smbfl

Package Details
SMBFL Case
Mechanical Drawing
Lead Code:
Part Marking: 3-7 Character Alpha/Numeric Code
Reference individual
device datasheet.
Mounting Pad Geometry (Dimensions in mm)
R0 (27-March 2013)
w w w. c e n t r a l s e m i . c o m
Package Details
SMBFL Case
Tape Dimensions and Orientation (Dimensions in mm)
Devices are taped in
accordance with
Electronic Industries
Association Standard
EIA-481-D
Tape Width: 12mm
Direction of Unreeling
Packaging Base
13” Reel
=
5,000 pcs.
Reel Labeling Information
Each reel is labeled with the following information:
Central Part Number, Customer Part Number, Purchase Order Number,
Quantity, Lot Number, Date Code and Ship Date.
Reel Packing Information
Reel
Size
13”
Reels per
Box
(Maximum)
Parts per
Box
(Maximum)
INCH
CM
LB
KG
5
25,000
15x4x15
38x10x38
9
5
Box Dimensions
Shipping Weight (Max.)
14
70,000
15x15x9
38x38x23
23
11
26
130,000
15x15x18
38x38x46
42
20
Ordering Information
• For devices taped and reeled on 13” reels, add TR13 suffix to part number.
• All SMDs are available in small quantities for prototype and manual placement applications.
R0 (27-March 2013)
w w w. c e n t r a l s e m i . c o m
Material Composition Specification
SMBFL Case
Device average mass . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mg
Fluctuation margin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +/-10%
Material
Component
Material
(%wt)
(mg)
active device
doped Si
1.54%
0.77
leadframe
copper alloy
50.08%
25.038
die attach
encapsulation*
plating
high temperature
solder paste
EMC GREEN
matte tin
Substance
Substance CAS No.
4.95%
42.23%
1.2%
(%wt)
(mg)
(ppm)
Si
7440-21-3
1.54%
0.77
15,400
Cu
7440-50-8
50%
25
500,000
Fe
7439-89-6
0.08%
0.038
760
Pb
7439-92-1
4.58%
2.29
45,800
Sn
7440-31-5
0.25%
0.124
2,480
Ag
7440-22-4
0.12%
0.062
1,240
silica (fused) 60676-86-0
32.52%
16.26
325,200
epoxy resin
29690-82-2
4.22%
2.11
42,200
21.116 phenol resin
9003-35-4
4.1%
2.05
41,000
carbon black
1333-86-4
0.13%
0.063
1,260
metal
hydroxide
1309-42-8
1.27%
0.633
12,660
Sn
7440-31-5
1.2%
0.6
12,000
2.476
0.6
*EMC GREEN molding compound is Halogen-Free.
Disclaimer
The information provided in this Material Composition data sheet is, to the best of our knowledge, correct. However, there is no
guarantee to completeness or accuracy, as some information is derived from data sources outside the company.
R0 (13-August 2012)
w w w. c e n t r a l s e m i . c o m