CYStech Electronics Corp. Spec. No. : C899QF Issued Date : 2009.11.09 Revised Date : 2009.12.23 Page No. : 1/6 Quadruple High Voltage NPN Epitaxial Planar Transistor Built-in Base Resistor HQN2498QF Description • High breakdown voltage. (BVCEO=400V) • Low saturation voltage, typical VCE(sat) =0.13V at Ic/IB =20mA/1mA. • Complementary to HQP1498QF • Pb-free package Equivalent Circuit Outline HQN2498QF SOP-10 The following ratings and characteristics apply to each transistor in this device. Absolute Maximum Ratings (Ta=25°C) Parameter Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current Total Power Dissipation Junction Temperature Storage Temperature HQN2498QF Symbol Limits Unit VCBO VCEO VEBO IC Pd Tj Tstg 400 400 7 300 1.5 150 -55~+150 V V V mA W °C °C Preliminary CYStek Product Specification CYStech Electronics Corp. Spec. No. : C899QF Issued Date : 2009.11.09 Revised Date : 2009.12.23 Page No. : 2/6 Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO ICER IEBO *VCE(sat) *VCE(sat) *VCE(sat) *VBE(sat) *hFE *hFE R fT Cob Min. 400 400 7 50 50 0.7 - Typ. 0.13 0.11 0.16 100 13 Max. 100 10 100 0.18 0.18 0.3 3.7 270 1.3 - Unit V V V nA nA nA V V V V kΩ MHz pF Test Conditions IC=50μA IC=1mA IE=50μA VCB=400V VCE=300V, REB=4kΩ VEB=6V IC=20mA, IB=1mA IC=50mA, IB=5mA IC=100mA, IB=10mA IC=20mA, IB=2mA VCE=10V, IC=10mA VCE=10V, IC=100mA VCE=10V, IC=10mA, f=5MHz VCB=10V, IE=0A, f=1MHz *Pulse Test: Pulse Width ≤380μs, Duty Cycle≤2% Ordering Information Device HQN2498QF HQN2498QF Package SOP-10 (Pb-free) Shipping Marking 3000 pcs / Tape & Reel N2498 Preliminary CYStek Product Specification Spec. No. : C899QF Issued Date : 2009.11.09 Revised Date : 2009.12.23 Page No. : 3/6 CYStech Electronics Corp. Characteristic Curves Current Gian vs Collector Current Saturation Voltage vs Collector Current 100000 Saturation Voltage---(mV) Current Gain---HFE 100 VCE = 10V VCE = 5V 10000 VCE(SAT) @ IC = 20IB 1000 100 VCE(SAT) @ IC =10IB 10 10 1 10 100 Collector Current---IC(mA) 1 1000 10 100 Collector Current---IC(mA) Power Derating Curve Saturation Voltage vs Collector Current 1.6 10000 Power Dissipation---PD(W) 1.4 Saturation Voltage---(mV) 1000 IC=10IB IC=20IB 1000 Total power dissipation per package 1.2 1 Power dissipation per transistor 0.8 0.6 0.4 0.2 VBE(SAT) 0 100 1 HQN2498QF 10 100 Collector Current---IC(mA) 1000 0 50 100 150 200 Ambient Temperature---TA(℃) Preliminary CYStek Product Specification CYStech Electronics Corp. Spec. No. : C899QF Issued Date : 2009.11.09 Revised Date : 2009.12.23 Page No. : 4/6 Reel Dimension Carrier Tape Dimension HQN2498QF Preliminary CYStek Product Specification CYStech Electronics Corp. Spec. No. : C899QF Issued Date : 2009.11.09 Revised Date : 2009.12.23 Page No. : 5/6 Recommended wave solderiRecommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. HQN2498QF Preliminary CYStek Product Specification CYStech Electronics Corp. Spec. No. : C899QF Issued Date : 2009.11.09 Revised Date : 2009.12.23 Page No. : 6/6 SOP-10 Dimension Marking: N2498 □□ 10-Lead SOP-10 Plastic Surface Mounted Package CYStek Package Code: QF Inches Min. Max. 0.2283 0.2441 0.1990 0.1969 0.1496 0.1575 0° 8° 0.0157 0.0354 0.0075 0.0098 DIM A B C D E F Millimeters Min. Max. 5.80 6.20 4.80 5.00 3.80 4.00 0° 8° 0.40 0.90 0.19 0.25 DIM M H L J K G Inches Min. Max. 0.0039 0.0098 0.0118 0.0173 0.0531 0.0689 0.0148 REF. 45° TYP. 0.0394 Millimeters Min. Max. 0.10 0.25 0.30 0.44 1.35 1.75 0.375 REF. 45° TYP. 1.00 TYP. Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: Pure tin plated • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. HQN2498QF Preliminary CYStek Product Specification