TO-92 - Central Semiconductor Corp.

Package Details
TO-92 Case
Mechanical Drawing
Lead Code:
Packing Options
Bulk:
White corrugated box with static shielded bags
Bulk Packing Quantity: 2,500
Tape and Reel / Ammo Pack:
Radial taped in accordance with EIA-468-C
Packing Quantity: 2,000
SCR*
1) Anode
2) Gate
or
3) Cathode
1) Cathode
2) Gate
3) Anode
FET*
1) Drain
2) Source
3) Gate
1) Drain
2) Gate
3) Source
or
1) Gate
2) Source
3) Drain
PUT
1) Anode
2) Gate
3) Cathode
Also available in the following lead form options
TO-92-5F, TO-92-5T, TO-92-5T1, TO-92-18F, TO-92-18R
1) Source
2) Drain
3) Gate
TRIAC
1) MT1
2) Gate
3) MT2
TRANSISTOR*
1) Emitter
2) Base
3) Collector
or
1) Collector
2) Base
3) Emitter
1) Emitter
2) Collector
3) Base
1) Base
2) Emitter
3) Collector
* Note: See individual device datasheet
for pinout information.
R1 (8-September 2015)
w w w. c e n t r a l s e m i . c o m
1
Package Details - TO-92 TR
Tape and Reel Specifications
1.0. Purpose:
This specification defines the tape and reel packaging requirements for TO-92
devices. Devices supplied to this specification are taped in accordance with
Electronic Industries Association Standard EIA-468-C.
2.0 Requirements:
2.1 Tape and Reel Requirements: Devices to be taped and reeled in
accordance with Figures 2 and 3.
2.2 Style Type: A suffix is added to part number to indicate Style Type.
Example: CS92B TRE (CS92B taped and reeled in accordance with
STYLE E). Note: STYLE E is preferred.
2.3 Packaging Base: Devices to be taped 2000 pieces per reel.
FIGURE 1. PHYSICAL DIMENSIONS
ALL DIMENSIONS IN INCHES (mm).
Central
2
TM
Semiconductor Corp.
w w w. c e n t r a l s e m i . c o m
Package Details - TO-92 TR
Tape and Reel Specifications
(Continued)
FIGURE 2. TAPING SPECIFICATIONS
SYMBOL
A
A1
D
F1
F2
H
H1
H2
P
P1
T
T1
T2
W
W1
W2
W3
NOTES:
1)
2)
3)
4)
5)
6)
7)
8)
DESCRIPTION
FRONT TO REAR DEFLECTION
LEFT TO RIGHT DEFLECTION
FEED HOLE DIAMETER
COMPONENT LEAD PITCH
COMPONENT LEAD PITCH
FEED HOLE TO BOTTOM OF COMPONENT
HEIGHT OF SEATING PLANE
HEIGHT OF FEED HOLE LOCATION
FEED HOLE PITCH
CENTER OF SEATING PLANE LOCATION
CARRIER TAPE THICKNESS
OVERALL TAPE THICKNESS
TOTAL TAPED PACKAGE THICKNESS
CARRIER TAPE WIDTH
ADHESIVE TAPE WIDTH
LEAD ENCLOSURE
ADHESIVE TAPE POSITION
INCHES
MIN
MAX
--0.039
--0.039
0.15
0.17
0.09
0.11
0.09
0.11
0.75
0.79
0.61
0.65
0.33
0.37
0.49
0.51
0.23
0.26
0.015
0.027
0.020
0.035
--0.057
0.69
0.75
0.20
0.28
0.18
----0.020
MM
MIN
----3.8
2.4
2.4
19.0
15.5
8.5
12.5
5.95
0.38
0.50
--17.5
5.0
4.5
---
MAX
1.0
1.0
4.2
2.9
2.9
20.0
16.5
9.5
12.9
6.75
0.68
0.90
1.44
19.0
7.0
--0.5
NOTE
1
6
6
2
7,8
3
4
4
5
5
MAXIMUM ALIGNMENT DEVIATION BETWEEN LEADS NOT TO BE GREATER THAN 0.2mm.
AS ILLUSTRATED, THE CLEARANCE TO THE LEAD STANDOFF FORM SHALL BE DEFINED TO THE POINT OF RADIUS FOR THE STANDOFF FORM.
MAXIMUM CUMULATIVE VARIATION BETWEEN TAPE FEED HOLES SHALL NOT EXCEED 1.0mm IN 20 PITCHES.
OVERALL TAPED PACKAGE THICKNESS, INCLUDING COMPONENT LEADS AND TAPE SPLICES SHALL NOT EXCEED 1.44mm.
HOLDDOWN TAPE NOT TO EXTEND BEYOND THE EDGES OF CARRIER TAPE AND THERE SHALL BE NO EXPOSURE OF ADHESIVE.
NO MORE THAN 0.1% MISSING AND NO CONSECUTIVE MISSING COMPONENTS PER REEL IS PERMITTED.
A TAPE LEADER AND TRAILER, HAVING AT LEAST 3 SPROCKET HOLES IS REQUIRED.
NO MORE THAN 10 SPLICES PER REEL IS PERMITTED AND SPLICES SHALL NOT INTERFERE WITH SPROCKET FEED HOLES.
Central
TM
Semiconductor Corp.
w w w. c e n t r a l s e m i . c o m
3
Package Details - TO-92 TR
Tape and Reel Specifications
(Continued)
FIGURE3. TAPING STYLE
Central
4
TM
Semiconductor Corp.
w w w. c e n t r a l s e m i . c o m
Package Details - TO-92 AP
Ammopack
Specifications
1.0. PURPOSE:
This specification defines the TO-92 Ammopack requirements. Devices supplied
to this specification are taped in accordance with Electronic Industries Association
Standard EIA-468-C.
2.0 REQUIREMENTS:
2.1 Tape Requirements: Devices to be taped in accordance with Figure 2.
2.2 Style Type: STYLE M (PREFERRED) or STYLE P (See Figures 3 and 4).
2.3 Ordering Info: Add suffix to part number to indicate Style Type .
Suffix APM For STYLE M (Equivalent to reel pack STYLE E).
Example: CS92B APM (CS92B SCR, Ammopack STYLE M).
or
Suffix APP For STYLE P (Equivalent to reel pack STYLE A).
Example: CS92B APP (CS92B SCR, Ammopack STYLE P).
2.4 Packaging Base: Devices to be taped 2000 pieces per Ammopack.
FIGURE 1. PHYSICAL DIMENSIONS
All Dimensions in Inches (mm)
Central
TM
Semiconductor Corp.
w w w. c e n t r a l s e m i . c o m
5
Package Details - TO-92 AP
TO-92 Ammopack
Specifications
(Continued)
SYMBOL
A
A1
D
F1
F2
H
H1
H2
P
P1
T
T1
T2
W
W1
W2
W3
NOTES:
1)
2)
3)
4)
5)
6)
7)
8)
FIGURE 2. (TAPING SPECIFICATIONS)
DESCRIPTION
FRONT TO REAR DEFLECTION
LEFT TO RIGHT DEFLECTION
FEED HOLE DIAMETER
COMPONENT LEAD PITCH
COMPONENT LEAD PITCH
FEED HOLE TO BOTTOM OF COMPONENT
HEIGHT OF SEATING PLANE
HEIGHT OF FEED HOLE LOCATION
FEED HOLE PITCH
CENTER OF SEATING PLANE LOCATION
CARRIER TAPE THICKNESS
OVERALL TAPE THICKNESS
TOTAL TAPED PACKAGE THICKNESS
CARRIER TAPE WIDTH
ADHESIVE TAPE WIDTH
LEAD ENCLOSURE
ADHESIVE TAPE POSITION
INCHES
MIN
MAX
--0.039
--0.039
0.15
0.17
0.09
0.11
0.09
0.11
0.75
0.79
0.61
0.65
0.33
0.37
0.49
0.51
0.23
0.26
0.015
0.027
0.020
0.035
--0.057
0.69
0.75
0.20
0.28
0.18
----0.020
MM
MIN
----3.8
2.4
2.4
19.0
15.5
8.5
12.5
5.95
0.38
0.50
--17.5
5.0
4.5
---
MAX
1.0
1.0
4.2
2.9
2.9
20.0
16.5
9.5
12.9
6.75
0.68
0.90
1.44
19.0
7.0
--0.5
NOTE
1
6
6
2
7,8
3
4
4
5
5
MAXIMUM ALIGNMENT DEVIATION BETWEEN LEADS NOT TO BE GREATER THAN 0.2mm.
AS ILLUSTRATED, THE CLEARANCE TO THE LEAD STANDOFF FORM SHALL BE DEFINED TO THE POINT OF RADIUS FOR THE STANDOFF FORM.
MAXIMUM CUMULATIVE VARIATION BETWEEN TAPE FEED HOLES SHALL NOT EXCEED 1.0mm IN 20 PITCHES.
OVERALL TAPED PACKAGE THICKNESS, INCLUDING COMPONENT LEADS AND TAPE SPLICES SHALL NOT EXCEED 1.44mm.
HOLDDOWN TAPE NOT TO EXTEND BEYOND THE EDGES OF CARRIER TAPE AND THERE SHALL BE NO EXPOSURE OF ADHESIVE.
NO MORE THAN 0.1% MISSING AND NO CONSECUTIVE MISSING COMPONENTS PER REEL IS PERMITTED.
A TAPE LEADER AND TRAILER, HAVING AT LEAST 3 SPROCKET HOLES IS REQUIRED.
NO MORE THAN 10 SPLICES PER REEL IS PERMITTED AND SPLICES SHALL NOT INTERFERE WITH SPROCKET FEED HOLES.
Central
6
TM
Semiconductor Corp.
w w w. c e n t r a l s e m i . c o m
Package Details - TO-92 AP
Ammopack
Specifications (Continued)
Note: The box is accessible from either side depending upon whether PIN 1 or PIN 3 is required at the leading edge.
Central
TM
Semiconductor Corp.
w w w. c e n t r a l s e m i . c o m
7
Material Composition Specification
TO-92 Case
Device average mass . . . . . . 206 mg (+/-10%)
Eutectic Die Attach
Material
(%wt)
(mg)
0.034%
0.07
Component
Material
active device
doped Si
bond wire
gold or copper
0.016%
0.032
leadframe
Cu alloy
w/ silver plating
44.824%
92.338
EMC
52.286%
107.71
EMC GREEN
52.286%
107.71
tin/lead process
2.84%
5.85
matte tin
2.84%
5.85
encapsulation*
plating**
Solder Die Attach
CAS No.
Si
Au
Cu
Cu
Fe
P
Ag
silica
epoxy resin
phenol resin
carbon black
Sb2O3
TBBA
silica
epoxy resin
phenol resin
carbon black
metal hydroxide
Sn
Pb
Sn
7440-21-3
7440-57-5
7440-50-8
7440-50-8
7439-89-6
7723-14-0
7440-22-4
7631-86-9
29690-82-2
9003-35-4
1333-86-4
1309-64-4
79-94-7
7631-86-9
29690-82-2
9003-35-4
1333-86-4
1309-42-8
7440-31-5
7439-92-1
7440-31-5
(%wt)
0.034%
Substance
(mg)
0.07
(ppm)
340
0.016%
0.032
155
44.641%
0.045%
0.016%
0.123%
40.694%
5.267%
4.748%
0.149%
1.146%
0.283%
38.816%
5.024%
4.529%
0.568%
3.35%
2.282%
0.558%
2.84%
91.96
0.092
0.032
0.254
83.83
10.85
9.78
0.306
2.36
0.584
79.96
10.35
9.33
1.17
6.9
4.7
1.15
5.85
446,408
447
155
1,233
406,942
52,670
47,476
1,485
11,456
2,835
388,155
50,243
45,291
5,680
33,495
22,816
5,583
28,398
Device average mass . . . . . . 206 mg (+/-10%)
Component
Material
active device
doped Si
bond wire
gold or copper
Material
(%wt)
(mg)
0.035%
0.07
0.016%
0.032
leadframe
Cu alloy
w/ silver plating
44.82%
92.34
die attach
silver epoxy
0.121%
0.25
EMC
52.16%
107.46
EMC GREEN
52.16%
107.46
tin/lead process
2.84%
5.85
matte tin
2.84%
5.85
encapsulation*
plating**
Substance
Substance
CAS No.
Si
Au
Cu
Cu
Fe
P
Ag
Pb
Sn
Ag
silica
epoxy resin
phenol resin
carbon black
Sb2O3
TBBA
silica
epoxy resin
phenol resin
carbon black
metal hydroxide
Sn
Pb
Sn
7440-21-3
7440-57-5
7440-50-8
7440-50-8
7439-89-6
7723-14-0
7440-22-4
7439-92-1
7440-31-5
7440-22-4
7631-86-9
29690-82-2
9003-35-4
1333-86-4
1309-64-4
79-94-7
7631-86-9
29690-82-2
9003-35-4
1333-86-4
1309-42-8
7440-31-5
7439-92-1
7440-31-5
(%wt)
0.035%
Substance
(mg)
0.073
0.016%
0.032
155
44.64%
0.045%
0.016%
0.123%
0.113%
0.006%
0.003%
40.6%
5.25%
4.74%
0.148%
1.14%
0.283%
38.72%
5.015%
4.519%
0.567%
3.34%
2.282%
0.558%
2.84%
91.96
0.092
0.032
0.254
0.232
0.012
0.006
83.64
10.82
9.76
0.305
2.35
0.582
79.77
10.33
9.31
1.167
6.88
4.7
1.15
5.85
446,408
447
155
1,233
1,126
58
29
406,019
52,524
47,379
1,481
11,408
2,825
387,233
50,146
45,194
5,665
33,398
22,816
5,583
28,398
(ppm)
354
*EMC GREEN molding compound is Halogen-Free.
**For Lead Free plating, add suffix “LEAD FREE” to part number.
For Tin/Lead plating, add suffix “TIN/LEAD” to part number.
No suffix designation allows for the supply of either lead-free or tin/lead plated product depending on availability.
Disclaimer
The information provided in this Material Composition data sheet is, to the best of our knowledge, correct. However, there is no guarantee to
completeness or accuracy, as some information is derived from data sources outside the company.
R5 (15-June 2015)
w w w. c e n t r a l s e m i . c o m
Material Composition Specification
TO-92 Case
Eutectic Die Attach
Device average mass . . . . . . 206 mg (+/-10%)
Material
(%wt)
(mg)
0.034%
0.07
Component
Material
active device
doped Si
bond wire
gold or copper
0.016%
0.032
leadframe
Cu alloy
w/ silver plating
44.824%
92.338
EMC
52.286%
107.71
EMC GREEN
52.286%
107.71
tin/lead process
2.84%
5.85
matte tin
2.84%
5.85
encapsulation*
plating**
Solder Die Attach
CAS No.
Si
Au
Cu
Cu
Fe
P
Ag
silica
epoxy resin
phenol resin
carbon black
Sb2O3
TBBA
silica
epoxy resin
phenol resin
carbon black
metal hydroxide
Sn
Pb
Sn
7440-21-3
7440-57-5
7440-50-8
7440-50-8
7439-89-6
7723-14-0
7440-22-4
7631-86-9
29690-82-2
9003-35-4
1333-86-4
1309-64-4
79-94-7
7631-86-9
29690-82-2
9003-35-4
1333-86-4
1309-42-8
7440-31-5
7439-92-1
7440-31-5
(%wt)
0.034%
Substance
(mg)
0.07
(ppm)
340
0.016%
0.032
155
44.641%
0.045%
0.016%
0.123%
40.694%
5.267%
4.748%
0.149%
1.146%
0.283%
38.816%
5.024%
4.529%
0.568%
3.35%
2.282%
0.558%
2.84%
91.96
0.092
0.032
0.254
83.83
10.85
9.78
0.306
2.36
0.584
79.96
10.35
9.33
1.17
6.9
4.7
1.15
5.85
446,408
447
155
1,233
406,942
52,670
47,476
1,485
11,456
2,835
388,155
50,243
45,291
5,680
33,495
22,816
5,583
28,398
Device average mass . . . . . . 206 mg (+/-10%)
Component
Material
active device
doped Si
bond wire
gold or copper
Material
(%wt)
(mg)
0.035%
0.07
0.016%
0.032
leadframe
Cu alloy
w/ silver plating
44.82%
92.34
die attach
silver epoxy
0.121%
0.25
EMC
52.16%
107.46
EMC GREEN
52.16%
107.46
tin/lead process
2.84%
5.85
matte tin
2.84%
5.85
encapsulation*
plating**
Substance
Substance
CAS No.
Si
Au
Cu
Cu
Fe
P
Ag
Pb
Sn
Ag
silica
epoxy resin
phenol resin
carbon black
Sb2O3
TBBA
silica
epoxy resin
phenol resin
carbon black
metal hydroxide
Sn
Pb
Sn
7440-21-3
7440-57-5
7440-50-8
7440-50-8
7439-89-6
7723-14-0
7440-22-4
7439-92-1
7440-31-5
7440-22-4
7631-86-9
29690-82-2
9003-35-4
1333-86-4
1309-64-4
79-94-7
7631-86-9
29690-82-2
9003-35-4
1333-86-4
1309-42-8
7440-31-5
7439-92-1
7440-31-5
(%wt)
0.035%
Substance
(mg)
0.073
(ppm)
354
0.016%
0.032
155
44.64%
0.045%
0.016%
0.123%
0.113%
0.006%
0.003%
40.6%
5.25%
4.74%
0.148%
1.14%
0.283%
38.72%
5.015%
4.519%
0.567%
3.34%
2.282%
0.558%
2.84%
91.96
0.092
0.032
0.254
0.232
0.012
0.006
83.64
10.82
9.76
0.305
2.35
0.582
79.77
10.33
9.31
1.167
6.88
4.7
1.15
5.85
446,408
447
155
1,233
1,126
58
29
406,019
52,524
47,379
1,481
11,408
2,825
387,233
50,146
45,194
5,665
33,398
22,816
5,583
28,398
*EMC GREEN molding compound is Halogen-Free.
**For Lead Free plating, add suffix “LEAD FREE” to part number.
For Tin/Lead plating, add suffix “TIN/LEAD” to part number.
No suffix designation allows for the supply of either lead-free or tin/lead plated product depending on availability.
Disclaimer
The information provided in this Material Composition data sheet is, to the best of our knowledge, correct. However, there is no guarantee to
completeness or accuracy, as some information is derived from data sources outside the company.
R5 (15-June 2015)
w w w. c e n t r a l s e m i . c o m