CYStech Electronics Corp. Spec. No. : C306S3 Issued Date : 2002.05.11 Revised Date : 2014.08.20 Page No. : 1/7 General Purpose PNP Epitaxial Planar Transistor BTA1576S3 Description The BTA1576S3 is designed for using in driver stage of AF amplifier and general purpose amplification. Excellent hFE linearity Complementary to BTC4081S3. Pb-free lead plating and halogen-free package Symbol Outline BTA1576S3 SOT-323 B:Base C:Collector E:Emitter Ordering Information Device BTA1576S3-0-T1-G Package SOT-323 (Pb-free lead plating and halogen-free package) Shipping 3000 pcs / Tape & Reel Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, T1 : 3000 pcs / tape & reel, 7” reel Product rank, zero for no rank products Product name BTA1576S3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C306S3 Issued Date : 2002.05.11 Revised Date : 2014.08.20 Page No. : 2/7 Absolute Maximum Ratings (Ta=25C) Parameter Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current Power Dissipation Junction Temperature Storage Temperature Symbol Limits Unit VCBO VCEO VEBO IC PD Tj Tstg -100 -65 -6 -150 225 150 -55~+150 V V V mA mW C C Characteristics (Ta=25C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *hFE fT Cob Min. -100 -65 -6 220 100 - Typ. -0.2 160 4.0 Max. -0.1 -0.1 -0.5 475 5.0 Unit V V V μA μA V MHz pF Test Conditions IC=-50μA IC=-1mA IE=-50μA VCB=-80V VEB=-6V IC=-50mA, IB=-5mA VCE=-6V, IC=-1mA VCE=-12V, IC=-2mA, f=30MHz VCB=-12V, f=1MHz *Pulse Test: Pulse Width 380μs, Duty Cycle2% Recommended Soldering Footprint BTA1576S3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C306S3 Issued Date : 2002.05.11 Revised Date : 2014.08.20 Page No. : 3/7 Typical Characteristics Emitter Grounded Output Characteristics Emitter Grounded Output Characteristics 0.25 0.16 1mA 5mA Collector Current---IC(A) Collector Current---IC(A) 0.14 0.12 0.1 500uA 400uA 0.08 300uA 0.06 200uA 0.04 IB=100uA 0.02 0.2 2.5mA 1.5mA 0.15 1mA 0.1 IB=500uA 0.05 0 0 0 1 2 3 4 5 Collector-to-Emitter Voltage---VCE(V) 6 0 1 2 3 4 5 Collector-to-Emitter Voltage---VCE(V) 6 Current Gain vs Collector Current Current Gain vs Collector Current 1000 1000 Current Gain---HFE Current Gain---HFE Ta=125°C Ta=125°C Ta= 75°C Ta= 25°C 100 Ta=75°C Ta=25°C 100 VCE=2V VCE=1V 10 10 0.1 1 10 100 Collector Current---IC(mA) 0.1 1000 1 10 100 1000 Collector Current---IC(mA) Current Gain vs Collector Current Saturation Voltage vs Collector Current 1000 1000 VCESAT=10IB Saturation Voltage---(mV) VCE=6V Current Gain---HFE Ta=125°C Ta=75°C Ta=25°C 100 125°C 75°C 25°C 10 100 0.1 BTA1576S3 1 10 100 Collector Current---IC(mA) 1000 1 10 100 Collector Current---IC(mA) 1000 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C306S3 Issued Date : 2002.05.11 Revised Date : 2014.08.20 Page No. : 4/7 Typical Characteristics(Cont.) Saturation Voltage vs Collector Current Saturation Voltage vs Collector Current 1000 10000 VBESAT@IC=10IB Saturation Voltage---(mV) Saturation Voltage---(mV) VCESAT=20IB 125°C 75°C 25°C 100 Ta=25°C Ta=75°C 1000 125°C 100 10 1 10 100 Collector Current---IC(mA) 1 1000 On Voltage vs Collector Current 10 100 Collector Current---IC(mA) 1000 Cutoff Frequency vs Collector Current 10000 1000 Cutoff Frequency---FT(MHZ) On Voltage---(mV) VBEON@VCE=6V 25°C 75°C 1000 125°C 100 FT@VCE=12V 100 10 1 10 100 Collector Current---IC(mA) 1000 0.1 Capacitance vs Reverse-biased Voltage 100 Power Derating Curve 100 250 Power Dissipation---PD(mW) Capacitance---(pF) 1 10 Collector Current---IC(mA) Cib 10 Cob 1 200 150 100 50 0 0.1 BTA1576S3 1 10 Reverse-biased Voltage---VR(V) 100 0 50 100 150 Ambient Temperature---TA(℃) 200 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C306S3 Issued Date : 2002.05.11 Revised Date : 2014.08.20 Page No. : 5/7 Reel Dimension Carrier Tape Dimension BTA1576S3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C306S3 Issued Date : 2002.05.11 Revised Date : 2014.08.20 Page No. : 6/7 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5C of actual peak temperature(tp) Ramp down rate Time 25 C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3C/second max. 3C/second max. 100C 150C 60-120 seconds 150C 200C 60-180 seconds 183C 60-150 seconds 240 +0/-5 C 217C 60-150 seconds 260 +0/-5 C 10-30 seconds 20-40 seconds 6C/second max. 6 minutes max. 6C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. BTA1576S3 CYStek Product Specification Spec. No. : C306S3 Issued Date : 2002.05.11 Revised Date : 2014.08.20 Page No. : 7/7 CYStech Electronics Corp. SOT-323 Dimension Marking: 3 Q A1 1 C FR Lp 2 XX A detail Z bp e1 W B e E D A Device Code Z Date Code He 0 v A 3-Lead SOT-323 Plastic Surface Mounted Package CYStek Package Code: S3 2 mm 1 scale Style: Pin 1.Base 2.Emitter 3.Collector *: Typical Inches Min. Max. 0.0315 0.0433 0.0000 0.0039 0.0118 0.0157 0.0039 0.0098 0.0709 0.0866 0.0453 0.0531 0.0512 - DIM A A1 bp C D E e Millimeters Min. Max. 0.80 1.10 0.00 0.10 0.30 0.40 0.10 0.25 1.80 2.20 1.15 1.35 1.3 - DIM e1 He Lp Q v w Inches Min. Max. 0.0256 0.0787 0.0886 0.0059 0.0177 0.0051 0.0091 0.0079 0.0079 - Millimeters Min. Max. 0.65 2.00 2.25 0.15 0.45 0.13 0.23 0.2 0.2 10 0 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: Lead: Pure tin plated. Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. CYStek reserves the right to make changes to its products without notice. CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. BTA1576S3 CYStek Product Specification