Case 106 - Central Semiconductor Corp.

Package Details - Case 106
Mechanical Drawing
Lead Code:
Cathode band
Packing options:
Bulk - Packing Code: D
D = White corrugated box with black conductive coating
(surface resistivity of <105 ohms per square).
Bulk Packing Quantity: 250
Tape and Reel - Packing Code: A
A = Axial taped and reeled in accordance with EIA-296-E. If required,
individual reels placed in poly antistatic coated bags (surface resistivity of
>109 and <1013 ohms per square).
Tape and Reel Packing Quantity: 800
Central
TM
Semiconductor Corp.
w w w. c e n t r a l s e m i . c o m
R0 (17-July 2008)
Material Composition Specification
CASE 106
Device average mass . . . . . . 1.95 g
Fluctuation margin . . . . . . . . +/-10%
Material
Component
Material
(%wt)
(mg)
active device
doped Si
0.29%
5.71
die attach
high temperature
solder
0.57%
11.11
leadframe
Cu alloy
EMC
54.1%
41.4%
1055
807.6
encapsulation*
EMC GREEN
plating**
ink
41.4%
807.6
tin/lead process
3.62%
70.55
100% tin process
3.62%
70.55
N/A
Substance
Substance CAS No.
0.0015%
0.03
(%wt)
(mg)
(ppm)
Si
7440-21-3
0.28%
5.43
2,785
Pb
7439-92-1
0.01%
0.28
144
Pb
7439-92-1
0.53%
10.275
5,269
Sn
7440-31-5
0.03%
0.556
285
Ag
7440-22-4
0.01%
0.279
143
Cu
7440-50-8
54.05%
1054
540,513
Fe
7439-89-6
0.05%
1.0
513
silica
7631-86-9
31.87%
621.37
318,651
epoxy resin
29690-82-2
4.14%
80.76
41,415
phenol resin
9003-35-4
4.01%
78.29
40,149
Sb2O3
Br
1309-64-4
0.70%
13.59
6,969
7726-95-6
0.70%
13.59
6,969
silica
7631-86-9
31.89%
621.85
318,897
epoxy resin
29690-82-2
4.14%
80.76
41,415
phenol resin
9003-35-4
4.02%
78.337
40,173
carbon black
1333-86-4
0.12%
2.423
1,243
metal
hydroxide
1309-42-8
1.24%
24.23
12,426
Sn
7440-31-5
2.89%
56.44
28,944
Pb
7439-92-1
0.72%
14.11
7,236
Sn
7440-31-5
3.62%
70.55
36,179
2-propenic
acid
53192-18-0
0.001%
0.0204
10
Al
7429-90-5
0.0003% 0.0054
3
silica
methanone
isoamyl 4benzoate
112945-52-5 0.00005% 0.0009
947-19-3
0.00005% 0.0009
21245-01-2 0.0001% 0.0024
0.5
0.5
1
*EMC GREEN molding compound is Halogen-Free.
**For Lead Free plating, add suffix “LEAD FREE” to part number.
For Tin/Lead plating, add suffix “TIN/LEAD” to part number.
No suffix designation allows for the supply of either lead-free or tin/lead plated product depending on availability.
Disclaimer
The information provided in this Material Composition data sheet is, to the best of our knowledge, correct. However, there is no
guarantee to completeness or accuracy, as some information is derived from data sources outside the company.
R0 (11-April 2012)
w w w. c e n t r a l s e m i . c o m