APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet RoHS Specification SSC-STW0Q2PA SSCSSC-STW0Q2PA September 2012 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-12 (Rev.01) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet STW0Q2PA Description This surface-mount LED comes in standard package dimension. It has a substrate made up of a molded plastic reflector sitting on top of a lead frame. The die is attached within the reflector cavity and the cavity is encapsulated by silicone. STW0Q2PA Features • Lead Frame type LED PKG size: 5.6*3.0 thickness 0.9mm • White colored SMT package • Pb-free Reflow Soldering Application • RoHS compliant The package design coupled with careful selection of component materials allow these products to perform with high reliability. Applications • Interior lighting • General lighting • Indoor and out door displays • Architectural / Decorative lighting SSCSSC-STW0Q2PA September 2012 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-12 (Rev.01) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet [ Contents ] 1. Outline dimensions of STW0Q2PA 2. Characteristics of STW0Q2PA 3. Characteristic diagrams 4. Color & Binning 5. Bin Code Description 6. Labeling 7. Packing 8. Recommended solder pad 9. Soldering 10. Precaution for use 11. Handling of Silicone Resin LEDs SSCSSC-STW0Q2PA September 2012 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-12 (Rev.01) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet 1. Outline dimensions of STW0Q2PA Package Marking N.C A C1 C2 TOP VIEW Slug BOTTOM VIEW SIDE VIEW Notes : [1] [2] [3] [4] All dimensions are in millimeters. Scale : none Undefined tolerance is ±0.1mm Forward current is 50mA per die for parallel inner circuit. Package Total Forward Current is 100mA SSCSSC-STW0Q2PA September 2012 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-12 (Rev.01) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet Material Structure ② ⑥ ③ ④ ⑤ ① Parts No. Name Description Materials ① LEAD FRAME Metal Copper Alloy (Silver Plated) ② Chip Source Blue LED GaN on Sapphire ③ Wire Metal Gold Wire ④ Encapsulation Silicone +Phosphor ⑤ Body Thermo Plastic Heat-resistant Polymer ⑥ Zener Diode Si - SSCSSC-STW0Q2PA September 2012 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-12 (Rev.01) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet 2. Characteristics of STW0Q2PA 1) Electro-Optical characteristics at 100mA (Ta=25℃, RH30%) Value Parameter Symbol Unit Min Typ Max VF 2.9 3.2 3.4 V VR - 0.9 1.2 V Iv - 10.5 - cd Luminous Flux Φ - 31.8 - lm Correlated Color Temperature CCT 4,200 - 7,000 K 2Θ1/2 - 120 - Deg. Forward Voltage [1] Reverse Voltage [2] Luminous Intensity* Viewing Angle [3] Color Rendering Index* Thermal resistance [4] 68 Ra RthJS - 15 - ºC/W *Notes : All measurements were made under the standardized environment of SSC. [1] Forward current is 50mA per die for parallel inner circuit. Package Total Forward Current is 100mA [2] The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. [3] 2Θ1/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity. [4] Thermal resistance: RthJS (Junction / solder) * Tolerance : VF :±0.1V, IV :±7%, Ra :±2, x,y :±0.01 2) Absolute Maximum Ratings Parameter Symbol Value Unit IF 160 mA Pd 592 mW Peak Forward Current IFM [2] 300 mA Junction Temperature Tj 125 ºC Operating Temperature Topr -40 ~ +85 ºC Storage Temperature Tstg -40 ~ +100 ºC ±5,000V HBM V Forward Current [1] Power Dissipation* ESD (HBM) SSCSSC-STW0Q2PA *Notes : LED’s properties might be different from suggested values like above and below tables if operation condition will September 2012 be exceeded our parameter range. [1] Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. www.seoulsemicon.com [2] IFM was measured at Tw≤1 msec of pulse width and D≤1/10 of duty ratio. 서식번호 : SSC-QP-7-07-12 (Rev.01) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 1) Spectrum data (IF=100mA, Ta=25℃, RH30%) 1.0 Relative Emission Intensity Z-Power LED X10490 Technical Data Sheet 3. Characteristic diagrams 0.8 0.6 0.4 0.2 0.0 300 400 500 600 700 800 Wavelength [nm] SSCSSC-STW0Q2PA September 2012 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-12 (Rev.01) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 Forward Current IF [mA] 100 10 1 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 Forward Voltage VF [V] 3) Forward Current vs. Relative Luminous Intensity, Ta=25℃ 1.6 1.4 Relative Luminous Intensity Z-Power LED X10490 Technical Data Sheet 2) Forward Voltage vs. Forward Current, Ta=25℃ 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0 20 40 60 80 100 120 140 160 Forward Current IF [mA] SSCSSC-STW0Q2PA September 2012 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-12 (Rev.01) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 0.304 20mA 0.302 60mA 100mA y Z-Power LED X10490 Technical Data Sheet 4) Chromaticity Coordinate vs. Forward Current, Ta=25℃ 0.300 150mA 200mA 0.298 0.296 0.294 0.285 0.286 0.287 0.288 0.289 0.290 0.291 x SSCSSC-STW0Q2PA September 2012 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-12 (Rev.01) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 1.0 Relative Light Output Z-Power LED X10490 Technical Data Sheet 5) Relative Light Output vs. Junction Temperature, IF=100mA 0.8 0.6 0.4 0.2 0.0 40 60 80 100 120 Junction Temperation Tj (? ) SSCSSC-STW0Q2PA September 2012 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-12 (Rev.01) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 0.310 0.305 25 0.300 44 y Z-Power LED X10490 Technical Data Sheet 6) Chromaticity Coordinate vs. Junction Temperature 0.295 64 84 0.290 104 0.285 0.280 0.270 0.275 0.280 0.285 0.290 0.295 x SSCSSC-STW0Q2PA September 2012 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-12 (Rev.01) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 Relative Forward Voltage 1.0 0.8 0.6 0.4 0.2 0.0 40 60 80 100 120 Junction Temperation Tj (? ) 8) Ambient Temperature vs. Maximum Forward Current 20 0 18 0 16 0 Forward Current IF[mA] Z-Power LED X10490 Technical Data Sheet 7) Forward Voltage Shift vs. Junction Temperature 14 0 o R th J -A = 1 00 C /W 12 0 10 0 80 60 40 20 0 -40 -20 0 20 40 60 80 1 00 O A m b ie n t te m p e ra tu re T a ( C ) SSCSSC-STW0Q2PA September 2012 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-12 (Rev.01) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet 9) Viewing angle, Ta=25℃ 0 -30 -60 -90 30 60 90 SSCSSC-STW0Q2PA September 2012 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-12 (Rev.01) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet 4. Color & Binning 0.41 4200K 0.40 4700K 4500K 5000K 5300K D1 D0 5600K D3 0.39 0.38 0.37 C1 6000K CIE Y 0.36 0.35 6500K 0.34 0.33 7000K 0.32 A1 A3 A0 A5 A2 A4 C0 B1 B0 B3 B2 B5 B4 C3 C2 C5 C4 D2 D5 D4 0.31 0.30 0.29 0.29 0.30 0.31 0.32 0.33 0.34 0.35 0.36 0.37 0.38 0.39 CIE X SSCSSC-STW0Q2PA September 2012 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-12 (Rev.01) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet 4. Color & Binning ● COLOR RANK <IF=100mA, Ta=25℃> 6500~7000K A0 A2 A4 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3028 0.3304 0.3041 0.324 0.3055 0.3177 0.3041 0.324 0.3055 0.3177 0.3068 0.3113 0.3126 0.3324 0.3136 0.3256 0.3146 0.3187 0.3115 0.3393 0.3126 0.3324 0.3136 0.3256 6000~6500K A1 A3 A5 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3115 0.3393 0.3126 0.3324 0.3136 0.3256 0.3126 0.3324 0.3136 0.3256 0.3146 0.3187 0.321 0.3408 0.3216 0.3334 0.3221 0.3261 0.3205 0.3481 0.321 0.3408 0.3216 0.3334 5600~6000K B0 B2 B4 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3207 0.3462 0.3212 0.3389 0.3217 0.3316 0.3212 0.3389 0.3217 0.3316 0.3222 0.3243 0.3293 0.3461 0.3293 0.3384 0.3294 0.3306 0.3292 0.3539 0.3293 0.3461 0.3293 0.3384 5300~5600K B1 B3 B5 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3292 0.3539 0.3293 0.3461 0.3293 0.3384 0.3293 0.3461 0.3293 0.3384 0.3294 0.3306 0.3373 0.3534 0.3369 0.3451 0.3366 0.3369 0.3376 0.3616 0.3373 0.3534 0.3369 0.3451 SSC-STW0Q2PA SSC September 2012 * Measurement Uncertainty of the Color Coordinates : ± 0.01 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-12 (Rev.01) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet 4. Color & Binning ● COLOR RANK <IF=100mA, Ta=25℃> 5000~5300K C0 C2 C4 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3376 0.3616 0.3373 0.3534 0.3369 0.3451 0.3373 0.3534 0.3369 0.3451 0.3366 0.3369 0.3456 0.3601 0.3448 0.3514 0.344 0.3428 0.3463 0.3687 0.3456 0.3601 0.3448 0.3514 4700~5000K C1 C3 C5 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3463 0.3687 0.3456 0.3601 0.3448 0.3514 0.3456 0.3601 0.3448 0.3514 0.344 0.3428 0.3539 0.3669 0.3526 0.3578 0.3514 0.3487 0.3552 0.376 0.3539 0.3669 0.3526 0.3578 4500~4700K D0 D2 D4 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3548 0.3736 0.3536 0.3646 0.3523 0.3555 0.3536 0.3646 0.3523 0.3555 0.3511 0.3465 0.3625 0.3711 0.3608 0.3616 0.359 0.3521 0.3641 0.3804 0.3625 0.3711 0.3608 0.3616 4200~4500K D1 D3 D5 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3641 0.3804 0.3625 0.3711 0.3608 0.3616 0.3625 0.3711 0.3608 0.3616 0.359 0.3521 0.3714 0.3775 0.3692 0.3677 0.367 0.3578 0.3736 0.3874 0.3714 0.3775 0.3692 0.3677 SSC-STW0Q2PA SSC September 2012 * Measurement Uncertainty of the Color Coordinates : ± 0.01 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-12 (Rev.01) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet 5. Bin Code Description Bin Code Luminous Intensity [mcd] Color Rank Forward Voltage [V] T5 B2 Z1 4,200K ~ 7,000K Luminous Intensity [mcd] *[1] @ IF = 100mA Flux *[2] [lm] RANK Min. Max. Typ. S0 9000 9500 28.9 S5 9500 10000 T0 10000 T5 Color Rank @ IF = 100mA Forward Voltage [V] @ IF =100mA A~ D RANK Min. Max. 30.0 Y3 2.9 3.0 10500 31.0 Z1 3.0 3.1 10500 11000 32.5 Z2 3.1 3.2 V0 11000 11500 33.1 Z3 3.2 3.3 V5 11500 12000 34.7 A1 3.3 3.4 W0 12000 13000 37.5 Available ranks Not yet available ranks CCT IV Rank 5300~7000 K (CIE A,B) S0 S5 T0 T5 V0 V5 W0 4200~5300 K (CIE C,D) S0 S5 T0 T5 V0 V5 W0 *Notes : All measurements were made under the standardized environment of SSC. [1] The LEDs are sorted based on luminous intensity measurements. [2] The typical lumen values are included for reference only. SSCSSC-STW0Q2PA September 2012 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-12 (Rev.01) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet 6. Labeling Full code form : X1X2-X3X4-X5-X6X7-X8X9 - X1 : Company X2 : Kind of LED X3X4 : CRI Group X5 : Package series X6X7 : Characteristic code X8 : Version X9 : Old Version Rank #1#2#3 - #1 : Luminous Intensity : IV [cd] - #2 : Color coordinates : x, y - #3 : Forward Voltage : VF [V] SSCSSC-STW0Q2PA September 2012 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-12 (Rev.01) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet 7. Packing Reel QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. HUMIDITY INDICATOR DESI PAK Aluminum Vinyl Bag QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. Outer Box Structure Material : Paper(SW3B(B)) TYPE SIZE (mm) ⓐ ⓑ ⓒ 7inch 245 220 102 245 220 142 1 SIDE ⓒ ① QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX ⓑ PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. ⓐ SSCSSC-STW0Q2PA September 2012 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-12 (Rev.01) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 15.4±1.0 180 13±0.3 2 60 Z-Power LED X10490 Technical Data Sheet 7. Packing 22 13 ( Tolerance: ±0.2, Unit: mm ) 1)Quantity : 3500pcs/Reel 2)Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm 3)Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10˚ to the carrier tape. 4)Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof SSCSSC-STW0Q2PA Package. September 2012 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-12 (Rev.01) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet 8. Recommended solder pad Notes : [1] All dimensions are in millimeters. [2] Scale : none [3] Undefined tolerance is ±0.1mm This drawing without tolerances are for reference only. SSCSSC-STW0Q2PA September 2012 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-12 (Rev.01) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet 9. Soldering IPC/JEDEC J-STD-020 Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (Tsmax to Tp) 3° C/second max. 3° C/second max. Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (Tsmin to Tsmax) (ts) 100 °C 150 °C 60-120 seconds 150 °C 200 °C 60-180 seconds Time maintained above: - Temperature (TL) - Time (tL) 183 °C 60-150 seconds 217 °C 60-150 seconds Peak Temperature (Tp) 215℃ 260℃ Time within 5°C of actual Peak Temperature (tp)2 10-30 seconds 20-40 seconds Ramp-down Rate 6 °C/second max. 6 °C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. * Caution 1. Reflow soldering is recommended not to be done more than two times. In the case of more than 24 hours passed soldering after first, LEDs will be damaged. 2. Repairs should not be done after the LEDs have been soldered. When repair is unavoidable, suitable tools must be used. 3. Die slug is to be soldered. 4. When soldering, do not put stress on the LEDs during heating. 5. After soldering, do not warp the circuit board. SSCSSC-STW0Q2PA September 2012 www.seoulsemicon.com 22 서식번호 : SSC-QP-7-07-12 (Rev.01) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet 10. Precaution for use (1) Storage To avoid the moisture penetration, we recommend store in a dry box with a desiccant . The recommended storage temperature range is 5C to 30C and a maximum humidity of RH50%. (2) Use Precaution after Opening the Packaging Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may affect the light output efficiency. Pay attention to the following: a. Recommend conditions after opening the package - Sealing - Temperature : 5 ~ 40℃ Humidity : less than RH30% b. If the package has been opened more than 4 week(MSL_2a) or the color of the desiccant changes, components should be dried for 10-12hr at 60±5℃ (3) Do not apply mechanical force or excess vibration during the cooling process to normal temperature after soldering. (4) Do not rapidly cool device after soldering. (5) Components should not be mounted on warped (non coplanar) portion of PCB. (6) Radioactive exposure is not considered for the products listed here in. (7) Gallium arsenide is used in some of the products listed in this publication. These products are dangerous if they are burned or shredded in the process of disposal. It is also dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed of. (8) This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA (Isopropyl Alcohol) should be used. (9) When the LEDs are in operation the maximum current should be decided after measuring the package temperature. (10) LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. (11) The appearance and specifications of the product may be modified for improvement without notice. (12) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration. (13) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy. The result can be a significant loss of light output from the fixture. Knowledge of the properties of the materials selected to be used in the construction of fixtures SSCcan help prevent these issues. SSC-STW0Q2PA (14)Attaching LEDs, do not use adhesives that outgas organic vapor. September 2012 www.seoulsemicon.com (15)The driving circuit must be designed to allow forward voltage only when it is ON or OFF. If the reverse voltage is applied to LED, migration can be generated resulting in LED damage. 서식번호 : SSC-QP-7-07-12 (Rev.01) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet 11. Handling of Silicone Resin LEDs (1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. (2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. (3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area. (4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. (6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this. product with acid or sulfur material in sealed space. SSCSSC-STW0Q2PA September 2012 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-12 (Rev.01)