SD3932 RF power transistors HF/VHF/UHF N-channel MOSFETs Preliminary Data Features ■ Gold metallization ■ Excellent thermal stability ■ Common source push-pull configuration ■ POUT = 350 W min. with 26.8 dB gain @ 123 MHz ■ In compliance with the 2002/95/EC european directive M244 Epoxy sealed Description The SD3932 is a gold metallized N-channel MOS field-effect RF power transistor. It is intended for use in 100V DC large signal applications up to 250MHz. Figure 1. Pin connection 1 1 3 3 2 1. Drain 2 3. Source 2. Gate Table 1. Device summary Order code Marking Package Packaging SD3932 SD3932 M244 Plastic tray October 2007 Rev 4 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. 1/14 www.st.com 14 Contents SD3932 Contents 1 2 Electrical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Static . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.2 Dynamic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 Impedance data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 4 Typical performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 5 Test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 6 Circuit layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 7 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 2/14 SD3932 Electrical data 1 Electrical data 1.1 Maximum ratings Table 2. Absolute maximum ratings (TCASE = 25°C) Symbol V(BR)DSS(1) VDGR VGS ID PDISS Tj TSTG Parameter Value Unit Drain source voltage 250 V Drain-gate voltage (RGS = 1MΩ) 250 V Gate-source voltage ±20 V Drain current 20 A Power dissipation 500 W Max. operating junction temperature 200 °C -65 to +150 °C Value Unit 0.35 °C/W Storage temperature 1. TJ = 150°C 1.2 Thermal data Table 3. Symbol RthJC Thermal data Parameter Junction - case thermal resistance 3/14 Electrical characteristics 2 SD3932 Electrical characteristics TCASE = +25 oC 2.1 Static Table 4. Static (per side) Symbol V(BR)DSS(1) VGS = 0 V Test conditions Min. IDS = 100 mA 250 Typ. Max. Unit V IDSS VGS = 0 V VDS = 100 V IGSS VGS = 20 V VDS = 0 V VGS(Q) VDS = 10 V ID = 250 mA VDS(ON) VGS = 10 V ID = 5A GFS VDS = 10 V ID = 2.5 A CISS VGS = 0 V VDS = 100 V f = 1 MHz 500 pF COSS VGS = 0 V VDS = 100 V f = 1 MHz 134 pF CRSS VGS = 0 V VDS = 100 V f = 1 MHz 6 pF 1.5 1 mA 250 nA 2.5 4.0 V 2.5 3.5 V 3 S 1. TJ = 150°C 2.2 Dynamic Table 5. Dynamic Symbol Test conditions Typ. Max. Unit 350 425 W P1dB VDD = 100 V GPS VDD = 100 V, IDQ = 2 x 250mA, POUT = 350W,f = 123MHz 26.8 dB hD VDD = 100 V, IDQ = 2 x 250mA, POUT = 350W,f = 123MHz 66 % IDQ = 2 x 250 mA f = 123MHz VDD = 100 V, IDQ = 2 x 250mA, POUT = 300W,f = 123MHz Load mismatch All phase angles 4/14 Min. 3:1 VSWR SD3932 3 Impedance data Impedance data Figure 2. Impedance data D ZDL Typical Input Impedance Typical Drain Load Impedance G Zin S Table 6. Impedance data Freq ZIN (Ω) ZDL (Ω) 123 MHz (800W Peak) 1.4 - j 5.5 6.4 + j 10.2 123 MHz (350W CW) 0.7 - j 3.9 3.2 + j 15 5/14 Typical performance 4 SD3932 Typical performance Figure 3. Capacitances vs voltage 1000 Coss Crss Ciss 900 Capacitances (pF) 800 700 600 500 400 Freq = 1 MHz 300 200 100 0 0 20 40 60 80 100 120 Vds (V) Figure 4. Transient thermal impedance Zth , Transient Thermal Impedance , Deg C/W 0.25 DF = 50% 0.2 DF = 20% 0.15 DF = 10% 0.1 0.05 0 1.0E-04 Single Pulse 1.0E-03 1.0E-02 1.0E-01 Rectangular Pulse Width , Seconds 6/14 1.0E+00 SD3932 Typical performance Figure 5. Maximum safe operating area 100 Ids(A) Operation limited by Rds(on) 100 µS 1 mS 10 10 mS 100 mS Tc = +25 °C Tj = +200 °C SINGLE PULSE DC 1 1 10 100 1000 Vds(V) Ids(A) Figure 6. Zero temperature coefficient point + 25°C 10 9 8 7 6 5 4 3 2 1 0 - 55°C +125°C ZTC POINT 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 Vgs(V) 7/14 Typical performance Figure 7. SD3932 Pout & efficiency vs pin - CW Figure 8. 90 29 400 80 28 350 70 27 300 60 26 250 50 200 40 150 30 100 0 0.0 0.5 1.0 25 24 22 10 21 0 20 1.5 0 Pin (W) Figure 9. 29 800 80 28 700 70 27 600 60 26 500 50 400 40 300 30 23 20 22 10 21 0 20 Freq = 123 MHz Vdd = 100V Idq = 2 x 250mA 0 0.0 2.0 4.0 Pin (W) 8/14 6.0 8.0 Gain(dB) Pout (W) 100 Pout (W) 90 Nd (%) 30 Eff 200 100 150 200 250 300 350 400 450 500 Figure 10. Gain vs output power 1 msec - 10% 100 1000 900 50 Pin (W) Pout(W) Pout & efficiency vs pin power 1 msec - 10% Pout Freq = 123 MHz Vdd = 100V Idq = 2 x 250mA 23 20 Freq = 123 MHz Vdd = 100V Idq = 2 x 250mA 50 Gain(dB) Pout (W) 450 Eff Pout (W) 30 Pout Nd (%) 100 500 Gain vs output power - CW - Freq = 123 MHz Vdd = 100V Idq = 2 x 250mA 25 24 0 100 200 300 400 500 Pin (W) Pout(W) 600 700 800 900 SD3932 5 Test circuit Test circuit Figure 11. Test circuit Table 7. Bill of materials Component Description C1 120 pF ATC 100B chip capacitor C2 1-20 pf Johanson variable capacitor C3 51 pF ATC 100B chip capacitor C4, C5 750 pF ATC 700B chip capacitor C6 43 pF ATC 100B chip capacitor C7 20 pF ATC 100B chip capacitor C8 1000 pF ATC 100C chip capacitor C9 43 pF ATC 100B chip capacitor C10 2200 pF ATC 100C chip capacitor C11 1200 pF ATC 100C chip capacitor R1, R2 1K ohm 1/4 watt chip resistor R3, R4 1K ohm 1/2 watt axial lead resistor L1 3 turns, 16 ga magnet wire, Id 3/8", 95 nH FB1, FB2 Fair-Rite # 2743019447 B1 20 ga teflon coated wire thru copper tube OD 1/8"x 1.3" T1 20 ga teflon coated wire thru 4 copper tubes OD 1/8"x 1.5" TL1 .135" x .155" microstrip TL2, TL3 .420" x .350" microstrip 9/14 Circuit layout Table 7. 6 Bill of materials (continued) Component Description TL4, TL5 .220" x .350" microstrip TL6, TL7 .350" x .660" microstrip TL8 .225" x .200" microstrip TL9 .175" x .250" microstrip Board .062" FR-4 Circuit layout Figure 12. Circuit layout photo 10/14 SD3932 SD3932 7 Package mechanical data Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 11/14 Package mechanical data Table 8. SD3932 M244 (.400 x .860 4/L BAL N/HERM W/FLG) mechanical data mm. Inch Dim. Min A Typ 5.59 B Max Min 5.84 0.220 5.08 Typ Max 0.230 0.200 C 3.02 3.28 0.119 0.129 D 9.65 9.91 0.380 0.390 E 19.81 20.82 0.780 0.820 F 10.92 11.18 0.430 0.440 G 27.94 1.100 H 33.91 34.16 1.335 1.345 I 0.10 0.15 0.004 0.006 J 1.52 1.78 0.060 0.070 K 2.59 2.84 0.102 0.112 L 4.83 5.84 0.190 0.230 M 10.03 10.34 0.395 0.407 N 21.59 22.10 0.850 0.870 Figure 13. Package dimensions Controlling Dimension: Inches 12/14 1020876B SD3932 8 Revision history Revision history Table 9. Document revision history Date Revision Changes 09-Sep-2003 1 First release 03-Jul-2007 2 Specification upgrade 07-Aug-2007 3 Updated: Cover page, Figure 7, 8, 9, 10 on page 8 31-Oct-2007 4 Updated: Table 4: Static (per side) on page 4 Added Section 5: Test circuit on page 8, Section 6: Circuit layout on page 10 13/14 SD3932 Please Read Carefully: Information in this document is provided solely in connection with ST products. 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