Package Details TO-92 Case Mechanical Drawing Lead Code: Packing Options Bulk: White corrugated box with static shielded bags Bulk Packing Quantity: 2,500 Tape and Reel / Ammo Pack: Radial taped in accordance with EIA-468-C Packing Quantity: 2,000 SCR* 1) Anode 2) Gate or 3) Cathode 1) Cathode 2) Gate 3) Anode FET* 1) Drain 2) Source 3) Gate 1) Drain 2) Gate 3) Source or 1) Gate 2) Source 3) Drain PUT 1) Anode 2) Gate 3) Cathode Also available in the following lead form options TO-92-5F, TO-92-5T, TO-92-5T1, TO-92-18F, TO-92-18R 1) Source 2) Drain 3) Gate TRIAC 1) MT1 2) Gate 3) MT2 TRANSISTOR* 1) Emitter 2) Base 3) Collector or 1) Collector 2) Base 3) Emitter 1) Emitter 2) Collector 3) Base 1) Base 2) Emitter 3) Collector * Note: See individual device datasheet for pinout information. R1 (8-September 2015) w w w. c e n t r a l s e m i . c o m 1 Package Details - TO-92 TR Tape and Reel Specifications 1.0. Purpose: This specification defines the tape and reel packaging requirements for TO-92 devices. Devices supplied to this specification are taped in accordance with Electronic Industries Association Standard EIA-468-C. 2.0 Requirements: 2.1 Tape and Reel Requirements: Devices to be taped and reeled in accordance with Figures 2 and 3. 2.2 Style Type: A suffix is added to part number to indicate Style Type. Example: CS92B TRE (CS92B taped and reeled in accordance with STYLE E). Note: STYLE E is preferred. 2.3 Packaging Base: Devices to be taped 2000 pieces per reel. FIGURE 1. PHYSICAL DIMENSIONS ALL DIMENSIONS IN INCHES (mm). Central 2 TM Semiconductor Corp. w w w. c e n t r a l s e m i . c o m Package Details - TO-92 TR Tape and Reel Specifications (Continued) FIGURE 2. TAPING SPECIFICATIONS SYMBOL A A1 D F1 F2 H H1 H2 P P1 T T1 T2 W W1 W2 W3 NOTES: 1) 2) 3) 4) 5) 6) 7) 8) DESCRIPTION FRONT TO REAR DEFLECTION LEFT TO RIGHT DEFLECTION FEED HOLE DIAMETER COMPONENT LEAD PITCH COMPONENT LEAD PITCH FEED HOLE TO BOTTOM OF COMPONENT HEIGHT OF SEATING PLANE HEIGHT OF FEED HOLE LOCATION FEED HOLE PITCH CENTER OF SEATING PLANE LOCATION CARRIER TAPE THICKNESS OVERALL TAPE THICKNESS TOTAL TAPED PACKAGE THICKNESS CARRIER TAPE WIDTH ADHESIVE TAPE WIDTH LEAD ENCLOSURE ADHESIVE TAPE POSITION INCHES MIN MAX --0.039 --0.039 0.15 0.17 0.09 0.11 0.09 0.11 0.75 0.79 0.61 0.65 0.33 0.37 0.49 0.51 0.23 0.26 0.015 0.027 0.020 0.035 --0.057 0.69 0.75 0.20 0.28 0.18 ----0.020 MM MIN ----3.8 2.4 2.4 19.0 15.5 8.5 12.5 5.95 0.38 0.50 --17.5 5.0 4.5 --- MAX 1.0 1.0 4.2 2.9 2.9 20.0 16.5 9.5 12.9 6.75 0.68 0.90 1.44 19.0 7.0 --0.5 NOTE 1 6 6 2 7,8 3 4 4 5 5 MAXIMUM ALIGNMENT DEVIATION BETWEEN LEADS NOT TO BE GREATER THAN 0.2mm. AS ILLUSTRATED, THE CLEARANCE TO THE LEAD STANDOFF FORM SHALL BE DEFINED TO THE POINT OF RADIUS FOR THE STANDOFF FORM. MAXIMUM CUMULATIVE VARIATION BETWEEN TAPE FEED HOLES SHALL NOT EXCEED 1.0mm IN 20 PITCHES. OVERALL TAPED PACKAGE THICKNESS, INCLUDING COMPONENT LEADS AND TAPE SPLICES SHALL NOT EXCEED 1.44mm. HOLDDOWN TAPE NOT TO EXTEND BEYOND THE EDGES OF CARRIER TAPE AND THERE SHALL BE NO EXPOSURE OF ADHESIVE. NO MORE THAN 0.1% MISSING AND NO CONSECUTIVE MISSING COMPONENTS PER REEL IS PERMITTED. A TAPE LEADER AND TRAILER, HAVING AT LEAST 3 SPROCKET HOLES IS REQUIRED. NO MORE THAN 10 SPLICES PER REEL IS PERMITTED AND SPLICES SHALL NOT INTERFERE WITH SPROCKET FEED HOLES. Central TM Semiconductor Corp. w w w. c e n t r a l s e m i . c o m 3 Package Details - TO-92 TR Tape and Reel Specifications (Continued) FIGURE3. TAPING STYLE Central 4 TM Semiconductor Corp. w w w. c e n t r a l s e m i . c o m Package Details - TO-92 AP Ammopack Specifications 1.0. PURPOSE: This specification defines the TO-92 Ammopack requirements. Devices supplied to this specification are taped in accordance with Electronic Industries Association Standard EIA-468-C. 2.0 REQUIREMENTS: 2.1 Tape Requirements: Devices to be taped in accordance with Figure 2. 2.2 Style Type: STYLE M (PREFERRED) or STYLE P (See Figures 3 and 4). 2.3 Ordering Info: Add suffix to part number to indicate Style Type . Suffix APM For STYLE M (Equivalent to reel pack STYLE E). Example: CS92B APM (CS92B SCR, Ammopack STYLE M). or Suffix APP For STYLE P (Equivalent to reel pack STYLE A). Example: CS92B APP (CS92B SCR, Ammopack STYLE P). 2.4 Packaging Base: Devices to be taped 2000 pieces per Ammopack. FIGURE 1. PHYSICAL DIMENSIONS All Dimensions in Inches (mm) Central TM Semiconductor Corp. w w w. c e n t r a l s e m i . c o m 5 Package Details - TO-92 AP TO-92 Ammopack Specifications (Continued) SYMBOL A A1 D F1 F2 H H1 H2 P P1 T T1 T2 W W1 W2 W3 NOTES: 1) 2) 3) 4) 5) 6) 7) 8) FIGURE 2. (TAPING SPECIFICATIONS) DESCRIPTION FRONT TO REAR DEFLECTION LEFT TO RIGHT DEFLECTION FEED HOLE DIAMETER COMPONENT LEAD PITCH COMPONENT LEAD PITCH FEED HOLE TO BOTTOM OF COMPONENT HEIGHT OF SEATING PLANE HEIGHT OF FEED HOLE LOCATION FEED HOLE PITCH CENTER OF SEATING PLANE LOCATION CARRIER TAPE THICKNESS OVERALL TAPE THICKNESS TOTAL TAPED PACKAGE THICKNESS CARRIER TAPE WIDTH ADHESIVE TAPE WIDTH LEAD ENCLOSURE ADHESIVE TAPE POSITION INCHES MIN MAX --0.039 --0.039 0.15 0.17 0.09 0.11 0.09 0.11 0.75 0.79 0.61 0.65 0.33 0.37 0.49 0.51 0.23 0.26 0.015 0.027 0.020 0.035 --0.057 0.69 0.75 0.20 0.28 0.18 ----0.020 MM MIN ----3.8 2.4 2.4 19.0 15.5 8.5 12.5 5.95 0.38 0.50 --17.5 5.0 4.5 --- MAX 1.0 1.0 4.2 2.9 2.9 20.0 16.5 9.5 12.9 6.75 0.68 0.90 1.44 19.0 7.0 --0.5 NOTE 1 6 6 2 7,8 3 4 4 5 5 MAXIMUM ALIGNMENT DEVIATION BETWEEN LEADS NOT TO BE GREATER THAN 0.2mm. AS ILLUSTRATED, THE CLEARANCE TO THE LEAD STANDOFF FORM SHALL BE DEFINED TO THE POINT OF RADIUS FOR THE STANDOFF FORM. MAXIMUM CUMULATIVE VARIATION BETWEEN TAPE FEED HOLES SHALL NOT EXCEED 1.0mm IN 20 PITCHES. OVERALL TAPED PACKAGE THICKNESS, INCLUDING COMPONENT LEADS AND TAPE SPLICES SHALL NOT EXCEED 1.44mm. HOLDDOWN TAPE NOT TO EXTEND BEYOND THE EDGES OF CARRIER TAPE AND THERE SHALL BE NO EXPOSURE OF ADHESIVE. NO MORE THAN 0.1% MISSING AND NO CONSECUTIVE MISSING COMPONENTS PER REEL IS PERMITTED. A TAPE LEADER AND TRAILER, HAVING AT LEAST 3 SPROCKET HOLES IS REQUIRED. NO MORE THAN 10 SPLICES PER REEL IS PERMITTED AND SPLICES SHALL NOT INTERFERE WITH SPROCKET FEED HOLES. Central 6 TM Semiconductor Corp. w w w. c e n t r a l s e m i . c o m Package Details - TO-92 AP Ammopack Specifications (Continued) Note: The box is accessible from either side depending upon whether PIN 1 or PIN 3 is required at the leading edge. Central TM Semiconductor Corp. w w w. c e n t r a l s e m i . c o m 7 Material Composition Specification TO-92 Case Device average mass . . . . . . 206 mg (+/-10%) Eutectic Die Attach Material (%wt) (mg) 0.034% 0.07 Component Material active device doped Si bond wire gold or copper 0.016% 0.032 leadframe Cu alloy w/ silver plating 44.824% 92.338 EMC 52.286% 107.71 EMC GREEN 52.286% 107.71 tin/lead process 2.84% 5.85 matte tin 2.84% 5.85 encapsulation* plating** Solder Die Attach CAS No. Si Au Cu Cu Fe P Ag silica epoxy resin phenol resin carbon black Sb2O3 TBBA silica epoxy resin phenol resin carbon black metal hydroxide Sn Pb Sn 7440-21-3 7440-57-5 7440-50-8 7440-50-8 7439-89-6 7723-14-0 7440-22-4 7631-86-9 29690-82-2 9003-35-4 1333-86-4 1309-64-4 79-94-7 7631-86-9 29690-82-2 9003-35-4 1333-86-4 1309-42-8 7440-31-5 7439-92-1 7440-31-5 (%wt) 0.034% Substance (mg) 0.07 (ppm) 340 0.016% 0.032 155 44.641% 0.045% 0.016% 0.123% 40.694% 5.267% 4.748% 0.149% 1.146% 0.283% 38.816% 5.024% 4.529% 0.568% 3.35% 2.282% 0.558% 2.84% 91.96 0.092 0.032 0.254 83.83 10.85 9.78 0.306 2.36 0.584 79.96 10.35 9.33 1.17 6.9 4.7 1.15 5.85 446,408 447 155 1,233 406,942 52,670 47,476 1,485 11,456 2,835 388,155 50,243 45,291 5,680 33,495 22,816 5,583 28,398 Device average mass . . . . . . 206 mg (+/-10%) Component Material active device doped Si bond wire gold or copper Material (%wt) (mg) 0.035% 0.07 0.016% 0.032 leadframe Cu alloy w/ silver plating 44.82% 92.34 die attach silver epoxy 0.121% 0.25 EMC 52.16% 107.46 EMC GREEN 52.16% 107.46 tin/lead process 2.84% 5.85 matte tin 2.84% 5.85 encapsulation* plating** Substance Substance CAS No. Si Au Cu Cu Fe P Ag Pb Sn Ag silica epoxy resin phenol resin carbon black Sb2O3 TBBA silica epoxy resin phenol resin carbon black metal hydroxide Sn Pb Sn 7440-21-3 7440-57-5 7440-50-8 7440-50-8 7439-89-6 7723-14-0 7440-22-4 7439-92-1 7440-31-5 7440-22-4 7631-86-9 29690-82-2 9003-35-4 1333-86-4 1309-64-4 79-94-7 7631-86-9 29690-82-2 9003-35-4 1333-86-4 1309-42-8 7440-31-5 7439-92-1 7440-31-5 (%wt) 0.035% Substance (mg) 0.073 0.016% 0.032 155 44.64% 0.045% 0.016% 0.123% 0.113% 0.006% 0.003% 40.6% 5.25% 4.74% 0.148% 1.14% 0.283% 38.72% 5.015% 4.519% 0.567% 3.34% 2.282% 0.558% 2.84% 91.96 0.092 0.032 0.254 0.232 0.012 0.006 83.64 10.82 9.76 0.305 2.35 0.582 79.77 10.33 9.31 1.167 6.88 4.7 1.15 5.85 446,408 447 155 1,233 1,126 58 29 406,019 52,524 47,379 1,481 11,408 2,825 387,233 50,146 45,194 5,665 33,398 22,816 5,583 28,398 (ppm) 354 *EMC GREEN molding compound is Halogen-Free. **For Lead Free plating, add suffix “LEAD FREE” to part number. For Tin/Lead plating, add suffix “TIN/LEAD” to part number. No suffix designation allows for the supply of either lead-free or tin/lead plated product depending on availability. Disclaimer The information provided in this Material Composition data sheet is, to the best of our knowledge, correct. However, there is no guarantee to completeness or accuracy, as some information is derived from data sources outside the company. R5 (15-June 2015) w w w. c e n t r a l s e m i . c o m Material Composition Specification TO-92 Case Eutectic Die Attach Device average mass . . . . . . 206 mg (+/-10%) Material (%wt) (mg) 0.034% 0.07 Component Material active device doped Si bond wire gold or copper 0.016% 0.032 leadframe Cu alloy w/ silver plating 44.824% 92.338 EMC 52.286% 107.71 EMC GREEN 52.286% 107.71 tin/lead process 2.84% 5.85 matte tin 2.84% 5.85 encapsulation* plating** Solder Die Attach CAS No. Si Au Cu Cu Fe P Ag silica epoxy resin phenol resin carbon black Sb2O3 TBBA silica epoxy resin phenol resin carbon black metal hydroxide Sn Pb Sn 7440-21-3 7440-57-5 7440-50-8 7440-50-8 7439-89-6 7723-14-0 7440-22-4 7631-86-9 29690-82-2 9003-35-4 1333-86-4 1309-64-4 79-94-7 7631-86-9 29690-82-2 9003-35-4 1333-86-4 1309-42-8 7440-31-5 7439-92-1 7440-31-5 (%wt) 0.034% Substance (mg) 0.07 (ppm) 340 0.016% 0.032 155 44.641% 0.045% 0.016% 0.123% 40.694% 5.267% 4.748% 0.149% 1.146% 0.283% 38.816% 5.024% 4.529% 0.568% 3.35% 2.282% 0.558% 2.84% 91.96 0.092 0.032 0.254 83.83 10.85 9.78 0.306 2.36 0.584 79.96 10.35 9.33 1.17 6.9 4.7 1.15 5.85 446,408 447 155 1,233 406,942 52,670 47,476 1,485 11,456 2,835 388,155 50,243 45,291 5,680 33,495 22,816 5,583 28,398 Device average mass . . . . . . 206 mg (+/-10%) Component Material active device doped Si bond wire gold or copper Material (%wt) (mg) 0.035% 0.07 0.016% 0.032 leadframe Cu alloy w/ silver plating 44.82% 92.34 die attach silver epoxy 0.121% 0.25 EMC 52.16% 107.46 EMC GREEN 52.16% 107.46 tin/lead process 2.84% 5.85 matte tin 2.84% 5.85 encapsulation* plating** Substance Substance CAS No. Si Au Cu Cu Fe P Ag Pb Sn Ag silica epoxy resin phenol resin carbon black Sb2O3 TBBA silica epoxy resin phenol resin carbon black metal hydroxide Sn Pb Sn 7440-21-3 7440-57-5 7440-50-8 7440-50-8 7439-89-6 7723-14-0 7440-22-4 7439-92-1 7440-31-5 7440-22-4 7631-86-9 29690-82-2 9003-35-4 1333-86-4 1309-64-4 79-94-7 7631-86-9 29690-82-2 9003-35-4 1333-86-4 1309-42-8 7440-31-5 7439-92-1 7440-31-5 (%wt) 0.035% Substance (mg) 0.073 (ppm) 354 0.016% 0.032 155 44.64% 0.045% 0.016% 0.123% 0.113% 0.006% 0.003% 40.6% 5.25% 4.74% 0.148% 1.14% 0.283% 38.72% 5.015% 4.519% 0.567% 3.34% 2.282% 0.558% 2.84% 91.96 0.092 0.032 0.254 0.232 0.012 0.006 83.64 10.82 9.76 0.305 2.35 0.582 79.77 10.33 9.31 1.167 6.88 4.7 1.15 5.85 446,408 447 155 1,233 1,126 58 29 406,019 52,524 47,379 1,481 11,408 2,825 387,233 50,146 45,194 5,665 33,398 22,816 5,583 28,398 *EMC GREEN molding compound is Halogen-Free. **For Lead Free plating, add suffix “LEAD FREE” to part number. For Tin/Lead plating, add suffix “TIN/LEAD” to part number. No suffix designation allows for the supply of either lead-free or tin/lead plated product depending on availability. Disclaimer The information provided in this Material Composition data sheet is, to the best of our knowledge, correct. However, there is no guarantee to completeness or accuracy, as some information is derived from data sources outside the company. R5 (15-June 2015) w w w. c e n t r a l s e m i . c o m