Material Composition Specification

Material Composition Specification
SOT-923 Case
Device average mass . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.45 mg
Fluctuation margin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +/-10%
Material
Component
Material
Substance
Substance CAS No.
(%wt)
(mg)
(%wt)
(mg)
(ppm)
active device
doped Si
6.67%
0.07
Si
7440-21-3
6.67%
0.03
66,667
bond wire
gold
0.67%
0.003
Au
7440-57-5
0.67%
0.003
6,667
copper
w/ silver plating
Cu
7440-50-8
46.67%
0.21
466,667
leadframe
47.78%
0.215
Ag
7440-22-4
1.11%
0.005
11,111
silica
7631-86-9
30.67%
0.138
306,667
epoxy resin
Proprietary
10.67%
0.048
106,667
Sb2O3
1309-64-4
0.89%
0.004
8,889
TBBA
79-94-7
0.22%
0.001
2,222
carbon black
1333-86-4
0.22%
0.001
2,222
silica
60676-86-0
28.22%
0.127
282,222
epoxy resin
29690-82-2
4.89%
0.022
48,889
phenol resin
9003-35-4
4.89%
0.022
48,889
carbon black
1333-86-4
0.22%
0.001
2,222
metal
hydroxide
1309-42-8
4.44%
0.02
44,444
Sn
7440-31-5
2.22%
0.01
22,222
EMC
42.67%
0.192
encapsulation*
EMC GREEN
plating
matte tin
42.67%
2.22%
0.192
0.01
*EMC GREEN molding compound is Halogen-Free.
Disclaimer
The information provided in this Material Composition data sheet is, to the best of our knowledge, correct. However, there is no
guarantee to completeness or accuracy, as some information is derived from data sources outside the company.
R2 (23-January 2014)
w w w. c e n t r a l s e m i . c o m