EN25S16A - Eon Silicon Solution Inc.

EN25S16A
EN25S16A
16 Megabit 1.8V Serial Flash Memory with 4Kbyte Uniform Sector
FEATURES
•
•
•
-
Single power supply operation
Full voltage range: 1.65-1.95 volt
Serial Interface Architecture
SPI Compatible: Mode 0 and Mode 3
16 M-bit Serial Flash
16 M-bit / 2048 KByte /8092 pages
256 bytes per programmable page
•
•
•
•
-
Standard, Dual or Quad SPI
Standard SPI: CLK, CS#, DI, DO, WP#, HOLD#
Dual SPI: CLK, CS#, DQ0, DQ1, WP#, HOLD#
Quad SPI: CLK, CS#, DQ0, DQ1, DQ2, DQ3
High performance
104MHz clock rate for one data bit
104MHz clock rate for two data bits
104MHz clock rate for four data bits
Burst Modes
8/16/32/64 linear burst with wrap-around
Low power consumption
5 mA typical active current
1μA typical power down current
• Software and Hardware Write Protection:
- Write Protect all or portion of memory via
software
- Enable/Disable protection with WP# pin
• High performance program/erase speed
- Page program time: 0.30ms typical
- Sector erase time: 40ms typical
- 32KB Block erase time 100ms typical
- 64KB Block erase time 150ms typical
- Chip erase time: 8 seconds typical
• Write Suspend and Write Resume
• Lockable 512 byte OTP security sector
• Support Serial Flash Discoverable
Parameters (SFDP) signature
• Read Unique ID Number (Note) ※
• Minimum 100K endurance cycle
• Package Options
- 8 pins SOP 150mil body width
- 8 pins VSOP 150mil body width
- 8 pins SOP 208mil body width
•
-
Uniform Sector Architecture:
512 sectors of 4-Kbyte
64 blocks of 32-Kbyte
32 blocks of 64-Kbyte
Any sector or block can be erased individually
- 8 contact VDFN 5x6 mm
- All Pb-free packages are compliant RoHS,
Halogen-Free and REACH.
• Industrial temperature Range
- 8 contact USON 4x3 mm
GENERAL DESCRIPTION
The EN25S16A is a 16 Megabit (2048K-byte) Serial Flash memory, with advanced write protection
mechanisms. The EN25S16A supports the standard Serial Peripheral Interface (SPI), and a high
performance Dual output as well as Dual, Quad I/O using SPI pins: Serial Clock, Chip Select, Serial
DQ0 (DI) and DQ1(DO), DQ2(WP#) and DQ3(HOLD#). SPI clock frequencies of up to 104MHz are
supported allowing equivalent clock rates of 208MHz (104MHz x 2) for Dual Output and 416MHz
(104MHz x 4) for Quad Output when using the Dual/Quad Output Fast Read instructions. The memory
can be programmed 1 to 256 bytes at a time, using the Page Program instruction.
The EN25S16A also offers a sophisticated method for protecting individual blocks against erroneous or
malicious program and erase operations. By providing the ability to individually protect and unprotect
blocks, a system can unprotect a specific block to modify its contents while keeping the remaining
blocks of the memory array securely protected. This is useful in applications where program code is
patched or updated on a subroutine or module basis or in applications where data storage segments
need to be modified without running the risk of errant modifications to the program code segments.
The EN25S16A is designed to allow either single Sector/Block at a time or full chip erase operation. The
EN25S16A can be configured to protect part of the memory as the software protected mode. The
device can sustain a minimum of 100K program/erase cycles on each sector or block.
※ Note: For additional Read Unique ID Number feature specifications, please contact our
regional sales representatives.
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
1
©2014 Eon Silicon Solution, Inc.,
Rev. B, Issue Date: 2014/04/15
www.eonssi.com
EN25S16A
Figure.1 CONNECTION DIAGRAMS
CS#
1
8
VCC
DO (DQ1)
2
7
HOLD# (DQ3)
WP# (DQ2)
3
6
CLK
4
5
DI (DQ0)
VSS
8 - LEAD SOP / VSOP
CS#
1
8
VCC
DO (DQ1)
2
7
HOLD# (DQ3)
WP# (DQ2)
3
6
CLK
4
5
DI (DQ0)
VSS
8 - LEAD USON / VDFN
Table 1. Pin Names
Symbol
Pin Name
CLK
Serial Clock Input
DI (DQ0)
Serial Data Input (Data Input Output 0) *1
DO (DQ1)
Serial Data Output (Data Input Output 1) *1
CS#
Chip Enable
WP# (DQ2)
Write Protect (Data Input Output 2) *2
HOLD# (DQ3)
HOLD# pin (Data Input Output 3) *2
Vcc
Supply Voltage (1.65-1.95 V)
Vss
Ground
NC
No Connect
Note:
1. DQ0 and DQ1 are used for Dual and Quad instructions.
2. DQ0 ~ DQ3 are used for Quad instructions.
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
2
©2014 Eon Silicon Solution, Inc.,
Rev. B, Issue Date: 2014/04/15
www.eonssi.com
EN25S16A
Figure 2. BLOCK DIAGRAM
Flash
Memory
X-Decoder
Address
Buffer
And
Latches
Y-Decoder
I/O Buffers
and
Data Latches
Control Logic
Serial Interface
CS#
CLK
DI (DQ0)
DO (DQ1)
WP# (DQ2)
HOLD# (DQ3)
Note:
1. DQ0 and DQ1 are used for Dual instructions.
2. DQ0 ~ DQ3 are used for Quad instructions.
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
3
©2014 Eon Silicon Solution, Inc.,
Rev. B, Issue Date: 2014/04/15
www.eonssi.com
EN25S16A
SIGNAL DESCRIPTION
Serial Data Input, Output and IOs (DI, DO and DQ0, DQ1, DQ2, DQ3)
The EN25S16A support standard SPI, Dual SPI and Quad SPI operation. Standard SPI instructions
use the unidirectional DI (input) pin to serially write instructions, addresses or data to the device on the
rising edge of the Serial Clock (CLK) input pin. Standard SPI also uses the unidirectional DO (output) to
read data or status from the device on the falling edge CLK.
Dual and Quad SPI instruction use the bidirectional IO pins to serially write instruction, addresses or
data to the device on the rising edge of CLK and read data or status from the device on the falling edge
of CLK.
Serial Clock (CLK)
The SPI Serial Clock Input (CLK) pin provides the timing for serial input and output operations. ("See
SPI Mode")
Chip Select (CS#)
The SPI Chip Select (CS#) pin enables and disables device operation. When CS# is high the device is
deselected and the Serial Data Output (DO, or DQ0, DQ1, DQ2 and DQ3) pins are at high impedance.
When deselected, the devices power consumption will be at standby levels unless an internal erase,
program or status register cycle is in progress. When CS# is brought low the device will be selected,
power consumption will increase to active levels and instructions can be written to and data read from
the device. After power-up, CS# must transition from high to low before a new instruction will be
accepted.
Hold (HOLD#)
The HOLD# pin allows the device to be paused while it is actively selected. When HOLD# is brought
low, while CS# is low, the DO pin will be at high impedance and signals on the DI and CLK pins will be
ignored (don’t care). The hold function can be useful when multiple devices are sharing the same SPI
signals. The HOLD# function is only available for standard SPI and Dual SPI operation, when during
Quad SPI, this pin is the Serial Data IO (DQ3) for Quad I/O operation.
Write Protect (WP#)
The Write Protect (WP#) pin can be used to prevent the Status Register from being written. Used in
conjunction with the Status Register’s Block Protect (BP0, BP1, BP2, BP3) bits and Status Register
Protect (SRP) bits, a portion or the entire memory array can be hardware protected. The WP# function
is only available for standard SPI and Dual SPI operation, when during Quad SPI, this pin is the Serial
Data IO (DQ2) for Quad I/O operation.
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
4
©2014 Eon Silicon Solution, Inc.,
Rev. B, Issue Date: 2014/04/15
www.eonssi.com
EN25S16A
MEMORY ORGANIZATION
The memory is organized as:
z
2,097,152 bytes
z
Uniform Sector Architecture
64 blocks of 32-Kbyte
32 blocks of 64-Kbyte
512 sectors of 4-Kbyte
8,092 pages (256 bytes each)
Each page can be individually programmed (bits are programmed from 1 to 0). The device is Sector,
Block or Chip Erasable but not Page Erasable.
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
5
©2014 Eon Silicon Solution, Inc.,
Rev. B, Issue Date: 2014/04/15
www.eonssi.com
EN25S16A
Table 2. Uniform Block Sector Architecture
42
41
40
39
38
37
36
35
17
16
34
33
32
….
190FFFh
18FFFFh
384
383
180000h
17F000h
180FFFh
17FFFFh
368
367
170000h
16F000h
170FFFh
16FFFFh
….
….
….
….
….
….
….
….
….
….
190000h
18F000h
….
….
….
….
….
….
….
….
….
….
….
….
….
400
399
352
351
160000h
15F000h
160FFFh
15FFFFh
….
43
1A0FFFh
19FFFFh
336
335
150000h
14F000h
150FFFh
14FFFFh
….
44
1A0000h
19F000h
320
319
140000h
13F000h
140FFFh
13FFFFh
….
45
416
415
304
303
130000h
12F000h
130FFFh
12FFFFh
….
46
1B0FFFh
1AFFFFh
….
47
1B0000h
1AF000h
….
48
432
431
….
49
1C0FFFh
1BFFFFh
….
50
1C0000h
1BF000h
….
51
448
447
288
287
120000h
11F000h
120FFFh
11FFFFh
….
18
52
1D0FFFh
1CFFFFh
272
271
110000h
10F000h
110FFFh
10FFFFh
….
19
53
1D0000h
1CF000h
….
20
54
464
463
….
21
55
1E0FFFh
1DFFFFh
….
22
56
1E0000h
1DF000h
….
23
57
480
479
….
24
58
1F0FFFh
1EFFFFh
….
25
59
1F0000h
1EF000h
….
26
60
496
495
….
27
61
1FFFFFh
….
28
62
Address range
1FF000h
….
29
63
511
….
30
Sector
….
31
32KB Block
….
64KB Block
256
100000h
100FFFh
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
6
©2014 Eon Silicon Solution, Inc.,
Rev. B, Issue Date: 2014/04/15
www.eonssi.com
EN25S16A
1
0
10
9
8
7
6
5
4
3
2
1
0
….
090FFFh
08FFFFh
128
127
080000h
07F000h
080FFFh
07FFFFh
112
111
070000h
06F000h
070FFFh
06FFFFh
….
….
….
….
….
….
….
….
….
….
090000h
08F000h
….
….
….
….
….
….
….
….
….
….
….
….
….
144
143
96
95
060000h
05F000h
060FFFh
05FFFFh
….
11
0A0FFFh
09FFFFh
80
79
050000h
04F000h
050FFFh
04FFFFh
….
12
0A0000h
09F000h
64
63
040000h
03F000h
040FFFh
03FFFFh
….
13
160
159
48
47
030000h
02F000h
030FFFh
02FFFFh
….
14
0B0FFFh
0AFFFFh
….
15
0B0000h
0AF000h
….
16
176
175
….
17
0C0FFFh
0BFFFFh
….
18
0C0000h
0BF000h
….
19
192
191
32
31
020000h
01F000h
020FFFh
01FFFFh
….
2
20
0D0FFFh
0CFFFFh
16
15
010000h
00F000h
010FFFh
00FFFFh
….
3
21
0D0000h
0CF000h
….
4
22
208
207
….
5
13
0E0FFFh
0DFFFFh
….
6
24
0E0000h
0DF000h
….
7
25
224
223
….
8
26
0F0FFFh
0EFFFFh
….
9
27
0F0000h
0EF000h
….
10
28
240
239
….
11
29
0FFFFFh
….
12
30
Address range
0FF000h
….
13
31
255
….
14
Sector
….
15
32KB Block
….
64KB Block
0
000000h
000FFFh
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
7
©2014 Eon Silicon Solution, Inc.,
Rev. B, Issue Date: 2014/04/15
www.eonssi.com
EN25S16A
OPERATING FEATURES
Standard SPI Modes
The EN25S16A is accessed through an SPI compatible bus consisting of four signals: Serial Clock
(CLK), Chip Select (CS#), Serial Data Input (DI) and Serial Data Output (DO). Both SPI bus operation
Modes 0 (0,0) and 3 (1,1) are supported. The primary difference between Mode 0 and Mode 3, as
shown in Figure 3, concerns the normal state of the CLK signal when the SPI bus master is in standby
and data is not being transferred to the Serial Flash. For Mode 0 the CLK signal is normally low. For
Mode 3 the CLK signal is normally high. In either case data input on the DI pin is sampled on the rising
edge of the CLK. Data output on the DO pin is clocked out on the falling edge of CLK.
Figure 3. SPI Modes
Dual SPI Instruction
The EN25S16A supports Dual SPI operation when using the “ Dual Output Fast Read and Dual I/ O
FAST_READ “ (3Bh and BBh) instructions. These instructions allow data to be transferred to or from
the Serial Flash memory at two to three times the rate possible with the standard SPI. The Dual Read
instructions are ideal for quickly downloading code from Flash to RAM upon power-up (code-shadowing)
or for application that cache code-segments to RAM for execution. The Dual output feature simply
allows the SPI input pin to also serve as an output during this instruction. When using Dual SPI
instructions the DI and DO pins become bidirectional I/O pins; DQ0 and DQ1. All other operations use
the standard SPI interface with single output signal.
Quad I/O SPI Modes
The EN25S16A supports Quad input / output operation when using the Quad I/O Fast Read (EBh).This
instruction allows data to be transferred to or from the Serial Flash memory at four to six times the rate
possible with the standard SPI. The Quad Read instruction offer a significant improvement in
continuous and random access transfer rates allowing fast code-shadowing to RAM or for application
that cache code-segments to RAM for execution. When using Quad SPI instruction the DI and DO pins
become bidirectional I/O pins; DQ0 and DQ1, and the WP# and HOLD# pins become DQ2 and DQ3
respectively.
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
8
©2014 Eon Silicon Solution, Inc.,
Rev. B, Issue Date: 2014/04/15
www.eonssi.com
EN25S16A
Figure 4. Quad I/O SPI Modes
Full Quad SPI Modes (QPI)
The EN25S16A also supports Full Quad SPI Mode (QPI) function while using the Enable Quad
Peripheral Interface mode (EQPI) (38h). When using Quad SPI instruction the DI and DO pins become
bidirectional I/O pins; DQ0 and DQ1, and the WP# and HOLD# pins become DQ2 and DQ3 respectively.
Figure 5. Full Quad SPI Modes
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
9
©2014 Eon Silicon Solution, Inc.,
Rev. B, Issue Date: 2014/04/15
www.eonssi.com
EN25S16A
Page Programming
To program one data byte, two instructions are required: Write Enable (WREN), which is one byte, and
a Page Program (PP) or Quad Input Page Program (QPP) sequence, which consists of four bytes plus
data. This is followed by the internal Program cycle (of duration tPP).
To spread this overhead, the Page Program (PP) instruction allows up to 256 bytes to be programmed
at a time (changing bits from 1 to 0) provided that they lie in consecutive addresses on the same page
of memory.
Sector Erase, Half Block Erase, Block Erase and Chip Erase
The Page Program (PP) instruction allows bits to be reset from 1 to 0. Before this can be applied, the
bytes of memory need to have been erased to all 1s (FFh). This can be achieved a sector at a time,
using the Sector Erase (SE) instruction, half a block at a time using the Half Block Erase (HBE)
instruction, a block at a time using the Block Erase (BE) instruction or throughout the entire memory,
using the Chip Erase (CE) instruction. This starts an internal Erase cycle (of duration tSE, tHBE, tBE or tCE).
The Erase instruction must be preceded by a Write Enable (WREN) instruction.
Polling During a Write, Program or Erase Cycle
A further improvement in the time to Write Status Register (WRSR), Program (PP) or Erase (SE, HBE ,
BE or CE) can be achieved by not waiting for the worst case delay (tW, tPP, tSE, tHBE, tBE or tCE). The Write
In Progress (WIP) bit is provided in the Status Register so that the application program can monitor its
value, polling it to establish when the previous Write cycle, Program cycle or Erase cycle is complete.
Active Power, Stand-by Power and Deep Power-Down Modes
When Chip Select (CS#) is Low, the device is enabled, and in the Active Power mode. When Chip
Select (CS#) is High, the device is disabled, but could remain in the Active Power mode until all internal
cycles have completed (Program, Erase, Write Status Register). The device then goes into the Standby Power mode. The device consumption drops to ICC1.
The Deep Power-down mode is entered when the specific instruction (the Enter Deep Power-down
Mode (DP) instruction) is executed. The device consumption drops further to ICC2. The device remains
in this mode until another specific instruction (the Release from Deep Power-down Mode and Read
Device ID (RDI) and Software Reset instruction) is executed.
All other instructions are ignored while the device is in the Deep Power-down mode. This can be used
as an extra software protection mechanism, when the device is not in active use, to protect the device
from inadvertent Write, Program or Erase instructions.
Status Register and Suspend Status Register
The Status Register and Suspend Status Register contain a number of status and control bits that can
be read or set (as appropriate) by specific instructions.
WIP bit. The Write In Progress (WIP) bit indicates whether the memory is busy with a Write Status
Register, Program or Erase cycle.
WEL bit. The Write Enable Latch (WEL) bit indicates the status of the internal Write Enable Latch.
BP3, BP2, BP1, BP0 bits. The Block Protect (BP3, BP2, BP1, BP0) bits are non-volatile. They define
the size of the area to be software protected against Program and Erase instructions.
WHDIS bit. The WP# and Hold# Disable bit (WHDIS bit), non-volatile bit, it indicates the WP# and
HOLD# are enabled or not. When it is “0” (factory default), the WP# and HOLD# are enabled. On the
other hand, while WHDIS bit is “1”, the WP# and HOLD# are disabled. No matter WHDIS is “0＂ or
“1＂, the system can executes Quad Input/Output FAST_READ (EBh), Quad Input Page Program (32h)
or EQPI (38h) command directly. User can use Flash Programmer to set WHDIS bit as “1＂ and then
the host system can let WP# and HOLD# keep floating in SPI mode.
SRP bit / OTP_LOCK bit The Status Register Protect (SRP) bit operates in conjunction with the Write
Protect (WP#) signal. The Status Register Protect (SRP) bit and Write Protect (WP#) signal allow the
device to be put in the Hardware Protected mode. In this mode, the non-volatile bits of the Status
Register (SRP, BP3, BP2, BP1, BP0) become read-only bits.
In OTP mode, this bit serves as OTP_LOCK bit, user can read/program/erase OTP sector as normal
sector while OTP_LOCK bit value is equal 0, after OTP_LOCK bit is programmed with 1 by WRSR
command, the OTP sector is protected from program and erase operation. The OTP_LOCK bit can only
be programmed once.
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
10
©2014 Eon Silicon Solution, Inc.,
Rev. B, Issue Date: 2014/04/15
www.eonssi.com
EN25S16A
Note : In OTP mode, the WRSR command will ignore any input data and program OTP_LOCK bit to 1,
user must clear the protect bits before entering OTP mode and program the OTP code, then execute
WRSR command to lock the OTP sector before leaving OTP mode.
WSE bit. The Write Suspend Erase Status (WSE) bit indicates when an Erase operation has been
suspended. The WSE bit is “1” after the host issues a suspend command during an Erase operation.
Once the suspended Erase resumes, the WSE bit is reset to “0”.
WSP bit. The Write Suspend Program Status (WSP) bit indicates when a Program operation has been
suspended. The WSP is “1” after the host issues a suspend command during the Program operation.
Once the suspended Program resumes, the WSP bit is reset to “0”.
Write Protection
Applications that use non-volatile memory must take into consideration the possibility of noise and other
adverse system conditions that may compromise data integrity. To address this concern the EN25S16A
provides the following data protection mechanisms:
z
Power-On Reset and an internal timer (tPUW) can provide protection against inadvertent changes
while the power supply is outside the operating specification.
z
Program, Erase and Write Status Register instructions are checked that they consist of a number
of clock pulses that is a multiple of eight, before they are accepted for execution.
z
All instructions that modify data must be preceded by a Write Enable (WREN) instruction to set
the Write Enable Latch (WEL) bit. This bit is returned to its reset state by the following events:
– Power-up
– Write Disable (WRDI) instruction completion or Write Status Register (WRSR) instruction
completion or Page Program (PP) instruction completion or Sector Erase (SE) instruction
completion or Half Block Erase (HBE) / Block Erase (BE) instruction completion or Chip Erase
(CE) instruction completion
z
The Block Protect (BP3, BP2, BP1, BP0) bits allow part of the memory to be configured as readonly. This is the Software Protected Mode (SPM).
z
The Write Protect (WP#) signal allows the Block Protect (BP3, BP2, BP1, BP0) bits and Status
Register Protect (SRP) bit to be protected. This is the Hardware Protected Mode (HPM).
z
In addition to the low power consumption feature, the Deep Power-down mode offers extra
software protection from inadvertent Write, Program and Erase instructions, as all instructions are
ignored except one particular instruction (the Release from Deep Power-down instruction).
Table 3. Protected Area Sizes Sector Organization
Status Register Content
BP3
Bit
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
BP2
Bit
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
BP1
Bit
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
BP0
Bit
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
Memory Content
Protect Areas
Addresses
None
Block 31
Block 30 to 31
Block 28 to 31
Block 24 to 31
Block 16 to 31
All
All
None
Block 0
Block 0 to 1
Block 0 to 3
Block 0 to 7
Block 0 to 15
All
All
None
1F0000h-1FFFFFh
1E0000h-1FFFFFh
1C0000h-1FFFFFh
180000h-1FFFFFh
100000h-1FFFFFh
000000h-1FFFFFh
000000h-1FFFFFh
None
000000h-00FFFFh
000000h-01FFFFh
000000h-03FFFFh
000000h-07FFFFh
000000h-0FFFFFh
000000h-1FFFFFh
000000h-1FFFFFh
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
11
Density(KB)
None
64KB
128KB
256KB
512KB
1024KB
2048KB
2048KB
None
64KB
128KB
256KB
512KB
1024KB
2048KB
2048KB
©2014 Eon Silicon Solution, Inc.,
Rev. B, Issue Date: 2014/04/15
Portion
None
Upper 1/32
Upper 2/32
Upper 4/32
Upper 8/32
Upper 16/32
All
All
None
Lower 1/32
Lower 2/32
Lower 4/32
Lower 8/32
Lower 16/32
All
All
www.eonssi.com
EN25S16A
INSTRUCTIONS
All instructions, addresses and data are shifted in and out of the device, most significant bit first. Serial
Data Input (DI) is sampled on the first rising edge of Serial Clock (CLK) after Chip Select (CS#) is
driven Low. Then, the one-byte instruction code must be shifted in to the device, most significant bit first,
on Serial Data Input (DI), each bit being latched on the rising edges of Serial Clock (CLK).
The instruction set is listed in Table 4. Every instruction sequence starts with a one-byte instruction
code. Depending on the instruction, this might be followed by address bytes, or by data bytes, or by
both or none. Chip Select (CS#) must be driven High after the last bit of the instruction sequence has
been shifted in. In the case of a Read Data Bytes (READ), Read Data Bytes at Higher Speed
(Fast_Read), Dual Output Fast Read (3Bh), Dual I/O Fast Read (BBh), Quad Input/Output
FAST_READ (EBh), Read Status Register (RDSR), Read Suspend Status Register (RDSSR) or
Release from Deep Power-down, and Read Device ID (RDI) instruction, the shifted-in instruction sequence is followed by a data-out sequence. Chip Select (CS#) can be driven High after any bit of the
data-out sequence is being shifted out.
In the case of a Page Program (PP), Sector Erase (SE), Half Block Erase (HBE), Block Erase (BE),
Chip Erase (CE), Write Status Register (WRSR), Write Enable (WREN), Write Disable (WRDI) or Deep
Power-down (DP) instruction, Chip Select (CS#) must be driven High exactly at a byte boundary,
otherwise the instruction is rejected, and is not executed. That is, Chip Select (CS#) must driven High
when the number of clock pulses after Chip Select (CS#) being driven Low is an exact multiple of eight.
For Page Program, if at any time the input byte is not a full byte, nothing will happen and WEL will not
be reset.
In the case of multi-byte commands of Page Program (PP), Quad Input Page Program (QPP) and
Release from Deep Power Down (RES) minimum number of bytes specified has to be given,
without which, the command will be ignored.
In the case of Page Program, if the number of byte after the command is less than 4 (at least 1
data byte), it will be ignored too. In the case of SE, HBE and BE, exact 24-bit address is a must,
any less or more will cause the command to be ignored.
All attempts to access the memory array during a Write Status Register cycle, Program cycle or Erase
cycle are ignored, and the internal Write Status Register cycle, Program cycle or Erase cycle continues
unaffected.
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
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©2014 Eon Silicon Solution, Inc.,
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EN25S16A
Table 4A. Instruction Set
Instruction Name
Byte 1
Code
RSTEN
66h
RST(1)
99h
EQPI
38h
RSTQIO(2)
Release Quad I/O or
Fast Read Enhanced
Mode
FFh
Write Enable
Write Disable / Exit
OTP mode
Read Status
Register
Read Suspend
Status Register
Byte 2
Byte 3
Byte 4
Byte 5
Byte 6
n-Bytes
06h
04h
05h
(S7-S0)(3)
continuous(4)
09h
(S7-S0)(3)
continuous(4)
Write Status
Register
01h
S7-S0
Page Program
02h
A23-A16
Quad Input Page
Program
32h
Write Suspend
B0h
Write Resume
Sector Erase / OTP
erase
32KB Half Block
Erase (HBE)
64KB Block Erase
30h
Chip Erase
C7h/ 60h
Deep Power-down
Release from Deep
Power-down, and
read Device ID
Release from Deep
Power-down
Manufacturer/
Device ID
Read Identification
Enter OTP mode
B9h
Read SFDP mode
A15-A8
A7-A0
A23-A16
A15-A8
A7-A0
20h
A23-A16
A15-A8
A7-A0
52h
A23-A16
A15-A8
A7-A0
D8h
A23-A16
A15-A8
A7-A0
D7-D0
Next byte
continuous
(one byte
per 2 clocks,
continuous)
(D7-D0, …) (5)
(6)
dummy
dummy
dummy
(ID7-ID0)
90h
dummy
dummy
(M7-M0)
(ID7-ID0)
(8)
(ID7-ID0)
(M7-M0)
(ID15-ID8)
00h
01h
(ID7-ID0)
9Fh
3Ah
(M7-M0)
5Ah
A23-A16
A15-A8
A7-A0
dummy
(D7-D0)
ABh
(7)
(Next Byte)
continuous
Notes:
1. RST command only executed if RSTEN command is executed first. Any intervening command will disable Reset.
2. Device accepts eight-clocks command in Standard SPI mode, or two-clocks command in Quad SPI mode
3. Data bytes are shifted with Most Significant Bit first. Byte fields with data in parenthesis “( )” indicate data being read from the
device on the DO pin.
4. The Status Register contents will repeat continuously until CS# terminate the instruction.
5. Quad Data
DQ0 = (D4, D0, …… )
DQ1 = (D5, D1, …… )
DQ2 = (D6, D2, …... )
DQ3 = (D7, D3, …... )
6. The Device ID will repeat continuously until CS# terminates the instruction.
7. The Manufacturer ID and Device ID bytes will repeat continuously until CS# terminates the instruction.
00h on Byte 4 starts with MID and alternate with DID, 01h on Byte 4 starts with DID and alternate with MID.
8. (M7-M0) : Manufacturer, (ID15-ID8) : Memory Type, (ID7-ID0) : Memory Capacity.
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
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EN25S16A
Table 4B. Instruction Set (Read Instruction)
Instruction Name
Byte 1
Code
Byte 2
Byte 3
Byte 4
Byte 5
Byte 6
n-Bytes
Read Data
03h
A23-A16
A15-A8
A7-A0
(D7-D0)
(Next byte)
continuous
Fast Read
0Bh
A23-A16
A15-A8
A7-A0
dummy
(D7-D0)
Dual Output Fast
Read
3Bh
A23-A16
A15-A8
A7-A0
dummy
(D7-D0, …) (1)
Dual I/O Fast Read
BBh
A23-A8(2)
A7-A0,
dummy (2)
(D7-D0, …) (1)
Quad I/O Fast Read
EBh
A23-A0,
dummy (4)
(dummy,
D7-D0 ) (5)
(D7-D0, …) (3)
Set Burst
C0h
(D7-D0)
Read Burst with
wrap
0Ch
A23-A16
A15-A8
A7-A0
dummy
(D7-D0)
(Next Byte)
continuous
(one byte
per 4 clocks,
continuous)
(one byte
per 4 clocks,
continuous)
(one byte
per 2 clocks,
continuous)
(6)
(Next Byte)
continuous
Notes:
1. Dual Output data
DQ0 = (D6, D4, D2, D0, ……)
DQ1 = (D7, D5, D3, D1, ……)
2. Dual Input Address
DQ0 = A22, A20, A18, A16, A14, A12, A10, A8 ; A6, A4, A2, A0, dummy 6, dummy 4, dummy 2, dummy 0
DQ1 = A23, A21, A19, A17, A15, A13, A11, A9 ; A7, A5, A3, A1, dummy 7, dummy 5, dummy 3, dummy 1
3. Quad Data
DQ0 = (D4, D0, …… )
DQ1 = (D5, D1, …… )
DQ2 = (D6, D2, …... )
DQ3 = (D7, D3, …... )
4. Quad Input Address
DQ0 = A20, A16, A12, A8, A4, A0, dummy 4, dummy 0
DQ1 = A21, A17, A13, A9, A5, A1, dummy 5, dummy 1
DQ2 = A22, A18, A14, A10, A6, A2, dummy 6, dummy 2
DQ3 = A23, A19, A15, A11, A7, A3, dummy 7, dummy 3
5. Quad I/O Fast Read Data
DQ0 = ( dummy 12, dummy 8, dummy 4, dummy 0, D4, D0, …… )
DQ1 = ( dummy 13, dummy 9, dummy 5, dummy 1, D5, D1, …… )
DQ2 = ( dummy 14, dummy 10, dummy 6, dummy 2, D6, D2, …… )
DQ3 = ( dummy 15, dummy 11, dummy 7, dummy 3, D7, D3, …… )
6. Set burst and Wrap Length
Table 5. Burst length configuration table
Data to setup
xxxxxx00b
xxxxxx01b
xxxxxx10b
xxxxxx11b
Burst length
8 Bytes ( default)
16 Bytes
32 Bytes
64 Bytes
Burst wrap (A[7:A0]) address range
00-07h, 08-0Fh, 10-17h, 18-1Fh...
00-0Fh, 10-1Fh, 20-2Fh, 30-3Fh...
00-1Fh, 20-3Fh, 40-5Fh, 60-7Fh...
00-3Fh, 40-7Fh, 80-BFh, C0-FFh
The data bit [7:2] are don't care, only [1:0] decodes 8/16/32/64 bytes length during Burst Read.
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
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EN25S16A
Table 6. Manufacturer and Device Identification
OP Code
(M7-M0)
(ID15-ID0)
(ID7-ID0)
ABh
74h
90h
1Ch
9Fh
1Ch
74h
3815h
Reset-Enable (RSTEN) (66h) and Reset (RST) (99h)
The Reset operation is used as a system (software) reset that puts the device in normal operating
Ready mode. This operation consists of two commands: Reset-Enable (RSTEN) and Reset (RST).
To reset the EN25S16A the host drives CS# low, sends the Reset-Enable command (66h), and drives
CS# high. Next, the host drives CS# low again, sends the Reset command (99h), and drives CS# high.
The Reset operation requires the Reset-Enable command followed by the Reset command. Any
command other than the Reset command after the Reset-Enable command will disable the ResetEnable.
A successful command execution will reset the Status register and the Suspend Status register to data
= 00h, see Figure 6 for SPI Mode and Figure 6.1 for QPI Mode. A device reset during an active
Program or Erase operation aborts the operation, which can cause the data of the targeted address
range to be corrupted or lost. Depending on the prior operation, the reset timing may vary. Recovery
from a Write operation requires more software latency time ( tSR) than recovery from other operations.
Please Figure 6.2.
Figure 6. Reset-Enable and Reset Sequence Diagram
Figure 6.1 . Reset-Enable and Reset Sequence Diagram in QPI Mode
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
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EN25S16A
Figure 6.2 Software Reset Recovery
Software Reset Flow
Note:
1. Reset-Enable (RSTEN) (66h) and Reset (RST) (99h) commands need to match standard SPI or QPI
(quad) mode.
2. Continue (Enhance) EB mode need to use quad Reset-Enable (RSTEN) (66h) and quad Reset (RST)
(99h) commands.
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EN25S16A
3. If user is not sure it is in SPI or Quad mode, we suggest to execute sequence as follows:
Quad Reset-Enable (RSTEN) (66h) -> Quad Reset (RST) (99h) -> SPI Reset-Enable (RSTEN) (66h)
-> SPI Reset (RST) (99h) to reset.
4. The reset command could be executed during embedded program and erase process, QPI mode,
Continue EB mode and suspend mode to back to SPI mode.
5. This flow cannot release the device from Deep power down mode.
6. The Status Register Bit and Suspend Status Register Bit will reset to default value after reset done.
7. If user reset device during erase, the embedded reset cycle software reset latency will take about
28us in worst case.
Enable Quad Peripheral Interface mode (EQPI) (38h)
The Enable Quad Peripheral Interface mode (EQPI) instruction will enable the flash device for Quad
SPI bus operation. Upon completion of the instruction, all instructions thereafter will be 4-bit multiplexed
input/output until a power cycle or “ Reset Quad I/O instruction “ instruction, as shown in Figure 7. The
device did not support the Read Data Bytes (READ) (03h), Dual Output Fast Read (3Bh), Dual
Input/Output FAST_READ (BBh) and Quad Input Page Program (32h) modes while the Enable Quad
Peripheral Interface mode (EQPI) (38h) turns on.
Figure 7. Enable Quad Peripheral Interface mode Sequence Diagram
Reset Quad I/O (RSTQIO) or Release Quad I/O Fast Read Enhancement Mode (FFh)
The Reset Quad I/O instruction resets the device to 1-bit Standard SPI operation. To execute a Reset
Quad I/O operation, the host drives CS# low, sends the Reset Quad I/O command cycle (FFh) then,
drives CS# high. This command can’t be used in Standard SPI mode.
User also can use the FFh command to release the Quad I/O Fast Read Enhancement Mode. The
detail description, please see the Quad I/O Fast Read Enhancement Mode section.
Note:
If the system is in the Quad I/O Fast Read Enhance Mode under QPI Mode, it is necessary to execute
FFh command by two times. The first FFh command is to release Quad I/O Fast Read Enhance Mode,
and the second FFh command is to release QPI Mode.
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or modifications due to changes in technical specifications.
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EN25S16A
Write Enable (WREN) (06h)
The Write Enable (WREN) instruction (Figure 8) sets the Write Enable Latch (WEL) bit. The Write
Enable Latch (WEL) bit must be set prior to every Page Program (PP), Sector Erase (SE), Half Block
Erase (HBE), Block Erase (BE), Chip Erase (CE) and Write Status Register (WRSR) instruction.
The Write Enable (WREN) instruction is entered by driving Chip Select (CS#) Low, sending the
instruction code, and then driving Chip Select (CS#) High.
The instruction sequence is shown in Figure 9.1 while using the Enable Quad Peripheral Interface
mode (EQPI) (38h) command.
Figure 8. Write Enable Instruction Sequence Diagram
Write Disable (WRDI) (04h)
The Write Disable instruction (Figure 9) resets the Write Enable Latch (WEL) bit in the Status Register
to a 0 or exit from OTP mode to normal mode. The Write Disable instruction is entered by driving Chip
Select (CS#) low, shifting the instruction code “04h” into the DI pin and then driving Chip Select (CS#)
high. Note that the WEL bit is automatically reset after Power-up and upon completion of the Write
Status Register, Page Program, Sector Erase, Half Block Erase (HBE), Block Erase (BE) and Chip
Erase instructions.
The instruction sequence is shown in Figure 9.1 while using the Enable Quad Peripheral Interface
mode (EQPI) (38h) command.
Figure 9. Write Disable Instruction Sequence Diagram
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
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EN25S16A
Figure 9.1 Write Enable/Disable Instruction Sequence in QPI Mode
Read Status Register (RDSR) (05h)
The Read Status Register (RDSR) instruction allows the Status Register to be read. The Status
Register may be read at any time, even while a Program, Erase or Write Status Register cycle is in
progress. When one of these cycles is in progress, it is recommended to check the Write In Progress
(WIP) bit before sending a new instruction to the device. It is also possible to read the Status Register
continuously, as shown in Figure 10.
The instruction sequence is shown in Figure 10.1 while using the Enable Quad Peripheral Interface
mode (EQPI) (38h) command.
Figure 10. Read Status Register Instruction Sequence Diagram
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
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EN25S16A
Figure 10.1 Read Status Register Instruction Sequence in QPI Mode
Table 7. Status Register Bit Locations
S7
SRP
Status
Register
Protect
1 = status
register write
disable
S6
OTP_LOCK
bit
(note 1)
1 = OTP
sector is
protected
Non-volatile bit
WHDIS
WP# & Hold#
Disable bit
1 = WP# and
HOLD# disable
0 = WP# and
HOLD# enable
S5
S4
S3
S2
S1
BP3
BP2
BP1
BP0
WEL
(Block
(Block
(Block
(Block
(Write Enable
Protected bits) Protected bits) Protected bits) Protected bits)
Latch)
(note 2)
(note 2)
(note 2)
(note 2)
S0
WIP
(Write In
Progress bit)
(Note 3)
1 = write
enable
0 = not write
enable
1 = write
operation
0 = not in write
operation
volatile bit
volatile bit
Non-volatile bit Non-volatile bit. Non-volatile bit Non-volatile bit Non-volatile bit
Note
1. In OTP mode, SRP bit is served as OTP_LOCK bit.
2. See the table 3 “Protected Area Sizes Sector Organization”.
3. When executed the (RDSR) (05h) command, the WIP (S0) value is the same as WIP (S7) in table 8.
The status and control bits of the Status Register are as follows:
WIP bit. The Write In Progress (WIP) bit indicates whether the memory is busy with a Write Status
Register, Program or Erase cycle. When set to 1, such a cycle is in progress, when reset to 0 no such
cycle is in progress.
WEL bit. The Write Enable Latch (WEL) bit indicates the status of the internal Write Enable Latch.
When set to 1 the internal Write Enable Latch is set, when set to 0 the internal Write Enable Latch is
reset and no Write Status Register, Program or Erase instruction is accepted.
BP3, BP2, BP1, BP0 bits. The Block Protect (BP3, BP2, BP1, BP0) bits are non-volatile. They define
the size of the area to be software protected against Program and Erase instructions. These bits are
written with the Write Status Register (WRSR) instruction. When one or both of the Block Protect (BP3,
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EN25S16A
BP2, BP1, BP0) bits is set to 1, the relevant memory area (as defined in Table 3.) becomes protected
against Page Program (PP) Sector Erase (SE), Half Block Erase (HBE) and Block Erase (BE),
instructions. The Block Protect (BP3, BP2, BP1, BP0) bits can be written and provided that the Hardware Protected mode has not been set. The Chip Erase (CE) instruction is executed if, and only if, all
Block Protect (BP3, BP2, BP1, BP0) bits are 0.
WHDIS bit. The WP# and Hold# Disable bit (WHDIS bit), non-volatile bit, it indicates the WP# and
HOLD# are enabled or not. When it is “0” (factory default), the WP# and HOLD# are enabled. On the
other hand, while WHDIS bit is “1”, the WP# and HOLD# are disabled. No matter WHDIS is “0＂ or
“1＂, the system can executes Quad Input/Output FAST_READ (EBh), Quad Input Page Program (32h)
or EQPI (38h) command directly. User can use Flash Programmer to set WHDIS bit as “1＂ and then
the host system can let WP# and HOLD# keep floating in SPI mode.
SRP bit / OTP_LOCK bit. The Status Register Protect (SRP) bit is operated in conjunction with the
Write Protect (WP#) signal. The Status Register Write Protect (SRP) bit and Write Protect (WP#) signal
allow the device to be put in the Hardware Protected mode (when the Status Register Protect (SRP) bit
is set to 1, and Write Protect (WP#) is driven Low). In this mode, the non-volatile bits of the Status
Register (SRP, BP3, BP2, BP1, BP0) become read-only bits and the Write Status Register (WRSR)
instruction is no longer accepted for execution.
In OTP mode, this bit is served as OTP_LOCK bit, user can read/program/erase OTP sector as normal
sector while OTP_LOCK value is equal 0, after OTP_LOCK is programmed with 1 by WRSR command,
the OTP sector is protected from program and erase operation. The OTP_LOCK bit can only be
programmed once.
Note : In OTP mode, the WRSR command will ignore any input data and program OTP_LOCK bit to 1,
user must clear the protect bits before enter OTP mode and program the OTP code, then execute
WRSR command to lock the OTP sector before leaving OTP mode.
Read Suspend Status Register (RDSSR) (09h)
The Read Suspend Status Register (RDSSR) instruction allows the Suspend Status Register to be
read. The Suspend Status Register may be read at any time, even while a Write Suspend or Write
Resume cycle is in progress. When one of these cycles is in progress, it is recommended to check the
Write In Progress (WIP) bit before sending a new instruction to the device. It is also possible to read the
Suspend Status Register continuously, as shown in Figure 11.
The instruction sequence is shown in Figure 11.1 while using the Enable Quad Peripheral Interface
mode (EQPI) (38h) command.
Figure 11. Read Suspend Status Register Instruction Sequence Diagram
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or modifications due to changes in technical specifications.
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EN25S16A
Figure 11.1 Read Suspend Status Register Instruction Sequence in QPI Mode
Table 8. Suspend Status Register Bit Locations
S7
WIP
(Write In
Progress bit)
(Note 1)
1 = write
operation
0 = not in write
operation
volatile bit
S6
S5
S4
S3
Fail bit
index
Reserved 1 = erase or Reserved
bit
bit
program or
WRSR
failed
0 = passed
volatile bit
S2
S1
S0
WSP
WSE
WEL
(Write Suspend
Program bits)
(Write Suspend
Erase status bit)
(Write Enable
Latch)
1 = Program
suspended
0 = Program is
not suspended
1 = Erase
1 = write enable
suspended
0 = not write
0 = Erase is not
enable
suspended
volatile bit
volatile bit
Reserved
bit
volatile bit
Note:
1. When executed the (RDSSR) (09h) command, the WIP (S7) value is the same as WIP (S0) in table 7.
2. Default at Power-up is “0”
The status and control bits of the Suspend Status Register are as follows:
Reserved bit. Suspend Status register bit locations 0, 4 and 6 are reserved for future use. Current
devices will read 0 for these bit locations. It is recommended to mask out the reserved bit when testing
the Suspend Status Register. Doing this will ensure compatibility with future devices.
WEL bit. The Write Enable Latch (WEL) bit indicates the status of the internal Write Enable Latch.
When set to 1 the internal Write Enable Latch is set, when set to 0 the internal Write Enable Latch is
reset and no Write Suspend or Write Resume instruction is accepted.
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EN25S16A
WSE bit. The Write Suspend Erase Status (WSE) bit indicates when an Erase operation has been
suspended. The WSE bit is “1” after the host issues a suspend command during an Erase operation.
Once the suspended Erase resumes, the WSE bit is reset to “0”.
WSP bit. The Write Suspend Program Status (WSP) bit indicates when a Program operation has been
suspended. The WSP is “1” after the host issues a suspend command during the Program operation.
Once the suspended Program resumes, the WSP bit is reset to “0”.
Fail bit. The fail bit, volatile bit, it will latched high when erase or program or WRSR failed. It will be
reset after new embedded program and erase cycle re-stared or power on or software reset.
WIP bit. The Write In Progress (WIP) bit indicates whether the memory is busy with a Write Suspend or
Write Resume cycle. When set to 1, such a cycle is in progress, when reset to 0 no such cycle is in
progress.
Write Status Register (WRSR) (01h)
The Write Status Register (WRSR) instruction allows new values to be written to the Status Register.
Before it can be accepted, a Write Enable (WREN) instruction must previously have been executed.
After the Write Enable (WREN) instruction has been decoded and executed, the device sets the Write
Enable Latch (WEL).
The Write Status Register (WRSR) instruction is entered by driving Chip Select (CS#) Low, followed by
the instruction code and the data byte on Serial Data Input (DI).
The instruction sequence is shown in Figure 12. The Write Status Register (WRSR) instruction has no
effect on S1 and S0 of the Status Register. Chip Select (CS#) must be driven High after the eighth bit of
the data byte has been latched in. If not, the Write Status Register (WRSR) instruction is not executed.
As soon as Chip Select (CS#) is driven High, the self-timed Write Status Register cycle (whose
duration is tW) is initiated. While the Write Status Register cycle is in progress, the Status Register may
still be read to check the value of the Write In Progress (WIP) bit. The Write In Progress (WIP) bit is 1
during the self-timed Write Status Register cycle, and is 0 when it is completed. When the cycle is
completed, the Write Enable Latch (WEL) is reset.
The Write Status Register (WRSR) instruction allows the user to change the values of the Block Protect
(BP3, BP2, BP1, BP0) bits, to define the size of the area that is to be treated as read-only, as defined in
Table 3. The Write Status Register (WRSR) instruction also allows the user to set or reset the Status
Register Protect (SRP) bit in accordance with the Write Protect (WP#) signal. The Status Register
Protect (SRP) bit and Write Protect (WP#) signal allow the device to be put in the Hardware Protected
Mode (HPM). The Write Status Register (WRSR) instruction is not executed once the Hardware
Protected Mode (HPM) is entered.
The instruction sequence is shown in Figure 12.1 while using the Enable Quad Peripheral Interface
mode (EQPI) (38h) command.
NOTE : In the OTP mode, WRSR command will ignore input data and program OTP_LOCK bit to 1.
Figure 12. Write Status Register Instruction Sequence Diagram
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or modifications due to changes in technical specifications.
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EN25S16A
Figure 12.1 Write Status Register Instruction Sequence in QPI Mode
Read Data Bytes (READ) (03h)
The device is first selected by driving Chip Select (CS#) Low. The instruction code for the Read Data
Bytes (READ) instruction is followed by a 3-byte address (A23-A0), each bit being latched-in during the
rising edge of Serial Clock (CLK). Then the memory contents, at that address, is shifted out on Serial
Data Output (DO), each bit being shifted out, at a maximum frequency fR, during the falling edge of
Serial Clock (CLK).
The instruction sequence is shown in Figure 13. The first byte addressed can be at any location. The
address is automatically incremented to the next higher address after each byte of data is shifted out.
The whole memory can, therefore, be read with a single Read Data Bytes (READ) instruction. When
the highest address is reached, the address counter rolls over to 000000h, allowing the read sequence
to be continued indefinitely.
The Read Data Bytes (READ) instruction is terminated by driving Chip Select (CS#) High. Chip Select
(CS#) can be driven High at any time during data output. Any Read Data Bytes (READ) instruction,
while an Erase, Program or Write cycle is in progress, is rejected without having any effects on the
cycle that is in progress.
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
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EN25S16A
Figure 13. Read Data Instruction Sequence Diagram
Read Data Bytes at Higher Speed (FAST_READ) (0Bh)
The device is first selected by driving Chip Select (CS#) Low. The instruction code for the Read Data
Bytes at Higher Speed (FAST_READ) instruction is followed by a 3-byte address (A23-A0) and a
dummy byte, each bit being latched-in during the rising edge of Serial Clock (CLK). Then the memory
contents, at that address, is shifted out on Serial Data Output (DO), each bit being shifted out, at a
maximum frequency FR, during the falling edge of Serial Clock (CLK).
The instruction sequence is shown in Figure 14. The first byte addressed can be at any location. The
address is automatically incremented to the next higher address after each byte of data is shifted out.
The whole memory can, therefore, be read with a single Read Data Bytes at Higher Speed
(FAST_READ) instruction. When the highest address is reached, the address counter rolls over to
000000h, allowing the read sequence to be continued indefinitely.
The Read Data Bytes at Higher Speed (FAST_READ) instruction is terminated by driving Chip Select
(CS#) High. Chip Select (CS#) can be driven High at any time during data output. Any Read Data Bytes
at Higher Speed (FAST_READ) instruction, while an Erase, Program or Write cycle is in progress, is
rejected without having any effects on the cycle that is in progress.
The instruction sequence is shown in Figure 14.1 while using the Enable Quad Peripheral Interface
mode (EQPI) (38h) command.
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
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©2014 Eon Silicon Solution, Inc.,
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Figure 14. Fast Read Instruction Sequence Diagram
Figure 14.1 Fast Read Instruction Sequence in QPI Mode
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EN25S16A
Dual Output Fast Read (3Bh)
The Dual Output Fast Read (3Bh) is similar to the standard Fast Read (0Bh) instruction except that
data is output on two pins, DQ0 and DQ1, instead of just DQ0. This allows data to be transferred from
the EN25S16A at twice the rate of standard SPI devices. The Dual Output Fast Read instruction is ideal
for quickly downloading code from to RAM upon power-up or for applications that cache codesegments to RAM for execution.
Similar to the Fast Read instruction, the Dual Output Fast Read instructions can operation at the
highest possible frequency of FR (see AC Electrical Characteristics). This is accomplished by adding
eight “dummy clocks after the 24-bit address as shown in figure 15. The dummy clocks allow the
device’s internal circuits additional time for setting up the initial address. The input data during the
dummy clock is “don’t care”. However, the DI pin should be high-impedance prior to the falling edge of
the first data out clock.
Figure 15. Dual Output Fast Read Instruction Sequence Diagram
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Dual Input / Output FAST_READ (BBh)
The Dual I/O Fast Read (BBh) instruction allows for improved random access while maintaining two IO
pins, DQ0 and DQ1. It is similar to the Dual Output Fast Read (3Bh) instruction but with the capability to
input the Address bits (A23-0) two bits per clock. This reduced instruction overhead may allow for code
execution (XIP) directly from the Dual SPI in some applications.
The Dual I/O Fast Read instruction enable double throughput of Serial Flash in read mode. The
address is latched on rising edge of CLK, and data of every two bits (interleave 2 I/O pins) shift out on
the falling edge of CLK at a maximum frequency. The first address can be at any location. The address
is automatically increased to the next higher address after each byte data is shifted out, so the whole
memory can be read out at a single Dual I/O Fast Read instruction. The address counter rolls over to 0
when the highest address has been reached. Once writing Dual I/O Fast Read instruction, the following
address/dummy/data out will perform as 2-bit instead of previous 1-bit, as shown in Figure 16.
Figure 16. Dual Input / Output Fast Read Instruction Sequence Diagram
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EN25S16A
Quad Input / Output FAST_READ (EBh)
The Quad Input/Output FAST_READ (EBh) instruction is similar to the Dual I/O Fast Read (BBh)
instruction except that address and data bits are input and output through four pins, DQ0, DQ1, DQ2 and
DQ3 and six dummy clocks are required prior to the data output. The Quad I/O dramatically reduces
instruction overhead allowing faster random access for code execution (XIP) directly from the Quad SPI.
The Quad Input/Output FAST_READ (EBh) instruction enable quad throughput of Serial Flash in read
mode. The address is latching on rising edge of CLK, and data of every four bits (interleave on 4 I/O
pins) shift out on the falling edge of CLK at a maximum frequency FR. The first address can be any
location. The address is automatically increased to the next higher address after each byte data is
shifted out, so the whole memory can be read out at a single Quad Input/Output FAST_READ
instruction. The address counter rolls over to 0 when the highest address has been reached. Once
writing Quad Input/Output FAST_READ instruction, the following address/dummy/data out will perform
as 4-bit instead of previous 1-bit.
The sequence of issuing Quad Input/Output FAST_READ (EBh) instruction is: CS# goes low ->
sending Quad Input/Output FAST_READ (EBh) instruction -> 24-bit address interleave on DQ3, DQ2,
DQ1 and DQ0 -> 6 dummy clocks -> data out interleave on DQ3, DQ2, DQ1 and DQ0 -> to end Quad
Input/Output FAST_READ (EBh) operation can use CS# to high at any time during data out, as shown
in Figure 17.
The instruction sequence is shown in Figure 17.1 while using the Enable Quad Peripheral Interface mode
(EQPI) (38h) command.
Figure 17. Quad Input / Output Fast Read Instruction Sequence Diagram
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Figure 17.1. Quad Input / Output Fast Read Instruction Sequence in QPI Mode
Another sequence of issuing Quad Input/Output FAST_READ (EBh) instruction especially useful in
random access is : CS# goes low -> sending Quad Input/Output FAST_READ (EBh) instruction -> 24bit address interleave on DQ3, DQ2, DQ1 and DQ0 -> performance enhance toggling bit P[7:0] -> 4
dummy clocks -> data out interleave on DQ3, DQ2, DQ1 and DQ0 till CS# goes high -> CS# goes low
(reduce Quad Input/Output FAST_READ (EBh) instruction) -> 24-bit random access address, as shown
in Figure 18.
In the performance – enhancing mode, P[7:4] must be toggling with P[3:0] ; likewise P[7:0] = A5h, 5Ah,
F0h or 0Fh can make this mode continue and reduce the next Quad Input/Output FAST_READ (EBh)
instruction. Once P[7:4] is no longer toggling with P[3:0] ; likewise P[7:0] = FFh, 00h, AAh or 55h. These
commands will reset the performance enhance mode. And afterwards CS# is raised or issuing FFh
command (CS# goes high -> CS# goes low -> sending FFh -> CS# goes high) instead of no toggling,
the system then will escape from performance enhance mode and return to normal operation.
While Program/ Erase/ Write Status Register is in progress, Quad Input/Output FAST_READ (EBh)
instruction is rejected without impact on the Program/ Erase/ Write Status Register current cycle.
The instruction sequence is shown in Figure 18.1 while using the Enable Quad Peripheral Interface
mode (EQPI) (38h) command.
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EN25S16A
Figure 18. Quad Input/Output Fast Read Enhance Performance Mode Sequence Diagram
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EN25S16A
Figure 18.1 Quad Input/Output Fast Read Enhance Performance Mode Sequence in QPI Mode
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EN25S16A
Set Burst (C0h)
The Set Burst command specifies the number of bytes to be output during a Read Bust command
before the device wraps around. To set the burst length the host driver CS# low, sends the Set Burst
command cycle (C0h) and one data cycle, then drivers CS# high, After power-up or reset, the burst
length is set to 8 bytes (00h), please refer to Table 5 for burst length data and Figure 19 for the
sequence. In QPI mode, a cycle is two nibbles, or two clocks, long, most significant nibble first.
The instruction sequence is shown in Figure 19.1 while using the Enable Quad Peripheral Interface
mode (EQPI) (38h) command.
Figure 19. Set Burst Instruction Sequence Diagram
Figure 19.1 Set Burst Instruction Sequence Diagram in QPI mode
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EN25S16A
Read Burst (0Ch)
To execute a Read Burst operation (Figure 20) the host drivers CS# low, and sends the Read Burst
command cycle (0Ch), followed by three address cycles and one dummy cycles (8 clocks).
After the dummy cycle, the device outputs data on the falling edge of the CLK signal starting from the
specific address location. The data output stream is continuous through all addresses until terminated
by a low-to high transition of CS# signal.
During Read Burst, the internal address point automatically increments until the last byte of the burst
reached, then jumps to first byte of the burst. All bursts are aligned to addresses within the bust length,
see Table 9. For example, if the burst length is 8 bytes, and the start address is 06h, the burst
sequence should be: 06h, 07h, 00h, 01h, 02h, 03h, 04h, 05h, 06h, etc. The pattern would repeat until
the command was terminated by pulling CS# as high status.
The instruction sequence is shown in Figure 20.1 while using the Enable Quad Peripheral Interface mode
(EQPI) (38h) command.
Table 9. Burst Address Range
Burst length
8 Bytes ( default)
16 Bytes
32 Bytes
64 Bytes
Burst wrap (A[7:A0]) address range
00-07h, 08-0Fh, 10-17h, 18-1Fh...
00-0Fh, 10-1Fh, 20-2Fh, 30-3Fh...
00-1Fh, 20-3Fh, 40-5Fh, 60-7Fh...
00-3Fh, 40-7Fh, 80-BFh, C0-FFh
CS#
0
1
2
3
4
5
6
7
8
9
10
28
29
30
31
32
33
34
35
36
37
38
39
CLK
Command
3 Address bytes
(24 clocks)
0Ch
DI
A23
A22
A21
A3
Dummy Byte
A2
A1
A0
*
DO
D7
D6
D5
D4
D3
D2
D1
D0
*
* = MSB
CS#
39
40
41
42
43
44
45
46
47
48
49
54
55
n
n+1
CLK
Data Byte 1
DI
DO
Data Byte n
Data Byte 2
D0
D7
D6
D5
D4
D3
D2
D1
D0
*
D7
D6
D1
D0
D7
*
D6
D5
D4
D3
D2
D1
D0
*
D7
*
CS#
CLK
Data Byte 1
Data Byte n
Data Byte 2
DI
DO
D7
*
D6
D5
D4
D3
D2
D1
D0
D7
D6
D1
D0
D7
*
D6
D5
D4
D3
D2
*
D1
D0
D7
*
Figure 20. Read Burst Instruction Sequence Diagram
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EN25S16A
Figure 20.1 Read Burst Instruction Sequence Diagram in QPI mode
Page Program (PP) (02h)
The Page Program (PP) instruction allows bytes to be programmed in the memory. Before it can be
accepted, a Write Enable (WREN) instruction must previously have been executed. After the Write
Enable (WREN) instruction has been decoded, the device sets the Write Enable Latch (WEL).
The Page Program (PP) instruction is entered by driving Chip Select (CS#) Low, followed by the instruction code, three address bytes and at least one data byte on Serial Data Input (DI). If the 8 least
significant address bits (A7-A0) are not all zero, all transmitted data that goes beyond the end of the
current page are programmed from the start address of the same page (from the address whose 8
least significant bits (A7-A0) are all zero). Chip Select (CS#) must be driven Low for the entire duration
of the sequence.
The instruction sequence is shown in Figure 21. If more than 256 bytes are sent to the device, previously latched data are discarded and the last 256 data bytes are guaranteed to be programmed correctly within the same page. If less than 256 Data bytes are sent to device, they are correctly programmed at the requested addresses without having any effects on the other bytes of the same page.
Chip Select (CS#) must be driven High after the eighth bit of the last data byte has been latched in,
otherwise the Page Program (PP) instruction is not executed.
As soon as Chip Select (CS#) is driven high, the self-timed Page Program cycle (whose duration is tPP)
is initiated. While the Page Program cycle is in progress, the Status Register may be read to check the
value of the Write In Progress (WIP) bit. The Write In Progress (WIP) bit is 1 during the self-timed Page
Program cycle, and is 0 when it is completed. At some unspecified time before the cycle is completed,
the Write Enable Latch (WEL) bit is reset.
A Page Program (PP) instruction applied to a page which is protected by the Block Protect (BP3, BP2,
BP1, BP0) bits (see Table 3) is not executed.
The instruction sequence is shown in Figure 21.1 while using the Enable Quad Peripheral Interface mode
(EQPI) (38h) command.
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Figure 21. Page Program Instruction Sequence Diagram
Figure 21.1 Program Instruction Sequence in QPI Mode
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EN25S16A
Quad Input Page Program (QPP) (32h)
The Quad Page Program (QPP) instruction allows up to 256 bytes of data to be programmed at
previously erased (FFh) memory locations using four pins: DQ0, DQ1, DQ2 and DQ3. The Quad Page
Program can improve performance for PROM Programmer and applications that have slow clock
speeds < 5MHz. Systems with faster clock speed will not realize much benefit for the Quad Page
Program instruction since the inherent page program time is much greater than the time it take to clockin the data.
A Write Enable instruction must be executed before the device will accept the Quad Page Program
(QPP) instruction (Status Register-1, WEL=1). The instruction is initiated by driving the CS# pin low
then shifting the instruction code “32h” followed by a 24-bit address (A23-A0) and at least one data byte,
into the IO pins. The CS# pin must be held low for the entire length of the instruction while data is being
sent to the device. All other functions of Quad Page Program (QPP) are identical to standard Page
Program. The Quad Page Program (QPP) instruction sequence is shown in Figure 22.
Figure 22. Quad Input Page Program Instruction Sequence Diagram (SPI Mode only)
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EN25S16A
Write Suspend (B0h)
Write Suspend allows the interruption of Sector Erase, Half Block Erase, Block Erase or Page Program
operations in order to erase, program, or read data in another portion of memory. The original operation
can be continued with Write Resume command. The instruction sequence is shown in Figure 23.
Only one write operation can be suspended at a time; if an operation is already suspended, the device
will ignore the Write Suspend command. Write Suspend during Chip Erase is ignored; Chip Erase is
not a valid command while a write is suspended.
Suspend to suspend ready timing: 20us.
Resume to another suspend timing: 1ms.
Figure 23. Write Suspend Instruction Sequence Diagram
Write Suspend During Sector Erase or Block Erase
Issuing a Write Suspend instruction during Sector Erase, Half Block Erase or Block Erase allows the
host to program or read any sector that was not being erased. The device will ignore any programming
commands pointing to the suspended sector(s). Any attempt to read from the suspended sector(s) will
out put unknown data because the Sector or Block Erase will be incomplete.
To execute a Write Suspend operation, the host drives CS# low, sends the Write Suspend command
cycle (B0h), then drives CS# high. A cycle is two nibbles long, most significant nibble first. The
Suspend Status register indicates that the erase has been suspended by changing the WSE bit from
“0” to “1”, but the device will not accept another command until it is ready. To determine when the
device will accept a new command, poll the WIP bit in the Suspend Status register or after issue
program suspend command, latency time 20us is needed before issue another command. For
“Suspend to Read”, “Resume to Read”, “Resume to Suspend” timing specification please note Figure
24.1, 24.2 and 24.3.
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Write Suspend During Page Programming
Issuing a Write Suspend instruction during Page Programming allows the host to erase or read any
sector that is not being programmed. Erase commands pointing to the suspended sector(s) will be
ignored. Any attempt to read from the suspended page will output unknown data because the program
will be incomplete.
To execute a Write Suspend operation, the host drives CS# low, sends the Write Suspend command
cycle (B0h), then drives CS# high. A cycle is two nibbles long, most significant nibble first. The
Suspend Status register indicates that the programming has been suspended by changing the WSP bit
from “0” to “1”, but the device will not accept another command until it is ready. To determine when the
device will accept a new command, poll the WIP bit in the Suspend Status register or wait after issue
program suspend command, latency time 20us is needed before issue another command. For
“Suspend to Read”, “Resume to Read”, “Resume to Suspend” timing specification please note Figure
24.1, 24.2 and 24.3.
The instruction sequence is shown in Figure 25.1 while using the Enable Quad Peripheral Interface mode
(EQPI) (38h) command.
Figure 24.1 Suspend to Read Latency
Figure 24.2 Resume to Read Latency
Figure 24.3 Resume to Suspend Latency
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Write Resume (30h)
Write Resume restarts a Write command that was suspended, and changes the suspend status bit in
the Suspend Status register (WSE or WSP) back to “0”.
The instruction sequence is shown in Figure 25. To execute a Write Resume operation, the host drives
CS# low, sends the Write Resume command cycle (30h), then drives CS# high. A cycle is two nibbles
long, most significant nibble first. To determine if the internal, self-timed Write operation completed, poll
the WIP bit in the Suspend Status register, or wait the specified time tSE, tHBE, tBE or tPP for Sector Erase,
Half Block Erase, Block Erase, or Page Programming, respectively. The total write time before suspend
and after resume will not exceed the uninterrupted write times tSE, tHBE, tBE or tPP. Resume to another
suspend operation requires latency time of 1ms.
The instruction sequence is shown in Figure 25.1 while using the Enable Quad Peripheral Interface mode
(EQPI) (38h) command.
Figure 25. Write Resume Instruction Sequence Diagram
Figure 25.1 Write Suspend/Resume Instruction Sequence in QPI Mode
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Figure 26. Write Suspend/Resume Flow
Note:
1. The ‘WIP’ can be either checked by command ‘09’or ‘05’ polling.
2. ‘Wait for write cycle’ can be referring to maximum write cycle time or polling the WIP.
3. ‘Wait for suspend latency’, after issue program suspend command, latency time 20us is needed
before issue another command or polling the WIP.
4. The ‘WES’ and ‘WSE’ can be checked by command ‘09’ polling.
5. ‘Suspend done’ means the chip can do further operations allowed by suspend spec.
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EN25S16A
Sector Erase (SE) (20h)
The Sector Erase (SE) instruction sets to 1 (FFh) all bits inside the chosen sector. Before it can be
accepted, a Write Enable (WREN) instruction must previously have been executed. After the Write
Enable (WREN) instruction has been decoded, the device sets the Write Enable Latch (WEL).
The Sector Erase (SE) instruction is entered by driving Chip Select (CS#) Low, followed by the instruction code, and three address bytes on Serial Data Input (DI). Any address inside the Sector (see
Table 2) is a valid address for the Sector Erase (SE) instruction. Chip Select (CS#) must be driven Low
for the entire duration of the sequence.
The instruction sequence is shown in Figure 27. Chip Select (CS#) must be driven High after the eighth
bit of the last address byte has been latched in, otherwise the Sector Erase (SE) instruction is not
executed. As soon as Chip Select (CS#) is driven High, the self-timed Sector Erase cycle (whose duration is tSE) is initiated. While the Sector Erase cycle is in progress, the Status Register may be read
to check the value of the Write In Progress (WIP) bit. The Write In Progress (WIP) bit is 1 during the
self-timed Sector Erase cycle, and is 0 when it is completed. At some unspecified time before the cycle
is completed, the Write Enable Latch (WEL) bit is reset.
A Sector Erase (SE) instruction applied to a sector which is protected by the Block Protect (BP3, BP2,
BP1, BP0) bits (see Table 3) is not executed.
The instruction sequence is shown in Figure 29.1 while using the Enable Quad Peripheral Interface
mode (EQPI) (38h) command.
Figure 27. Sector Erase Instruction Sequence Diagram
32KB Half Block Erase (HBE) (52h)
The Half Block Erase (HBE) instruction sets to 1 (FFh) all bits inside the chosen block. Before it can be
accepted, a Write Enable (WREN) instruction must previously have been executed. After the Write
Enable (WREN) instruction has been decoded, the device sets the Write Enable Latch (WEL).
The Half Block Erase (HBE) instruction is entered by driving Chip Select (CS#) Low, followed by the instruction code, and three address bytes on Serial Data Input (DI). Any address inside the Block (see
Table 2) is a valid address for the Block Erase (BE) instruction. Chip Select (CS#) must be driven Low
for the entire duration of the sequence.
The instruction sequence is shown in Figure 28. Chip Select (CS#) must be driven High after the eighth
bit of the last address byte has been latched in, otherwise the Half Block Erase (HBE) instruction is not
executed. As soon as Chip Select (CS#) is driven High, the self-timed Half Block Erase cycle (whose
duration is tHBE) is initiated. While the Half Block Erase cycle is in progress, the Status Register may
be read to check the value of the Write In Progress (WIP) bit. The Write In Progress (WIP) bit is 1
during the self-timed Half Block Erase cycle, and is 0 when it is completed. At some unspecified time
before the cycle is completed, the Write Enable Latch (WEL) bit is reset.
A Half Block Erase (HBE) instruction applied to a block which is protected by the Block Protect (BP3,
BP2, BP1, BP0) bits (see Table 3) is not executed.
The instruction sequence is shown in Figure 29.1 while using the Enable Quad Peripheral Interface mode
(EQPI) (38h) command.
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EN25S16A
Figure 28. 32KB Half Block Erase Instruction Sequence Diagram
64KB Block Erase (BE) (D8h)
The Block Erase (BE) instruction sets to 1 (FFh) all bits inside the chosen block. Before it can be
accepted, a Write Enable (WREN) instruction must previously have been executed. After the Write
Enable (WREN) instruction has been decoded, the device sets the Write Enable Latch (WEL).
The Block Erase (BE) instruction is entered by driving Chip Select (CS#) Low, followed by the instruction code, and three address bytes on Serial Data Input (DI). Any address inside the Block (see
Table 2) is a valid address for the Block Erase (BE) instruction. Chip Select (CS#) must be driven Low
for the entire duration of the sequence.
The instruction sequence is shown in Figure 29. Chip Select (CS#) must be driven High after the eighth
bit of the last address byte has been latched in, otherwise the Block Erase (BE) instruction is not
executed. As soon as Chip Select (CS#) is driven High, the self-timed Block Erase cycle (whose duration is tBE) is initiated. While the Block Erase cycle is in progress, the Status Register may be read to
check the value of the Write In Progress (WIP) bit. The Write In Progress (WIP) bit is 1 during the selftimed Block Erase cycle, and is 0 when it is completed. At some unspecified time before the cycle is
completed, the Write Enable Latch (WEL) bit is reset.
A Block Erase (BE) instruction applied to a block which is protected by the Block Protect (BP3, BP2,
BP1, BP0) bits (see Table 3) is not executed.
The instruction sequence is shown in Figure 29.1 while using the Enable Quad Peripheral Interface
mode (EQPI) (38h) command.
Figure 29. 64KB Block Erase Instruction Sequence Diagram
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Figure 29.1 Block/Sector Erase Instruction Sequence in QPI Mode
Chip Erase (CE) (C7h/60h)
The Chip Erase (CE) instruction sets all bits to 1 (FFh). Before it can be accepted, a Write Enable
(WREN) instruction must previously have been executed. After the Write Enable (WREN) instruction
has been decoded, the device sets the Write Enable Latch (WEL).
The Chip Erase (CE) instruction is entered by driving Chip Select (CS#) Low, followed by the instruction
code on Serial Data Input (DI). Chip Select (CS#) must be driven Low for the entire duration of the
sequence.
The instruction sequence is shown in Figure 30. Chip Select (CS#) must be driven High after the eighth
bit of the instruction code has been latched in, otherwise the Chip Erase instruction is not executed. As
soon as Chip Select (CS#) is driven High, the self-timed Chip Erase cycle (whose duration is tCE) is
initiated. While the Chip Erase cycle is in progress, the Status Register may be read to check the value
of the Write In Progress (WIP) bit. The Write In Progress (WIP) bit is 1 during the self-timed Chip Erase
cycle, and is 0 when it is completed. At some unspecified time before the cycle is completed, the Write
Enable Latch (WEL) bit is reset.
The Chip Erase (CE) instruction is executed only if all Block Protect (BP3, BP2, BP1, BP0) bits are 0.
The Chip Erase (CE) instruction is ignored if one, or more blocks are protected.
The instruction sequence is shown in Figure 30.1 while using the Enable Quad Peripheral Interface
mode (EQPI) (38h) command.
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Figure 30. Chip Erase Instruction Sequence Diagram
Figure 30.1 Chip Erase Sequence in QPI Mode
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EN25S16A
Deep Power-down (DP) (B9h)
Executing the Deep Power-down (DP) instruction is the only way to put the device in the lowest consumption mode (the Deep Power-down mode). It can also be used as an extra software protection
mechanism, while the device is not in active use, since in this mode, the device ignores all Write,
Program and Erase instructions.
Driving Chip Select (CS#) High deselects the device, and puts the device in the Standby mode (if there
is no internal cycle currently in progress). But this mode is not the Deep Power-down mode. The Deep
Power-down mode can only be entered by executing the Deep Power-down (DP) instruction, to reduce
the standby current (from ICC1 to ICC2, as specified in Table 14.)
Once the device has entered the Deep Power-down mode, all instructions are ignored except the
Release from Deep Power-down and Read Device ID (RDI) instruction. This releases the device from
this mode. The Release from Deep Power-down and Read Device ID (RDI) instruction also allows the
Device ID of the device to be output on Serial Data Output (DO).
The Deep Power-down mode automatically stops at Power-down, and the device always Powers-up in
the Standby mode. The Deep Power-down (DP) instruction is entered by driving Chip Select (CS#) Low,
followed by the instruction code on Serial Data Input (DI). Chip Select (CS#) must be driven Low for the
entire duration of the sequence.
The instruction sequence is shown in Figure 31. Chip Select (CS#) must be driven High after the eighth
bit of the instruction code has been latched in, otherwise the Deep Power-down (DP) instruction is not
executed. As soon as Chip Select (CS#) is driven High, it requires a delay of tDP before the supply
current is reduced to ICC2 and the Deep Power-down mode is entered.
Any Deep Power-down (DP) instruction, while an Erase, Program or Write cycle is in progress, is
rejected without having any effects on the cycle that is in progress.
Figure 31. Deep Power-down Instruction Sequence Diagram
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
46
©2014 Eon Silicon Solution, Inc.,
Rev. B, Issue Date: 2014/04/15
www.eonssi.com
EN25S16A
Release from Deep Power-down and Read Device ID (RDI)
Once the device has entered the Deep Power-down mode, all instructions are ignored except the
Release from Deep Power-down and Read Device ID (RDI) instruction. Executing this instruction takes
the device out of the Deep Power-down mode.
Please note that this is not the same as, or even a subset of, the JEDEC 16-bit Electronic Signature
that is read by the Read Identifier (RDID) instruction. The old-style Electronic Signature is supported for
reasons of backward compatibility, only, and should not be used for new designs. New designs should,
instead, make use of the JEDEC 16-bit Electronic Signature, and the Read Identifier (RDID) instruction.
When used only to release the device from the power-down state, the instruction is issued by driving
the CS# pin low, shifting the instruction code “ABh” and driving CS# high as shown in Figure 32. After
the time duration of tRES1 (See AC Characteristics) the device will resume normal operation and other
instructions will be accepted. The CS# pin must remain high during the tRES1 time duration.
When used only to obtain the Device ID while not in the power-down state, the instruction is initiated by
driving the CS# pin low and shifting the instruction code “ABh” followed by 3-dummy bytes. The Device
ID bits are then shifted out on the falling edge of CLK with most significant bit (MSB) first as shown in
Figure 33. The Device ID value for the EN25S16A are listed in Table 6. The Device ID can be read
continuously. The instruction is completed by driving CS# high.
When Chip Select (CS#) is driven High, the device is put in the Stand-by Power mode. If the device
was not previously in the Deep Power-down mode, the transition to the Stand-by Power mode is
immediate. If the device was previously in the Deep Power-down mode, though, the transition to the
Standby Power mode is delayed by tRES2, and Chip Select (CS#) must remain High for at least tRES2
(max), as specified in Table 16. Once in the Stand-by Power mode, the device waits to be selected, so
that it can receive, decode and execute instructions.
Except while an Erase, Program or Write Status Register cycle is in progress, the Release from Deep
Power-down and Read Device ID (RDI) instruction always provides access to the 8bit Device ID of the
device, and can be applied even if the Deep Power-down mode has not been entered.
Any Release from Deep Power-down and Read Device ID (RDI) instruction while an Erase, Program or
Write Status Register cycle is in progress, is not decoded, and has no effect on the cycle that is in
progress.
Figure 32. Release Power-down Instruction Sequence Diagram
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
47
©2014 Eon Silicon Solution, Inc.,
Rev. B, Issue Date: 2014/04/15
www.eonssi.com
EN25S16A
Figure 33. Release Power-down / Device ID Instruction Sequence Diagram
Read Manufacturer / Device ID (90h)
The Read Manufacturer/Device ID instruction is an alternative to the Release from Power-down /
Device ID instruction that provides both the JEDEC assigned manufacturer ID and the specific device
ID.
The Read Manufacturer/Device ID instruction is very similar to the Release from Power-down / Device
ID instruction. The instruction is initiated by driving the CS# pin low and shifting the instruction code
“90h” followed by a 24-bit address (A23-A0) of 000000h. After which, the Manufacturer ID for Eon (1Ch)
and the Device ID are shifted out on the falling edge of CLK with most significant bit (MSB) first as
shown in Figure 34. The Device ID values for the EN25S16A are listed in Table 6. If the 24-bit address
is initially set to 000001h the Device ID will be read first
The Read Manufacturer/Device ID (90h) instruction is available in Standard SPI Mode only.
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
48
©2014 Eon Silicon Solution, Inc.,
Rev. B, Issue Date: 2014/04/15
www.eonssi.com
EN25S16A
Figure 34. Read Manufacturer / Device ID Diagram
Read Identification (RDID) (9Fh)
The Read Identification (RDID) instruction allows the 8-bit manufacturer identification to be read,
followed by two bytes of device identification. The device identification indicates the memory type in the
first byte , and the memory capacity of the device in the second byte .
Any Read Identification (RDID) instruction while an Erase or Program cycle is in progress, is not
decoded, and has no effect on the cycle that is in progress. The Read Identification (RDID) instruction
should not be issued while the device is in Deep Power down mode.
The device is first selected by driving Chip Select Low. Then, the 8-bit instruction code for the
instruction is shifted in. This is followed by the 24-bit device identification, stored in the memory, being
shifted out on Serial Data Output , each bit being shifted out during the falling edge of Serial Clock .
The instruction sequence is shown in Figure 35. The Read Identification (RDID) instruction is
terminated by driving Chip Select High at any time during data output.
When Chip Select is driven High, the device is put in the Standby Power mode. Once in the Standby
Power mode, the device waits to be selected, so that it can receive, decode and execute instructions.
The Read Identification (RDID) instruction is available in Standard SPI Mode only.
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
49
©2014 Eon Silicon Solution, Inc.,
Rev. B, Issue Date: 2014/04/15
www.eonssi.com
EN25S16A
Figure 35. Read Identification (RDID)
Enter OTP Mode (3Ah)
This Flash has an extra 512 bytes OTP sector, user must issue ENTER OTP MODE command to read,
program or erase OTP sector. After entering OTP mode, the OTP sector is mapping to sector 511, SRP
bit becomes OTP_LOCK bit and can be read with RDSR command. The Chip Erase, Bank Erase, Half
Bank Erase, Suspend and Resume commands are also disabled.
In OTP mode, user can read other sectors, but program/erase other sectors only allowed when
OTP_LOCK bit equal to ‘0’.
WRSR command will ignore the input data and program OTP_LOCK bit to 1.
User can use WRDI (04H) command to exit OTP mode.
The instruction sequence is shown in Figure 36.1 while using the Enable Quad Peripheral Interface
mode (EQPI) (38h) command.
Erase OTP Command (20h)
User only can use Sector Erase (20h) command only to erase OTP data.
Table 10. OTP Sector Address
Sector
Sector Size
Address Range
127
512 byte
1FF000h – 1FF1FFh
Note: The OTP sector is mapping to sector 511
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
50
©2014 Eon Silicon Solution, Inc.,
Rev. B, Issue Date: 2014/04/15
www.eonssi.com
EN25S16A
Figure 36. Enter OTP Mode
Figure 36.1 Enter OTP Mode Sequence in QPI Mode
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
51
©2014 Eon Silicon Solution, Inc.,
Rev. B, Issue Date: 2014/04/15
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EN25S16A
Read SFDP Mode (5Ah)
EN25S16A features Serial Flash Discoverable Parameters (SFDP) mode. Host system can retrieve the
operating characteristics, structure and vendor specified information such as identifying information,
memory size, operating voltage and timing information of this device by SFDP mode.
The device is first selected by driving Chip Select (CS#) Low. The instruction code for the Read SFDP
Mode is followed by a 3-byte address (A23-A0) and a dummy byte, each bit being latched-in during the
rising edge of Serial Clock (CLK). Then the memory contents, at that address, is shifted out on Serial
Data Output (DO), each bit being shifted out, at a maximum frequency FR, during the falling edge of
Serial Clock (CLK).
The instruction sequence is shown in Figure 37. The first byte addressed can be at any location. The
address is automatically incremented to the next higher address after each byte of data is shifted out.
The whole memory can, therefore, be read with a single Serial Flash Discoverable Parameters (SFDP)
instruction. When the highest address is reached, the address counter rolls over to 0x00h, allowing the
read sequence to be continued indefinitely. The Serial Flash Discoverable Parameters (SFDP)
instruction is terminated by driving Chip Select (CS#) High. Chip Select (CS#) can be driven High at
any time during data output. Any Read Data Bytes at Serial Flash Discoverable Parameters (SFDP)
instruction, while an Erase, Program or Write cycle is in progress, is rejected without having any effects
on the cycle that is in progress.
Figure 37. Read SFDP Mode Instruction Sequence Diagram
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
52
©2014 Eon Silicon Solution, Inc.,
Rev. B, Issue Date: 2014/04/15
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EN25S16A
Table 11. Serial Flash Discoverable Parameters (SFDP) Signature and Parameter Identification
Data Value (Advanced Information)
Description
SFDP Signature
SFDP Minor Revision Number
SFDP Major Revision Number
Number of Parameter Headers (NPH)
Unused
ID Number
Parameter Table Minor Revision
Number
Parameter Table Major Revision
Number
Parameter Table Length (in DW)
Parameter Table Pointer (PTP)
Unused
Address (h)
Address (Bit)
(Byte Mode)
Data
Comment
00h
01h
02h
03h
04h
05h
06h
07h
08h
07 : 00
15 : 08
23 : 16
31 : 24
07 : 00
15 : 08
23 : 16
31 : 24
07 : 00
53h
46h
44h
50h
00h
01h
00h
FFh
00h
Star from 0x00
Star from 0x01
1 parameter header
Reserved
JEDEC ID
09h
15 : 08
00h
Star from 0x00
0Ah
23 : 16
01h
Star from 0x01
0Bh
0Ch
0Dh
0Eh
0Fh
31 : 24
07 : 00
15 : 08
23 : 16
31 : 24
09h
30h
00h
00h
FFh
9 DWORDs
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
53
©2014 Eon Silicon Solution, Inc.,
Rev. B, Issue Date: 2014/04/15
Signature [31:0]:
Hex: 50444653
000030h
Reserved
www.eonssi.com
EN25S16A
Table 12. Parameter ID (0) (Advanced Information) 1/9
Description
Address (h)
(Byte Mode)
Address
(Bit)
Block / Sector Erase sizes
Identifies the erase granularity for all Flash
Components
00
Write Granularity
Write Enable Instruction Required for
Writing to Volatile Status Register
Write Enable Opcode Select for Writing to
Volatile Status Register
02
Data
01b
00 = reserved
01 = 4KB erase
10 = reserved
11 = 64KB erase
1b
0 = No, 1 = Yes
00b
00 = N/A
01 = use 50h opcode
11 = use 06h opcode
01
30h
03
04
05
06
07
08
09
10
11
12
13
14
15
Unused
31h
4 Kilo-Byte Erase Opcode
Supports (1-1-2) Fast Read
Device supports single input opcode & address
and dual output data Fast Read
111b
4 KB Erase Support
(FFh = not supported)
1b
0 = not supported
1 = supported
00b
00 = 3-Byte
01 = 3- or 4-Byte (e.g.
defaults to 3-Byte
mode; enters 4-Byte
mode on command)
10 = 4-Byte
11 = reserved
19
0b
0 = not supported
1 = supported
20
1b
0 = not supported
1 = supported
21
1b
0 = not supported
1 = supported
22
0b
0 = not supported
1 = supported
23
24
1b
Reserved
FFh
Reserved
17
18
Supports Double Transfer Rate (DTR)
Clocking
Indicates the device supports some type of
double transfer rate clocking.
Supports (1-2-2) Fast Read
Device supports single input opcode, dual input
address, and dual output data Fast Read
Supports (1-4-4) Fast Read
Device supports single input opcode, quad input
address, and quad output data Fast Read
Supports (1-1-4) Fast Read
Device supports single input opcode & address
and quad output data Fast Read
Unused
32h
Reserved
20h
16
Address Byte
Number of bytes used in addressing for flash arra
write and erase.
Comment
25
26
27
33h
Unused
28
29
30
31
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
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©2014 Eon Silicon Solution, Inc.,
Rev. B, Issue Date: 2014/04/15
www.eonssi.com
EN25S16A
Table 12. Parameter ID (0) (Advanced Information) 2/9
Description
Flash Memory Density
Address (h)
(Byte Mode)
37h : 34h
Address
(Bit)
31 : 00
Data
Comment
00FFFFFFh
16 Mbits
Data
Comment
00100b
4 dummy clocks
010b
8 mode bits
Table 12. Parameter ID (0) (Advanced Information) 3/9
Description
(1-4-4) Fast Read Number of Wait states
(dummy clocks) needed before valid
output
Address (h)
(Byte Mode)
38h
Quad Input Address Quad Output (1-44) Fast Read Number of Mode Bits
(1-4-4) Fast Read Opcode
Opcode for single input opcode, quad input
address, and quad output data Fast Read.
(1-1-4) Fast Read Number of Wait states
(dummy clocks) needed before valid
output
39h
3Ah
(1-1-4) Fast Read Number of Mode Bits
(1-1-4) Fast Read Opcode
Opcode for single input opcode & address
and quad output data Fast Read.
3Bh
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
Address
(Bit)
00
01
02
03
04
05
06
07
08
09
10
11
12
13
14
15
16
17
18
19
20
21
22
23
31 : 24
55
EBh
00000b
Not Supported
000b
Not Supported
FFh
Not Supported
©2014 Eon Silicon Solution, Inc.,
Rev. B, Issue Date: 2014/04/15
www.eonssi.com
EN25S16A
Table 12. Parameter ID (0) (Advanced Information) 4/9
Description
(1-1-2) Fast Read Number of Wait states
(dummy clocks) needed before valid
output
Address (h)
(Byte Mode)
3Ch
(1-1-2) Fast Read Number of Mode Bits
(1-1-2) Fast Read Opcode
Opcode for single input opcode & address
and dual output data Fast Read.
(1-2-2) Fast Read Number of Wait states
(dummy clocks) needed before valid
output
3Dh
15 : 08
3Eh
16
17
18
19
20
21
22
23
(1-2-2) Fast Read Number of Mode Bits
(1-2-2) Fast Read Opcode
Opcode for single input opcode, dual input
address, and dual output data Fast Read.
Address
(Bit)
00
01
02
03
04
05
06
07
3Fh
Data
Comment
01000b
8 dummy clocks
000b
Not Supported
3Bh
00100b
4 dummy clocks
000b
Not Supported
31 : 24
BBh
Address
(Bit)
Data
Supports (2-2-2) Fast Read
Device supports dual input opcode &
address and dual output data Fast Read.
00
0b
Reserved. These bits default to all 1’s
01
02
03
111b
04
1b
Table 12. Parameter ID (0) (Advanced Information) 5/9
Description
Supports (4-4-4) Fast Read
Device supports Quad input opcode &
address and quad output data Fast Read.
Address (h)
(Byte Mode)
40h
Reserved. These bits default to all 1’s
Reserved. These bits default to all 1’s
43h : 41h
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
56
05
06
07
31 : 08
Comment
0 = not supported
1 = supported
Reserved
0 = not supported
1 = supported
(EQPI Mode)
111b
Reserved
FFh
Reserved
©2014 Eon Silicon Solution, Inc.,
Rev. B, Issue Date: 2014/04/15
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EN25S16A
Table 12. Parameter ID (0) (Advanced Information) 6/9
Description
Reserved. These bits default to all 1’s
(2-2-2) Fast Read Number of Wait states
(dummy clocks) needed before valid
output
Address (h)
(Byte Mode)
45h : 44h
46h
(2-2-2) Fast Read Number of Mode Bits
(2-2-2) Fast Read Opcode
Opcode for dual input opcode & address
and dual output data Fast Read.
47h
Address
(Bit)
15 : 00
16
17
18
19
20
21
22
23
31 : 24
Data
Comment
FFh
Reserved
00000b
Not Supported
000b
Not Supported
FFh
Not Supported
Data
Comment
Table 12. Parameter ID (0) (Advanced Information) 7/9
Description
Reserved. These bits default to all 1’s
(4-4-4) Fast Read Number of Wait states
(dummy clocks) needed before valid
output
Address (h)
(Byte Mode)
49h : 48h
4Ah
(4-4-4) Fast Read Number of Mode Bits
(4-4-4) Fast Read Opcode
Opcode for quad input opcode/address,
quad output data Fast Read.
4Bh
Address
(Bit)
15 : 00
16
17
18
19
20
21
22
23
FFh
Reserved
00100b
4 dummy clocks
010b
8 mode bits
31 : 24
EBh
Must Enter EQPI
Mode Firstly
Table 12. Parameter ID (0) (Advanced Information) 8/9
Description
Sector Type 1 Size
Sector Type 1 Opcode
Sector Type 2 Size
Sector Type 2 Opcode
Address (h)
(Byte Mode)
4Ch
4Dh
4Eh
4Fh
Address
(Bit)
07 : 00
15 : 08
23 : 16
31 : 24
Data
Comment
0Ch
20h
0Fh
52h
4 KB
32 KB
Table 12. Parameter ID (0) (Advanced Information) 9/9
Description
Sector Type 3 Size
Sector Type 3 Opcode
Sector Type 4 Size
Sector Type 4 Opcode
Address (h)
(Byte Mode)
50h
51h
52h
53h
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
57
Address
(Bit)
07 : 00
15 : 08
23 : 16
31 : 24
Data
Comment
10h
D8h
00h
FFh
64 KB
©2014 Eon Silicon Solution, Inc.,
Rev. B, Issue Date: 2014/04/15
Not Supported
Not Supported
www.eonssi.com
EN25S16A
Power-up Timing
All functionalities and DC specifications are specified for a VCC ramp rate of greater than 1V per 100 ms
(0V to 1.65V in less than 270 ms). See Table 13 and Figure 38 for more information.
Figure 38. Power-up Timing
Table 13. Power-Up Timing
Symbol
TPU-READ
(1)
TPU-WRITE
(1)
Parameter
Min.
Unit
VCC Min to Read Operation
100
µs
VCC Min to Write Operation
100
µs
Note:
1. This parameter is measured only for initial qualification and after a design or process change that
could affect this parameter.
.
INITIAL DELIVERY STATE
The device is delivered with the memory array erased: all bits are set to 1 (each byte contains FFh).
The Status Register contains 00h (all Status Register bits are 0).
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
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©2014 Eon Silicon Solution, Inc.,
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EN25S16A
Table 14. DC Characteristics
(Ta = - 40°C to 85°C; VCC = 1.65-1.95V)
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
ILI
Input Leakage Current
1
±2
µA
ILO
Output Leakage Current
1
±2
µA
ICC1
ICC2
ICC3
ICC4
Standby Current
CS# = VCC, VIN = VSS or
VCC
5
35
µA
Deep Power-down
Current
CS# = VCC, VIN = VSS or
VCC
5
35
µA
10
15
mA
5
8
mA
12
20
mA
Operating Current
(READ)
CLK = 0.1 VCC / 0.9 VCC at
104MHz in Fast Read, DQ =
open
CLK = 0.1 VCC / 0.9 VCC at
33MHz in Fast Read , DQ =
open
CLK = 0.1 VCC / 0.9 VCC at
104MHz in Quad read, DQ =
open
CLK = 0.1 VCC / 0.9 VCC at
33MHz in Quad read, DQ =
open
CS# = VCC
8
15
mA
15
22
mA
CS# = VCC
4
8
mA
CS# = VCC
CS# = VCC
5
15
mA
5
15
mA
0.8
0.2 VCC
V
1
VCC+0.4
V
< 0.1
0.3
V
ICC6
Operating Current (PP)
Operating Current
(WRSR)
Operating Current (SE)
ICC7
Operating Current (BE)
VIL
Input Low Voltage
– 0.5
VIH
Input High Voltage
0.7VCC
VOL
Output Low Voltage
IOL = 100 µA, Vcc=Vcc Min.
VOH
Output High Voltage
IOH = –100 µA , Vcc=Vcc
Min.
ICC5
VCC-0.2
1.8
V
Table 15. AC Measurement Conditions
Symbol
CL
Parameter
Min.
Max.
Load Capacitance
30
Input Rise and Fall Times
Unit
pF
5
ns
Input Pulse Voltages
0.2VCC to 0.8VCC
V
Input Timing Reference Voltages
0.3VCC to 0.7VCC
V
VCC / 2
V
Output Timing Reference Voltages
Figure 39. AC Measurement I/O Waveform
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
59
©2014 Eon Silicon Solution, Inc.,
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EN25S16A
Table 16. AC Characteristics
(Ta = - 40°C to 85°C; VCC = 1.65-1.95V)
Symbol
FR
Alt
fC
Parameter
Serial Clock Frequency for:
FAST_READ, PP, SE, HBE, BE, DP, RES,
WREN, WRDI, WRSR, Dual Output Fast Read ,
RDSR
Serial Clock Frequency for:
Read Burst, RDID, Quad I/O Fast Read and
EQPI.
Min
Typ
Max
Unit
D.C.
104
MHz
D.C.
104
MHz
D.C.
50
MHz
fR
Serial Clock Frequency for READ.
tCH 1
Serial Clock High Time
4.5
ns
tCL1
Serial Clock Low Time
4.5
ns
Serial Clock Rise Time (Slew Rate)
0.1
V / ns
Serial Clock Fall Time (Slew Rate)
tCLCH
2
tCHCL 2
0.1
V / ns
CS# Active Setup Time
5
ns
tCHSH
CS# Active Hold Time
5
ns
tSHCH
CS# Not Active Setup Time
5
ns
tCHSL
5
10
30
ns
tDIS
CS# Not Active Hold Time
CS# High Time for read
CS# High Time for program/erase
Output Disable Time
tCLQX
tHO
Output Hold Time
0
ns
tDVCH
tDSU
Data In Setup Time
2
ns
tCHDX
tDH
Data In Hold Time
5
ns
tHLCH
HOLD# Low Setup Time ( relative to CLK )
5
ns
tHHCH
HOLD# High Setup Time ( relative to CLK )
5
ns
tCHHH
HOLD# Low Hold Time ( relative to CLK )
5
ns
HOLD# High Hold Time ( relative to CLK )
5
ns
tSLCH
tCSS
tSHSL
tSHQZ
tCSH
2
tCHHL
ns
6
ns
tHLQZ
2
tHZ
HOLD# Low to High-Z Output
6
ns
tHHQX
2
tLZ
HOLD# High to Low-Z Output
6
ns
tV
Output Valid from CLK for 30 pF
Output Valid from CLK for 15 pF
8
6
ns
tCLQV
tWHSL3
Write Protect Setup Time before CS# Low
20
tSHWL3
Write Protect Hold Time after CS# High
100
tDP 2
CS# High to Deep Power-down Mode
tRES1 2
tW
CS# High to Standby Mode without Electronic
Signature read
CS# High to Standby Mode with Electronic
Signature read
Write Status Register Cycle Time
tPP
Page Programming Time
tSE
Sector Erase Time
tHBE
tRES2 2
ns
ns
3
µs
3
µs
1.8
µs
50
ms
0.3
2.5
ms
0.04
0.3
s
2
32KB Block Erase Time
0.1
1
s
tBE
64KB Block Erase Time
0.15
1.2
s
tCE
Chip Erase Time
8
24
s
10
28
µs
0
µs
tSR
Software Reset
Latency
WIP = write operation
WIP = not in write operation
Note: 1. tCH + tCL must be greater than or equal to 1/ fC
2. Value guaranteed by characterization, not 100% tested in production.
3. Only applicable as a constraint for a Write status Register instruction when Status Register Protect Bit is set at 1.
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
60
©2014 Eon Silicon Solution, Inc.,
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EN25S16A
Figure 40. Serial Output Timing
Figure 41. Input Timing
Figure 42. Hold Timing
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
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EN25S16A
ABSOLUTE MAXIMUM RATINGS
Stresses above the values so mentioned above may cause permanent damage to the device. These
values are for a stress rating only and do not imply that the device should be operated at conditions up
to or above these values. Exposure of the device to the maximum rating values for extended periods of
time may adversely affect the device reliability.
Parameter
Value
Unit
Storage Temperature
-65 to +150
C
Plastic Packages
-65 to +125
C
Output Short Circuit Current1
200
mA
Input and Output Voltage
(with respect to ground) 2
-0.5 to Vcc+0.5
V
Vcc
-0.5 to Vcc+0.5
V
Notes:
1.
No more than one output shorted at a time. Duration of the short circuit should not be greater than one second.
2.
Minimum DC voltage on input or I/O pins is –0.5 V. During voltage transitions, inputs may undershoot Vss to –1.0V for periods of
up to 50ns and to –2.0 V for periods of up to 20ns. See figure below. Maximum DC voltage on output and I/O pins is Vcc + 0.5 V.
During voltage transitions, outputs may overshoot to Vcc + 2.0 V for periods up to 20ns. See figure below.
RECOMMENDED OPERATING RANGES 1
Parameter
Value
Unit
-40 to 85
C
Full: 1.65 to 1.95
V
Ambient Operating Temperature
Industrial Devices
Operating Supply Voltage
Vcc
Notes:
1. Recommended Operating Ranges define those limits between which the functionality of the device is guaranteed.
Vcc
+1.5V
Maximum Negative Overshoot Waveform
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
Maximum Positive Overshoot Waveform
62
©2014 Eon Silicon Solution, Inc.,
Rev. B, Issue Date: 2014/04/15
www.eonssi.com
EN25S16A
Table 17. DATA RETENTION and ENDURANCE
Parameter Description
Test Conditions
Min
Unit
Data Retention Time
85°C
20
Years
Erase/Program Endurance
-40 to 85 °C
100k
cycles
Table 18. CAPACITANCE
( VCC = 1.65-1.95V)
Parameter Symbol
Parameter Description
Test Setup
CIN
Input Capacitance
COUT
Output Capacitance
Typ
Max
Unit
VIN = 0
6
pF
VOUT = 0
8
pF
Note : Sampled only, not 100% tested, at TA = 25°C and a frequency of 20MHz.
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
63
©2014 Eon Silicon Solution, Inc.,
Rev. B, Issue Date: 2014/04/15
www.eonssi.com
EN25S16A
PACKAGE MECHANICAL
b
E
E1
Figure 43. SOP 8 ( 150 mil )
e
Detail A
Detail A
DIMENSION IN MM
NOR
MAX
A
--1.75
A1
--0.25
A2
--1.50
D
--5.00
E
--6.20
E1
--4.00
e
1.27
--b
--0.51
L
--1.27
0
0
θ
--0
8
Note : 1. Coplanarity: 0.1 mm
2. Max. allowable mold flash is 0.15 mm
at the pkg ends, 0.25 mm between leads.
SYMBOL
MIN.
1.35
0.10
--4.80
5.80
3.80
--0.33
0.4
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
64
©2014 Eon Silicon Solution, Inc.,
Rev. B, Issue Date: 2014/04/15
www.eonssi.com
EN25S16A
Figure 44. VSOP 8 ( 150 mil )
SYMBOL
A
MIN.
--
A1
A2
D
E
E1
e
b
L
0.05
0.65
4.80
5.80
3.80
--0.33
0.40
DIMENSION IN MM
NOR
MAX
-0.90
0.10
0.70
4.90
6.00
3.90
1.27
0.41
0.71
0.15
0.75
5.00
6.20
4.00
--0.51
1.27
θ
0
-10
Note : 1. Coplanarity: 0.1 mm
2. Max. allowable mold flash is 0.15 mm
at the pkg ends, 0.25 mm between leads.
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
65
©2014 Eon Silicon Solution, Inc.,
Rev. B, Issue Date: 2014/04/15
www.eonssi.com
EN25S16A
Figure 45. SOP 8 ( 208 mil )
SYMBOL
MIN.
1.75
0.05
1.70
5.15
7.70
5.15
--0.35
0.5
DIMENSION IN MM
NOR
1.975
0.15
1.825
5.275
7.90
5.275
1.27
0.425
0.65
MAX
2.20
0.25
1.95
5.40
8.10
5.40
--0.50
0.80
A
A1
A2
D
E
E1
e
b
L
0
0
0
θ
0
4
8
Note : 1. Coplanarity: 0.1 mm
2. Max. allowable mold flash is 0.15 mm
at the pkg ends, 0.25 mm between leads.
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
66
©2014 Eon Silicon Solution, Inc.,
Rev. B, Issue Date: 2014/04/15
www.eonssi.com
EN25S16A
Figure 46. USON 8 ( 4x3 mm )
DIMENSION IN MM
MIN.
NOR
MAX
A
0.5
0.55
0.6
A1
0
0.02
0.05
A2
0.15
A3
0.35
0.4
0.45
D
2.9
3.0
3.1
E
3.9
4.0
4.1
D1
0.1
0.2
0.3
E1
0.7
0.8
0.9
e
--0.8
--b
0.25
0.3
0.35
L
0.55
0.6
0.65
Note : 1. Coplanarity: 0.1 mm
2. Max. allowable mold flash is 0.15 mm
at the pkg ends, 0.25 mm between leads.
SYMBOL
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
67
©2014 Eon Silicon Solution, Inc.,
Rev. B, Issue Date: 2014/04/15
www.eonssi.com
EN25S16A
Figure 47. VDFN 8 ( 5x6 mm )
Controlling dimensions are in millimeters (mm).
DIMENSION IN MM
MIN.
NOR
MAX
A
0.70
0.75
0.80
A1
0.00
0.02
0.04
A2
--0.20
--D
5.90
6.00
6.10
E
4.90
5.00
5.10
D2
3.30
3.40
3.50
E2
3.90
4.00
4.10
e
--1.27
--b
0.35
0.40
0.45
L
0.55
0.60
0.65
Note : 1. Coplanarity: 0.1 mm
SYMBOL
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
68
©2014 Eon Silicon Solution, Inc.,
Rev. B, Issue Date: 2014/04/15
www.eonssi.com
EN25S16A
ORDERING INFORMATION
EN25S16A
-
104
G
I
P
PACKAGING CONTENT
P = RoHS, Halogen-Free and REACH compliant
TEMPERATURE RANGE
I = Industrial (-40°C to +85°C)
PACKAGE
G = 8-pin 150mil SOP
RB = 8-pin 150mil VSOP
H = 8-pin 208mil SOP
XB = 8-pin USON (4x3mm)
W = 8-pin VDFN (5x6mm)
SPEED
104 = 104 MHz
BASE PART NUMBER
EN = Eon Silicon Solution Inc.
25S = 1.8V Serial Flash with 4KB Uniform-Sector
16 = 16 Megabit (2048K x 8)
A = version identifier
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
69
©2014 Eon Silicon Solution, Inc.,
Rev. B, Issue Date: 2014/04/15
www.eonssi.com
EN25S16A
Revisions List
Revision No Description
Date
Preliminary 0.0
Initial Release
1. Update Table 14. DC Characteristics on page on page 59.
(1) Update ICC5 (WRSR) from 1/15 mA to 4/8 mA (typ. / max.)
2. Update Table 16. AC Characteristics on page 60.
(1) Update tw from 15 ms to 50 ms (max.)
(2) Update tHBE from 0.2 s to 0.1 s (typ.)
(3) Update tBE from 0.3/2 s to 0.15/1.2 s (typ. / max.)
2013/10/31
Add 8-pin SOP 208mil package option.
2014/04/15
A
B
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
70
©2014 Eon Silicon Solution, Inc.,
Rev. B, Issue Date: 2014/04/15
2014/03/03
www.eonssi.com