CYStech Electronics Corp. Spec. No. : C303C2 Issued Date : 2004.02.11 Revised Date : 2014.04.25 Page No. : 1/6 High Speed Switching diode 1SS400C2 Features •Extremely small surface mounting type.(SC-79/SOD523) •High speed switching applications •Low reverse current Symbol Outline Ordering Information Device 1SS4000C2-0-T5-G Package SOD-523 (Pb-free lead plating and halogen-free package) Shipping 8000 pcs / tape & reel Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, T5 : 8000 pcs / tape & reel, 7” reel Product rank, zero for no rank products Product name 1SS400C2 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C303C2 Issued Date : 2004.02.11 Revised Date : 2014.04.25 Page No. : 2/6 Absolute Maximum Ratings • Maximum Temperatures Storage Temperature Tstg..................................................................................................... -55~+150°C Junction Temperature Tj .............................................................................................................. +150°C • Maximum Voltages and Currents (Ta=25°C) DC Reverse Voltage VR .................................................................................................................... 100 V Mean Rectifying Current IF ........................................................................................……….. 200mA Peak Forward Surge Current IFSM………………………………….. ………………………………………. 500mA • Thermal Characteristics Total Device Dissipation @ TA=25°C (Note) Thermal Resistance, Junction to Ambient PD……………………………………………….200mW RθJA……………………………………………625°C/W Note: FR-5 board minimum pad. Characteristics (Ta=25°C) Characteristic Symbol Condition Min. Max. Unit Forward Voltage VF IF=100mA - 1.2 V Reverse Leakage Current IR VR=100V - 0.1 μA Diode Capacitance CD VR=0.5V, f=1MHz - 3 pF Reverse Recovery Time trr IF=IR=10mA - 4 ns 1SS400C2 CYStek Product Specification Spec. No. : C303C2 Issued Date : 2004.02.11 Revised Date : 2014.04.25 Page No. : 3/6 CYStech Electronics Corp. Typical Characteristics Forward Current vs Forward Voltage Forward Current Derating Curve 100 M ounting on glass epoxy PCBs 100 Forward Current---I F(mA) Percentage of Rated Forward Current---(%) 120 80 60 40 10 8 5℃ 25℃ 1 20 - 40℃ 0 0.1 0 25 50 75 100 125 150 175 200 0.2 0.6 0.8 1 1.2 Forward Voltage---VF(V) Ambient Temperature---TA(℃) Reverse Leakage Current vs Reverse Voltage Capacitance vs Reverse Voltage 0.68 Capacitance between terminals---C T(pF) 10 Reverse Leakage Current---IR(μA) 0.4 T a= 125℃ 1 0.1 T a= 8 5℃ 0.01 T a= 25℃ f=1MHz Ta=25℃ 0.64 0.6 0.56 0.52 0.001 0 10 20 30 Reverse Voltage---VR(V) 40 50 0 2 4 6 8 Reverse Voltage---VR (V) Recommended Footprint 1SS400C2 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C303C2 Issued Date : 2004.02.11 Revised Date : 2014.04.25 Page No. : 4/6 Reel Dimension Carrier Tape Dimension 1SS400C2 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C303C2 Issued Date : 2004.02.11 Revised Date : 2014.04.25 Page No. : 5/6 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. 1SS400C2 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C303C2 Issued Date : 2004.02.11 Revised Date : 2014.04.25 Page No. : 6/6 SOD-523 Dimension Marking Code : 1 1 2 A 2 Style : Pin 1. Cathode 2. Anode 2-lead SOD-523 Plastic Package CYStek Package Code : C2 *: Typical Millimeters Min. Max. 0.510 0.770 0.500 0.700 0.250 0.350 0.080 0.150 0.750 0.850 DIM A A1 b c D Inches Min. Max. 0.020 0.031 0.020 0.028 0.010 0.014 0.003 0.006 0.030 0.033 DIM Min. E E1 E2 L θ Millimeters Min. Max. 1.100 1.300 1.500 1.700 0.200 REF 0.010 0.070 7° REF Inches Min. Max. 0.043 0.051 0.059 0.067 0.008 REF 0.001 0.003 7° REF Notes: 1.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 2.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. 1SS400C2 CYStek Product Specification