TDA7266SA 7W+7W DUAL BRIDGE AMPLIFIER ■ ■ WIDE SUPPLY VOLTAGE RANGE (3.5-18V) MINIMUM EXTERNAL COMPONENTS – NO SWR CAPACITOR TECHNOLOGY BI20II – NO BOOTSTRAP – NO BOUCHEROT CELLS – INTERNALLY FIXED GAIN ■ STAND-BY & MUTE FUNCTIONS ■ SHORT CIRCUIT PROTECTION ■ THERMAL OVERLOAD PROTECTION CLIPWATT15 ORDERING NUMBER: TDA7266SA DESCRIPTION The TDA7266SA is a dual bridge amplifier specially designed for LCD Monitor, PC Motherboard, TV and Portable Radio applications. Pin to pin compatible with: TDA7266S, TDA7266, TDA7266M, TDA7266MA, TDA7266B, TDA7297SA & TDA7297. BLOCK AND APPLICATION DIAGRAM VCC 470µF 3 0.22µF 4 IN1 + 100nF 13 1 OUT1+ 2 OUT1- 15 OUT2+ 14 OUT2- ST-BY 7 S-GND 0.22µF IN2 9 Vref 12 + + - MUTE 6 PW-GND 8 + D94AU175B September 2003 1/11 TDA7266SA ABSOLUTE MAXIMUM RATINGS Symbol Parameter Value Unit Vs Supply Voltage 20 V IO Output Peak Current (internally limited) 2 A Ptot Total Power Dissipation (Tamb = 70°C) Top Operating Temperature Tstg, Tj 20 W 0 to 70 °C -40 to 150 °C Value Unit Typ = 1.8; Max. = 2.5 °C/W 48 °C/W Storage and Junction Temperature THERMAL DATA Symbol Parameter Rth j-case Thermal Resistance Junction-case Rth j-amb Thermal Resistance Junction-ambient PIN CONNECTION (Top view) 15 OUT2+ 14 OUT2- 13 VCC 12 IN2 11 N.C. 10 N.C. 9 S-GND 8 PW-GND 7 ST-BY 6 MUTE 5 N.C. 4 IN1 3 VCC 2 OUT1- 1 OUT1+ D03AU1463 ELECTRICAL CHARACTERISTCS (VCC = 11V, RL = 8Ω, f = 1KHz, Tamb = 25°C unless otherwise specified) Symbol VCC Iq Parameter Test Condition Supply Range 3 Total Quiescent Current VOS Output Offset Voltage PO Output Power THD 10% Total Harmonic Distortion PO = 1W THD Min. 6.3 Typ. CT AMUTE Supply Voltage Rejection 11 18 V 65 mA 120 mV 7 0.05 % 1 % 40 56 dB 60 dB Mute Attenuation 60 80 dB 150 °C GV Closed Loop Voltage Gain 2/11 0.2 46 Thermal Threshold ∆GV W Crosstalk Tw Voltage Gain Matching f = 100Hz, VR =0.5V Unit 50 PO = 0.1W to 2W f = 100Hz to 15KHz SVR Max. 25 26 27 dB 0.5 dB TDA7266SA ELECTRICAL CHARACTERISTCS (continued) (VCC = 11V, RL = 8Ω, f = 1KHz, Tamb = 25°C unless otherwise specified) Symbol Parameter Ri Input Resistance VTMUTE Mute Threshold VTST-BY IST-BY eN Test Condition Min. Typ. 25 30 Max. KΩ for VCC > 6.4V; Vo = -30dB 2.3 2.9 4.1 V for VCC < 6.4V; Vo = -30dB VCC/2 -1 VCC/2 -075 VCC/2 -0.5 V 0.8 1.3 1.8 V 100 µA St-by Threshold St-by Current V6 = GND Total Output Voltage Unit A Curve; f = 20Hzto 20KHz µV 150 APPLICATION SUGGESTION STAND-BY AND MUTE FUNCTIONS (A) Microprocessor Application In order to avoid annoying "Pop-Noise" during Turn-On/Off transients, it is necessary to guarantee the right Stby and mute signals sequence. It is quite simple to obtain this function using a microprocessor (Fig. 1 and 2). At first St-by signal (from µP) goes high and the voltage across the St-by terminal (Pin 7) starts to increase exponentially. The external RC network is intended to turn-on slowly the biasing circuits of the amplifier, this to avoid "POP" and "CLICK" on the outputs. When this voltage reaches the St-by threshold level, the amplifier is switched-on and the external capacitors in series to the input terminals (C3, C53) start to charge. It's necessary to mantain the mute signal low until the capacitors are fully charged, this to avoid that the device goes in play mode causing a loud "Pop Noise" on the speakers. A delay of 100-200ms between St-by and mute signals is suitable for a proper operation. Figure 1. Microprocessor Application VCC C1 0.22µF IN1 3 4 + 1 C5 470µF OUT1+ 2 OUT1- 15 OUT2+ 14 OUT2- 13 C6 100nF - ST-BY R1 10K 7 C2 10µF S-GND µP 9 Vref C3 0.22µF IN2 MUTE R2 10K 12 + + - 6 C4 1µF PW-GND 8 + D95AU258A 3/11 TDA7266SA Figure 2. Microprocessor Driving Signals +VS(V) VIN (mV) VST-BY pin 7 1.8 1.3 0.8 VMUTE pin 6 4.1 2.9 2.3 Iq (mA) VOUT (V) OFF ST-BY PLAY MUTE MUTE ST-BY OFF D96AU259mod B) Low Cost Application In low cost applications where the µP is not present, the suggested circuit is shown in fig.3. The St-by and mute terminals are tied together and they are connected to the supply line via an external voltage divider. The device is switched-on/off from the supply line and the external capacitor C4 is intended to delay the St-by and mute threshold exceeding, avoiding "Popping" problems. 4/11 TDA7266SA Figure 3. Stand-alone low-cost Application VCC C3 0.22µF R1 47K IN1 ST-BY R2 47K 3 4 + 1 C1 470µF OUT1+ 2 OUT1- 15 OUT2+ 14 OUT2- 13 C2 100nF 7 C4 10µF S-GND 9 - Vref C5 0.22µF + 12 + IN2 - MUTE PW-GND 6 8 + D95AU260A Figure 4. Distortion vs Frequency Figure 5. Gain vs Frequency THD(%) Le vel(dB r) 5.0000 10 4.0000 Vcc = 11V Rl = 8 oh m Po ut = 1W 3.0000 V cc = 11 V Rl = 8 o h m 1 2.0000 1.0000 0.0 -1.000 P o u t = 100 m W 0.1 -2.000 -3.000 P o u t = 2W -4.000 0.0 10 -5.000 100 1k fr eq ue nc y (Hz) 10k 20k 10 100 1k 10k 100k fr equenc y (Hz) 5/11 TDA7266SA Figure 6. Mute Attenuation vs Vpin.8 Figure 8. Quiescent Current vs Supply Voltage Iq (mA) Attenua tion (dB) 10 70 0 65 -10 60 -20 -30 55 -40 50 -50 45 -60 -70 40 -80 35 -90 30 -100 1 1.5 2 2.5 3 3.5 4 4.5 5 Figure 7. Stand-By attenuation vs Vpin 9 Attenuation (dB) 0 0.2 0.4 0.6 0.8 1 1.2 1.4 Vpin.7 (V) 6/11 4 5 6 7 8 9 10 11 12 Vsupply(V) Vpin .6(V) 10 0 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 -110 -120 3 1.6 1.8 2 2.2 2.4 13 14 15 16 17 18 TDA7266SA Figure 9. PC Board Component Layout Figure 10. Evaluation Board Top Layer Layout Figure 11. Evaluation Board Bottom Layer Layout 7/11 TDA7266SA HEAT SINK DIMENSIONING: In order to avoid the thermal protection intervention, that is placed approximatively at Tj = 150°C, it is important the dimensioning of the Heat Sinker RTh (°C/W). The parameters that influence the dimensioning are: – Maximum dissipated power for the device (Pdmax) – Max thermal resistance Junction to case (RTh j-c) – Max. ambient temperature Tamb max – Quiescent current Iq (mA) Example: VCC = 11V, Rload = 8ohm, RTh j-c = 2.5 °C/W , Tamb max = 50°C 2 Vc c - + Iq ⋅ Vc c Pdmax = (N° channels) · -------------------------2 R loa d Π ⋅ -------------2 Pdmax = 2 · ( 3.0 ) + 0.5 = 6.5 W 150 – T am b max 150 – 50- – 2.5 = 12.8°C/W - – R T h j-c = --------------------(Heat Sinker) R Th c-a = ---------------------------------------6.5 P d max In figure 12 is shown the Power derating curve for the device. Figure 12. Power derating curve 25 Pd (W) 20 (a) 15 (b) 10 (c) 5 0 0 40 80 Tamb (°C) 8/11 120 160 a) Infinite Heatsink b) 7 °C/ W c) 10 °C/ W TDA7266SA Clipwatt Assembling Suggestions The suggested mounting method of Clipwatt on external heat sink, requires the use of a clip placed as much as possible in the plastic body center, as indicated in the example of figure 13. A thermal grease can be used in order to reduce the additional thermal resistance of the contact between package and heatsink. A pressing force of 7 - 10 Kg gives a good contact and the clip must be designed in order to avoid a maximum contact pressure of 15 Kg/mm2 between it and the plastic body case. As example , if a 15Kg force is applied by the clip on the package , the clip must have a contact area of 1mm2 at least. Figure 13. Example of right placement of the clip 9/11 TDA7266SA mm inch DIM. MIN. TYP. MAX. MIN. TYP. MAX. A 3.2 0.126 B 1.05 0.041 C 0.15 0.006 D 1.55 0.061 Weight: 1.92gr E 0.49 0.55 0.019 0.022 F 0.67 0.73 0.026 0.029 G 1.14 1.27 1.4 0.045 0.050 0.055 G1 17.57 17.78 17.91 0.692 0.700 0.705 H1 12 0.480 H2 18.6 0.732 H3 19.85 0.781 L 17.95 0.707 L1 14.45 0.569 L2 10.7 OUTLINE AND MECHANICAL DATA 11 11.2 0.421 0.433 L3 5.5 0.217 M 2.54 0.100 M1 2.54 0.100 0.441 Clipwatt15 0044538 10/11 TDA7266SA Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. 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