Material Composition Specification SOT-923 Case Device average mass . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.45 mg Fluctuation margin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +/-10% Material Component Material Substance Substance CAS No. (%wt) (mg) (%wt) (mg) (ppm) active device doped Si 6.67% 0.07 Si 7440-21-3 6.67% 0.03 66,667 bond wire gold 0.67% 0.003 Au 7440-57-5 0.67% 0.003 6,667 copper w/ silver plating Cu 7440-50-8 46.67% 0.21 466,667 leadframe 47.78% 0.215 Ag 7440-22-4 1.11% 0.005 11,111 silica 7631-86-9 30.67% 0.138 306,667 epoxy resin Proprietary 10.67% 0.048 106,667 Sb2O3 1309-64-4 0.89% 0.004 8,889 TBBA 79-94-7 0.22% 0.001 2,222 carbon black 1333-86-4 0.22% 0.001 2,222 silica 60676-86-0 28.22% 0.127 282,222 epoxy resin 29690-82-2 4.89% 0.022 48,889 phenol resin 9003-35-4 4.89% 0.022 48,889 carbon black 1333-86-4 0.22% 0.001 2,222 metal hydroxide 1309-42-8 4.44% 0.02 44,444 Sn 7440-31-5 2.22% 0.01 22,222 EMC 42.67% 0.192 encapsulation* EMC GREEN plating matte tin 42.67% 2.22% 0.192 0.01 *EMC GREEN molding compound is Halogen-Free. Disclaimer The information provided in this Material Composition data sheet is, to the best of our knowledge, correct. However, there is no guarantee to completeness or accuracy, as some information is derived from data sources outside the company. R2 (23-January 2014) w w w. c e n t r a l s e m i . c o m