TLM621H

Package Details
TLM621H Case
Mechanical Drawing
Part Marking:
2-3 Character Alpha/Numeric Code
Lead Code:
Reference individual device data sheet.
Mounting Pad Geometry (Dimensions in mm)
R1 (4-March 2010)
w w w. c e n t r a l s e m i . c o m
Package Details
TLM621H Case
Tape Dimensions and Orientation (Dimensions in mm)
Devices are taped in
accordance with
Electronic Industries
Association Standard
EIA-481-1-A
Tape Width: 8mm
Direction of Unreeling
Packaging Base
7” Reel
=
3,000 pcs.
Reel Labeling Information
Each reel is labeled with the following information:
Central Part Number, Customer Part Number, Purchase Order Number,
Quantity, Lot Number, Date Code, Ship Date and Marking Code.
Reel Packing Information
Reel
Size
Reels per
Box
(Maximum)
Parts per
Box
(Maximum)
INCH
CM
LB
KG
7”
9
18
40
108
27,000
54,000
120,000
324,000
9x9x5
9x9x9
21x9x9
27x9x17
23x23x13
23x23x23
53x23x23
69x23x43
3
6
13
34
2
3
6
16
Box Dimensions
Shipping Weight (Max.)
Ordering Information
• For devices taped and reeled on 7” reels, add TR suffix to part number.
• All SMDs are available in small quantities for prototype and manual placement applications.
R1 (4-March 2010)
w w w. c e n t r a l s e m i . c o m
Material Composition Specification
TLM621H Case
Device average mass . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.77 mg
Fluctuation margin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +/-10%
Component
Material
active device
bond wire
leadframe
die attach
encapsulation*
plating
Material
Substance CAS No.
(%wt)
(mg)
doped Si
6.63%
0.25
Si
gold
0.53%
0.02
Cu alloy
silver epoxy
EMC GREEN
Ni/Pd/Au Process
43.21%
2.65%
46.39%
0.58%
Substance
(%wt)
(mg)
(ppm)
7440-21-3
6.63%
0.25
66,278
Au
7440-57-5
0.53%
0.02
5,302
Cu
7440-50-8
41.89%
1.58
418,876
Ni
7440-02-0
1.01%
0.038
10,074
Si
7440-21-3
0.27%
0.01
2,651
Mg
7439-95-4
0.05%
0.002
530
Ag
7440-22-4
1.86%
0.07
18,558
epoxy resin
Proprietary
0.8%
0.03
7,953
silica (fused) 60676-86-0
43.48%
1.64
434,783
epoxy resin
29690-82-2
1.33%
0.05
13,256
phenol resin
9003-35-4
1.33%
0.05
13,256
carbon black
1333-86-4
0.27%
0.01
2,651
Ni
7440-02-0
0.5%
0.019
5,037
Pd
7440-05-3
0.05%
0.002
530
Au
7440-57-5
0.03%
0.001
265
1.63
0.1
1.75
0.022
*EMC GREEN molding compound is Halogen-Free.
Disclaimer
The information provided in this Material Composition data sheet is, to the best of our knowledge, correct. However, there is no
guarantee to completeness or accuracy, as some information is derived from data sources outside the company.
R1 (3-June 2011)
w w w. c e n t r a l s e m i . c o m