Package Details TLM832DS Case Mechanical Drawing Part Marking: 2-3 Character Alpha/Numeric Code Lead Code: Reference individual device datasheet. Mounting Pad Geometry (Dimensions in mm) R0 (7-February 2012) w w w. c e n t r a l s e m i . c o m Package Details TLM832DS Case Tape Dimensions and Orientation (Dimensions in mm) Devices are taped in accordance with Electronic Industries Association Standard EIA-481-D Tape Width: 8mm Direction of Unreeling Packaging Base 7” Reel = 3,000 pcs. Reel Labeling Information Each reel is labeled with the following information: Central Part Number, Customer Part Number, Purchase Order Number, Quantity, Lot Number, Date Code, Ship Date and Marking Code. Reel Packing Information Reel Size Reels per Box (Maximum) Parts per Box (Maximum) INCH CM LB KG 7” 9 17 40 108 27,000 51,000 120,000 324,000 9x9x5 9x9x9 21x9x9 27x9x17 23x23x13 23x23x23 53x23x23 69x23x43 4 7 14 39 2 4 7 18 Box Dimensions Shipping Weight (Max.) Ordering Information • For devices taped and reeled on 7” reels, add TR suffix to part number. • All SMDs are available in small quantities for prototype and manual placement applications. R0 (7-February 2012) w w w. c e n t r a l s e m i . c o m Material Composition Specification TLM832DS Case Device average mass . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13.1 mg Fluctuation margin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +/-10% Material Component Material Substance Substance CAS No. (%wt) (mg) (%wt) (mg) (ppm) active device doped Si 2.29% 0.3 Si 7440-21-3 2.29% 0.3 22,901 bond wire gold 0.46% 0.06 Au 7440-57-5 0.46% 0.06 4,580 Cu 7440-50-8 17.63% 2.31 176,336 Fe 7439-89-6 0.4% 0.053 4,046 Zn 7440-66-6 0.02% 0.003 229 Ag 7440-22-4 .18% 0.023 1,756 epoxy resin Proprietary 0.11% 0.015 1,145 Ag 7440-22-4 0.47% 0.061 4,656 silica (fused) 60676-86-0 73.05% 9.57 730,534 epoxy resin 29690-82-2 2.34% 0.307 23,435 phenol resin 9003-35-4 2.34% 0.307 23,435 carbon black 1333-86-4 0.24% 0.031 2,366 Sn 7440-31-5 0.46% 0.06 4,580 leadframe die attach encapsulation* plating Cu alloy w/ silver plating silver epoxy EMC GREEN matte tin 18.24% 0.58% 77.97% 0.46% 2.39 0.076 10.215 0.06 *EMC GREEN molding compound is Halogen Free. Disclaimer The information provided in this Material Composition data sheet is, to the best of our knowledge, correct. However, there is no guarantee to completeness or accuracy, as some information is derived from data sources outside the company. R0 (11-January 2012) w w w. c e n t r a l s e m i . c o m