Color Bin Structure - Seoul Semiconductor

SZ5-M1-WX-XX – High-Power LED
Superior Efficacy and Lumen output with Small Form Factor
Z Power LED – Z5-M1
SZ5-M1-WX-XX (Cool, Neutral, Warm)
MacAdam
3-Step
RoHS
Product Brief
Description
Features and Benefits
•
The Z-Power series is designed for high
flux output applications with high current
operation capability.
•
It incorporates state of the art SMD
design and low thermal resistant
material.
•
•
•
•
•
•
•
•
The Z Power LED is ideal light sources
for directional lighting applications such
as Spot Lights, various outdoor
applications, automotive lightings and
high performance torches .
High Lumen Output and Efficacy
Designed for high current operation
Low Thermal Resistance
Wide CCT range 3000~7000K
High Color Quality, CRI Min. 80
ANSI compliant Binning
MacAdam 3 Step for Warm White
Key Applications
•
•
•
•
•
•
•
Indoor lighting
Outdoor lighting
Automotive
Architectural lighting
Industrial lighting (High/Low bay)
Portable Torch
Home appliance
Table 1. Product Selection Table
CCT
CRI
Part Number
Color
Min.
Typ.
Max.
Min
SZ5-M1-W0-00
Cool White
4700K
5300K
7000K
70
SZ5-M1-W0-C8
Cool White
4700K
5300K
7000K
75
SZ5-M1-WN-00
Neutral White
3700K
4000K
4700K
70
SZ5-M1-WN-C8
Neutral White
3700K
4000K
4700K
80
SZ5-M1-WW-00
Warm White
2600K
3000K
3200K
68
SZ5-M1-WW-C8
Warm White
2600K
3000K
3700K
80
SZ5-M1-WW-C9
Warm White
2600K
3000K
3200K
90
Rev3.2, Jul 20. 2015
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SZ5-M1-WX-XX – High-Power LED
Table of Contents
Index
•
Product Brief
1
•
Table of Contents
2
•
Product Performance
3
•
Characteristics Graph
5
•
Color Bin Structure
11
•
Mechanical Dimensions
16
•
Packaging Information
17
•
Product Nomenclature
18
•
Recommended Solder Pad
19
•
Reflow Soldering Characteristics
20
•
Handling of Silicone Resin for LEDs
21
•
Precaution For Use
22
•
Company Information
25
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SZ5-M1-WX-XX – High-Power LED
Performance Characteristics
Table 2. Electro Optical Characteristics, Tj=25ºC, RH30%
Part Number
Typical
Luminous Flux [2]
ФV [3] (lm)
CCT
(K) [1]
Typical Forward
Voltage (VF) [4]
CRI
[5],
Ra
Viewing
Angle
(degree
s)
2Θ ½
Typ.
350mA
700mA*
1.2A*
350mA
700mA*
1.2A*
Min.
Typ.
SZ5-M1-W0-00
5300
158
285
433
2.95
3.14
3.33
70
118
SZ5-M1-W0-C8
5300
150
271
411
2.95
3.14
3.33
75
118
SZ5-M1-WN-00
4000
156
276
415
2.95
3.14
3.33
70
118
SZ5-M1-WN-C8
4000
142
253
382
2.95
3.14
3.33
80
118
SZ5-M1-WW-00
3000
148
265
403
2.95
3.14
3.33
68
118
SZ5-M1-WW-C8
3000
128
231
353
2.95
3.14
3.33
80
118
SZ5-M1-WW-C9
3000
105
188
286
2.95
3.14
3.33
90
118
Table 3. Electro Optical Characteristics, Tj=85ºC
Typical
Luminous Flux [2]
ФV [3] (lm)
CCT (K)
Part Number
[1]
Typical Forward
Voltage (VF) [4]
Typ.
350mA
700mA*
1.2A*
350mA
700mA*
1.2A*
SZ5-M1-W0-00
5300
142
258
393
2.78
2.96
3.14
SZ5-M1-W0-C8
5300
135
245
373
2.78
2.96
3.14
SZ5-M1-WN-00
4000
137
250
380
2.78
2.96
3.14
SZ5-M1-WN-C8
4000
126
229
349
2.78
2.96
3.14
SZ5-M1-WW-00
3000
141
239
364
2.78
2.96
3.14
SZ5-M1-WW-C8
3000
117
210
322
2.78
2.96
3.14
SZ5-M1-WW-C9
3000
95
153
232
2.78
2.96
3.14
Notes :
(1) Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram. Color
coordinate : 0.005, CCT 5% tolerance.
(2) Seoul Semiconductor maintains a tolerance of 7% on flux and power measurements.
(3) ФV is the total luminous flux output as measured with an integrating sphere.
(4) Tolerance is 0.06V on forward voltage measurements.
(5) Tolerance is 2.0 on CRI measurements.
* No values are provided by real measurement. Only for reference purpose
Rev3.2, Jul 20. 2015
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SZ5-M1-WX-XX – High-Power LED
Performance Characteristics
Table 4. Absolute Maximum Ratings, Tj=25ºC
Value
Parameter
Symbol
Forward Current [1]
Peak Pulsed Forward Current
Unit
IF
[2]
Min.
Typ.
Max.
-
-
1500
mA
2000
mA
IF
Reverse Voltage
VR
-
-
5
V
Power Dissipation
Pd
-
-
5.22
W
Junction Temperature
Tj
-
-
150
ºC
Operating Temperature
Topr
- 40
-
125
ºC
Storage Temperature
Tstg
- 40
-
125
ºC
Thermal resistance (J to S) [3]
RθJ-S
-
4.5
-
K/W
ESD Sensitivity(HBM) [4]
Class 3A JESD22-A114-E
Notes :
(1) At Junction Temperature 25℃ condition.
(2) Pulse width ≤10ms, duty cycle ≤ 10% condition.
(3) RθJ-S is tested at 350mA.
(4) The zener diode is included to protect the product from ESD.
•
Thermal resistance can be increased substantially depending on the heat sink design/operating
condition, and the maximum possible driving current will decrease accordingly.
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SZ5-M1-WX-XX – High-Power LED
Characteristics Graph
Fig 1. Color Spectrum, Tj=25ºC
Relative Radiant Power [%]
1.25
Cool white
Neutral white
Warm white
1.00
0.75
0.50
0.25
0.00
350
400
450
500
550
600
650
700
750
800
Wavelength [nm]
Fig 2. Typical Spatial Distribution
100
Relative Luminous Intensity [%]
90
80
70
60
50
40
30
20
10
0
-80
-60
-40
-20
0
20
40
60
80
Angular Displacement [degrees]
Rev3.2, Jul 20. 2015
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SZ5-M1-WX-XX – High-Power LED
Characteristics Graph
Fig 3. Forward Voltage vs. Forward Current, Tj=25℃
1.6
1600
Forward
[A]
Current [mA]
Forward Current
1.4
1400
1200
1.2
1.0
1000
0.8
800
0.6
600
0.4
400
0.2
200
0.0
2.4
2.6
2.8
3.0
3.2
3.4
3.6
3.8
Forward Voltage [V]
Fig 4. Forward Current vs. Relative Luminous Flux, Tj=25℃
400
Relative Luminous Flux [%]
350
300
250
200
150
100
50
0
0
200
400
600
800
1000
1200
1400
1600
Forward Current [mA]
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SZ5-M1-WX-XX – High-Power LED
Characteristics Graph
Fig 5. Forward Current vs. CIE x, y Shift, Tj=25℃
0.02
ΔCIE
CIE(X)
x
y
ΔCIE
CIE(Y)
0.01
0.00
-0.01
-0.02
0
200
400
600
800
1000
1200
1400
Forward Current [mA]
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SZ5-M1-WX-XX – High-Power LED
Characteristics Graph
Fig 6. Relative Light Output vs. Junction Temperature, IF=350mA
120
Relative luminous flux [%]
100
80
60
40
20
0
25
50
75
100
125
150
o
Junction Temperature [ C]
Fig 7. Junction Temp. vs. CIE x, y Shift, IF=350mA
0.02
x
ΔCIE
CIE(X)
y
ΔCIE
CIE(Y)
0.01
0.00
-0.01
-0.02
25
50
75
100
125
150
o
Junction Temperature [ C]
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SZ5-M1-WX-XX – High-Power LED
Characteristics Graph
Fig 8. Relative Forward vs. Junction Temperature, IF=350mA
0.05
0.00
-0.05
 VF
-0.10
-0.15
-0.20
-0.25
-0.30
40
60
80
100
120
140
160
o
Junction Temperature [ C]
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SZ5-M1-WX-XX – High-Power LED
Characteristics Graph
Fig 9. Maximum Forward Current vs. Ambient Temperature, Tj(max.)=150℃, IF =1500mA
1.6
1600
Rth(j-a)=15℃/W
Rth(j-a)=20℃/W
Rth(j-a)=25℃/W
1200
1.2
Maximum Current [A]
Maximum Current [mA]
1400
1.4
1400
1400
1000
1.0
0.8
800
0.6
600
0.4
400
0.2
200
0.0
0
20
40
60
80
100
120
140
o
Ambient Temperature [ C]
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SZ5-M1-WX-XX – High-Power LED
Color Bin Structure
Table 5. Bin Code description, IF=350mA, Tj=25℃
Luminous Flux (lm)
Color
Chromaticity
Coordinate
Part Number
Bin Code
Min.
Max.
V2
130
140
V3
140
150
W1
150
160
W2
160
V2
Bin Code
Min.
Max.
G
2.75
3.00
H
3.00
3.25
170
I
3.25
3.50
130
140
G
2.75
3.00
V3
140
150
W1
150
160
H
3.00
3.25
V2
130
140
G
2.75
3.00
V3
140
150
H
3.00
3.25
W1
150
160
W2
160
170
I
3.25
3.50
U3
109
118.5
G
2.75
3.00
V1
118.5
130
H
3.00
3.25
V2
130
140
V3
140
150
I
3.25
3.50
V2
130
140
G
2.75
3.00
V3
140
150
H
3.00
3.25
W1
150
160
I
3.25
3.50
U3
109
118.5
G
2.75
3.00
V1
118.5
130
H
3.00
3.25
V2
130
140
V3
140
150
I
3.25
3.50
U1
91
100
G
2.75
3.00
U2
100
109
H
3.00
3.25
U3
109
118.5
I
3.25
3.50
SZ5-M1-W0-00
SZ5-M1-W0-C8
Refer to page.13
Refer to page.13
SZ5-M1-WN-00
Refer to page.14
SZ5-M1-WN-C8
SZ5-M1-WW-00
Refer to page.14
Refer to page.15
SZ5-M1-WW-C8
SZ5-M1-WW-C9
Rev3.2, Jul 20. 2015
Typical Forward Voltage (VF)
Refer to page.15
Refer to page.15
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SZ5-M1-WX-XX – High-Power LED
Color Bin Structure
Table 6. Flux Bin Code description, Tj=85℃
Luminous Flux (lm)
350mA*
700mA*
Bin Code
Min.
Max.
Min.
Max.
U1
84
92
152
167
U2
92
100
167
182
U3
100
109
182
198
V1
109
119
193
205
V2
119
129
205
218
V3
129
138
218
240
W1
138
147
240
256
W2
147
156
256
272
Table 7. VF Bin Code description, Tj=85℃
Forward Voltage (VF)
350mA*
700mA*
Bin Code
Min.
Max.
Min.
Max.
G
2.60
2.82
2.77
3.02
H
2.82
3.06
3.02
3.27
I
3.06
3.30
3.27
3.52
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SZ5-M1-WX-XX – High-Power LED
Color Bin Structure
CIE Chromaticity Diagram (Cool white), Tj =25℃, IF=350mA
4700K
0.38
5000K
C1
5300K
CIE (y)
0.36
C0
5600K
B1
C2
B0
B3
C4
B2
B5
6000K
6500K
0.34
7000K
A0
A2
0.32
A1
A3
C3
C5
B4
A5
A4
0.30
0.30
0.32
0.34
0.36
CIE (x)
A0
A1
A2
A3
A4
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
0.3028
0.3304
0.3115
0.3393
0.3041
0.3240
0.3126
0.3324
0.3055
0.3177
0.3041
0.3240
0.3126
0.3324
0.3055
0.3177
0.3136
0.3256
0.3068
0.3113
0.3126
0.3324
0.3210
0.3408
0.3136
0.3256
0.3216
0.3334
0.3146
0.3187
0.3115
0.3393
0.3205
0.3481
0.3126
0.3324
0.3210
0.3408
0.3136
0.3256
A5
B0
B1
B2
B3
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
0.3136
0.3256
0.3207
0.3462
0.3292
0.3539
0.3212
0.3389
0.3293
0.3461
0.3146
0.3187
0.3212
0.3389
0.3293
0.3461
0.3217
0.3316
0.3293
0.3384
0.3221
0.3261
0.3293
0.3461
0.3373
0.3534
0.3293
0.3384
0.3369
0.3451
0.3216
0.3334
0.3292
0.3539
0.3376
0.3616
0.3293
0.3461
0.3373
0.3534
B4
B5
C0
C1
C2
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
0.3217
0.3316
0.3293
0.3384
0.3376
0.3616
0.3463
0.3687
0.3373
0.3534
0.3222
0.3243
0.3294
0.3306
0.3373
0.3534
0.3456
0.3601
0.3369
0.3451
0.3294
0.3306
0.3366
0.3369
0.3456
0.3601
0.3539
0.3669
0.3448
0.3514
0.3293
0.3384
0.3369
0.3451
0.3463
0.3687
0.3552
0.3760
0.3456
0.3601
C3
C4
C5
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
0.3456
0.3601
0.3369
0.3451
0.3448
0.3514
0.3448
0.3514
0.3366
0.3369
0.3440
0.3428
0.3526
0.3578
0.3440
0.3428
0.3514
0.3487
0.3539
0.3669
0.3448
0.3514
0.3526
0.3578
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SZ5-M1-WX-XX – High-Power LED
Color Bin Structure
CIE Chromaticity Diagram (Neutral white), Tj =25℃, IF=350mA
0.42
3700K
4000K
0.40
E1
CIE (y)
4200K
E0
4500K
4700K
0.38
D1
D0
D2
0.36
E2
D3
E3
E5
E4
D5
D4
0.34
0.34
0.36
0.38
0.40
CIE (x)
D0
D1
D2
D3
D4
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
0.3548
0.3736
0.3641
0.3804
0.3536
0.3646
0.3625
0.3711
0.3524
0.3555
0.3536
0.3646
0.3625
0.3711
0.3524
0.3555
0.3608
0.3616
0.3512
0.3465
0.3625
0.3711
0.3714
0.3775
0.3608
0.3616
0.3692
0.3677
0.3590
0.3521
0.3641
0.3804
0.3736
0.3874
0.3625
0.3711
0.3714
0.3775
0.3608
0.3616
D5
E0
E1
E2
E3
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
0.3608
0.3616
0.3736
0.3874
0.3869
0.3958
0.3714
0.3775
0.3842
0.3855
0.3590
0.3521
0.3714
0.3775
0.3842
0.3855
0.3692
0.3677
0.3813
0.3751
0.3670
0.3578
0.3842
0.3855
0.3970
0.3935
0.3813
0.3751
0.3934
0.3825
0.3692
0.3677
0.3869
0.3958
0.4006
0.4044
0.3842
0.3855
0.3970
0.3935
E4
E5
CIE x
CIE y
CIE x
CIE y
0.3692
0.3677
0.3813
0.3751
0.3670
0.3578
0.3783
0.3646
0.3783
0.3646
0.3898
0.3716
0.3813
0.3751
0.3934
0.3825
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SZ5-M1-WX-XX – High-Power LED
Color Bin Structure
CIE Chromaticity Diagram (Warm white), Tj=25℃, IF=350mA
F0
F1
F2
F3
F4
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
0.3996
0.4015
0.4146
0.4089
0.396
0.3907
0.4104
0.3978
0.3925
0.3798
0.396
0.3907
0.4104
0.3978
0.3925
0.3798
0.4062
0.3865
0.3889
0.369
0.4104
0.3978
0.4248
0.4048
0.4062
0.3865
0.4198
0.3931
0.4017
0.3751
0.4089
0.4299
0.4165
0.4104
0.3978
0.4248
0.4048
0.4062
0.4146
F5
G11
G12
G13
0.3865
G14
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
0.4062
0.3865
0.4299
0.4165
0.4261
0.4077
0.4223
0.3990
0.4185
0.3902
0.4017
0.3751
0.4261
0.4077
0.4223
0.3990
0.4185
0.3902
0.4147
0.3814
0.4147
0.3814
0.4324
0.4100
0.4284
0.4011
0.4243
0.3922
0.4203
0.3834
0.4198
0.3931
0.4365
0.4189
0.4324
0.4100
0.4284
0.4011
0.4243
0.3922
G21
G22
G23
G24
G31
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
0.4365
0.4189
0.4324
0.4100
0.4284
0.4011
0.4243
0.3922
0.4430
0.4212
0.4324
0.4100
0.4284
0.4011
0.4243
0.3922
0.4203
0.3834
0.4387
0.4122
0.4387
0.4122
0.4345
0.4033
0.4302
0.3943
0.4259
0.3853
0.4451
0.4145
0.4430
0.4212
0.4387
0.4122
0.4345
0.4033
0.4302
0.3943
0.4496
0.4236
G32
G33
G34
G41
G42
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
0.4387
0.4122
0.4345
0.4033
0.4302
0.3943
0.4496
0.4236
0.4451
0.4145
0.4345
0.4033
0.4302
0.3943
0.4259
0.3853
0.4451
0.4145
0.4406
0.4055
0.4406
0.4055
0.4361
0.3964
0.4316
0.3873
0.4515
0.4168
0.4468
0.4077
0.4451
0.4145
0.4406
0.4055
0.4361
0.3964
0.4562
0.4260
0.4515
0.4168
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SZ5-M1-WX-XX – High-Power LED
Color Bin Structure
CIE Chromaticity Diagram (Warm white), Tj=25℃, IF=350mA
G43
G44
H11
H12
H13
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
0.4406
0.4055
0.4361
0.3964
0.4625
0.4275
0.4575
0.4182
0.4526
0.4090
0.4361
0.3964
0.4316
0.3873
0.4575
0.4182
0.4526
0.4090
0.4477
0.3998
0.4420
0.3985
0.4373
0.3893
0.4515
0.4168
0.4468
0.4077
0.4420
0.3985
0.4077
0.4420
0.3985
0.4562
0.4260
0.4515
0.4168
0.4468
0.4468
H14
H21
H22
H23
0.4077
H24
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
0.4477
0.3998
0.4687
0.4289
0.4636
0.4197
0.4585
0.4104
0.4534
0.4012
0.4428
0.3906
0.4636
0.4197
0.4585
0.4104
0.4534
0.4012
0.4483
0.3919
0.4373
0.3893
0.4575
0.4182
0.4526
0.4090
0.4477
0.3998
0.4428
0.3906
0.4420
0.3985
0.4625
0.4275
0.4575
0.4182
0.4526
0.4090
0.4477
0.3998
H31
H32
H33
H34
H41
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
0.4750
0.4304
0.4697
0.4211
0.4644
0.4118
0.4591
0.4025
0.4810
0.4319
0.4697
0.4211
0.4644
0.4118
0.4591
0.4025
0.4538
0.3932
0.4758
0.4225
0.4636
0.4197
0.4585
0.4104
0.4534
0.4012
0.4483
0.3919
0.4697
0.4211
0.4687
0.4289
0.4636
0.4197
0.4585
0.4104
0.4534
0.4012
0.4750
0.4304
H42
H43
H44
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
0.4758
0.4225
0.4703
0.4132
0.4648
0.4038
0.4703
0.4132
0.4648
0.4038
0.4593
0.3944
0.4644
0.4118
0.4591
0.4025
0.4538
0.3932
0.4697
0.4211
0.4644
0.4188
0.4591
0.4025
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SZ5-M1-WX-XX – High-Power LED
Mechanical Dimensions
Notes :
(1) All dimensions are in millimeters.
(2) Scale : none
(3) Undefined tolerance is ±0.1mm
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SZ5-M1-WX-XX – High-Power LED
Emitter Tape & Reel Packaging
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SZ5-M1-WX-XX – High-Power LED
Product Nomenclature
RANK :
QUANTITY : #####
LOT NUMBER : ###### #### ###
SSC PART NUMBER : ### ## ## ##
Table 8. Part Numbering System : X1X2X3 - X4X5 - X6X7 - X8X9
Part Number Code
Description
Part Number
X1
Company
S
X2
Z-Power LED series number
Z
X3
PKG series
5
X4
PKG series
M
M series
X5
Revision number
1
New version
X6 X7
Color Specification
W0
Pure white
WN
Neutral white
WW
Warm white
C8
CRI (min.) 80
C9
CRI (min.) 90
00
The others
X8 X9
Color Specification
Value
Table 9. Lot Numbering System : Y1Y1Y2Y3Y3Y4Y5Y5Y5Y5 - Y6Y6Y6 - Y7Y7Y7 - Y8Y8Y8Y8Y8Y8Y8
Lot Number Code
Description
Y1
Year
Y2
Month
Y3
Day
Y4
Production area
Y5
Mass order
Y6
Taping number
Y7
Reel number
Y8
Internal management number
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SZ5-M1-WX-XX – High-Power LED
Recommended Solder Pad
Notes :
(1) All dimensions are in millimeters.
(2) Scale : none
(3) This drawing without tolerances are for reference only.
(4) Undefined tolerance is ±0.1mm.
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SZ5-M1-WX-XX – High-Power LED
Reflow Soldering Characteristics
IPC/JEDEC J-STD-020
Table 10.
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
Average ramp-up rate (Tsmax to Tp)
3° C/second max.
3° C/second max.
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Tsmin to Tsmax) (ts)
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-180 seconds
Time maintained above:
- Temperature (TL)
- Time (tL)
183 °C
60-150 seconds
217 °C
60-150 seconds
Peak Temperature (Tp)
215℃
260℃
Time within 5°C of actual Peak
Temperature (tp)2
10-30 seconds
20-40 seconds
Ramp-down Rate
6 °C/second max.
6 °C/second max.
Time 25°C to Peak Temperature
6 minutes max.
8 minutes max.
Caution
(1) Reflow soldering is recommended not to be done more than two times. In the case of more than
24 hours passed soldering after first, LEDs will be damaged.
(2) Repairs should not be done after the LEDs have been soldered. When repair is unavoidable,
suitable tools must be used.
(3) Die slug is to be soldered.
(4) When soldering, do not put stress on the LEDs during heating.
(5) After soldering, do not warp the circuit board.
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SZ5-M1-WX-XX – High-Power LED
Handling of Silicone Resin for LEDs
(1) During processing, mechanical stress on the surface should be minimized as much as possible.
Sharp objects of all types should not be used to pierce the sealing compound.
(2) In general, LEDs should only be handled from the side. By the way, this also applies to
LEDs without a silicone sealant, since the surface can also become scratched.
(3) When populating boards in SMT production, there are basically no restrictions regarding the form
of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be
prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s
reflector area.
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These
conditions must be considered during the handling of such devices. Compared to standard
encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As
mentioned previously, the increased sensitivity to dust requires special care during processing. In
cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning
solution must be applied to the surface after the soldering of components.
(5) Seoul Semiconductor suggests using isopropyl alcohol for cleaning. In case other solvents are
used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic
cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED.
(6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this
product with acid or sulfur material in sealed space.
(7) Avoid leaving fingerprints on silicone resin parts.
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SZ5-M1-WX-XX – High-Power LED
Precaution for Use
(1) Storage
To avoid the moisture penetration, we recommend storing Z5 Series LEDs in a dry box with a
desiccant . The recommended storage temperature range is 5℃ to 30℃ and a maximum humidity of
RH50%.
(2) Use Precaution after Opening the Packaging
Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may
affect the light output efficiency.
Pay attention to the following:
a. Recommend conditions after opening the package
- Sealing / Temperature : 5 ~ 40℃ Humidity : less than RH30%
b. If the package has been opened more than 1 year (MSL 2) or the color of
the desiccant changes, components should be dried for 10-12hr at 60±5℃
(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering.
(4) Do not rapidly cool device after soldering.
(5) Components should not be mounted on warped (non coplanar) portion of PCB.
(6) Radioactive exposure is not considered for the products listed here in.
(7) Gallium arsenide is used in some of the products listed in this publication. These products are
dangerous if they are burned or shredded in the process of disposal. It is also dangerous to drink the
liquid or inhale the gas generated by such products when chemically disposed of.
(8) This device should not be used in any type of fluid such as water, oil, organic solvent and etc.
When washing is required, IPA (Isopropyl Alcohol) should be used.
(9) When the LEDs are in operation the maximum current should be decided after measuring the
package temperature.
(10) LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months or
more after being shipped from Seoul Semiconductor. A sealed container with a nitrogen atmosphere
should be used for storage.
(11) The appearance and specifications of the product may be modified for improvement without
notice.
(12) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration.
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SZ5-M1-WX-XX – High-Power LED
Precaution for Use
(13) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca
n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy. T
he result can be a significant loss of light output from the fixture. Knowledge of the properties of the m
aterials selected to be used in the construction of fixtures can help prevent these issues.
(14) The slug is electrically isolated.
(15) Attaching LEDs, do not use adhesives that outgas organic vapor.
(16) The driving circuit must be designed to allow forward voltage only when it is ON or OFF. If the rev
erse voltage is applied to LED, migration can be generated resulting in LED damage.
(17) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS). Below is
a list of suggestions that Seoul Semiconductor purposes to minimize these effects.
a. ESD (Electro Static Discharge)
Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come
into contact. While most ESD events are considered harmless, it can be an expensive problem in
many industrial environments during production and storage. The damage from ESD to an LEDs may
cause the product to demonstrate unusual characteristics such as:
- Increase in reverse leakage current lowered turn-on voltage
- Abnormal emissions from the LED at low current
The following recommendations are suggested to help minimize the potential for an ESD event.
One or more recommended work area suggestions:
- Ionizing fan setup
- ESD table/shelf mat made of conductive materials
- ESD safe storage containers
One or more personnel suggestion options:
- Antistatic wrist-strap
- Antistatic material shoes
- Antistatic clothes
Environmental controls:
- Humidity control (ESD gets worse in a dry environment)
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SZ5-M1-WX-XX – High-Power LED
Precaution for Use
b. EOS (Electrical Over Stress)
Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is
subjected to a current or voltage that is beyond the maximum specification limits of the device.
The effects from an EOS event can be noticed through product performance like:
- Changes to the performance of the LED package
(If the damage is around the bond pad area and since the package is completely encapsulated
the package may turn on but flicker show severe performance degradation.)
- Changes to the light output of the luminaire from component failure
- Components on the board not operating at determined drive power
Failure of performance from entire fixture due to changes in circuit voltage and current across total
circuit causing trickle down failures. It is impossible to predict the failure mode of every LED exposed
to electrical overstress as the failure modes have been investigated to vary, but there are some
common signs that will indicate an EOS event has occurred:
- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)
- Damage to the bond pads located on the emission surface of the LED package
(shadowing can be noticed around the bond pads while viewing through a microscope)
- Anomalies noticed in the encapsulation and phosphor around the bond wires.
- This damage usually appears due to the thermal stress produced during the EOS event.
c. To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing:
- A surge protection circuit
- An appropriately rated over voltage protection device
- A current limiting device
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SZ5-M1-WX-XX – High-Power LED
Company Information
Published by
Seoul Semiconductor © 2013 All Rights Reserved.
Company Information
Seoul Semiconductor (www.SeoulSemicon.com) manufacturers and packages a wide selection of
light emitting diodes (LEDs) for the automotive, general illumination/lighting, Home appliance, signage
and back lighting markets. The company is the world’s fifth largest LED supplier, holding more than
10,000 patents globally, while offering a wide range of LED technology and production capacity in
areas such as “nPola”, "Acrich", the world’s first commercially produced AC LED, and "Acrich MJT Multi-Junction Technology" a proprietary family of high-voltage LEDs.
The company’s broad product portfolio includes a wide array of package and device choices such as
Acrich and Acirch2, high-brightness LEDs, mid-power LEDs, side-view LEDs, and through-hole type
LEDs as well as custom modules, displays, and sensors.
Legal Disclaimer
Information in this document is provided in connection with Seoul Semiconductor products. With
respect to any examples or hints given herein, any typical values stated herein and/or any information
regarding the application of the device, Seoul Semiconductor hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual
property rights of any third party. The appearance and specifications of the product can be changed
to improve the quality and/or performance without notice.
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