TLM832DS

Package Details
TLM832DS Case
Mechanical Drawing
Part Marking:
2-3 Character Alpha/Numeric Code
Lead Code:
Reference individual device datasheet.
Mounting Pad Geometry
(Dimensions in mm)
R0 (7-February 2012)
w w w. c e n t r a l s e m i . c o m
Package Details
TLM832DS Case
Tape Dimensions and Orientation (Dimensions in mm)
Devices are taped in
accordance with
Electronic Industries
Association Standard
EIA-481-D
Tape Width: 8mm
Direction of Unreeling
Packaging Base
7” Reel
=
3,000 pcs.
Reel Labeling Information
Each reel is labeled with the following information:
Central Part Number, Customer Part Number, Purchase Order Number,
Quantity, Lot Number, Date Code, Ship Date and Marking Code.
Reel Packing Information
Reel
Size
Reels per
Box
(Maximum)
Parts per
Box
(Maximum)
INCH
CM
LB
KG
7”
9
17
40
108
27,000
51,000
120,000
324,000
9x9x5
9x9x9
21x9x9
27x9x17
23x23x13
23x23x23
53x23x23
69x23x43
4
7
14
39
2
4
7
18
Box Dimensions
Shipping Weight (Max.)
Ordering Information
• For devices taped and reeled on 7” reels, add TR suffix to part number.
• All SMDs are available in small quantities for prototype and manual placement applications.
R0 (7-February 2012)
w w w. c e n t r a l s e m i . c o m
Material Composition Specification
TLM832DS Case
Device average mass . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13.1 mg
Fluctuation margin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +/-10%
Material
Component
Material
Substance
Substance CAS No.
(%wt)
(mg)
(%wt)
(mg)
(ppm)
active device
doped Si
2.29%
0.3
Si
7440-21-3
2.29%
0.3
22,901
bond wire
gold
0.46%
0.06
Au
7440-57-5
0.46%
0.06
4,580
Cu
7440-50-8
17.63%
2.31
176,336
Fe
7439-89-6
0.4%
0.053
4,046
Zn
7440-66-6
0.02%
0.003
229
Ag
7440-22-4
.18%
0.023
1,756
epoxy resin
Proprietary
0.11%
0.015
1,145
Ag
7440-22-4
0.47%
0.061
4,656
silica (fused) 60676-86-0
73.05%
9.57
730,534
epoxy resin
29690-82-2
2.34%
0.307
23,435
phenol resin
9003-35-4
2.34%
0.307
23,435
carbon black
1333-86-4
0.24%
0.031
2,366
Sn
7440-31-5
0.46%
0.06
4,580
leadframe
die attach
encapsulation*
plating
Cu alloy
w/ silver plating
silver epoxy
EMC GREEN
matte tin
18.24%
0.58%
77.97%
0.46%
2.39
0.076
10.215
0.06
*EMC GREEN molding compound is Halogen Free.
Disclaimer
The information provided in this Material Composition data sheet is, to the best of our knowledge, correct. However, there is no
guarantee to completeness or accuracy, as some information is derived from data sources outside the company.
R0 (11-January 2012)
w w w. c e n t r a l s e m i . c o m