THS3001-DIE www.ti.com SLOS812 – AUGUST 2012 420-MHz HIGH-SPEED CURRENT-FEEDBACK AMPLIFIER Check for Samples: THS3001-DIE FEATURES 1 • • • • • • High Speed: – 40-ns Settling Time (0.1%) High Output Drive Excellent Video Performance Low Input Offset Voltage Very Low Distortion Wide Range of Power Supplies • Evaluation Module Available APPLICATIONS • • • Communication Imaging High-Quality Video DESCRIPTION The THS3001 is a high-speed current-feedback operational amplifier, ideal for communication, imaging, and high-quality video applications. This device offers a very fast slew rate, bandwidth, and settling time for largesignal applications requiring excellent transient response. In addition, the THS3001 operates with a very low distortion, making it well suited for applications such as wireless communication basestations or ultrafast ADC or DAC buffers. ORDERING INFORMATION (1) (1) (2) PRODUCT PACKAGE DESIGNATOR PACKAGE THS3001 TD Bare Die In Waffle Pack (2) ORDERABLE PART NUMBER PACKAGE QUANTITY THS3001TDA1 360 THS3001TDA2 10 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2012, Texas Instruments Incorporated THS3001-DIE SLOS812 – AUGUST 2012 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. BARE DIE INFORMATION DIE THICKNESS BACKSIDE FINISH BACKSIDE POTENTIAL BOND PAD METALLIZATION COMPOSITION BOND PAD THICKNESS 10.5 mils. Silicon with backgrind Floating TiW/AlSi(1%)Cu(0.5%) 1820 nm Table 1. Bond Pad Coordinates in Microns 2 DESCRIPTION PAD NUMBER X MIN Y MIN X MAX Y MAX IN- 1 128.4 587 230 688.6 IN+ 2 128.4 327.4 230 429 VCC- 3 209.25 94.9 310.85 196.5 OUT 4 956.2 385.85 1057.8 487.45 VCC+ 5 1022.7 692.5 1124.3 794.1 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: THS3001-DIE PACKAGE OPTION ADDENDUM www.ti.com 21-Aug-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) THS3001TDA1 ACTIVE 0 360 TBD Call TI N / A for Pkg Type THS3001TDA2 ACTIVE 0 10 TBD Call TI N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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