obsolete - Analog Devices

High Precision
Tri-Axis Inertial Sensor
ADIS16350/ADIS16355
FEATURES
FUNCTIONAL BLOCK DIAGRAM
AUX_ADC
Guidance and control
Platform control and stabilization
Motion control and analysis
Inertial measurement units
General navigation
Image stabilization
Robotics
ADIS16350/ADIS16355
TEMPERATURE
SENSORS
TRI-AXIS MEMS
ANGULAR
RATE SENSOR
SIGNAL
CONDITIONING
AND
CONVERSION
CALIBRATION
AND
DIGITAL
PROCESSING
CS
SCLK
SPI
PORT
DIN
OBS
APPLICATIONS
AUX_DAC
DIGITAL
CONTROL
SELF-TEST
DOUT
VCC
TRI-AXIS MEMS
ACCELLERATION
SENSOR
OLE
GND
POWER
MANAGEMENT
ALARMS
AUX
I/O
06874-001
Tri-axis gyroscope with digital range scaling
±75°/s, ±150°/s, ±300°/s settings
14-bit resolution
Tri-axis accelerometer
±10 g measurement range
14-bit resolution
350 Hz bandwidth
Factory calibrated sensitivity, bias, and alignment
ADIS16350: +25°C
ADIS16355: −40°C to +85°C
Digitally controlled bias calibration
Digitally controlled sample rate
Digitally controlled filtering
Programmable condition monitoring
Auxiliary digital input/output
Digitally activated self-test
Programmable power management
Embedded temperature sensor
SPI-compatible serial interface
Auxiliary 12-bit ADC input and DAC output
Single-supply operation: 4.75 V to 5.25 V
2000 g shock survivability
TE
RST
DIO1 DIO2
Figure 1.
GENERAL DESCRIPTION
The ADIS16350/ADIS16355 iSensor™ is a complete triple axis
gyroscope and triple axis accelerometer inertial sensing system.
This sensor combines the Analog Devices, Inc., iMEMS® and
mixed signal processing technology to produce a highly
integrated solution that provides calibrated, digital inertial
sensing. An SPI interface and simple output register structure
allow for easy access to data and configuration controls.
controller dynamically compensates for all major influences on
the MEMS sensors, thus maintaining highly accurate sensor
outputs without further testing, circuitry, or user intervention.
The SPI port provides access to the following embedded sensors:
X-, Y-, and Z-axis angular rates; X-, Y-, and Z-axis linear acceleration; internal temperature; power supply; and auxiliary analog
input. The inertial sensors are precision-aligned across axes,
and are calibrated for offset and sensitivity. An embedded
.
This compact module is approximately 23 mm × 23 mm ×
23 mm and provides a convenient flex-based connector system.
The following programmable features simplify system integration:
in-system autobias calibration, digital filtering and sample rate,
self-test, power management, condition monitoring, and
auxiliary digital input/output.
Rev. B
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113 ©2007–2009 Analog Devices, Inc. All rights reserved.
ADIS16350/ADIS16355
TABLE OF CONTENTS
Features .............................................................................................. 1 Control Register Structure ........................................................ 12 Applications ....................................................................................... 1 Auxiliary ADC Function ........................................................... 12 Functional Block Diagram .............................................................. 1 Basic Operation .............................................................................. 13 General Description ......................................................................... 1 Serial Peripheral Interface (SPI) ............................................... 13 Revision History ............................................................................... 2 Data Output Register Access .................................................... 14 Specifications..................................................................................... 3 Programming and Control ............................................................ 15 Timing Specifications .................................................................. 6 Control Register Overview ....................................................... 15 Timing Diagrams.......................................................................... 6 Control Register Structure ........................................................ 15 Absolute Maximum Ratings............................................................ 7 Calibration................................................................................... 16 ESD Caution .................................................................................. 7 Global Commands ..................................................................... 16 Pin Configuration and Function Descriptions ............................. 8 Operational Control................................................................... 17 Typical Performance Characteristics ............................................. 9 Status and Diagnostics ............................................................... 19 Theory of Operation ...................................................................... 12 Applications Information .............................................................. 22 Overview...................................................................................... 12 Installation Guidelines ............................................................... 22 Gyroscope Sensor ....................................................................... 12 Outline Dimensions ....................................................................... 24 Accelerometer Sensor ................................................................ 12 Ordering Guide .......................................................................... 24 OBS
OLE
Factory Calibration .................................................................... 12 REVISION HISTORY
9/09—Rev. A to Rev. B
Changes to Figure 4 and Figure 5 ................................................... 7
Changes to Ordering Guide .......................................................... 24
2/08—Rev. 0 to Rev. A
Added ADIS16355 .............................................................. Universal
Changes to Features.......................................................................... 1
Changes to General Description .................................................... 1
Changes to Temperature Coefficient Throughout Table 1 and
Gyroscope Noise Performance Output Noise............................... 3
Changes to Output Range................................................................ 4
Added Endnote 1 .............................................................................. 5
Changes to Table 3 ............................................................................ 7
Inserted Figure 4 ............................................................................... 8
Deleted Figure 10 .............................................................................. 8
Inserted Figure 9, Figure 10, and Figure 11 .................................. 9
Deleted Figure 12 .............................................................................. 9
Changes to Figure 13 and Figure 14 ............................................. 10
TE
Inserted Figure 15 ........................................................................... 10
Deleted Figure 17, Figure 18, Figure 20, and Figure 21............. 10
Changes to Factory Calibration Section ...................................... 12
Changes to Writing to Registers Section ..................................... 13
Replaced Data Output Register Access Section ......................... 14
Deleted Figure 28............................................................................ 15
Changes to Table 9.......................................................................... 15
Changes to Global Commands Section ....................................... 16
Changes to Internal Sample Rate Section ................................... 17
Changes to Auxiliary DAC Section .............................................. 18
Changes to General-Purpose Input/Output Section ................. 18
Changes to Table 37 ....................................................................... 21
Changes to Installation Guidelines Section ................................ 22
Updated Outline Dimensions ....................................................... 24
Changes to Ordering Guide .......................................................... 24
8/07—Revision 0: Initial Version
Rev. B | Page 2 of 24
ADIS16350/ADIS16355
SPECIFICATIONS
TA = −40°C to +85°C, VCC = 5.0 V, angular rate = 0°/s, dynamic range = 300°/s, ±1 g, unless otherwise noted.
Table 1.
Parameter
GYROSCOPE SENSITIVITY
Initial Sensitivity
Temperature Coefficient
Gyroscope Axis Nonorthogonality
Gyroscope Axis Misalignment
Nonlinearity
GYROSCOPE BIAS
In Run Bias Stability
Angular Random Walk
Temperature Coefficient
Conditions
Each axis
25°C, dynamic range = ±300°/s
25°C, dynamic range = ±150°/s
25°C, dynamic range = ±75°/s
ADIS16350, see Figure 6
ADIS16355, see Figure 9
25°C, difference from 90° ideal
25°C, relative to base-plate and guide pins
Best fit straight line
Min
Typ
Max
Unit
0.0725
0.07326
0.03663
0.01832
600
40
±0.05
±0.5
0.1
0.0740
°/s/LSB
°/s/LSB
°/s/LSB
ppm/°C
ppm/°C
Degree
Degree
% of FS
25°C, 1 σ
25°C
ADIS16350, see Figure 7
ADIS16355, see Figure 10
Any axis, 1 σ (linear acceleration bias
compensation enabled)
VCC = 4.75 V to 5.25 V
0.015
4.2
0.1
0.01
0.05
0.25
°/s/V
25°C, ±300°/s range, 2-tap filter setting
25°C, ±150°/s range, 8-tap filter setting
25°C, ±75°/s range, 32-tap filter setting
25°C, f = 25 Hz, ±300°/s, no filtering
0.60
0.35
0.17
0.05
°/s rms
°/s rms
°/s rms
°/s/√Hz rms
350
14
Hz
kHz
OBS
Linear Acceleration Effect
Voltage Sensitivity
GYROSCOPE NOISE PERFORMANCE
Output Noise
Rate Noise Density
GYROSCOPE FREQUENCY RESPONSE
3 dB Bandwidth
Sensor Resonant Frequency
GYROSCOPE SELF-TEST STATE
Change for Positive Stimulus
Change for Negative Stimulus
Internal Self-Test Cycle Time
ACCELEROMETER SENSITIVITY
Dynamic Range
Initial Sensitivity
Temperature Coefficient
Axis Nonorthogonality
Axis Misalignment
Nonlinearity
ACCELEROMETER BIAS
In-Run Bias Stability
Velocity Random Walk
Temperature Coefficient
°/s
°/√hr
°/s/°C
°/s/°C
°/s/g
OLE
±300°/s range setting
±300°/s range setting
TE
432
−432
723
−723
25
±8
2.471
±10
2.522
100
40
±0.25
±0.5
±0.2
1105
−1105
LSB
LSB
ms
Each axis
25°C
ADIS16350, see Figure 8
ADIS16355, see Figure 11
25°C, difference from 90° ideal
25°C, relative to base-plate and guide pins
Best fit straight line
25°C, 1 σ
25°C
ADIS16350, see Figure 12
ADIS16355, see Figure 15
Rev. B | Page 3 of 24
0.7
2.0
4
0.5
2.572
g
mg/LSB
ppm/°C
ppm/°C
Degree
Degree
% of FS
mg
m/s/√hr
mg/°C
mg/°C
ADIS16350/ADIS16355
Parameter
ACCELEROMETER NOISE PERFORMANCE
Output Noise
Noise Density
ACCELEROMETER FREQUENCY RESPONSE
3 dB Bandwidth
Sensor Resonant Frequency
ACCELEROMETER SELF-TEST STATE
Output Change When Active
TEMPERATURE SENSOR
Output at 25°C
Scale Factor
ADC INPUT
Resolution
Integral Nonlinearity
Differential Nonlinearity
Offset Error
Gain Error
Input Range
Input Capacitance
DAC OUTPUT
Resolution
Relative Accuracy
Differential Nonlinearity
Offset Error
Gain Error
Output Range
Output Impedance
Output Settling Time
LOGIC INPUTS 1
Input High Voltage, VINH
Input Low Voltage, VINL
Conditions
Min
25°C, no filtering
25°C, no filtering
73
OBS
Logic 1 Input Current, IINH
Logic 0 Input Current, IINL
All Except RST
RST
Input Capacitance, CIN
DIGITAL OUTPUTS1
Output High Voltage, VOH
Output Low Voltage, VOL
SLEEP TIMER
Timeout Period 2
FLASH MEMORY
Endurance 3
Data Retention 4
CONVERSION RATE
Maximum Sample Rate
Minimum Sample Rate
Typ
Max
35
1.85
mg rms
mg/√Hz rms
350
10
Hz
kHz
146
219
LSB
LSB/°C
12
±2
±1
±4
±2
Bits
LSB
LSB
LSB
LSB
V
pF
2.5
20
OLE
12
±4
±1
±5
±0.5
For Code 101 to Code 4095
2
10
2.0
For CS signal when used to wake up from
sleep mode
VIH = 3.3 V
VIL = 0 V
ISOURCE = 1.6 mA
ISINK = 1.6 mA
0.8
0.55
V
V
V
±0.2
±10
μA
−40
−1
10
−60
μA
mA
pF
0.5
10,000
20
SMPL_PRD = 0x01
SMPL_PRD = 0xFF
Rev. B | Page 4 of 24
Bits
LSB
LSB
mV
%
V
Ω
μs
TE
2.5
2.4
TJ = 85°C
LSB
0
6.88
0
During acquisition
5 kΩ/100 pF to GND
Unit
0.4
V
V
128
Sec
Cycles
Years
819.2
0.413
SPS
SPS
ADIS16350/ADIS16355
Parameter
START-UP TIME 5
Initial Power-Up
Sleep Mode Recovery
POWER SUPPLY
Operating Voltage Range, VCC
Power Supply Current
Conditions
Min
Typ
Max
150
3
4.75
Normal mode at 25°C
Fast mode at 25°C
Sleep mode at 25°C
5.0
33
57
500
Unit
ms
ms
5.25
V
mA
mA
μA
1
The digital I/O signals are driven by an internal 3.3 V supply, and the inputs are 5 V tolerant.
Guaranteed by design.
3
Endurance is qualified as per JEDEC Standard 22, Method A117 and measured at −40°C, +25°C, +85°C, and +125°C.
3
Retention lifetime equivalent at junction temperature (TJ) 85°C as per JEDEC Standard 22, Method A117. Retention lifetime decreases with junction temperature.
5
Defined as the time from wake-up to the first conversion. This time does not include sensor settling time, which is dependent on the filter settings.
2
OBS
OLE
TE
Rev. B | Page 5 of 24
ADIS16350/ADIS16355
TIMING SPECIFICATIONS
TA = 25°C, VCC = 5.0 V, angular rate = 0°/s, unless otherwise noted.
Table 2.
Parameter
fSCLK
tCS
Description
Fast mode, SMPL_PRD ≤ 0x09 (fS ≥ 164 Hz)
Normal mode, SMPL_PRD ≥ 0x0A (fS ≤ 149 Hz)
Data rate time, fast mode, SMPL_PRD ≤ 0x09 (fS ≥ 164 Hz)
Data rate time, normal mode, SMPL_PRD ≥ 0x0A (fS ≤ 149 Hz)
Data stall time, fast mode SMPL_PRD ≤ 0x09 (fS ≥ 164 Hz)
Data stall time, normal mode SMPL_PRD ≥ 0x0A (fS ≤ 149 Hz)
Chip select to clock edge
tDAV
tDSU
tDHD
tDF
tDR
tSFS
Data output valid after SCLK falling edge 2
Data input setup time before SCLK rising edge
Data input hold time after SCLK rising edge
Data output fall time
Data output rise time
CS high after SCLK edge 3
tDATARATE
tDATASTALL
1
OBS
Min 1
0.01
10
40
160
9
75
48.8
Typ
Max1
2
300
Unit
MHz
kHz
μs
μs
μs
μs
ns
100
ns
ns
ns
ns
ns
ns
24.4
48.8
5
5
12.5
12.5
5
Guaranteed by design, not production tested.
The MSB presents an exception to this parameter. The MSB clocks out on the falling edge of CS. The rest of the DOUT bits are clocked after the falling edge of SCLK and
are governed by this specification.
3
This parameter may need to be expanded to allow for proper capture of the LSB. After CS goes high, the DOUT line goes into a high impedance state.
OLE
TIMING DIAGRAMS
CS
SCLK
tDATARATE
06874-002
tDATASTALL
Figure 2. SPI Chip Select Timing
CS
tCS
TE
tSFS
1
2
3
4
5
6
15
16
SCLK
tDAV
DOUT
MSB
DB14
DB13
tDSU
DIN
W/R
DB12
DB11
A4
A3
DB10
DB2
DB1
LSB
tDHD
A5
A2
D2
D1
Figure 3. SPI Timing, Utilizing SPI Settings Typically Identified as Phase = 1, Polarity = 1
Rev. B | Page 6 of 24
LSB
06874-003
2
ADIS16350/ADIS16355
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Acceleration
Any Axis, Unpowered
Any Axis, Powered
VCC to GND
Digital Input/Output Voltage to GND
Analog Inputs to GND
Operating Temperature Range
Storage Temperature Range
Rating
2000 g
2000 g
−0.3 V to +6.0 V
−0.3 V to +5.3 V
−0.3 V to +3.6 V
−40°C to +85°C
−65°C to +125°C1, 2
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Table 4. Package Characteristics
Package Type
24-Lead Module
θJA
39.8°C/W
θJC
14.2°C/W
Device Weight
16 grams
1
Extended exposure to temperatures outside the specified temperature
range of −40°C to +85°C can adversely affect the accuracy of the factory
calibration. For best accuracy, store the parts within the specified operating
range of −40°C to +85°C.
2
Although the device is capable of withstanding short-term exposure to
150°C, long-term exposure threatens internal mechanical integrity.
ESD CAUTION
OBS
OLE
TE
Rev. B | Page 7 of 24
ADIS16350/ADIS16355
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
SCLK
DIN
DIO1
DIO2
VCC
GND
GND
DNC
DNC
AUX_ADC
DNC
3
5
7
9
11
13
15
17
19
21
23
2
4
6
8
10
12
14
16
18
20
22
24
DNC
CS
VCC
VCC
GND
DNC
DNC
AUX_DAC
DNC
DNC
RST
DNC
1
DOUT
TOP VIEW
(Not to Scale)
06874-038
ADIS16350/ADIS16355
NOTES
1. THIS REPRESENTATION DISPLAYS THE TOP VIEW PINOUT
FOR THE MATING SOCKET CONNECTOR.
2. THE ACTUAL CONNECTOR PINS ARE NOT VISIBLE FROM
THE TOP VIEW.
3. MATING CONNECTOR: SAMTEC CLM-112-02 OR EQUIVALENT.
4. DNC = DO NOT CONNECT.
OBS
Figure 4. Pin Configuration
Z-AXIS
aZ
OLE
Y-AXIS
aY
gZ
TE
X-AXIS
aX
gY
gX
PIN 23
ORIGIN ALIGNMENT REFERENCE POINT
SEE MSC_CTRL[6].
NOTES
1. ACCELERATION (aX, aY, aZ) AND ROTATIONAL (gX, gY, gZ) ARROWS
INDICATE THE DIRECTION OF MOTION THAT PRODUCES
A POSITIVE OUTPUT.
06874-004
PIN 1
Figure 5. Pin Configuration, Connector Top View
Table 5. Pin Function Descriptions
Pin No.
1, 2, 16, 17, 18, 19, 22, 23, 24
3
4
5
6
7
8
9
10, 11, 12
13, 14, 15
20
21
1
Mnemonic
DNC
SCLK
DOUT
DIN
CS
DIO1
RST
DIO2
VCC
GND
AUX_DAC
AUX_ADC
Type 1
N/A
I
O
I
I
I/O
I
I/O
S
S
O
I
S = supply, O = output, I = input.
Rev. B | Page 8 of 24
Description
Do Not Connect
SPI Serial Clock
SPI Data Output
SPI Data Input
SPI Chip Select
Digital Input/Output
Reset
Digital Input/Output
Power Supply
Power Ground
Auxiliary, 12-Bit, DAC Output
Auxiliary, 12-Bit, ADC Input
ADIS16350/ADIS16355
TYPICAL PERFORMANCE CHARACTERISTICS
5
0.4
4
0.3
3
+1σ
0.2
+1σ
1
0
–1σ
–1
–2
µ
0
–0.1
–0.2
–4
–0.3
–35
–20
–5
10
25
40
55
70
85
100
TEMPERATURE (°C)
06874-030
–3
–5
–50
OBS
–0.4
–50
–1σ
–35
–20
–5
10
25
40
55
70
85
Figure 9. ADIS16355 Gyroscope Sensitivity vs. Temperature
20
1.00
OLE
5
µ
0
–5
0.50
+1σ
0.25
µ
0
–0.25
–1σ
–10
–1σ
–0.50
–15
–0.75
–20
–5
10
25
40
55
70
85
100
TEMPERATURE (°C)
06874-031
–35
–1.00
–50
–35
–20
–5
10
TE
06874-035
+1σ
0.75
BIAS (°/s)
10
–20
–50
100
TEMPERATURE (°C)
Figure 6. ADIS16350 Gyroscope Sensitivity vs. Temperature
15
BIAS (°/s)
0.1
06874-034
µ
SENSITIVITY (%)
SENSITIVITY (%)
2
25
40
55
70
85
100
TEMPERATURE (°C)
Figure 7. ADIS16350 Gyroscope Bias vs. Temperature
Figure 10. ADIS16355 Gyroscope Bias vs. Temperature
1.0
1.00
0.8
0.75
0.6
+1σ
0.50
SENSITIVITY (%)
µ
0.2
0
–1σ
–0.2
0.25
+1σ
µ
0
–0.25
–1σ
–0.4
–0.50
–0.6
–1.0
–50
–35
–20
–5
10
25
40
55
70
85
100
TEMPERATURE (°C)
Figure 8. ADIS16350 Accelerometer Sensitivity vs. Temperature
–1.00
–50
06874-036
–0.75
–0.8
06874-032
SENSITIVITY (%)
0.4
–35
–20
–5
10
25
40
55
70
85
100
TEMPERATURE (°C)
Figure 11. ADIS16355 Accelerometer Sensitivity vs. Temperature
Rev. B | Page 9 of 24
ADIS16350/ADIS16355
400
60
300
40
200
20
BIAS (mg)
BIAS (mg)
100
+1σ
0
µ
+1σ
µ
0
–1σ
–100
–20
–200
–1σ
–5
10
25
40
55
70
85
100
TEMPERATURE (°C)
–60
–50
OBS
0.01
–1σ
10
1
10
100
1000
INTEGRATION TIME (Seconds)
Figure 13. Gyroscope Root Allan Variance
25
20
15
10
–0.1
0
0.1
TE
0.2
0.3
0.4
SENSITIVITY ERROR (%)
PERCENTAGE OF POPULATION (%)
30
25
20
15
10
5
µ
–1σ
100
INTEGRATION TIME (Seconds)
1000
06874-008
ROOT ALLAN VARIANCE (g)
+1σ
0.001
10
100
Figure 16. Gyroscope Sensitivity Error, +25°C
0.01
1
85
30
35
0.1
70
35
0
0.1
0.0001
0.01
55
OLE
06874-005
0.1
40
40
5
0.001
0.01
25
45
PERCENTAGE OF POPULATION (%)
ROOT ALLAN VARIANCE (°/s)
µ
–5
Figure 15. ADIS16355 Accelerometer Bias vs. Temperature
1
+1σ
–20
TEMPERATURE (°C)
Figure 12. ADIS16350 Accelerometer Bias vs. Temperature
0.1
–35
06874-010
–20
0
–0.3
–0.2
–0.1
0
0.1
0.2
BIAS VOLTAGE SENSITIVITY (°/s/V)
0.3
0.4
06874-011
–35
06874-033
–400
–50
06874-037
–40
–300
Figure 17. Gyroscope Bias Voltage Power Supply Sensitivity, +25°C
Figure 14. Accelerometer Root Allan Variance
Rev. B | Page 10 of 24
ADIS16350/ADIS16355
30
25
20
15
10
5
0
–0.5 –0.4 –0.3 –0.2 –0.1
0
0.1
0.3
0.3
0.4
0.5
SENSITIVITY ERROR (%)
25
20
15
10
5
0
45
46
47
48
49
50
51
52
53
54
55
56
57
58
GYROSCOPE POSITIVE SELF-TEST (°/s)
Figure 18. Accelerometer Sensitivity Error Distribution, +25°C
06874-020
PERCENTAGE OF POPULATION (%)
30
06874-013
PERCENTAGE OF POPULATION (%)
35
Figure 21. Gyroscope Positive Self-Test Distribution, +25°C
OBS
20
25
14
OLE
12
10
8
6
4
2
0
–0.10 –0.08 –0.06 –0.04 –0.02
0
0.02 0.04 0.06 0.08 0.10
BIAS DRIFT ACCELERATION FACTOR (°/s/g)
15
10
TE
5
0
–57 –56 –55 –54 –53 –52 –51 –50 –49 –48 –47 –46 –45 –44
GYROSCOPE NEGATIVE SELF-TEST (°/s)
Figure 19. Gyroscope Bias Sensitivity to Linear Acceleration, +25°C
Figure 22. Gyroscope Negative Self-Test Distribution, +25°C
35
0.5
PERCENTAGE OF POPULATION (%)
0.4
0.3
0.2
0.1
0
–0.1
–0.2
–0.3
30
25
20
15
10
5
20:19
19:27
18:35
06874-017
TIME (Hour:Minute)
17:44
16:52
16:00
15:09
14:17
13:25
12:33
11:42
9:58
10:50
9:06
8:15
7:07
6:02
5:10
4:19
3:27
2:35
1:43
0
0.00
–0.5
Figure 20. Long-Term Bias Stability, +25°C
0.30
0.32
0.34
0.36
0.38
0.40
0.42
0.44
0.46
ACCELEROMETER SELF-TEST (g)
Figure 23. Accelerometer Self-Test Distribution, +25°C
Rev. B | Page 11 of 24
0.48
06874-022
–0.4
0:51
BIAS (°/s)
20
06874-021
PERCENTAGE OF POPULATION (%)
16
06874-014
PERCENTAGE OF POPULATION (%)
18
ADIS16350/ADIS16355
THEORY OF OPERATION
OVERVIEW
CONTROL REGISTER STRUCTURE
The ADIS16350/ADIS16355 integrate three orthogonal axes of
gyroscope sensors with three orthogonal axes of accelerometer
sensors, creating the basic six degrees of freedom (6DOF) in a
single package. The accelerometers are oriented along the axis
of rotation for each gyroscope. These six sensing elements are
held together by a mechanical structure that provides tight force
and motion coupling. Each sensor output signal is sampled
using an ADC, and then the digital data is fed into a proprietary
digital processing circuit. The digital processing circuit applies
the correction tables to each sensor output, manages the input/
output function using a simple register structure and serial
interface, and provides many other features that simplify systemlevel designs.
The ADIS16350/ADIS16355 provide configuration control to
many critical operating parameters by using a dual-memory
register structure. The volatile SRAM register locations control
operation of the part while the nonvolatile flash memory
locations preserve the configuration settings. Updating register
contents affects only its SRAM location. Preserving the updates
in its corresponding flash memory location requires initiation
of the flash update command. This helps reduce the number of
write cycles to the flash memory and consequently increases the
endurance of the flash memory. During startup and reset-recovery
sequences, the flash memory contents are automatically loaded
into the SRAM register locations.
OBS
GYROSCOPE SENSOR
The core MEMs angular rate sensor (gyroscope) operates on the
principle of a resonator gyroscope. Two polysilicon sensing structures each contain a dither frame, which is electrostatically driven
to resonance. This provides the velocity element required to
produce a Coriolis force during rotation. At two of the outer
extremes of each frame, orthogonal to the dither motion, are
movable fingers that are placed between fixed fingers to form
a capacitive pickoff structure that senses Coriolis motion. The
resulting signal is fed to a series of gain and demodulation stages
that produce the electrical rate signal output.
The auxiliary ADC is a standard 12-bit ADC that digitizes other
system-level analog signals. The output of the ADC can be monitored through the AUX_ADC register, as defined in Table 6.
The ADC is a 12-bit successive approximation converter. The
output data is presented in straight binary format with the fullscale range extending from 0 V to 2.5 V.
OLE
The core acceleration sensor is a surface micromachined
polysilicon structure built on top of the silicon wafer. Polysilicon
springs suspend the structure over the surface of the wafer and
provide a resistance against acceleration forces. Deflection of the
structure is measured using a differential capacitor that consists
of independent fixed plates and central plates attached to the
moving mass. Acceleration deflects the beam and unbalances
the differential capacitor, resulting in a differential output that is
fed to a series of gain and demodulation stages that produce the
electrical rate signal output.
Figure 24 shows the equivalent circuit of the analog input
structure of the ADC. The input capacitor (C1) is typically 4 pF
and can be attributed to parasitic package capacitance. The two
diodes provide ESD protection for the analog input. Care must
be taken to ensure that the analog input signals are never outside
the range of −0.3 V to +3.5 V. Signals outside this range causes
the diodes to become forward-biased and to start conducting.
The diodes can handle 10 mA without causing irreversible
damage. The resistor is a lumped component that represents
the on resistance of the switches. The value of this resistance is
typically 100 Ω. Capacitor C2 represents the ADC sampling
capacitor and is typically 16 pF.
TE
VDD
D
C1
FACTORY CALIBRATION
The ADIS16350 provides a factory calibration that simplifies
the process of integrating it into system-level designs. This
calibration provides correction for initial sensor bias and
sensitivity, power supply variation, axial alignment, and linear
acceleration (gyroscopes). An extensive, three-dimensional
characterization provides the basis for generating correction
tables for each individual sensor. The ADIS16355 provides the
same calibration, over temperature.
D
R1 C2
06874-023
ACCELEROMETER SENSOR
AUXILIARY ADC FUNCTION
Figure 24. Equivalent Analog Input Circuit
Conversion Phase: Switch Open
Track Phase: Switch Closed
For ac applications, it is recommended that high frequency
components from the analog input signal be removed by using
a low-pass filter on the analog input pin.
In applications where harmonic distortion and signal-to-noise
ratios are critical, the analog input must be driven from a low
impedance source. Large source impedances significantly affect
the ac performance of the ADC. This can necessitate the use of
an input buffer amplifier. When no input amplifier is used to drive
the analog input, the source impedance should be limited to
values lower than 1 kΩ.
Rev. B | Page 12 of 24
ADIS16350/ADIS16355
BASIC OPERATION
The ADIS16350/ADIS16355 are designed for simple integration
into system designs, requiring only a 5 V power supply and a
4-wire, industry-standard serial peripheral interface (SPI). All
outputs and user-programmable functions are handled by a
simple register structure. Each register is 16 bits in length and
has its own unique bit map. The 16 bits in each register consist
of an upper byte (D8 to D15) and a lower byte (D0 to D7), each
with its own 6-bit address.
Writing to Registers
SERIAL PERIPHERAL INTERFACE (SPI)
Reading from Registers
The serial peripheral interface (SPI) port includes four signals:
chip select (CS), serial clock (SCLK), data input (DIN), and data
output (DOUT). The CS line enables the SPI port and frames
each SPI event. When this signal is high, the DOUT line is in a
high impedance state and the signals on DIN and SCLK have no
impact on operation. A complete data frame contains 16 clock
cycles. Because the SPI port operates in full-duplex mode, it
supports simultaneous, 16-bit receive (DIN) and transmit (DOUT)
functions during the same data frame. This enables the user to
configure the next read cycle, while, at the same time, receiving
the data associated with the previous configuration.
Reading the contents of a register requires a modification to the
sequence illustrated in Figure 25. In this case, the first two bits
in the DIN sequence are 0, followed by the address of the register.
Each register has two addresses (an upper address and a lower
address), but either one can be used to access the entire 16 bits of
data. The final eight bits of the DIN sequence are irrelevant and can
be counted as don’t cares during a read command. During the next
data frame, the DOUT sequence contains the 16-bit data of the
register, as shown in Figure 26. Although a single read command
requires two separate data frames, the full-duplex mode minimizes this overhead, requiring only one extra data frame when
continuously sampling.
Figure 25 displays a typical data frame for writing a command
to a control register. In this case, the first bit of the DIN sequence
is a 1, followed by a 0, the 6-bit address of the target register,
and the 8-bit data command. Because each write command
covers a single byte of data, two data frames are required when
writing the entire 16-bit space of a register. Note that 16 SCLK
cycles are required for a successful write operation.
OBS
OLE
DATA FRAME
CS
SCLK
DIN
W/R
A5
A4
A3
A2
A1
A0
REGISTER ADDRESS
WRITE = 1
READ = 0
DC7
DC6
DC5 DC4
DC3
DC2
DC1
DATA FOR WRITE COMMANDS
DON’T CARE FOR READ COMMANDS
TE
DC0
06874-024
Refer to Table 2, Figure 2, and Figure 3 for detailed information
regarding timing and operation of the SPI port.
Figure 25. DIN Bit Sequence
CS
DATA FRAME
DATA FRAME
SCLK
W/R BIT
DOUT
ADDRESS
DON’T CARE
NEXT COMMAND
ZERO
BASED ON PREVIOUS COMMAND
16-BIT REGISTER CONTENTS
Figure 26. SPI Sequence for Read Commands
Rev. B | Page 13 of 24
06874-025
DIN
ADIS16350/ADIS16355
DATA OUTPUT REGISTER ACCESS
Table 6 provides the data configuration for each output data
register in the ADIS16350/ADIS16355. Starting with the MSB
of the upper byte, each output data register has the following bit
sequence: new data (ND) flag, error/alarm (EA) flag, followed
by 14 data bits. The data bits are LSB-justified and, in the case of
the 12-bit data formats, the remaining two bits (Bit 12 and Bit
13) are not used. The ND flag indicates that unread data resides
in the output data registers. This flag clears and returns to 0
during an output register read sequence. It returns to 1 after the
next internal sample update cycle completes. The EA flag indicates an error condition. The STATUS register contains all of
the error flags and provides the ability to investigate root cause.
Table 6. Output Data Register Information
Name
SUPPLY_OUT
XGYRO_OUT
YGYRO_OUT
ZGYRO_OUT
XACCL_OUT
YACCL_OUT
ZACCL_OUT
XTEMP_OUT
YTEMP_OUT
ZTEMP_OUT
AUX_ADC
1
Function
Power supply measurement
X-axis gyroscope output measurement
Y-axis gyroscope output measurement
Z-axis gyroscope output measurement
X-axis acceleration output measurement
Y-axis acceleration output measurement
Z-axis acceleration output measurement
X-axis gyroscope sensor temperature measurement
Y-axis gyroscope sensor temperature measurement
Z-axis gyroscope sensor temperature measurement
Auxiliary analog input data
OBS
Data Format
Binary
Twos complement
Twos complement
Twos complement
Twos complement
Twos complement
Twos complement
Twos complement
Twos complement
Twos complement
Binary
OLE
5 V = 2730 LSBs (nominal)
Assumes that the scaling is set to 300°/s.
3
Typical condition, 25°C = 0 LSB.
2
Data
Length
12 bits
14 bits
14 bits
14 bits
14 bits
14 bits
14 bits
12 bits
12 bits
12 bits
12 bits
Addresses
0x03, 0x02
0x05, 0x04
0x07, 0x06
0x09, 0x08
0x0B, 0x0A
0x0D, 0x0C
0x0F, 0x0E
0x11, 0x10
0x13, 0x12
0x15, 0x14
0x17, 0x16
Table 7. Output Coding Example, XGYRO_OUT, YGYRO_OUT, and ZGYRO_OUT 1, 2
±300°/s Range
80°/s
40°/s
0.07326°/s
0°/s
−0.07326°/s
−40°/s
−80°/s
1
2
Rate of Rotation
±150°/s Range
40°/s
20°/s
0.03663°/s
0°/s
−0.03663°/s
−20°/s
−40°/s
±75°/s Range
20°/s
10°/s
0.018315°/s
0°/s
−0.018315°/s
−10°/s
−20°/s
Binary Output
00 0100 0100 0100
00 0010 0010 0010
00 0000 0000 0001
00 0000 0000 0000
11 1111 1111 1111
11 1101 1101 1110
11 1011 1011 1100
Scale Factor
(per LSB)
1.8315 mV 1
0.07326°/s 2
0.07326°/s2
0.07326°/s2
2.522 mg
2.522 mg
2.522 mg
0.1453°C 3
0.1453°C3
0.1453°C3
0.6105 mV
TE
Hexadecimal Output
0x0444
0x0222
0x0001
0x0000
0x3FFF
0x3DDE
0x3BBC
Decimal
1092
546
1
0
−1
−546
−1092
The two most significant bits are not included.
Zero offset null performance is assumed.
Table 8. Output Coding Example, XACCL_OUT, YACCL_OUT, and ZACCL_OUT 1, 2
Acceleration (g)
2.522
1
0.002522
0
−0.002522
−1
−2.522
1
2
Binary Output
00 0011 1110 1000
00 0001 1000 1101
00 0000 0000 0001
00 0000 0000 0000
11 1111 1111 1111
11 1110 0111 0011
11 1100 0001 1000
Hexadecimal Output
0x03E8
0x018D
0x0001
0x0000
0x3FFF
0x3E73
0x3C18
The two most significant bits are not included.
Zero offset null performance is assumed.
Rev. B | Page 14 of 24
Decimal
1000
397
1
0
−1
−397
−1000
ADIS16350/ADIS16355
PROGRAMMING AND CONTROL
CONTROL REGISTER OVERVIEW
CONTROL REGISTER STRUCTURE
There are many programmable features that are controlled by
writing commands to the appropriate control registers using the
SPI. The following sections describe these controls and specify
each function, along with the corresponding register configuration.
The features available for configuration in this register space are:
The ADIS16350/ADIS16355 use a temporary, RAM-based
memory structure to facilitate the control registers listed
in Table 9. The operational configuration is stored in a flash
memory structure that automatically loads into the control
registers during the start-up sequence. Each nonvolatile register
has a corresponding flash memory location for storing the latest
configuration contents. The contents of each nonvolatile register must be stored to flash manually.
•
•
•
Calibration
Global commands
Operational control
•
Sample rate
•
Power management
•
Digital filtering
•
Dynamic range
•
DAC output
•
Digital input/output
Operational status and diagnostics
•
Self-test
•
Status conditions
•
Alarms
Note that the contents of these registers are nonvolatile after they
are stored to flash. The flash update command, available in the
COMMAND register, provides this function. The ENDURANCE
register provides a counter that allows for reliability management against the flash memory write cycle specification.
OBS
•
Table 9. Control Register Mapping
Register Name
ENDURANCE
Type
R
R
Volatility
Nonvolatile
Volatile
XGYRO_OFF
YGYRO_OFF
ZGYRO_OFF
XACCL_OFF
YACCL_OFF
ZACCL_OFF
ALM_MAG1
ALM_MAG2
ALM_SMPL1
ALM_SMPL2
ALM_CTRL
AUX_DAC
GPIO_CTRL
MSC_CTRL
SMPL_PRD
SENS/AVG
SLP_CNT
STATUS
COMMAND
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R
W
Nonvolatile
Nonvolatile
Nonvolatile
Nonvolatile
Nonvolatile
Nonvolatile
Nonvolatile
Nonvolatile
Nonvolatile
Nonvolatile
Nonvolatile
Volatile
Volatile
Nonvolatile 1
Nonvolatile
Nonvolatile
Volatile
Volatile
N/A
1
OLE
Addresses
0x00, 0x01
0x02 to 0x17
0x18, 0x19
0x1A, 0x1B
0x1C, 0x1D
0x1E, 0x1F
0x20, 0x21
0x22, 0x23
0x24, 0x25
0x26, 0x27
0x28, 0x29
0x2A, 0x2B
0x2C, 0x2D
0x2E, 0x2F
0x30, 0x31
0x32, 0x33
0x34, 0x35
0x36, 0x37
0x38, 0x39
0x3A, 0x3B
0x3C, 0x3D
0x3E, 0x3F
Bytes
2
22
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
Function
Flash memory write count
Output data
Reserved
X-axis gyroscope bias offset factor
Y-axis gyroscope bias offset factor
Z-axis gyroscope bias offset factor
X-axis acceleration bias offset factor
Y-axis acceleration bias offset factor
Z-axis acceleration bias offset factor
Alarm 1 amplitude threshold
Alarm 2 amplitude threshold
Alarm 1 sample size
Alarm 2 sample size
Alarm control
Auxiliary DAC data
Auxiliary digital input/output control
Miscellaneous control
Internal sample period (rate) control
Dynamic range/digital filter control
Sleep mode control
System status
System command
The contents of the lower byte are nonvolatile; the contents of the upper byte are volatile.
Rev. B | Page 15 of 24
Reference Tables
Table 29
Table 6
TE
Table 10, Table 11
Table 10, Table 11
Table 10, Table 11
Table 12, Table 13
Table 12, Table 13
Table 12, Table 13
Table 32, Table 33
Table 32, Table 33
Table 34, Table 35
Table 34, Table 35
Table 36, Table 37
Table 22, Table 23
Table 24, Table 25
Table 27, Table 28
Table 16, Table 17
Table 20, Table 21
Table 18, Table 19
Table 30, Table 31
Table 14, Table 15
ADIS16350/ADIS16355
CALIBRATION
Precision Automatic Bias Null Calibration
For applications that require point-of-use calibration, the bias
correction registers provide bias level control for all six sensors.
Table 10, Table 11, Table 12, and Table 13 provide the details
required for using these registers to calibrate the output bias for
each sensor.
Another option for gyroscope calibration, which typically provides
better accuracy, is with the single-command, precision autonull.
This incorporates the optimal averaging time for generating
bias correction factors for all three gyroscope sensors. This
command requires approximately 30 seconds to complete.
For optimal calibration accuracy, the device should be stable
(no motion) for this entire period. Once it has started, a reset
command is needed to stop it prematurely, if required. The
following sequence starts this calibration option (see Table 15):
Table 10. Gyroscope Bias Correction Registers
Register
XGYRO_OFF
YGYRO_OFF
ZGYRO_OFF
Addresses
0x1A, 0x1B
0x1C, 0x1D
0x1E, 0x1F
Common Parameters
Default value = 0x0000
Scale = 0.018315°/s per LSB
Twos complement, read/write
Write 0x10 to Address 0x3E
Restoring Factory Calibration
Table 11. Gyroscope Bias Correction Register Bits
Bits
[15:13]
[12:0]
The factory calibration can be restored by returning the contents of
each bias correction register to their default value of zero. This
command also flushes all of the data from the digital filter taps.
To accomplish this function for all six sensor signal paths (see
Table 15),
Description
Not used
Data bits, typical adjustment range = ±75°
OBS
Table 12. Accelerometer Bias Correction Registers
Register
XACCL_OFF
YACCL_OFF
ZACCL_OFF
Addresses
0x21, 0x20
0x23, 0x22
0x25, 0x24
Common Parameters
Default value = 0x0000
Scale = 2.522 mg per LSB
Twos complement, read/write
Table 13. Accelerometer Bias Correction Register Bits
Bits
[15:12]
[11:0]
Description
Not used
Data bits, typical adjustment range = ±5.16 g
Manual Bias Calibration
Linear Acceleration Bias Compensation (Gyroscopes)
OLE
The following command enables compensation for acceleration
influences on gyroscope bias behavior:
Set Bit 7 of Address 0x34 to 1 (see Table 28)
Linear Acceleration Origin Alignment
TE
The following command provides origin alignment for the
accelerometers to the point of percussion (see Figure 5), using
the MSC_CTRL register.
Because each offset bias register has read/write access, the bias
of each sensor is adjustable. For example, if an output offset of
0.18°/s is observed in the Z-axis gyroscope, the ZGYRO_OFF
register provides the calibration factor necessary to improve the
accuracy. Using its sensitivity of 0.018315°/s, an adjustment of
−10 LSBs is required. The twos complement, hexadecimal code
of −10 LSBs is 0x1FF6.
To implement this calibration factor, use the following pseudocode:
Write 0xF6 to Address 0x1E, then write 0x1F to
Address 0x1F
This step reduces the 0.18°/s error term to 0.00315°/s.
Automatic Bias Null Calibration
A single-command, automatic bias calibration measures all
three gyroscope output registers, then loads the three bias
correction registers with values that return their outputs to zero
(null). A single register write command starts this process (see
Table 15).
Write 0x01 to Address 0x3E
Write 0x02 to Address 0x3E
Set Bit 6 of Address 0x34 to 1 (see Table 28)
GLOBAL COMMANDS
Global commands provide single-write initiations for common
operations such as calibration, flash update, auxiliary DAC
latch, and software reset. Each global command has a unique
control bit assigned to it in the COMMAND register and is
initiated by writing 1 to its assigned bit.
The flash update command writes the contents of each nonvolatile register into flash memory for storage. This process
takes approximately 100 ms and requires the power supply
voltage to be within specification for the duration of the event.
Note that this operation also automatically follows the autonull,
precision autonull, and factory reset commands. After waiting
the appropriate time for the flash update to complete, verify
successful completion by reading the STATUS register (flash
update error = 0, if successful).
The DAC latch command loads the contents of AUX_DAC into
the DAC latches, which control the actual output level. This
overcomes the challenge of discontinuous outputs that would
otherwise be associated with two separate write cycles for upper
and lower bytes. Finally, the software reset command sends the
ADIS16350/ADIS16355 digital processor into a restart sequence,
effectively accomplishing the same tasks as the RST line.
Rev. B | Page 16 of 24
ADIS16350/ADIS16355
Table 14. COMMAND Register Definition
Address
0x3F, 0x3E
Default
N/A
Format
N/A
Access
Write only
Table 15. COMMAND Bit Descriptions
Bits
[15:8]
[7]
[6:5]
[4]
[3]
[2]
[1]
[0]
Description
Not used
Software reset command
Not used
Precision autonull command
Flash update command
Auxiliary DAC data latch
Factory calibration restore command
Autonull command
The sample rate setting also affects the power dissipation.
The normal mode power (SMPL_PRD > 0x09) dissipation is
approximately 67% less than the fast mode (SMPL_PRD ≤ 0x09)
power dissipation. The two different modes of operation offer a
system-level trade-off between performance (sample rate, serial
transfer rate) and power dissipation.
Power Management
In addition to offering two different performance modes for power
optimization, the SLP_CNT register provides a programmable
shutdown period. Writing the appropriate sleep time to the lower
byte of the SLP_CNT register shuts the device down for the
specified time. The following example illustrates this relationship:
Bits [7:0] = 00000110 = 6 codes = 3 seconds
OPERATIONAL CONTROL
Internal Sample Rate
OBS
The internal sample rate defines how often data output variables
are updated, independent of the rate at which they are read out on
the SPI port. The SMPL_PRD register controls the internal sample
rate and has two parts: a time base and a multiplier. The sample
period can be calculated using the following equation:
At the completion of the programmed duration, normal operation
resumes. If measurements are required before sleep period
completion or if it is necessary to end the indefinite shutdown,
the device can be awakened by pulling the CS line down to a 0
state, then returning it to a 1 state. Otherwise, the CS line must
be kept in a 1 (high) state to maintain sleep mode.
When writing a sleep time to the SLP_CNT register, the time
between the 16th SCLK edge and the CS rising edge must be less
than 10 μs in fast mode and less than 80 μs in normal mode.
OLE
TS = TB × (NS + 1)
where:
TS is the sample period.
TB is the time base.
NS is the multiplier.
Table 18. SLP_CNT Register Definition
Address
0x3B, 0x3A
1
The default value is the minimum register setting, 0x01, which
corresponds to the maximum sample rate of 819.2 samples per
second. The contents of this register are nonvolatile.
Table 16. SMPL_PRD Register Definition
Address
0x37, 0x36
Default
0x0001
Format
N/A
Access
R/W
Description
Not used
Time base, 0 = 0.61035 ms, 1 = 18.921 ms
Multiplier (add 1 before multiplying by the time base)
An example calculation of the sample period for the device is
If SMPL_PRD = 0x0007, Bits [7:0] = 00000111
Bit 7 = 0, so TB = 0.61035 ms
Default
0x0000
TE
Format
Binary
Access
R/W
Scale is the weight of each LSB in the lower byte of this register.
Table 19. SLP_CNT Bit Descriptions
Bits
[15:8]
[7:0]
Description
Not used
Data bits
Digital Filtering
Table 17. SMPL_PRD Bit Descriptions
Bits
[15:8]
[7]
[6:0]
Scale1
0.5 sec
The signal conditioning circuit of each sensor has an analog
bandwidth of approximately 350 Hz. A programmable-length
Bartlett Window FIR filter provides opportunity for additional
noise reduction on all of the output data registers. The
SENS/AVG register controls the number of taps in power-of-two
step sizes, from zero to six.
Filter setup requires one simple step: write the appropriate M
factor to the assigned bits in the SENS/AVG register. The bit
assignments are listed in Table 21. The frequency response
relationship for this filter is:
Bits [6:0] = 0000111 = 7 = NS
H B ( f ) = H A2 ( f ) H A ( f ) =
TS = TB × (NS + 1) = 0.61035 ms × (7 + 1) = 4.8828 ms
fS = 1∕TS = 204.8 SPS
The sample rate setting has a direct impact on the SPI data rate
capability. For SMPL_PRD settings ≤ 0x09 (fast mode), the SPI
SCLK can run at a rate up to 2.0 MHz. For SMPL_PRD settings >
0x09 (normal mode), the SPI SCLK can run at a rate up to 300 kHz.
Rev. B | Page 17 of 24
sin(π × N × f × t s )
N × sin(π × f × t s )
ADIS16350/ADIS16355
0
Table 22. AUX_DAC Register Definition
Address
0x31, 0x30
–20
Default
0x0000
Format
Binary
Access
R/W
–40
MAGNITUDE (dB)
Table 23. AUX_DAC Bit Descriptions
Bits
[15:12]
[11:0]
–60
–80
Updating the DAC output voltage requires four steps.
–100
N=2
N=4
N = 16
N = 64
–140
0.001
1.
0.01
0.1
1
06874-027
–120
FREQUENCY (f/fS)
Dynamic Range
4.
OBS
There are three dynamic range settings: ±75°/s, ±150°/s, and
±300°/s. The lower dynamic range settings (75, 150) limit the
minimum filter tap sizes to maintain the resolution as the measurement range decreases. The recommended order for programming
the SENS/AVG register is upper byte (sensitivity), followed by
lower byte (filtering). The contents of the SENS/AVG register
are nonvolatile.
Table 20. SENS/AVG Register Definition
Default
0x0402
Format
N/A
Table 21. SENS/AVG Bit Descriptions
Bits
[15:11]
[10:8]
Value
100
010
001
[7:3]
[2:0]
Access
R/W
2.
3.
Figure 27. Bartlett Window FIR Frequency Response
Address
0x39, 0x38
Description
Not used
Data bits; 0x0000 – 0 V output, 0x0FFF – 2.5 V output
Determine the binary number associated with the desired
output level.
Write the lower eight bits of this binary number to the
lower address of the AUX_DAC register.
Write the upper eight bits of this binary number to the
upper address of the AUX_DAC register.
Execute the DAC latch global command by writing 0x04 to
Address 0x3E (see Table 15).
General-Purpose Input/Output
Two general-purpose pins enable digital input/output control
using the SPI. The GPIO_CTRL control register establishes the
configuration of these pins and handles the SPI-to-pin controls.
Each pin provides the flexibility of both input (read) and output
(write) operations.
OLE
For example, writing 0x0202 to this register establishes Line 2 as
an output and sets its level as a 1. Writing 0x0000 to this register
establishes both lines as inputs, and their status can be read through
Bit 8 and Bit 9 of this register.
Description
Not used
Measurement range (sensitivity)
selection
300°/s (default condition)
150°/s, filter taps ≥ 4 (Bits [2:0] ≥ 0x02)
75°/s, filter taps ≥ 16 (Bits [2:0] ≥ 0x04)
Not used
Filter tap setting, number of taps,
N = 2M; for example, 011, N = 23 = 8 taps
TE
The digital input/output lines are also available for data-ready and
alarm/error indications. In the event of conflict, the following
priority structure governs the digital input/output configuration:
1.
2.
3.
MSC_CTRL (Data-ready indicator)
ALM_CTRL (Alarm indicator)
GPIO_CTRL (General-purpose)
Table 24. GPIO_CTRL Register Definition
Address
0x33, 0x32
Default
0x0000
Format
N/A
Auxiliary DAC
Table 25. GPIO_CTRL Bit Descriptions
The auxiliary DAC provides a 12-bit level adjustment function.
The AUX_DAC register controls the operation of this feature.
It offers a rail-to-rail buffered output that has a range of 0 V
to 2.5 V. The DAC can drive its output to within 5 mV of the
ground reference when it is not sinking current. As the output
approaches ground, the linearity begins to degrade (100 LSB
beginning point). As the sink current increases, the nonlinear
range increases. The DAC output latch function, contained in
the COMMAND register, provides continuous operation while
writing each byte of this register. The contents of this register
are volatile, which means that the desired output level must be
set after every reset and power cycle event.
Bits
[15:10]
[9]
[8]
[7:2]
[1]
[0]
Access
R/W
Description
Not used
General-purpose input/output Line 2 data level
1 = high, 0 = low
General-purpose input/output Line 1 data level
1 = high, 0 = low
Not used
General-purpose input/output Line 2, data direction
control
1 = output, 0 = input
General-purpose input/output Line 1, data direction
control
1 = output, 0 = input
The contents of the GPIO_CTRL register are volatile.
Rev. B | Page 18 of 24
ADIS16350/ADIS16355
STATUS AND DIAGNOSTICS
Self-Test
Table 26 summarizes a number of status and diagnostic
operations, along with their corresponding control registers.
The MSC_CTRL register also provides a self-test function that
verifies the mechanical integrity of the MEMS sensor. There are
two different self-test options: internal self-test and external
self-test.
Table 26. Status and Diagnostic Functions
Register
MSC_CTRL
STATUS
ENDURANCE
ALM_MAG1
ALM_MAG2
ALM_SMPL1
ALM_SMPL2
ALM_CTRL
Function
Data-ready input/output indicator; self-test,
mechanical check for sensor element
Status: Check for predefined error conditions
Flash memory endurance
Alarms: Configure and check for user-specific
conditions
The internal test provides a simple, two-step process for
checking the MEMS sensor.
1.
2.
If a failure is indicated, then Bits [10:15] of the STATUS register
indicate which of the six sensors it is associated with.
Data-Ready Input/Output Indicator
The data-ready function provides an indication of updated output
data. The MSC_CTRL register allows the user to configure either
of the general-purpose input/output pins (DIO1 or DIO2) as a
data-ready indicator signal.
OBS
Table 27. MSC_CTRL Register Definition
Address
0x35, 0x34
Default
0x0000
Format
N/A
Table 28. MSC_CTRL Bit Descriptions
Bits
[15:11]
[10]
[9]
[8]
[7]
[6]
[5:3]
[2]
[1]
[0]
Start the process by writing 1 to Bit 10 in the MSC_CTRL
register.
Wait long enough for the response to settle, then check the
result by reading Bit 5 of the STATUS register.
The entire cycle takes approximately 35 ms, and the output data
is not available during this time. The external self-test is a static
condition that can be enabled and disabled. In this test, both
positive and negative gyroscope MEMS sensor movements are
available. For the accelerometers, only positive MEMS sensor
movement is available.
OLE
Access
R/W
Description
Not used
Internal self-test enable (clears on completion)
1 = enabled, 0 = disabled
Manual self-test, negative stimulus
1 = enabled, 0 = disabled
Manual self-test, positive stimulus
1 = enabled, 0 = disabled
Linear acceleration bias compensation for gyroscopes
1 = enabled, 0 = disabled
Linear accelerometer origin alignment
1 = enabled, 0 = disabled
Not used
Data-ready enable
1 = enabled, 0 = disabled
Data-ready polarity
1 = active high, 0 = active low
Data-ready line select
1 = DIO2, 0 = DIO1
After writing to the appropriate control bit, the output registers
reflect the changes after a delay that reflects the response time
associated with the sensor/signal conditioning circuit. For
example, the standard 350 Hz bandwidth reflects an exponential
response with a time constant of 0.45 ms. Note that the digital
filtering affects this delay as well. The appropriate bit definitions
for self-test are listed in Table 27 and Table 28.
Flash Memory Endurance
TE
The ENDURANCE register maintains a running count of writes
to the flash memory. It provides up to 32,768 counts. Note that
if this count is exceeded, the register wraps around and goes
back to zero, before beginning to increment again.
Table 29. ENDURANCE Register Definition
Address
0x01, 0x00
Rev. B | Page 19 of 24
Default
N/A
Format
Binary
Access
Read only
ADIS16350/ADIS16355
Status Conditions
Alarms
The STATUS register contains the following error condition flags:
alarm conditions, self-test status, overrange, SPI communication
failure, control register update failure, and power supply range
failure. See Table 30 and Table 31 for the appropriate register
access and bit assignment for each flag.
Two independent alarms provide programmable condition
monitoring. Event detections occur when output register data
meets the configured conditions. Configuration options include the
following:
The bits assigned for checking power supply range and sensor
overrange automatically reset to 0 when the error condition
no longer exists. The remaining error flag bits in the STATUS
register require a read to return them to 0. Note that a STATUS
register read clears all of the bits to 0. If any error conditions
remain, the bits revert to 1 during the next internal output
register update cycle.
Table 30. STATUS Register Definition
Address
0x3D, 0x3C
Default
0x0000
Format
N/A
Access
Read only
OBS
Table 31. STATUS Bit Descriptions
Bits
[15]
[14]
[13]
[12]
[11]
[10]
[9]
[8]
[7:6]
[5]
[4]
[3]
[2]
[1]
[0]
Description
Z-axis accelerometer self-diagnostic error flag
1 = failure, 0 = passing
Y-axis accelerometer self-diagnostic error flag
1 = failure, 0 = passing
X-axis accelerometer self-diagnostic error flag
1 = failure, 0 = passing
Z-axis gyroscope self-diagnostic error flag
1 = failure, 0 = passing
Y-axis gyroscope self-diagnostic error flag
1 = failure, 0 = passing
X-axis gyroscope self-diagnostic error flag
1 = failure, 0 = passing
Alarm 2 status
1 = active, 0 = inactive
Alarm 1 status
1 = active, 0 = inactive
Not used
Self-test diagnostic error flag
1 = error condition, 0 = normal operation
Sensor over range (any of the six)
1 = error condition, 0 = normal operation
SPI communications failure
1 = error condition, 0 = normal operation
Control register update failed
1 = error condition, 0 = normal operation
Power supply in range above 5.25 V
1 = above 5.25 V, 0 = below 5.25 V (normal)
Power supply below 4.75 V
1 = below 4.75 V, 0 = above 4.75 V (normal)
•
•
•
•
•
All output data registers are available for monitoring as the
source data.
The source data can be filtered or unfiltered.
Comparisons can be static or dynamic (rate of change).
The threshold levels and times are configurable.
Comparison can be greater than or less than.
The ALM_MAG1 register and the ALM_MAG2 register both
establish the threshold level for detecting events. These registers
take on the format of the source data and provide a bit for
establishing the greater than/less than comparison direction.
When making dynamic comparisons, the ALM_SMPL1 register
and the ALM_SMPL2 register establish the number of averages
taken for the source data as a reference for comparison. In this
configuration, each subsequent source data sample is subtracted
from the previous one, establishing an instantaneous delta. The
ALM_CTRL register controls the source data selection, static/
dynamic selection, filtering selection, and digital input/output
usage for the alarms.
OLE
The rate of change calculation is
YC =
1
N DS
N DS
∑ y(n + 1) −y(n)
n =1
TE
The rate of change alarm is determined by comparing
YC with MC according to the ALM_MAG1 /ALM_MAG2 settings
where:
NDS is the number of samples in ALM_SMPL1 and
ALM_SMPL2.
y(n) is the sampled output data.
MC is the magnitude for comparison in ALM_MAG1 and
ALM_MAG2.
YC is the factor to compare with MC.
Rev. B | Page 20 of 24
ADIS16350/ADIS16355
Table 32. ALM_MAG1 and ALM_MAG2 Register Definitions
Table 36. ALM_CTRL Register Definition
Register
ALM_MAG1
ALM_MAG2
Addresses
0x2F, 0x2E
Addresses
0x27, 0x26
0x29, 0x28
Default
0x0000
0x0000
Format
N/A
N/A
Access
R/W
R/W
Default
0x0000
Format
N/A
Access
R/W
Table 37. ALM_CTRL Bit Designations
Table 33. ALM_MAG1 and ALM_MAG2 Bit Descriptions
Bits
[15]
[14]
[13:0]
Description
Comparison polarity: 1 = greater than, 0 = less than
Not used
Data bits, format matches source data format
Bits
[15:12]
0000
0001
0010
0011
0100
0101
0110
0111
1000
1001
1010
1011
Table 34. ALM_SMPL1 and ALM_SIMPL2 Register Definitions
Registers
ALM_SMPL1
ALM_SMPL2
Addresses
0x2B, 0x2A
0x2D, 0x2C
Default
0x0000
0x0000
Format
Binary
Binary
OBS
Access
R/W
R/W
Table 35. ALM_SMPL1 and ALM_SIMPL2 Bit Descriptions
Bit
[15:8]
[7:0]
Description
Not used
Data bits
Value
[11:8]
[7]
Description
Alarm 2 source selection
Disable
Power supply output
X-axis gyroscope output
Y-axis gyroscope output
Z-axis gyroscope output
X-axis accelerometer output
Y-axis accelerometer output
Z-axis accelerometer output
X-axis gyroscope temperature output
Y-axis gyroscope temperature output
Z-axis gyroscope temperature output
Auxiliary ADC input
Alarm 1 source selection (same as Alarm 2)
Rate of change (ROC) enable for Alarm 2
1 = rate of change, 0 = static level
Rate of change (ROC) enable for Alarm 1
1 = rate of change, 0 = static level
Not used
Comparison data filter setting
1 = filtered data, 0 = unfiltered data
Not used
Alarm output enable
1 = enabled, 0 = disabled
Alarm output polarity
1 = active high, 0 = active low
Alarm output line select
1 = DIO2, 0 = DIO1
OLE
[6]
[5]
[4]
[3]
[2]
[1]
[0]
Rev. B | Page 21 of 24
TE
ADIS16350/ADIS16355
APPLICATIONS INFORMATION
INSTALLATION GUIDELINES
Electrical Connections
Installation requires two steps: mechanical attachment of the body,
followed by the electrical connection. This device is designed
for postsolder reflow installation. It is not designed to survive
the temperatures associated with normal solder reflow processes.
The electrical interface is a single connector that is attached to a
flexible circuit extension.
Mechanical Attachment
The open mounting tabs on each side of the body provide
enough room for 2 mm (or 2-56) machine screws. Note that
316 stainless steel and aluminum screws are available for use in
this attachment.
When planning the installation process, the primary trade-off
to consider is the attachment strength advantage of stainless
steel against the nonmagnetic properties of aluminum for systems
that are sensitive to magnetic field disturbances.
OBS
Figure 28 provides a graphical display of the mechanical
attachment, and Figure 29 provides a recommendation for the
physical layout of all the holes required for attaching these
devices.
One option for mating connectors can be found in the Samtec
CLM family. In this case, the part number starts with CLM-112-02.
The flexible circuit has stress relief points to absorb environmental
stresses, such as temperature cycling and vibration. Figure 29
provides the alignment hole locations for designs that employ the
suggested connector mate. The dimensions offered in Figure 29
assume that the device and the mating connector are on the
same surface. The electrical connection is held by friction only.
Proper Removal
The flexible circuit interface can tear under excessive force
conditions. An example of excessive force is attempting to
break the electrical connection by pulling on the body of the
device, placing all of the stress on the flexible circuit.
The electrical connector must be broken by an appropriate tool,
which is designed to apply even pressure to each side of the
rigid part of the flex cable. The recommended extraction
sequence is to break the mate between the electrical interface,
and then to remove the mechanical attachment hardware.
OLE
TE
1.588mm HOLE AND SLOT
FOR ALIGNMENT PINS, 2 EACH
06874-028
DRILL AND TAP HOLE
FOR 2mm (2-56) SCREW,
2 EACH
Figure 28. Mechanical Attachment
Rev. B | Page 22 of 24
ADIS16350/ADIS16355
DRILL AND INSERT
1.5mm PIN 2×
(HOLE PLACEMENT
INACCURACY MAY
REQUIRE USE OF
UNDERSIZED PIN).
26.700
BSC
DRILL AND TAP FOR
M2 SCREW
AS REQUIRED
2×.
4
BSC
27.700
BSC
10
HOLE 2×.
SEE SAMTEC MOUNTING
DRAWING FOR CLM SERIES SOCKET.
8.350
OBS
0.500 BSC
2×
4
BSC
THE LOCATION OF THE MATING CONNECTOR
RELATIVE TO THE ALIGNMENT PINS MAY BE
PLACED ±0.75mm FROM THIS DIMENSION AS
DESIRED. PLACING THIS FURTHER OUT WILL
HAVE LESS BEND/STRESS RELIEF IN THE FLEX.
OLE
06874-029
16.810
2×
Figure 29. Hole Locations
TE
Rev. B | Page 23 of 24
ADIS16350/ADIS16355
OUTLINE DIMENSIONS
31.900
31.700
31.500
9.464
9.210
8.956
(2×)
2.382
BSC
17.41
17.21
17.01
(2×)
1.588
BSC
TOP VIEW
22.964
22.710
22.456
1.588
BSC
14.950
14.550
14.150
PIN 24
10.50
BSC
23.504
23.250
22.996
2.660
2.500
2.340
7.18
BSC
1.00
BSC
0.05
BSC
PIN 1
FRONT VIEW
21.410
21.210
21.010
BOTTOM VIEW
5.20
5.00
4.80
(2×)
OBS
10.60
BSC
4.20
4.00
3.80
(2×)
2.00 BSC
12.10
BSC
OLE
SIDE VIEW
DETAIL A
4.330
BSC
DETAIL A
0.305
BSC (24×)
4.162 BSC
1.00
BSC (22×)
1.65 BSC
TE
011108-C
23.454
23.200
22.946
14.00 BSC
Figure 30. 24-Lead Module with Connector Interface
(ML-24-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model
ADIS16350AMLZ 1
ADIS16350/PCBZ1
ADIS16355AMLZ1
ADIS16355/PCBZ1
1
Temperature Range
−40°C to +85°C
−40°C to +85°C
Package Description
24-Lead Module with Connector Interface
Interface Board
24-Lead Module with Connector Interface
Interface Board
Z = RoHS Compliant Part.
©2007–2009 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D06874-0-9/09(B)
Rev. B | Page 24 of 24
Package Option
ML-24-2
ML-24-2