Package Details TLM833S Case Mechanical Drawing Part Marking: 3-4 Character Alpha/Numeric Code Lead Code: Reference individual device datasheet. Mounting Pad Geometry (Dimensions in mm) R0 (7-February 2012) w w w. c e n t r a l s e m i . c o m Package Details TLM833S Case Tape Dimensions and Orientation (Dimensions in mm) Devices are taped in accordance with Electronic Industries Association Standard EIA-481-D Tape Width: 8mm Direction of Unreeling Packaging Base 7” Reel = 3,000 pcs. Reel Labeling Information Each reel is labeled with the following information: Central Part Number, Customer Part Number, Purchase Order Number, Quantity, Lot Number, Date Code, Ship Date and Marking Code. Reel Packing Information Reel Size Reels per Box (Maximum) Parts per Box (Maximum) INCH CM LB KG 7” 9 18 40 108 27,000 54,000 120,000 324,000 9x9x5 9x9x9 21x9x9 27x9x17 23x23x13 23x23x23 53x23x23 69x23x43 4 8 17 45 2 4 8 21 Box Dimensions Shipping Weight (Max.) Ordering Information • For devices taped and reeled on 7” reels, add TR suffix to part number. • All SMDs are available in small quantities for prototype and manual placement applications. R0 (7-February 2012) w w w. c e n t r a l s e m i . c o m Material Composition Specification TLM833S Case Device average mass . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 mg Fluctuation margin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +/-10% Component Material active device bond wire leadframe die attach encapsulation* plating Material Substance CAS No. (%wt) (mg) doped Si 2.5% 0.6 Si gold 1.0% 0.24 Cu alloy w/ silver plating silver epoxy EMC GREEN matte tin 30.9% 1.0% 55.0% 9.6% Substance (%wt) (mg) (ppm) 7440-21-3 2.5% 0.6 25,000 Au 7440-57-5 1.0% 0.24 10,000 Cu 7440-50-8 30.1% 7.22 300,836 Fe 7439-89-6 0.7% 0.173 7,208 Zn 7440-66-6 0.04% 0.009 358 Ag 7440-22-4 0.1% 0.015 637 epoxy resin Proprietary 0.2% 0.05 2,083 Ag 7440-22-4 0.8% 0.19 7,917 silica (fused) 60676-86-0 46.8% 11.22 467,504 epoxy resin Proprietary 3.5% 0.84 35,000 epoxy, cresol 29690-82-2 novolac 1.1% 0.263 10,954 phenol resin 9003-35-4 3.5% 0.84 35,000 carbon black 1333-86-4 0.2% 0.04 1,667 Sn 7440-31-5 9.6% 2.3 95,834 7.42 0.24 13.2 2.3 *EMC GREEN molding compound is Halogen-Free. Disclaimer The information provided in this Material Composition data sheet is, to the best of our knowledge, correct. However, there is no guarantee to completeness or accuracy, as some information is derived from data sources outside the company. R1 (3-June 2011) w w w. c e n t r a l s e m i . c o m