CYStech Electronics Corp. Spec. No. : C338S2 Issued Date : 2009.04.03 Revised Date : 2013.09.11 Page No. : 1/6 1.0Amp. Surface Mount Schottky Barrier Diodes CSOD5817-5819S2 Features • For surface mounted applications. • For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications • Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0 • Low leakage current • High surge capability • High temperature soldering: 250°C/10 seconds at terminals • Exceeds environmental standards of MIL-S-19500/228 • RoHS compliant package Mechanical Data • Case: Molded plastic, JEDEC SOD-323. • Terminals: Pure tin plated, Solderable per MIL-STD-750 method 2026 • Polarity: Indicated by cathode band. • Weight: 4.507 mg approximately Symbol Outline CSOD58XXS2 2 (Anode) SOD-323 Ordering Information Device Package SOD-323 CSOD58XXS2-0-T1-G (Pb-free lead plating and halogen-free package) Shipping 3000 pcs / Tape & Reel Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, T1 : 3000 pcs/ tape & reel in 7” reel Product rank, zero for no rank products Product name CSOD5817-5819S2 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C338S2 Issued Date : 2009.04.03 Revised Date : 2013.09.11 Page No. : 2/6 Maximum Ratings and Electrical Characteristics (Rating at 25°C ambient temperature unless otherwise specified. ) Parameter Repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum instantaneous forward voltage, IF=1A (Note 1) Average forward rectified current Peak forward surge current @8.3ms single half sine wave superimposed on rated load (JEDEC method) Maximum DC reverse current VR=VRRM,TJ=25℃(Note 1) Maximum thermal resistance, Junction to ambient Diode junction capacitance @ f=1MHz and applied 4V reverse voltage Storage temperature range Operating temperature range VRRM VRMS VR 5817 20 14 20 Type 5818 30 21 30 5819 40 28 40 VF 0.45 0.55 0.6 Symbol Units V V V V IO 1 A IFSM 10 A IR 1 Rth,JA 500(typ) ℃/W CD 120 (max) pF Tstg TJ -65 ~ +150 -50 ~ +150 ℃ ℃ mA Notes : 1.Pulse test, pulse width=300μsec, 2% duty cycle Recommended Footprint mm inch CSOD5817-5819S2 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C338S2 Issued Date : 2009.04.03 Revised Date : 2013.09.11 Page No. : 3/6 Characteristic Curves CSOD5817-5819S2 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C338S2 Issued Date : 2009.04.03 Revised Date : 2013.09.11 Page No. : 4/6 Reel Dimension Carrier Tape Dimension CSOD5817-5819S2 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C338S2 Issued Date : 2009.04.03 Revised Date : 2013.09.11 Page No. : 5/6 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6°C/second max. 6 minutes max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. CSOD5817-5819S2 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C338S2 Issued Date : 2009.04.03 Revised Date : 2013.09.11 Page No. : 6/6 SOD-323 Dimension K A Marking: XX 5H 1 2 B D Style: Pin 1.Cathode 2.Anode J H E C 2-Lead SOD-323 Plastic Surface Mounted Package CYStek Package Code: S2 Type CSOD5817S2 CSOD5818S2 CSOD5819S2 Inches Min. Max. 0.0630 0.0709 0.0453 0.0531 0.0315 0.0394 0.0098 0.0157 DIM A B C D Millimeters Min. Max. 1.60 1.80 1.15 1.35 0.80 1.00 0.25 0.40 DIM E H J K Marking Code SJ SK SL Inches Min. Max. 0.0060 0.0000 0.0040 0.0035 0.0070 0.0906 0.1063 Millimeters Min. Max. 0.15 0.00 0.10 0.089 0.177 2.30 2.70 Notes: 1.Controlling dimension : millimeters. 2.Lead thickness specified per L/F drawing with solder plating. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. CSOD5817-5819S2 CYStek Product Specification