PD84001 RF power transistor the LdmoST plastic family Features ■ Excellent thermal stability ■ Common source configuration ■ Broadband performances POUT = 1 W with 15 dB gain @ 870 MHz ■ Plastic package ■ ESD protection ■ Supplied in tape and reel ■ In compliance with the 2002/95/EC european directive SOT-89 Figure 1. Pin connection Description Source The PD84001 is a common source N-channel, enhancement-mode lateral field-effect RF power transistor. It is designed for high gain, broad band commercial and industrial applications. It operates at 7 V in common source mode at frequencies of up to 1 GHz. PD84001’s superior gain and efficiency makes it an ideal solution for portable radio and UHF RFID reader. Table 1. Source Gate Drain Device summary Order code Marking Package Packaging PD84001 8401 SOT-89 Tape and reel August 2008 Rev 4 1/18 www.st.com 18 Contents PD84001 Contents 1 2 Electrical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Static . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.2 Dynamic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.3 ESD protection characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.4 Moisture sensitivity level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 Impedance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 4 Typical performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 5 Test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 6 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 7 2/18 6.1 Thermal pad and via design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 6.2 Soldering profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 PD84001 Electrical data 1 Electrical data 1.1 Maximum ratings Table 2. Absolute maximum ratings (TCASE = +25 °C) Symbol Value Unit V(BR)DSS Drain-source voltage 18 V VGS Gate-source voltage -0.5 to +15 V 1.5 A 6 W 150 °C -65 to +150 °C Value Unit 21 °C/W ID PDISS TJ TSTG 1.2 Parameter Drain current Power dissipation Max. operating junction temperature Storage temperature Thermal data Table 3. Symbol RthJC Thermal data Parameter Junction - case thermal resistance 3/18 Electrical characteristics PD84001 2 Electrical characteristics 2.1 Static Table 4. Static (TCASE = +25 oC) Symbol 2.2 Test conditions Min. VDS = 28 V 1 μA IGSS VGS = 5 V VDS = 0 V 1 μA VGS(Q) VDS = 10 V ID = 250 μA 5.0 V VDS(ON) VGS = 10 V ID = 0.4 A CISS VGS = 0 V VDS = 7 V COSS VGS = 0 V CRSS VGS = 0 V 2.0 3.0 0.6 V f = 1 MHz 14.7 pF VDS = 7 V f = 1 MHz 13.3 pF VDS = 7 V f = 1 MHz 1.3 pF Dynamic Dynamic Test conditions Min. Typ. Max. Unit POUT VDD = 7.5 V, IDQ = 50 mA, PIN = 17 dBm, f = 870 MHz 30 31 dBm GPS VDD = 7.5 V, IDQ = 50 mA, POUT = 30 dBm, f = 870 MHz 13 15 dB VDD = 7.5 V, IDQ = 50 mA PIN = 17 dBm, f = 870 MHz 55 60 % hD Load VDD = 7.5 V, IDQ = 50 mA, POUT = 1 W, f = 870 MHz mismatch All phase angles 20:1 VSWR ESD protection characteristics Table 6. ESD protection characteristics Test conditions Class Human body model 2 Machine model M3 Moisture sensitivity level Table 7. 4/18 Unit VGS = 0 V Symbol 2.4 Max. IDSS Table 5. 2.3 Typ. Moisture sensitivity level Test methodology Rating J-STD-020B MSL 3 PD84001 3 Impedance Impedance Figure 2. Current conventions Table 8. Impedance data Freq. (MHz) ZGS (Ω) ZDL(Ω) 920 4.0 + j4.3 3.7 + j6.2 900 3.6 + j4.3 3.9 + j5.5 880 3.3 + j4.1 4.1 + j4.7 860 3.1 + j3.7 4.3 + j4.0 840 2.9 + j3.4 4.5 + j3.2 820 2.8 + j3.0 4.8 + j2.4 800 2.7 + j2.5 5.0 + j1.6 5/18 Typical performance 4 Typical performance Figure 3. VGS vs ID 6/18 PD84001 Figure 4. DC output characteristics PD84001 Typical performance Figure 5. CRSS vs VDS Figure 6. CISS vs VDS 20 3.2 3.0 18 2.8 2.6 16 2.4 14 2.2 Ciss (pF) Crss (pF) 2.0 1.8 1.6 1.4 1.2 12 10 8 6 1.0 0.8 4 0.6 0.4 2 0.2 0 0.0 0 1 2 3 4 5 6 CRSS 7 8 9 10 11 12 13 14 15 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Vds (V) CISS Figure 7. Vds (V) COSS VS VDS Coss vs Vds 28 26 24 22 Coss (pF) 20 18 16 14 12 10 8 6 4 2 0 0 1 2 3 4 5 COSS 6 7 8 9 10 11 12 13 14 15 Vds (V) 7/18 Typical performance Figure 8. PD84001 Gain vs output power and frequency Figure 9. Output power vs input power and frequency 34 20 32 18 30 Pout (dBm) Gain (dB) 16 14 12 10 28 26 24 Vdd = 7.5V Idq = 50m A 22 8 20 6 18 18 20 22 24 26 28 30 32 34 0 2 4 6 8 Pout (dBm) 840 MHz 870 MHz 900 MHz 840 MHz 12 14 16 18 20 870 MHz 900 MHz Figure 11. Gain and efficiency vs frequency 70 18 80 60 16 70 50 14 60 12 50 10 40 Gain (dB) Nd (%) Figure 10. Efficiency vs output power and frequency 40 30 Vdd = 7.5V Idq = 50m A 20 Pin = 17dBm Vdd = 7.5V Idq = 50m A 8 10 18 20 22 24 26 28 30 32 Pout (dBm) 840 MHz 8/18 10 Pin (dBm) 870 MHz 34 6 810 820 830 840 850 860 870 880 Freq (MHz) 900 MHz Gain Nd 890 900 30 910 20 920 PD84001 Typical performance Figure 12. Input return loss vs frequency Figure 13. Output power vs input power and VDD 0 34 -4 30 Pout (dBm) Input Return Loss (dB) 32 Pin = 17dBm Vdd = 7.5V Idq = 50m A -2 -6 28 26 24 Freq = 870 MHz Idq = 50m A 22 -8 20 -10 810 820 830 840 850 860 870 880 890 900 910 920 18 0 2 4 6 8 Freq (MHz) 10 12 14 16 18 20 Pin (dBm) 9V 7.5V 6V 70 34 60 32 50 30 0.4 28 0.3 30 26 0.2 20 24 0.1 Pout (dBm) Nd (%) Figure 14. Efficiency vs output power and VDD Figure 15. Output power and drain current vs drain supply voltage 40 10 18 20 22 24 26 28 30 Pout (dBm) 9V 7.5V 32 34 0.6 Freq = 870 MHz Pin = 17dBm Idq = 50m A 0.5 22 0 2 3 4 5 6 7 8 9 10 Vdd (V) 6V Pout ID 9/18 Typical performance PD84001 y 26 90 24 80 22 70 20 60 Freq = 520 MHz Vdd = 7.5V 18 50 16 40 14 30 12 20 10 10 8 0 -5 0 5 10 15 20 25 30 Pin (dBm) 10/18 Gain-70mA Gain-200mA Gain-50mA Gain-100mA Eff-70mA Eff-200mA Eff-50mA Eff-100mA Efficiency (%) Gain (dB) Figure 16. Gain and efficiency vs pin PD84001 5 Test circuit Test circuit Figure 17. Test circuit schematic / 840-900 MHz 11/18 Package mechanical data 6 PD84001 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com 12/18 PD84001 Package mechanical data Table 9. SOT-89 mechanical data Dim. mm. Min Typ Inch Max Min Typ Max A 1.4 1.6 55.1 63.0 B 0.44 0.56 17.3 22.0 B1 0.36 0.48 14.2 18.9 C 0.35 0.44 13.8 17.3 C1 0.35 0.44 13.8 17.3 D 4.4 4.6 173.2 181.1 D1 1.62 1.83 63.8 72.0 E 2.29 2.6 90.2 102.4 e 1.42 1.57 55.9 61.8 e1 2.92 3.07 115.0 120.9 H 3.94 4.25 155.1 167.3 L 0.89 1.2 35.0 47.2 Figure 18. Package dimensions 13/18 Package mechanical data 6.1 PD84001 Thermal pad and via design Thernal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been designed to address thermal, power dissipation and electrical requirements of the device. The via pattern is based on thru-hole vias with 0.203 mm to 0.330 mm finished hole size on a 0.5 mm to 1.2 mm grid pattern with 0.025 plating on via walls. If micro vias are used in a design, it is suggested that the quantity of vias be increased by a 4:1 ratio to achieve similar results. Figure 19. Pad layout details SOT-89 14/18 PD84001 6.2 Package mechanical data Soldering profile Figure 20 shows the recommeded solder for devices that have Pb-free terminal plating and where a Pb-free solder is used. Figure 20. Recommended solder profile Figure 21 shows the recommeded solder for devices with Pb-free terminal plating used with leaded solder, or for devices with leaded terminal plating used with a leaded solder. Figure 21. Recommended solder profile for leaded devices 15/18 Package mechanical data Figure 22. Reel information 16/18 PD84001 PD84001 7 Revision history Revision history Table 10. Document revision history Date Revision Changes 06-Dec-2006 1 Initial release 16-May-2007 2 Marking updated 05-Jun-2007 3 Part number update 25-Aug-2008 4 Updated Table 4 on page 4 17/18 PD84001 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 18/18