Package Details TLM621H Case Mechanical Drawing Part Marking: 2-3 Character Alpha/Numeric Code Lead Code: Reference individual device data sheet. Mounting Pad Geometry (Dimensions in mm) R1 (4-March 2010) w w w. c e n t r a l s e m i . c o m Package Details TLM621H Case Tape Dimensions and Orientation (Dimensions in mm) Devices are taped in accordance with Electronic Industries Association Standard EIA-481-1-A Tape Width: 8mm Direction of Unreeling Packaging Base 7” Reel = 3,000 pcs. Reel Labeling Information Each reel is labeled with the following information: Central Part Number, Customer Part Number, Purchase Order Number, Quantity, Lot Number, Date Code, Ship Date and Marking Code. Reel Packing Information Reel Size Reels per Box (Maximum) Parts per Box (Maximum) INCH CM LB KG 7” 9 18 40 108 27,000 54,000 120,000 324,000 9x9x5 9x9x9 21x9x9 27x9x17 23x23x13 23x23x23 53x23x23 69x23x43 3 6 13 34 2 3 6 16 Box Dimensions Shipping Weight (Max.) Ordering Information • For devices taped and reeled on 7” reels, add TR suffix to part number. • All SMDs are available in small quantities for prototype and manual placement applications. R1 (4-March 2010) w w w. c e n t r a l s e m i . c o m Material Composition Specification TLM621H Case Device average mass . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.77 mg Fluctuation margin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +/-10% Component Material active device bond wire leadframe die attach encapsulation* plating Material Substance CAS No. (%wt) (mg) doped Si 6.63% 0.25 Si gold 0.53% 0.02 Cu alloy silver epoxy EMC GREEN Ni/Pd/Au Process 43.21% 2.65% 46.39% 0.58% Substance (%wt) (mg) (ppm) 7440-21-3 6.63% 0.25 66,278 Au 7440-57-5 0.53% 0.02 5,302 Cu 7440-50-8 41.89% 1.58 418,876 Ni 7440-02-0 1.01% 0.038 10,074 Si 7440-21-3 0.27% 0.01 2,651 Mg 7439-95-4 0.05% 0.002 530 Ag 7440-22-4 1.86% 0.07 18,558 epoxy resin Proprietary 0.8% 0.03 7,953 silica (fused) 60676-86-0 43.48% 1.64 434,783 epoxy resin 29690-82-2 1.33% 0.05 13,256 phenol resin 9003-35-4 1.33% 0.05 13,256 carbon black 1333-86-4 0.27% 0.01 2,651 Ni 7440-02-0 0.5% 0.019 5,037 Pd 7440-05-3 0.05% 0.002 530 Au 7440-57-5 0.03% 0.001 265 1.63 0.1 1.75 0.022 *EMC GREEN molding compound is Halogen-Free. Disclaimer The information provided in this Material Composition data sheet is, to the best of our knowledge, correct. However, there is no guarantee to completeness or accuracy, as some information is derived from data sources outside the company. R1 (3-June 2011) w w w. c e n t r a l s e m i . c o m