CYStech Electronics Corp. N-Channel Enhancement Mode Power MOSFET MTN10N65FPG Spec. No. : C725FP Issued Date : 2009.06.15 Revised Date : 2011.08.15 Page No. : 1/10 BVDSS : 650V RDS(ON) : 0.82Ω ID : 10A Description The MTN10N65FPG is a N-channel enhancement-mode MOSFET, providing the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost effectiveness. The TO-220FP package is universally preferred for all commercial-industrial applications Features • Low On Resistance • Simple Drive Requirement • Low Gate Charge • Fast Switching Characteristic • Insulating package, front/back side insulating voltage=2500V(AC) • Pb-free lead plating and halogen-free package Applications • Power Factor Correction • LCD TV Power • Full and Half Bridge Power Symbol Outline MTN10N65FPG G:Gate D:Drain S:Source MTN10N65FPG TO-220FP G D S CYStek Product Specification Spec. No. : C725FP Issued Date : 2009.06.15 Revised Date : 2011.08.15 Page No. : 2/10 CYStech Electronics Corp. Absolute Maximum Ratings (TC=25°C) Parameter Symbol Limits Unit Drain-Source Voltage (Note 1) Gate-Source Voltage Continuous Drain Current Continuous Drain Current @TC=100°C Pulsed Drain Current @ VGS=10V (Note 2) Single Pulse Avalanche Energy @ L=4.3mH, ID=10 Amps, VDD=50V Repetitive Avalanche Energy Peak Diode Recovery dv/dt (Note 3) Maximum Temperature for Soldering @ Lead at 0.063 in(1.6mm) from case for 10 seconds Maximum Temperature for Soldering @ Package Body for 10 seconds Total Power Dissipation (TC=25℃) Linear Derating Factor Operating Junction and Storage Temperature VDS VGS ID ID IDM EAS EAR dv/dt 650 ±30 10* 6 40* 237 5 3.0 V V A A A V/ns TL 300 °C TPKG 260 °C Pd 50 0.4 -55~+150 W W/°C °C Tj, Tstg *Drain current limited by maximum junction temperature mJ Note : 1. TJ=+25℃ to +150℃. 2. Repetitive rating; pulse width limited by maximum junction temperature. 3. ISD≤10A, dI/dt≤100A/μs, VDD≤BVDSS, TJ=+150℃. Thermal Data Parameter Thermal Resistance, Junction-to-case, max Thermal Resistance, Junction-to-ambient, max MTN10N65FPG Symbol Rth,j-c Rth,j-a Value 2.5 100 Unit °C/W °C/W CYStek Product Specification CYStech Electronics Corp. Spec. No. : C725FP Issued Date : 2009.06.15 Revised Date : 2011.08.15 Page No. : 3/10 Characteristics (Tj=25°C, unless otherwise specified) Symbol Min. Static BVDSS 650 ∆BVDSS/∆Tj VGS(th) 2.0 *GFS IGSS IDSS IDSS *RDS(ON) Dynamic *Qg *Qgs *Qgd *td(ON) *tr *td(OFF) *tf Ciss Coss Crss Source-Drain Diode *VSD *IS *ISM *trr *Qrr - Typ. Max. Unit Test Conditions 0.6 6.8 0.75 4.0 ±100 25 250 0.82 V V/°C V S nA μA μA Ω VGS=0, ID=250μA Reference to 25°C, ID=250μA VDS = VGS, ID=250μA VDS =15V, ID=5A VGS=±30 VDS =650V, VGS =0 VDS =520V, VGS =0, Tj=125°C VGS =10V, ID=6A 53 10.7 22.3 19 16 49 16 2516 182.2 71 - nC ID=10A, VDD=325V, VGS=10V ns VDD=325V, ID=10A, VGS=10V, RG=9.1Ω pF VGS=0V, VDS=25V, f=1MHz 352 2.9 1.5 10 40 528 4.35 V IS=10A, VGS=0V A VD=VG=0, VS=1.3V ns μC VGS=0, IF=10A, dI/dt=100A/μs *Pulse Test : Pulse Width ≤300μs, Duty Cycle≤2% Ordering Information Device MTN10N65FPG MTN10N65FPG Package TO-220FP (Pb-free lead plating and halogen-free package) Shipping 50 pcs/tube CYStek Product Specification Spec. No. : C725FP Issued Date : 2009.06.15 Revised Date : 2011.08.15 Page No. : 4/10 CYStech Electronics Corp. Typical Characteristics Static Drain-Source On-resistance vs Ambient Temperature Typical Output Characteristics 2 20 Drain Current - I D(A) 18 16 15V 10V 9V 7V 14 12 10 Static Drain-Source On-state Resistance-RDS(on) (Ω) 6V 5.5V 8 5V 6 4 2 1.5 1 0.5 ID=6A, VGS=10V VGS=4.5V 0 0 10 20 30 Drain-Source Voltage -VDS(V) 0 -100 40 -50 30 1 VGS=10V 0.8 Ta=25°C 25 Drain Current-I D(on)(A) Static Drain-Source On-State Resistance-R DS(on)(Ω) 150 Drain Current vs Gate-Source Voltage Static Drain-Source On-State resistance vs Drain Current 0.6 0.4 0.2 VDS=30V 20 15 VDS=10V 10 5 0 0 0.1 1 10 Drain Current-ID(A) 0 100 10 15 20 Body Diode Forward Voltage Variation vs Source Current and Temperature 100 5 Reverse Drain Current-I DR (A) Ta=25°C ID=6A 4 5 Gate-Source Voltage-VGS(V) Static Drain-Source On-State Resistance vs Gate-Source Voltage Static Drain-Source On-State Resistance-R DS(ON)(Ω) 0 50 100 Ambient Temperature-Ta(°C) 3 2 1 VGS=0V 10 Ta=150°C 1 Ta=25°C 0.1 0 4 MTN10N65FPG 6 8 10 Gate-Source Voltage-VGS(V) 12 0 0.2 0.4 0.6 0.8 1 1.2 1.4 Source Drain Voltage -VSD(V) CYStek Product Specification Spec. No. : C725FP Issued Date : 2009.06.15 Revised Date : 2011.08.15 Page No. : 5/10 CYStech Electronics Corp. Characteristic Curves(Cont.) Brekdown Voltage vs Ambient Temperature Capacitance vs Reverse Voltage 10000 800 Drain-Source Breakdown Voltage BVDSS(V) Capacitance-(pF) f=1MHz Ciss 1000 Coss 100 750 700 650 ID=250μA, VGS=0V Crss 10 0 5 10 15 20 25 Drain-to-Source Voltage-VDS (V) 600 -100 30 -50 50 100 150 200 Gate Charge Characteristics Maximum Safe Operating Area 12 100 VDS=130V Gate-Source Voltage---VGS(V) 10μ 100μs 10 Drain Current --- ID(A) 0 Ambient Temperature-Tj(°C) 1ms 10ms 1 100ms Operation in this area is limited by RDS(ON) 0.1 DC Single pulse Tc=25°C; Tj=150°C VDS=325V VDS=520V 8 6 4 2 ID=10A 0 0.01 1 10 10 100 Drain-Source Voltage -VDS(V) 1000 0 10 20 30 40 50 60 Total Gate Charge---Qg(nC) Maximum Drain Current vs Case Temperature 10 8 (A) Maximum Drain Current---I D 12 6 4 2 0 25 50 75 100 125 150 175 Case Temperature---TC (°C) MTN10N65FPG CYStek Product Specification CYStech Electronics Corp. Spec. No. : C725FP Issued Date : 2009.06.15 Revised Date : 2011.08.15 Page No. : 6/10 Typical Characteristics(Cont.) Transient Thermal Response Curves ZθJC(t), Thermal Response 10 1 D=0.5 1.ZθJC(t)=2.5°C/W max. 2.Duty Factor, D=t1/t2 3.TJM-TC=PDM*ZθJC(t) 0.2 0.1 0.05 0.1 0.02 0.01 Single Pulse 0.01 1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 t1, Square Wave Pulse Duration(s) MTN10N65FPG CYStek Product Specification CYStech Electronics Corp. Spec. No. : C725FP Issued Date : 2009.06.15 Revised Date : 2011.08.15 Page No. : 7/10 Test Circuit and Waveforms MTN10N65FPG CYStek Product Specification CYStech Electronics Corp. Spec. No. : C725FP Issued Date : 2009.06.15 Revised Date : 2011.08.15 Page No. : 8/10 Test Circuit and Waveforms(Cont.) MTN10N65FPG CYStek Product Specification CYStech Electronics Corp. Spec. No. : C725FP Issued Date : 2009.06.15 Revised Date : 2011.08.15 Page No. : 9/10 TO-220FP Dimension Marking: Device Name CYS 10N65 Date Code □□□□G Style: Pin 1.Gate 2.Drain 3.Source 3-Lead TO-220FP Plastic Package CYStek Package Code: FP *Typical Millimeters Min. Max. 4.20 4.80 2.50 3.10 2.20 2.80 0.74 0.78 0.90 1.50 1.30 1.90 0.30 0.90 DIM A A2 A3 b b1 b2 c Inches Min. Max. 0.1654 0.1890 0.0984 0.1220 0.0866 0.1102 0.0291 0.0307 0.0354 0.0591 0.0512 0.0748 0.0118 0.0354 DIM D E e F H2 L L1 Millimeters Min. Max. 9.70 10.30 15.70 16.30 2.35 2.75 3.20 3.80 6.90 7.50 29.20 30.80 3.40 3.80 Inches Min. Max. 0.3819 0.4055 0.6181 0.6417 0.0925 0.1083 0.1260 0.1496 0.2717 0.2953 1.1496 1.2126 0.1339 0.1496 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. MTN10N65FPG CYStek Product Specification