BAT54S2

CYStech Electronics Corp.
Spec. No. : C302S
Issued Date : 2004.11.26
Revised Date : 2015.01.07
Page No. : 1/6
Small Signal Schottky diode
BAT54S2
Features
•Guard ring protected
•Low forward voltage drop
•Very small plastic SMD package
•Pb-free lead plating and halogen-free package
Applications
•Ultra high-speed switching
•Voltage clamping
•Protection circuits
•Blocking diodes
Symbol
Outline
BAT54S2
SOD-323
Ordering Information
Device
BAT54S2-0-T1-G
Package
SOD-323
(Pb-free lead plating and halogen-free package)
Shipping
3000 pcs / tape & reel
Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and
green compound products
Packing spec, T1 : 3000 pcs / tape & reel, 7” reel
Product rank, zero for no rank products
Product name
BAT54S2
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C302S
Issued Date : 2004.11.26
Revised Date : 2015.01.07
Page No. : 2/6
Absolute Maximum Ratings
Symbol
VR
IF
IFRM
IFSM
Ptot
Tstg
Tj
Tamb
Parameter
continuous reverse voltage
continuous forward current
repetitive peak forward current
non-repetitive peak forward current
total power dissipation
storage temperature
operating junction temperature
operating ambient temperature
Conditions
tp≤1s, δ≤0.5
tp<10ms
Tamb≤25℃
Min
-65
-65
-65
Max
30
200
300
600
200
+150
+150
+125
Unit
V
mA
mA
mA
mW
℃
℃
℃
Characteristics (Ta=25°C, unless otherwise specified)
Parameter
Reverse Breakdown Voltage
Forward Voltage (Note 1)
Symbol
Condition
Min.
Max.
Unit
VBR
IR=100μA
30
-
V
VF(1)
IF=0.1mA
-
240
mV
VF(2)
IF=1mA
-
320
mV
VF(3)
IF=10mA
-
400
mV
VF(4)
IF=30mA
-
500
mV
VF(5)
IF=100mA
-
800
mV
Reverse Leakage Current (Note 2)
IR
VR=25V
-
2
μA
Diode Capacitance
CD
-
10
pF
Reverse Recovery Time
trr
VR=1V, f=1MHz
when switched from IF= 10mA
to IR=10mA; RL=100Ω;
measured at IR=1mA
-
5
ns
Notes: 1.pulse test, tp=380μs, duty cycle<2%.
2.pulse test, tp=300μs, duty cycle<2%.
Thermal Characteristics
Symbol
Parameter
Rth j-a
thermal resistance from junction to ambient
Conditions
Value
Unit
note 1
635
K/W
Note 1 : Device mounted on a FR-4 PCB
BAT54S2
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C302S
Issued Date : 2004.11.26
Revised Date : 2015.01.07
Page No. : 3/6
Typical Characteristics
Forward Current & Forward Voltage
Diode Capacitance & Reverse-Biased Voltage
100
250
Diode Capacitance-Cd (pF)
Forward Current-IF (mA)
200
150
100
10
50
0
1
0
200
400
600
800
1000
0.1
Forward Voltage-VF (mV)
1
10
100
Reverse Biased Voltage-VR (V)
Recommended Footprint
mm
inch
BAT54S2
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C302S
Issued Date : 2004.11.26
Revised Date : 2015.01.07
Page No. : 4/6
Reel Dimension
Carrier Tape Dimension
BAT54S2
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C302S
Issued Date : 2004.11.26
Revised Date : 2015.01.07
Page No. : 5/6
Recommended wave soldering condition
Product
Pb-free devices
Peak Temperature
260 +0/-5 °C
Soldering Time
5 +1/-1 seconds
Recommended temperature profile for IR reflow
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Preheat
−Temperature Min(TS min)
−Temperature Max(TS max)
−Time(ts min to ts max)
Time maintained above:
−Temperature (TL)
− Time (tL)
Peak Temperature(TP)
Time within 5°C of actual peak
temperature(tp)
Ramp down rate
Time 25 °C to peak temperature
Sn-Pb eutectic Assembly
Pb-free Assembly
3°C/second max.
3°C/second max.
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
183°C
60-150 seconds
240 +0/-5 °C
217°C
60-150 seconds
260 +0/-5 °C
10-30 seconds
20-40 seconds
6°C/second max.
6 minutes max.
6°C/second max.
8 minutes max.
Note : All temperatures refer to topside of the package, measured on the package body surface.
BAT54S2
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C302S
Issued Date : 2004.11.26
Revised Date : 2015.01.07
Page No. : 6/6
SOD-323 Dimension
Marking:
K
A
5JVH
2
1
Style: Pin 1.Cathode 2.Anode
B
D
2-Lead SOD-323 Plastic Surface
Mounted Package,
CYStek Package Code: S2
J
H
E
C
*: Typical
Inches
Min.
Max.
0.0630 0.0709
0.0453 0.0531
0.0315 0.0394
0.0098 0.0157
DIM
A
B
C
D
Millimeters
Min.
Max.
1.60
1.80
1.15
1.35
0.80
1.00
0.25
0.40
DIM
E
H
J
K
Inches
Min.
Max.
0.0060 REF
0.0000 0.0040
0.0035 0.0070
0.0906 0.1063
Millimeters
Min.
Max.
0.15 REF
0.00
0.10
0.089
0.177
2.30
2.70
Notes: 1.Controlling dimension : millimeters.
2.Lead thickness specified per L/F drawing with solder plating.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BAT54S2
CYStek Product Specification