CYStech Electronics Corp. Spec. No. : C345S2 Issued Date : 2004.04.27 Revised Date : 2013.04.15 Page No. : 1/6 Small Signal Schottky diode RB751V-40S2 Description Planar silicon Schottky barrier diode encapsulated in a SOD-323 plastic SMD package. Features •Small surface mounting type SC-76/SOD323 •Low reverse current and low forward voltage •High reliability •Pb-free lead plating and halogen-free package Applications Low current rectification and high speed switching Symbol Outline RB751V-40S2 2 (Anode) SOD-323 Ordering Information Device RB751V-40S2-0-T1-G RB751V-40S2 Package SOD-323 (Pb-free lead plating and halogen-free package) Shipping Marking 3000 pcs / Tape & Reel 5E CYStek Product Specification CYStech Electronics Corp. Spec. No. : C345S2 Issued Date : 2004.04.27 Revised Date : 2013.04.15 Page No. : 2/6 Absolute Maximum Ratings • Maximum Temperatures Storage Temperature Tstg..................................................................................................... -40~+125°C Junction Temperature Tj .............................................................................................................. +125°C • Maximum Voltages and Currents (Ta=25°C) Peak Reverse Voltage VRM…………………………………………………………………………. 40 V DC Reverse Voltage VR ...................................................................................................................... 30 V Mean Rectifying Current IO ........................................................................................................... 30 mA Peak Forward Surge Current IFSM………………………………….. ……………………………………….200 mA Characteristics (Ta=25°C) Characteristic Forward Voltage VF IF=1mA - Typ - Reverse Leakage Current IR VR=30V - - 0.5 μA Capacitance Between Terminals CT VR=1V, f=1MHz - 2 - pF RB751V-40S2 Symbol Condition Min. Max. Unit 370 mV CYStek Product Specification Spec. No. : C345S2 Issued Date : 2004.04.27 Revised Date : 2013.04.15 Page No. : 3/6 CYStech Electronics Corp. Characteristic Curves Forward Current vs Forward Voltage Forward Current Derating Curve 100 M ounting on glass epoxy PCBs 100 Forward Current---I F(mA) Percentage of Rated Forward Current---(%) 120 80 60 40 10 125℃ 1 75℃ 25℃ 0.1 20 - 25℃ 0 0.01 0 25 50 75 100 125 150 0 0.1 0.2 0.3 0.4 Ambient Temperature---TA(℃) Forward Voltage---VF(V) Reverse Leakage Current vs Reverse Voltage Capacitance vs Reverse Voltage 0.5 10 T a= 125℃ 10 T a= 75℃ 1 0.1 T a= 25℃ Ta=-25℃ 0.01 Typ. pulse easurement Capacitance between terminals---C T(pF) 100 Reverse Leakage Current---IR(μA) T yp. pulse measurement f=1MHz Ta=25℃ 1 0.001 0 10 20 Reverse Voltage---VR(V) RB751V-40S2 30 0 2 4 6 8 10 12 14 Reverse Voltage---VR(V) CYStek Product Specification CYStech Electronics Corp. Spec. No. : C345S2 Issued Date : 2004.04.27 Revised Date : 2013.04.15 Page No. : 4/6 Reel Dimension Carrier Tape Dimension RB751V-40S2 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C345S2 Issued Date : 2004.04.27 Revised Date : 2013.04.15 Page No. : 5/6 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. RB751V-40S2 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C345S2 Issued Date : 2004.04.27 Revised Date : 2013.04.15 Page No. : 6/6 SOD-323 Dimension Marking: K A 55EH 2 1 Style: Pin 1.Cathode 2.Anode B D 2-Lead SOD-323 Plastic Surface Mounted Package, CYStek Package Code: S2 J H E C *: Typical Inches Min. Max. 0.0630 0.0709 0.0453 0.0531 0.0315 0.0394 0.0098 0.0157 DIM A B C D Millimeters Min. Max. 1.60 1.80 1.15 1.35 0.80 1.00 0.25 0.40 DIM E H J K Inches Min. Max. 0.0060 REF 0.0000 0.0040 0.0035 0.0070 0.0906 0.1063 Millimeters Min. Max. 0.15 REF 0.00 0.10 0.089 0.177 2.30 2.70 Notes: 1.Controlling dimension : millimeters. 2.Lead thickness specified per L/F drawing with solder plating. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. RB751V-40S2 CYStek Product Specification