, 095, 115, etc.
NOVEMBER 1997 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP4xxxM3BJ Overvoltage Protector Series
Description (continued)
The TISP4xxxM3BJ range consists of nineteen voltage variants to meet various maximum system voltage levels (58 V to 320 V). They are
guaranteed to voltage limit and withstand the listed international lightning surges in both polarities. These medium (M) current protection
devices are in a plastic package SMBJ (JEDEC DO-214AA with J-bend leads) and supplied in embossed tape reel pack. For alternative
voltage and holding current values, consult the factory. For higher rated impulse currents in the SMB package, the 100 A 10/1000
TISP4xxxH3BJ series is available.
Absolute Maximum Ratings, TA = 25 °C (Unless Otherwise Noted)
Rating
Repetitive peak off-state voltage, (see Note 1)
Symbol
‘4070
‘4080
‘4095
‘4115
‘4125
‘4145
‘4165
‘4180
‘4200
‘4220
‘4240
‘4250
‘4265
‘4290
‘4300
‘4350
‘4360
‘4395
‘4400
VDRM
Value
± 58
± 65
± 75
± 90
±100
±120
±135
±145
±155
±160
±180
±190
±200
±220
±230
±275
±290
±320
±300
Unit
V
Non-repetitive peak on-state pulse current (see Notes 2, 3 and 4)
2/10 µs (GR-1089-CORE, 2/10 µs voltage wave shape)
300
8/20 µs (IEC 61000-4-5, combination wave generator, 1.2/50 voltage, 8/20 current)
220
10/160 µs (FCC Part 68, 10/160 µs voltage wave shape)
120
5/200 µs (VDE 0433, 10/700 µs voltage wave shape)
110
ITSP
A
0.2/310 µs (I3124, 0.5/700 µs voltage wave shape)
100
5/310 µs (ITU-T K.20/21/45, K.44 10/700 µs voltage wave shape)
100
5/310 µs (FTZ R12, 10/700 µs voltage wave shape)
100
10/560 µs (FCC Part 68, 10/560 µs voltage wave shape)
75
10/1000 µs (GR-1089-CORE, 10/1000 µs voltage wave shape)
50
Non-repetitive peak on-state current (see Notes 2, 3 and 5)
20 ms (50 Hz) full sine wave
30
ITSM
16.7 ms (60 Hz) full sine wave
32
A
1000 s 50 Hz/60 Hz a.c.
2.1
Initial rate of rise of on-state current, Exponential current ramp, Maximum ramp value < 100 A
di T/dt
300
A/µs
Junction temperature
TJ
-40 to +150
°C
Storage temperature range
Tstg
-65 to +150
°C
NOTES: 1. See Applications Information and Figure 11 for voltage values at lower temperatures.
2. Initially, the TISP4xxxM3BJ must be in thermal equilibrium with TJ = 25 °C.
3. The surge may be repeated after the TISP4xxxM3BJ returns to its initial conditions.
4. See Applications Information and Figure 12 for current ratings at other temperatures.
5. EIA/JESD51-2 environment and EIA/JESD51-3 PCB with standard footprint dimensions connected with 5 A rated printed wiring
track widths. See Figure 9 for the current ratings at other durations. Derate current values at -0.61 %/°C for ambient temperatures
above 25 ° C.
NOVEMBER 1997 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP4xxxM3BJ Overvoltage Protector Series
Electrical Characteristics, TA = 25 °C (Unless Otherwise Noted)
IDRM
Parameter
Repetitive peak offstate current
Test Conditions
VD = VDRM
V(BO)
Breakover voltage
dv/dt = ±250 V/ms, R SOURCE = 300 Ω
V(BO)
Impulse breakover
voltage
dv/dt ≤ ±1000 V/µs, Linear voltage ramp,
Maximum ramp value = ±500 V
di/dt = ±20 A/µs, Linear current ramp,
Maximum ramp value = ±10 A
I(BO)
VT
IH
dv/dt
ID
Breakover current
On-state voltage
Holding current
Critical rate of rise of
off-state voltage
Off-state current
Min
TA = 25 °C
TA = 85 °C
‘4070
‘4080
‘4095
‘4115
‘4125
‘4145
‘4165
‘4180
‘4200
‘4220
‘4240
‘4250
‘4265
‘4290
‘4300
‘4350
‘4360
‘4395
‘4400
‘4070
‘4080
‘4095
‘4115
‘4125
‘4145
‘4165
‘4180
‘4200
‘4220
‘4240
‘4250
‘4265
‘4290
‘4300
‘4350
‘4360
‘4395
‘4400
dv/dt = ±250 V/ms, R SOURCE = 300 Ω
I T = ±5 A, t W = 100 µs
I T = ±5 A, di/dt = +/-30 mA/ms
±0.15
±0.15
Linear voltage ramp, Maximum ramp value < 0.85V DRM
VD = ±50 V
Typ
Max
±5
±10
±70
±80
±95
±115
±125
±145
±165
±180
±200
±220
±240
±250
±265
±290
±300
±350
±360
±395
±400
±78
±88
±102
±122
±132
±151
±171
±186
±207
±227
±247
±257
±272
±298
±308
±359
±370
±405
±410
±0.6
±3
±0.35
µA
V
V
A
V
A
kV/µs
±5
TA = 85 °C
Unit
±10
µA
NOVEMBER 1997 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP4xxxM3BJ Overvoltage Protector Series
Electrical Characteristics, TA = 25 °C (Unless Otherwise Noted)
Parameter
Test Conditions
f = 1 MHz, Vd = 1 V rms, VD = 0,
f = 1 MHz, Vd = 1 V rms, VD = -1 V
Coff
Off-state capacitance
f = 1 MHz, Vd = 1 V rms, VD = -2 V
f = 1 MHz, Vd = 1 V rms, VD = -50 V
f = 1 MHz, Vd = 1 V rms, VD = -100 V
(see Note 6)
NOTE
Min
4070 thru ‘4115
‘4125 thru ‘4220
‘4240 thru ‘4400
‘4070 thru ‘4115
‘4125 thru ‘4220
‘4240 thru ‘4400
‘4070 thru ‘4115
‘4125 thru ‘4220
‘4240 thru ‘4400
‘4070 thru ‘4115
‘4125 thru ‘4220
‘4240 thru ‘4400
‘4125 thru ‘4220
‘4240 thru ‘4400
Typ
83
62
50
78
56
45
72
52
42
36
26
19
21
15
Max
100
74
60
94
67
54
87
62
50
44
31
22
25
18
Unit
Typ
Max
Unit
pF
6: To avoid possible voltage clipping, the ‘4125 is tested with V D = -98 V.
Thermal Characteristics
Parameter
RθJA
NOTE
Junction to free air thermal resistance
Test Conditions
Min
EIA/JESD51-3 PCB, IT = ITSM(1000),
TA = 25 °C, (see Note 7)
265 mm x 210 mm populated line card,
4-layer PCB, IT = ITSM(1000), TA = 25 °C
115
°C/W
52
7: EIA/JESD51-2 environment and PCB has standard footprint dimensions connected with 5 A rated printed wiring track widths.
NOVEMBER 1997 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP4xxxM3BJ Overvoltage Protector Series
Parameter Measurement Information
+i
Quadrant I
ITSP
Switching
Characteristic
ITSM
IT
V(BO)
VT
I(BO)
IH
V DRM
-v
IDRM
ID
VD
ID
IDRM
VD
VDRM
+v
IH
I(BO)
V(BO)
VT
IT
ITSM
I
Quadrant III
Switching
Characteristic
ITSP
-i
PMXXAAB
Figure 1. Voltage-Current Characteristic for T and R Terminals
All Measurements are Referenced to the R Terminal
NOVEMBER 1997 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP4xxxM3BJ Overvoltage Protector Series
Typical Characteristics
OFF-STATE CURRENT
vs
JUNCTION TEMPERATURE
TCMAG
100
1.10
NORMALIZED BREAKOVER VOLTAGE
vs
JUNCTION TEMPERATURE TC4MAF
Normalized Breakover Voltage
VD = ±50 V
|I D| - Off-State Current - µA
10
1
0·1
1.05
1.00
0·01
0.95
0·001
-25
0
25
50
75
100
TJ - Junction Temperature - °C
125
-25
150
ON-STATE CURRENT
vs
ON-STATE VOLTAGE
50
40
30
TA = 25 °C
t W = 100 µs
10
5
4
3
2
1.5
1
0.7
'4125
THRU
'4200
'4240
THRU
'4400
1
NORMALIZED HOLDING CURRENT
vs
JUNCTION TEMPERATURE TC4MAD
1.5
20
15
7
2.0
TC4MACA
Normalized Hol ding Current
IT - On-State Current - A
70
150
Figure 3.
Figure 2.
100
0
25
50
75
100 125
TJ - Junction Temperature - °C
0.9
0.8
0.7
0.6
0.5
'4070
THRU
'4115
1.5
2
31 4 5
VT - On-State Voltage - V
1.0
0.4
7
Figure 4.
NOVEMBER 1997 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
10
-25
0
25
50
75
100
TJ - Junction Temperature - °C
Figure 5.
125
150
TISP4xxxM3BJ Overvoltage Protector Series
Typical Characteristics
1
NORMALIZED CAPACITANCE
vs
OFF-STATE VOLTAGE
TC4MABB
DIFFERENTIAL OFF-STATE CAPACITANCE
vs
RATED REPETITIVE PEAK OFF-STATE VOLTAGE
TCMAEB
40
0.9
0.7
0.6
0.5
'4070 THRU '4115
0.4
'4125 THRU '4220
0.3
'4240 THRU '4400
0.2
0.5
1
2
3
5
10
20 30
VD - Off-state Voltage - V
50
35
∆C = Coff(-2 V) - Coff (-50 V)
30
25
20
100 150
50
Figure 6.
60 70 80 90 100
150
200 250 300 350
VDRM - Repetitive Peak Off-State Voltage - V
Figure 7.
TYPICAL CAPACITANCE ASYMMETRY
vs
OFF-STATE VOLTAGE
TC4XBB
3
|Coff(+VD) - Coff(-VD) | — Capacitance Asymmetry — pF
Capacitance Normali zed to VD = 0
∆C - Differential Off-State Capacitance- pF
TJ = 25 °C
Vd = 1 Vrms
0.8
Vd = 10 mV rms, 1 MHz
2
1
Vd = 1 V rms, 1 MHz
0
0.5 0.7 1
2
3 4 5
7 10
20 30 4050
VD — Off-State Voltage — V
Figure 8.
NOVEMBER 1997 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP4xxxM3BJ Overvoltage Protector Series
Rating and Thermal Information
THERMAL IMPEDANCE
vs
POWER DURATION
TI4MAC
30
VGEN = 600 Vrms, 50/60 Hz
RGEN = 1.4*VGEN /ITSM(t)
EIA/JESD51-2 ENVIRONMENT
EIA/JESD51-3 PCB
TA = 25 °C
20
15
10
9
8
7
6
5
4
3
2
1.5
0·1
1
10
100
TI4MAE
150
Z θA(t) - Transie nt Thermal Impedance - °C/W
ITSM(t) - Non-Repetitive Peak On-State Current - A
NON-REPETITIVE PEAK ON-STATE CURRENT
vs
CURRENT DURATION
1000
100
90
80
70
60
50
40
30
20
15
10
9
8
7
6
5
4
0·1
ITSM(t) APPLIED FOR TIME t
EIA/JESD51-2 ENVIRONMENT
EIA/JESD51-3 PCB
TA = 25 °C
1
10
100
1000
t - Power Duration - s
t - Current Duration - s
Figure 10.
Figure 9.
IMPULSE RATING
vs
AMBIENT TEMPERATURE
VDRM DERATING FACTOR
vs
MINIMUM AMBIENT TEMPERATURE
TC4MAA
400
TI4MADA
1.00
BELLCORE 2/10
300
0.99
250
'4125 THRU '4200
Impulse Current - A
Derating Factor
0.98
0.97
0.96
0.95
'4070 THRU '4115
IEC 1.2/50, 8/20
200
150
FCC 10/160
120
100
90
80
70
ITU-T 10/700
FCC 10/560
60
0.94
50
'4240 THRU '4400
0.93
-40 -35 -30 -25 -20 -15 -10 -5
BELLCORE 10/1000
0
5
10 15 20 25
TAMIN - Minimum Ambient Temperature - °C
Figure 11.
NOVEMBER 1997 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
40
-40 -30 -20 -10 0
10 20 30 40 50 60 70 80
TA - Ambient Temperature - °C
Figure 12.
TISP4xxxM3BJ Overvoltage Protector Series
APPLICATIONS INFORMATION
Deployment
These devices are two terminal overvoltage protectors. They may be used either singly to limit the voltage between two conductors (Figure 13)
or in multiples to limit the voltage at several points in a circuit (Figure 14).
Th3
Th1
Th1
Th2
Figure 14. Multi-Point Protection
Figure 13. Two Point Protection
In Figure 13, protector Th1 limits the maximum voltage between the two conductors to ±V(BO). This configuration is normally used to protect
circuits without a ground reference, such as modems. In Figure 14, protectors Th2 and Th3 limit the maximum voltage between each conductor and ground to the ±V(BO) of the individual protector. Protector Th1 limits the maximum voltage between the two conductors to its ±V(BO)
value. If the equipment being protected has all its vulnerable components connected between the conductors and ground, then protector Th1
is not required.
Impulse Testing
To verify the withstand capability and safety of the equipment, standards require that the equipment is tested with various impulse wave forms.
The table below shows some common values.
Standard
Peak Voltage
Setting
V
Voltage
Wave Shape
µs
2/10
10/1000
10/160
10/560
9/720 †
9/720 †
0.5/700
Peak Current
Value
A
Current
Wave Shape
µs
TISP4XXXM3
25 °C Rating
A
Series
Resistance
Ω
2500
500
2/10
300
11
1000
100
10/1000
50
1500
200
10/160
120
2x5.6
800
100
10/560
75
3
FCC Part 68
1500
37.5
5/320 †
100
0
(March 1998)
1000
25
5/320 †
100
0
I3124
1500
37.5
0.2/310
100
0
37.5
1500
5/310
100
0
10/700
ITU-T K.20/K.21
100
4000
† FCC Part 68 terminology for the waveforms produced by the ITU-T recommendation K.21 10/700 impulse generator
GR-1089-CORE
If the impulse generator current exceeds the protector’s current rating, then a series resistance can be used to reduce the current to the
protector’s rated value to prevent possible failure. The required value of series resistance for a given waveform is given by the following
calculations. First, the minimum total circuit impedance is found by dividing the impulse generator’s peak voltage by the protector’s rated
current. The impulse generator’s fictive impedance (generator’s peak voltage divided by peak short circuit current) is then subtracted from the
minimum total circuit impedance to give the required value of series resistance.
For the FCC Part 68 10/560 waveform, the following values result. The minimum total circuit impedance is 800/75 = 10.7 Ω and the generator’s
fictive impedance is 800/100 = 8 Ω. This gives a minimum series resistance value of 10.7 - 8 = 2.7 Ω. After allowing for tolerance, a 3 Ω ±10%
resistor would be suitable. The 10/160 waveform needs a standard resistor value of 5.6 Ω per conductor. These would be R1a and R1b in
Figure 16 and Figure 17. FCC Part 68 allows the equipment to be non-operational after the 10/160 (conductor to ground) and 10/560 (interconductor) impulses. The series resistor value may be reduced to zero to pass FCC Part 68 in a non-operational mode, e.g. Figure 15. For this
type of design, the series fuse must open before the TISP4xxxM3 fails. For Figure 15, the maximum fuse i2t is 2.3 A2s. In some cases, the
equipment will require verification over a temperature range. By using the rated waveform values from Figure 12, the appropriate series resistor
value can be calculated for ambient temperatures in the range of -40 °C to 85 °C.
NOVEMBER 1997 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP4xxxM3BJ Overvoltage Protector Series
AC Power Testing
The protector can withstand currents applied for times not exceeding those shown in Figure 9. Currents that exceed these times must be
terminated or reduced to avoid protector failure. Fuses, PTC (Positive Temperature Coefficient) thermistors and fusible resistors are overcurrent
protection devices which can be used to reduce the current flow. Protective fuses may range from a few hundred milliamperes to one ampere.
In some cases, it may be necessary to add some extra series resistance to prevent the fuse opening during impulse testing. The current versus
time characteristic of the overcurrent protector must be below the line shown in Figure 9. In some cases, there may be a further time limit
imposed by the test standard (e.g. UL 1459 wiring simulator failure).
Capacitance
The protector characteristic off-state capacitance values are given for d.c. bias voltage, VD, values of 0, -1 V, -2 V and -50 V. Where possible
values are also given for -100 V. Values for other voltages may be calculated by multiplying the VD = 0 capacitance value by the factor given in
Figure 6. Up to 10 MHz, the capacitance is essentially independent of frequency. Above 10 MHz, the effective capacitance is strongly
dependent on connection inductance. In many applications, such as Figure 16 and Figure 18, the typical conductor bias voltages will be about
-2 V and -50 V. Figure 7 shows the differential (line unbalance) capacitance caused by biasing one protector at -2 V and the other at -50 V.
Figure 8 shows the typical capacitance asymmetry; the difference between the capacitance measured with a positive value of VD and the
capacitance value when the polarity of VD is reversed. Capacitance asymmetry is an important parameter in ADSL systems where the
protector often has no d.c. bias and the signal level is in the region of ±10 V.
Normal System Voltage Levels
The protector should not clip or limit the voltages that occur in normal system operation. For unusual conditions, such as ringing without the
line connected, some degree of clipping is permissible. Under this condition, about 10 V of clipping is normally possible without activating the
ring trip circuit.
Figure 11 allows the calculation of the protector VDRM value at temperatures below 25 °C. The calculated value should not be less than the
maximum normal system voltages. The TISP4265M3BJ, with a VDRM of 200 V, can be used for the protection of ring generators producing
100 V rms of ring on a battery voltage of -58 V (Th2 and Th3 in Figure 18). The peak ring voltage will be 58 + 1.414*100 = 199.4 V. However,
this is the open circuit voltage and the connection of the line and its equipment will reduce the peak voltage. In the extreme case of an
unconnected line, clipping the peak voltage to 190 V should not activate the ring trip. This level of clipping would occur at the temperature
when the VDRM has reduced to 190/200 = 0.95 of its 25 °C value. Figure 11 shows that this condition will occur at an ambient temperature of
-28 °C. In this example, the TISP4265M3BJ will allow normal equipment operation provided that the minimum expected ambient temperature
does not fall below -28 °C.
JESD51 Thermal Measurement Method
To standardize thermal measurements, the EIA (Electronic Industries Alliance) has created the JESD51 standard. Part 2 of the standard
(JESD51-2, 1995) describes the test environment. This is a 0.0283 m3 (1 ft3) cube which contains the test PCB (Printed Circuit Board)
horizontally mounted at the center. Part 3 of the standard (JESD51-3, 1996) defines two test PCBs for surface mount components; one for
packages smaller than 27 mm on a side and the other for packages up to 48 mm. The SMBJ measurements used the smaller 76.2 mm x
114.3 mm (3.0 “ x 4.5 “) PCB. The JESD51-3 PCBs are designed to have low effective thermal conductivity (high thermal resistance) and
represent a worst case condition. The PCBs used in the majority of applications will achieve lower values of thermal resistance, and can
dissipate higher power levels than indicated by the JESD51 values.
NOVEMBER 1997 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP4xxxM3BJ Overvoltage Protector Series
Typical Circuits
MODEM
TIP
WIRE
RING
FUSE
R1a
RING DETECTOR
Th3
HOOK SWITCH
Th1
D.C. SINK
TISP4350
PROTECTED
EQUIPMENT
Th2
SIGNAL
R1b
RING
WIRE
TIP
AI6XBMA
E.G. LINE CARD
AI6XBK
Figure 15. Modem Inter-Wire Protection
Figure 16. PROTECTION MODULE
R1a
Th3
SIGNAL
Th1
Th2
R1b
AI6XBL
D.C.
Figure 17. ISDN Protection
OVERCURRENT
PROTECTION
TIP
WIRE
RING/TEST
PROTECTION
TEST
RELAY
RING
RELAY
SLIC
RELAY
S3a
R1a
Th3
S1a
SLIC
PROTECTION
Th4
S2a
SLIC
Th1
Th2
RING
WIRE
Th5
R1b
S3b
S1b
S2b
TISP6xxxx,
TISPPBLx,
TISP6NTP2
C1
220 nF
TEST
EQUIPMENT
RING
GENERATOR
V BAT
AI6XBJ
Figure 18. Line Card Ring/Test Protection
NOVEMBER 1997 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP4xxxM3BJ Overvoltage Protector Series
MECHANICAL DATA
Recommended Printed Wiring Footprint
2.54
(.100)
SMB Pad Size
2.40
(.095)
DIMENSIONS ARE:
MILLIMETERS
(INCHES)
2.16
(.085)
MDXX BIA
Device Symbolization Code
Devices will be coded as below. As the device parameters are symmetrical, terminal 1 is not identified.
Device
TISP4070M3BJ
TISP4080M3BJ
TISP4095M3BJ
TISP4115M3BJ
TISP4125M3BJ
TISP4145M3BJ
TISP4165M3BJ
TISP4180M3BJ
TISP4200M3BJ
TISP4220M3BJ
TISP4240M3BJ
TISP4250M3BJ
TISP4265M3BJ
TISP4290M3BJ
TISP4300M3BJ
TISP4350M3BJ
TISP4360M3BJ
TISP4395M3BJ
TISP4400M3BJ
Symbolization
Code
4070M3
4080M3
4095M3
4115M3
4125M3
4145M3
4165M3
4180M3
4200M3
4220M3
4240M3
4250M3
4265M3
4290M3
4300M3
4350M3
4360M3
4395M3
4400M3
Device Symbolization Code
Devices are shipped in one of the carriers below. Unless a specific method of shipment is specified by the customer, devices will be shipped in
the most practical carrier. For production quantities, the carrier will be embossed tape reel pack. Evaluation quantities may be shipped in bulk
pack or embossed tape.
For Standard
For Lead Free
Termination Finish Termination Finish
Order As
Order As
Carrier
Embossed Tape Reel Pack
Bulk Pack
NOVEMBER 1997 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP4xxxM3BJR
TISP4xxxM3BJ
TISP4xxxM3BJR-S
TISP4xxxM3BJ-S
TISP4xxxM3BJ Overvoltage Protector Series
MECHANICAL DATA
SMBJ (DO-214AA) Plastic Surface Mount Diode Package
This surface mount package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will
withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high
humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly.
SMB
4.06 - 4.57
(.160 - .180)
3. 30 - 3. 94
(.130 - .155)
1
2
Index
Mark
(if needed)
2. 00 - 2.40
(.079 - .094)
1. 90 - 2.10
(.075 - .083)
0. 76 - 1.52
(.030 - .060)
0. 10 - 0. 20
(.004 - .008)
1. 96 - 2. 32
(.077 - .091)
5. 21 - 5.59
(.205 - .220)
DIMENSIONS ARE:
MILLIMETERS
(INCHES)
MDXXBHAA
NOVEMBER 1997 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP4xxxM3BJ Overvoltage Protector Series
MECHANICAL DATA
Tape Dimensions
SMB Package Single-Sprocket Tape
1. 55 - 1.65
(.061 - .065 )
3. 90 - 4.10
(.154 - .161 )
1. 95 - 2.05
(.077 - .081)
0. 40
MAX .
(.016)
1. 65 - 1.85
(.065 - .073 )
5. 45 - 5.55
(.215 - .219 ) 11.70 - 12.30
(.461 - .484 )
7. 90 - 8.10
(.311 - .319 )
1. 5
MIN .
(.059)
0 MIN .
20 °
Index
Mark
(if needed)
Cover
Tape
4. 5
MAX .
(.177)
Carrier Tape
Embossment
Direction of Feed
Maximium component
rotation
Typical component
cavity center line
Typical component
center line
NOTES: A. The clearance between the component and the cavity must be within 0.05 mm (.002 in) MIN. to 0.65 mm (.026 in)
MAX. so that the component cannot rotate more than 20° within the determined cavity.
B. Taped devices are supplied on a reel of the following dimensions:
Reel diameter:
330 mm ± 3.0 mm (12.99 in ± .118 in)
Reel hub diameter: 75 mm (2.95 in) MIN.
Reel axial hole:
13.0 mm ± 0.5 mm (.512 in ± .020 in)
C. 3000 devices are on a reel.
“TISP” is a trademark of Bourns, Ltd., a Bourns Company, and is Registered in U.S. Patent and Trademark Office.
“Bourns” is a registered trademark of Bourns, Inc. in the U.S. and other countries.
NOVEMBER 1997 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
8. 20
MAX .
(.323)
MDXXBJA