TI THS3001-DIE

THS3001-DIE
www.ti.com
SLOS812 – AUGUST 2012
420-MHz HIGH-SPEED CURRENT-FEEDBACK AMPLIFIER
Check for Samples: THS3001-DIE
FEATURES
1
•
•
•
•
•
•
High Speed:
– 40-ns Settling Time (0.1%)
High Output Drive
Excellent Video Performance
Low Input Offset Voltage
Very Low Distortion
Wide Range of Power Supplies
•
Evaluation Module Available
APPLICATIONS
•
•
•
Communication
Imaging
High-Quality Video
DESCRIPTION
The THS3001 is a high-speed current-feedback operational amplifier, ideal for communication, imaging, and
high-quality video applications. This device offers a very fast slew rate, bandwidth, and settling time for largesignal applications requiring excellent transient response. In addition, the THS3001 operates with a very low
distortion, making it well suited for applications such as wireless communication basestations or ultrafast ADC or
DAC buffers.
ORDERING INFORMATION (1)
(1)
(2)
PRODUCT
PACKAGE
DESIGNATOR
PACKAGE
THS3001
TD
Bare Die In Waffle Pack (2)
ORDERABLE PART NUMBER
PACKAGE QUANTITY
THS3001TDA1
360
THS3001TDA2
10
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality
Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room
temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not
warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012, Texas Instruments Incorporated
THS3001-DIE
SLOS812 – AUGUST 2012
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
BARE DIE INFORMATION
DIE THICKNESS
BACKSIDE FINISH
BACKSIDE
POTENTIAL
BOND PAD
METALLIZATION COMPOSITION
BOND PAD
THICKNESS
10.5 mils.
Silicon with backgrind
Floating
TiW/AlSi(1%)Cu(0.5%)
1820 nm
Table 1. Bond Pad Coordinates in Microns
2
DESCRIPTION
PAD NUMBER
X MIN
Y MIN
X MAX
Y MAX
IN-
1
128.4
587
230
688.6
IN+
2
128.4
327.4
230
429
VCC-
3
209.25
94.9
310.85
196.5
OUT
4
956.2
385.85
1057.8
487.45
VCC+
5
1022.7
692.5
1124.3
794.1
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Links: THS3001-DIE
PACKAGE OPTION ADDENDUM
www.ti.com
21-Aug-2012
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
THS3001TDA1
ACTIVE
0
360
TBD
Call TI
N / A for Pkg Type
THS3001TDA2
ACTIVE
0
10
TBD
Call TI
N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
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