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Remote Controller of Air Conditioner Using MSP430
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System Description
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System Description
This board demonstrates an ultra-low power, general purpose, infrared remote controller solution. The
board uses a FRAM-based MCU MSP430FR4133, which supports features such as real time clock, button
scan, infrared encoding, LED backlight, and LCD display.
1.1
MSP430FR4133
The MSP430FR4133 is a FRAM-based ultra-low power mixed signal MCU. With the following features, the
MSP430FR4133 is highly suitable for portable device applications.
• 16-bit RISC architecture up to 16 Mhz
• Wide supply voltage range from 1.8 V to 3.6 V
• 64-Pin/56-Pin/48Pin TSSOP/LQFP package options
• Integrated LCD driver with charge pump can support up to 4x36 or 8x32 segment LCD
• Optimized 16-bit timer for infrared signal generation
• Low power mode (LPM3.5) with RTC on:0.77 uA
• Low power mode (LPM3.5) with LCD on: 0.936 uA
• Active mode: 126 uA/MHz
• 10^15 write cycle endurance low power ferroelectric RAM (FRAM) can be used to store data
• 10-channel, 10-bit analog-to-digital converter (ADC) with built-in 1.5 V reference for battery powered
system
• All I/Os are capacitive touch I/O
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Circuit Design
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Circuit Design
The highly-integrated mixed signal processer MSP430FR4133 has a small amount of components
necessary to realize a fully-functional air conditioner remote controller.
Refer to Figure 1 for the design block diagram.
Figure 1. Remote Controller Block Diagram
A 4x28 segment LCD is directly connected to the MSP430FR4133 LCD driver pins. Designers can swap
the COM and SEG pins to simplify the PCB layout.
A 4x4 matrix is used to detect 15 buttons. The matrix columns are connected to interrupt-enabled GPIOs
(P1) to wake up the MSP430FR4133 from low power mode. MCU internal pull up/pull down resistors are
used as button scan matrix pull up resistors. No external resistor is needed for button detection, and no
external circuit is needed for battery voltage detection. The function is also realized by the MCU ADC
module without any external component.
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Circuit Design
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A 32.768 KHz watch crystal serves as the MCU FLL and RTC clock source. Two chip capacitors, C4 and
C6, are used as the crystal loading capacitor. Designers must choose C4 and C6 values carefully
according to crystal specification. Cautious PCB layout design for the crystal is strongly recommended, to
secure system clock robustness. Figure 2 illustrates an example of the crystal PCB design.
Figure 2. Crystal PCB Layout
Refer to SLAA322B-MSP430 32-kHz Crystal Oscillators for detailed design considerations.
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Software Description
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Software Description
The software implements an interrupt-driven structure. In the main loop, the MCU stays in LPM3.5 mode.
Interrupts from the button, RTC, and timer wake up the MCU for task processing. Inputs from the button
are processed in task KeyProcess (), which handles system status and generates the content for the LCD
display and infrared signal. RTC generates a 3S interval interrupt to inform the system of battery voltage
measurement.
Figure 3. Software Structure
3.1
Infrared Signal Generation
There are several kinds of infrared modulation protocols in the industry. This design illustrates pulse
distance protocol with data frame format, the most commonly-used format for air conditioner remote
controllers. As shown in Figure 4, each bit is composed of a carrier-modulated pulse and a space. The
space’s width distinguishes logic 1 and logic 0 respectively. The carrier-modulated pulse width is constant.
In this design, space length for 1 is 1690 uS, and 560 uS for digit 0. Modulated pulse width is 560 uS.
Figure 4. Pulse Distance Protocol, Bit Encoding
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Software Description
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A complete data frame format is shown in Figure 5.
Figure 5. Pulse Distance Protocol, Data Frame Format
The envelope waveform depends on the frame format. Quantize all of the above items with a minimum
time slot of 0.56 ms, as shown in Table 1.
Table 1. Table 1. Pulse Distance Protocol, Data Encoding Quantization Table
Leading Code
Logic ‘1’
Logic ‘0'
Tail Code
Items
Carrier
Modulated
Pulse
Space
Carrier
Modulated
Pulse
Space
Carrier
Modulated
Pulse
Space
Carrier
Modulated
Pulse
Space
Length
9 ms
4.5 ms
0.56 ms
1.69 ms
0.56 ms
0.56 ms
0.56 ms
0 ms
Quantizatio
n
16
8
1
3
1
1
1
0
TA1 is used to generate an envelope waveform, and each pair of carrier-modulated pulse and space must
update the CCR0 and CCR2 once. The CCR0 depends on the carrier-modulated pulse period plus the
space period, while the CCR2 depends on the carrier-modulated pulse period. For instance, if TA1
sources from SMCLK of 4 MHz and uses default divider configuration, CCR0 and CCR2 are individually
configured as 54,000 and 36,000, to generate the leading code (9 ms carrier modulated pulse paired with
4.5 ms space), and updated to 9,000 and 2,240 for logic 1 (see Figure 6). To send one full data frame,
CCR0 and CCR2 must be updated 34 (1+8*2+8*2+1) times, which is achieved in the TA1 interrupt
routine.
Figure 6. Pulse Distance Protocol, TA1 in Envelope Generation
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Test Setup and Results
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To generate 38 kHz carrier with ¼ duty, CCR0 and CCR2 of TA0 are configured according to SMCLK. For
example, with a 4 MHz SMCLK, CCR0 and CCR2 are individually configured to be 105 (4,000/38) and 26
(4,000/38/4). Figure 7 shows how the duty setting works.
Figure 7. Pulse Distance Protocol, TA0 in Carrier Generation
4
Test Setup and Results
4.1
Power and Infrared Code Test
2 AAA batteries power the board. By pressing the button pads with conductors, the user can observe the
contents on the LCD. Typical air-conditioner working modes and parameters can be configured. A microampere meter is inserted in the power path to monitor the board power consumption as shown in Figure 8.
Table 2 shows the sample board test results. To observe the infrared signal, use P1.0 with an
oscilloscope. Figure 9 shows the infrared driving signal, typically 38 KHz PWM carriers, 30% duty.
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Test Setup and Results
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Figure 8. Current Test Setup
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Test Setup and Results
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Figure 9. Infra Transmitter Driving Signal from MCU
Table 2. Power Consumption Test Result (VCC = 3.0 V with RTC ON and LCD ON, LPM3.5)
Board NO#
Vcc(V)
Low Power Mode with RTC and LCD ON
Standby Current (uA)
1#
3.0
LPM3.5
2.6
2#
3.0
LPM3.5
3.4
3#
3.0
LPM3.5
3.6
4#
3.0
LPM3.5
2.8
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Test Setup and Results
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Oscillation Frequency, Peak-Peak Voltage and Allowance Test
The ultra-low power 32.768 KHz crystal is the MCU RTC clock source and FLL reference clock source. It
is essential to secure the robustness from noises. According to SLAA322B-MSP430 32-kHz Crystal
Oscillators, the user can test the oscillation frequency and allowance to calculate the SF (Safety Factor),
and evaluate system clock robustness. As described in SLAA322B, the SF should be greater than 3.
To perform the oscillation frequency test, download FR4133CrystalTest.c to the board. Then observe the
MCLK frequency on P1.4, which indicates crystal oscillation frequency.
For an oscillation peak-peak voltage test, observe the signal on XOUT with a low capacitor (<2 pF) probe.
For an oscillation allowance test, add a resistor (Rq) in series with the crystal, as shown in Figure 10.
Figure 10. Oscillation Allowance Test with Added Resister Rq
Table 3 shows the test results of sample boards with different value Rq.
Table 3. Oscillation Test with VCC = 3.0 V, Temperature = 25℃
℃，Crystal ESR = 35 KOhm
Board
Rq = 0Ohm
Rq=100KOhm
Rq=200KOhm
SF
Freq.(Khz)
Vp-p(mV)
Freq.(Khz)
Vp-p(mV)
Freq.(Khz)
Vp-p(mV)
1#
32.769
512
32.770
616
32.770
560
>6.7
2#
32.769
504
32.770
624
32.770
568
>6.7
3#
32.770
448
32.770
536
32.771
488
>6.7
4#
32.769
488
32.770
560
32.770
520
>6.7
5#
32.770
512
32.770
600
32.771
584
>6.7
6#
32.769
472
32.770
568
32.771
528
>6.7
7#
32.770
630
32.768
608
32.769
520
>6.7
8#
32.767
480
32.770
576
32.770
536
>6.7
As shown in Table 3, even with a 200 KOhm resistor added in series with the crystal, the crystal works
normally, which indicates the SF is greater than 6.7.
10
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Design Files
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5
Design Files
5.1
Schematics
To download the schematic, see the design files at http://www.ti.com/tool/TIDU513
1
2
3
4
U1
C3
104 104 104
C4
200
R1
none
GND
1M
R2
0R
C6
200
GND
B
C5
104
32768
C7
104
C8
106
R3
47K
C9
105
P1
4
3
2
1
GND
DVCC
RST
TEST
R4
2K
JTAG-SBW
C16
101
L8
L9
L10
L11
L12
L13
L14
L15
L16
L17
L18
L19
L20
L21
L24
L25
L26
L27
L28
L29
L30
L31
KEYOUT1
KEYOUT2
KEYOUT3
KEYOUT4
J1
L0
L1
L2
L3
L4
L5
L8
L9
L10
L11
COM1 L12
COM2 L13
COM3 L14
COM4 L15
15
16
17
18
19
20
21
22
23
24
25
26
27
28
A
L16
L17
L18
L19
L20
L21
L24
L25
L26
L27
L28
L29
L30
L31
14
13
12
11
10
9
8
7
6
5
4
3
2
1
Header14*2
B
DVCC
R5
0R
C12
C10 C11
104 104 4.7uF
3V
2
GND
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
1
C1 C2
P7.5/L5
P3.0/L8
P7.4/L4
P3.1/L9
P7.3/L3
P3.2/L10
P7.2/L2
P3.3/L11
P7.1/L1
P3.4/L12
P7.0/L0
P3.5/L13
P4.7/R13
P3.6/L14
P4.6/R23
P3.7/L15
P4.5/R33
P6.0/L16
P4.4/LCDC2
P6.1/L17
P4.3/LCDC1
P6.2/L18
P4.2/XOUT
P6.3/L19
P4.1/XIN
P6.4/L20
DVSS
P6.5/L21
MSP430FR4133
DVCC
P2.0/L24
RST/NMI/SBWTDIO
P2.1/L25
TEST/SBWTCK
P2.2/L26
P4.0/TA1.1
P2.3/L27
P8.3/TA1.2
P2.4/L28
P8.2/TA1CLK
P2.5/L29
P1.7/TA0.1/TDO/A7
P2.6/L30
P1.6/TA0.2/TDI/TCLK/A6
P2.7/L31
P1.5/TA0CLK/TMS/A5
P5.0/UCB0STE/L32
P1.4/MCLK/TCK/A4
P5.1/UCB0CLK/L33
P1.3/UCA0STE/A3 P5.2/UCB0SIMO/UCB0SDA/L34
P1.2/UCA0CLK/A2
P5.3/UCB0SOMI/UCB0SCL/L35
P1.1/UCA0RXD/UCA0SOMI/A1/Veref+
P5.4/L36
P1.0/UCA0TXD/UCA0SIMO/A0/Veref–
P5.5/L37
| +
A
GND
1
2
3
4
5
6
7
8
9
10
11
12
XOUT
13
XIN
14
GND
15
DVCC
16
RST
17
TEST
18
19
20
21
KEYSHIFT 22
23
KEYIN1
BACKLI GHT 24
25
KEYIN2
26
KEYIN3
27
KEYIN4
SEND
28
L5
L4
L3
L2
L1
L0
VCC
R6
0R
U2 C13
C14 C15
100uF
Battery
106 104
GND
VCC
KEYIN4
KEYIN3
KEYIN2
COLD/BLOW.HEAT
SLEEP/SWINGLR
C
1
2
1
Button-2p
TIMER/SWINGUD
1
KEYSHIFT
2
1
2
Button-2p
GND
TEMP.DIS
1
Button-2p
SILENT
2
Button-2p
1
1
TURBO
2
Button-2p
1
ON/OFF
1
2
Button-2p
2
BACKLI GHT
R7
2R2
HEAT/HEALTH.AIR
1
Button-2p
1
Button-2p
SHIFT
2
VCC
SEND
KEYIN1
Button-2p
2
1
SAVE
2
Button-2p
2
1
LIGHT
2
Button-2p
MODE
1
2
Button-2p
1
FAN
2
Button-2p
Button-2p
+
Button-2p
R9
220R
KEYOUT1
LED2
Backlight
R8
300R
2
LED1
Infrared Radiation
Q2
KEYOUT2
R10
10R
R11
100K
KEYOUT3
KEYOUT4
GND
GND
Title
D
C
Q1
Size
D
Number
Revision
A
Date:
File:
1
2
3
2014-9-11
Sheet of
Z:\Share_F
older\..\RemoteControlerB.SchDoc
Drawn By:
4
Figure 11. Schematic
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Design Files
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Bill of Materials
To download the bill of materials (BOM), see the design files at http://www.ti.com/tool/TIDU513.
Table 4. BOM
Designator
12
Description
Quantity
+, -, COLD/BLOW.HEAT, FAN, HEAT/HEALTH.AIR,
LIGHT, MODE, ON/OFF, SAVE, SILENT,
SLEEP/SWINGLR, TEMP.DIS, TIMER/SWINGUD,
TURBO
Buttons
14
C1, C2, C3, C5
0805, Chip Capacitor, X7R,16 V, +-10%
4
C4, C6
0805, Chip Capacitor Chip Capacitor 200 X7R,16 V, +10%
2
C7, C10, C11, C14
0805, Chip Capacitor 104 X7R, 16 V, +-10%
4
C8, C16
0805, Chip Capacitor 106 X7R,16 V, +-10%
1
C9
0805, Chip Capacitor 105 X7R,16 V, +-10%
1
C12
0805, Chip Capacitor Cap Pol1 X7R,16 V, +-10%
1
C13
0805, Chip Capacitor Cap Pol1 X7R,16 V, +-10%
1
C15
0805, Chip Capacitor 102 X7R,16 V, +-10%
1
Crystal
32.768 Khz crystal
1
J1
Header14*2
1
LED1
Infrared Radiation transmitter
1
LED2
Backlight LED
1
P1
JTAG-SBW
1
Q1, Q2
Transistor
2
R1, R2, R3, R4, R5, R6, R8, R9, R10, R11
0805 Chip Resistor
10
R7
0805 Chip Resistor
1
SHIFT
Button
1
U1
MSP430F4133
1
U2
Battery
1
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5.3
PCB Layout
To download the layer plots, see the design files at http://www.ti.com/tool/TIDU513.
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Design Files
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Figure 12. PCB Layer 1
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Figure 13. PCB Layer 2
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Design Files
5.4
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Gerber Files
To download the Gerber files, see the design files at http://www.ti.com/tool/TIDU513.
6
Software Files
To download the software files, see the design files at http://www.ti.com/tool/TIDU513
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About the Author
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7
About the Author
JASON GUO is a system application engineer at Texas Instruments, where he is responsible for
developing reference design solutions for the industrial segment. Jason earned his Engineering Master of
Integrated Circuits Design from Peking University, and Bachelor of Electronic Engineering from Shanghai
Jiaotong University.
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