CYStech Electronics Corp. Spec. No. : C209N3 Issued Date : 2002.05.11 Revised Date : 2014.06.27 Page No. : 1/7 General Purpose NPN Epitaxial Planar Transistor BTC4061N3 Description • High breakdown voltage. • Low collector output capacitance. • Ideal for chroma circuit. • Pb-free lead plating and halogen-free package package. Symbol Outline BTC4061N3 SOT-23 B：Base C：Collector E：Emitter Ordering Information Device BTC4061N3-X-T1-G Package SOT-23 (Pb-free lead plating and halogen-free package) Shipping 3000 pcs / tape & reel Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, T1 : 3000 pcs / tape & reel, 7” reel Product rank, zero for no rank products Product name BTC4061N3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C209N3 Issued Date : 2002.05.11 Revised Date : 2014.06.27 Page No. : 2/7 Absolute Maximum Ratings (Ta=25°C) Parameter Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current Power Dissipation Junction Temperature Storage Temperature Symbol VCBO VCEO VEBO IC Pd Tj Tstg Limits 300 300 6 500 225 150 -55~+150 Unit V V V mA mW °C °C Thermal Data Parameter Thermal Resistance, Junction-to-case, max Thermal Resistance, Junction-to-ambient, max Symbol Rth,j-c Rth,j-a Value 175 556 Unit °C/W Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *VBE(sat) *hFE1 *hFE2 *hFE3 fT Cob Min. 300 300 6 90 100 40 50 - Typ. 0.15 - Max. 50 50 0.35 0.9 270 6 Unit V V V nA nA V V MHz pF Test Conditions IC=100μA IC=1mA IE=10μA VCB=250V VEB=5V IC=20mA, IB=2mA IC=20mA, IB=2mA VCE=10V, IC=1mA VCE=10V, IC=10mA VCE=10V, IC=30mA VCE=20V, IC=10mA, f=20MHz VCB=20V, f=1MHz *Pulse Test: Pulse Width ≤380μs, Duty Cycle≤2% Classification Of hFE 2 Rank P Q Range 100~180 120~270 BTC4061N3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C209N3 Issued Date : 2002.05.11 Revised Date : 2014.06.27 Page No. : 3/7 Characteristic Curves Saturation Voltage vs Collector Current Current Gain vs Collector Current 1000 Saturation Voltage---(mV) Current Gain---HFE 1000 HFE 100 VCE=10V VCE=5V VCE(SAT) IC=20IB 100 IC=10IB 10 10 1 10 Collector Current ---IC(mA) 1 100 10 Collector Current--- IC(mA) 100 Cutoff Frequency vs Collector Current Saturation Voltage vs Collector Current 1 Cutoff Frequency---FT(GHZ) Saturation Voltage---(mV) 1000 VBE(SAT)@IC=10IB FT@VCE=30V 0.1 100 1 10 Collector Current ---IC(mA) 100 1 10 Collector Current---IC(mA) 100 Power Derating Curve Power Dissipation---PD(mW) 250 200 150 100 50 0 0 50 100 150 200 Ambient Temperature --- Ta(℃ ) BTC4061N3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C209N3 Issued Date : 2002.05.11 Revised Date : 2014.06.27 Page No. : 4/7 Reel Dimension Carrier Tape Dimension BTC4061N3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C209N3 Issued Date : 2002.05.11 Revised Date : 2014.06.27 Page No. : 5/7 Recommended Soldering Footprint BTC4061N3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C209N3 Issued Date : 2002.05.11 Revised Date : 2014.06.27 Page No. : 6/7 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. BTC4061N3 CYStek Product Specification Spec. No. : C209N3 Issued Date : 2002.05.11 Revised Date : 2014.06.27 Page No. : 7/7 CYStech Electronics Corp. SOT-23 Dimension Marking: Product Code 1D Date Code: Year+Month Year: 3→2003, 4→2004 Month: 1→1, 2→2,‧‧‧ 9→9, A→10, B→11, C→12 3-Lead SOT-23 Plastic Surface Mounted Package CYStek Package Code: N3 Style : Pin 1.Base 2.Emitter 3.Collector *:Typical Inches Min. Max. 0.1102 0.1204 0.0472 0.0669 0.0335 0.0512 0.0118 0.0197 0.0669 0.0910 0.0000 0.0040 DIM A B C D G H Millimeters Min. Max. 2.80 3.04 1.20 1.70 0.89 1.30 0.30 0.50 1.70 2.30 0.00 0.10 DIM J K L S V L1 Inches Min. Max. 0.0032 0.0079 0.0118 0.0266 0.0335 0.0453 0.0830 0.1161 0.0098 0.0256 0.0118 0.0197 Millimeters Min. Max. 0.08 0.20 0.30 0.67 0.85 1.15 2.10 2.95 0.25 0.65 0.30 0.50 Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material : • Lead : Pure tin plated.. • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYSrek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. BTC4061N3 CYStek Product Specification