M65665CFP/SP PICTURE-IN-PICTURE SIGNAL PROCESSING REJ03F0011-0100Z Rev.2.00 Sep.04.2003 Description The M65665CFP/SP is a PIP (Picture in Picture) signal processing LSI, whose sub-picture input is composite signal or component signals(Y/C or Y/U/V) for NTSC. The built-in field memory (168k-bit RAM) , V-chip data slicer and analog circuitries lead the high quality PIP system low cost and small size. Features • • • • • Internal V-chip data slicer (for sub-picture) Vertical filter for sub-picture ( Y signal ) Base band com filter (2 Line) Single sub-picture ( selectable picture size : 1/9 , 1/16 ) Sub-picture processing specification ( 1/9 , 1/16 size) : Quantization bits Y, B-Y, R-Y : 7 bits Horizontal sampling 229 pixels (Y), 57 pixels (B-Y, R-Y) Vertical lines 69/ 52 lines • Frame ( sub-picture ) on/off • Built-in analog circuits : Two 8-bit A/D converters (for sub-picture signal) Three 8-bit D/A converters (for Y, U and V of sub-picture) Auto Slicer(Sync Sep.), Sync-tip-clamp, VCXO, OSD switch, etc.. I • I C BUS control ( parallel/serial control) : PIP on/off , Frame on/off ( programmable luma level), Sub-picture size ( 1/9, 1/16 ), PIP position ( free position ), Picture freeze , Y delay adjustment, Chroma level, Tint, Black level, Contrast ...etc.. Application NTSC color TV Recommended Operating Conditions Supply voltage range --------------------- 3.2 to 3.5 V Recommended supply voltage --------------------- 3.3 V Rev.2.00, Sep.04.2003, page 1 of 17 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 Rev.2.00, Sep.04.2003, page 2 of 17 SWM SDATA SCLK DVdd DVss BGPS SCK BGPM FSC TEST5 5 6 7 8 9 10 11 12 13 14 15 16 17 18 VRT 4 Yin(ADC) 3 SWM OSD_SEL SDATA SCLK DVdd DVss BGPS SCK BGPM FSC TEST5 CIN(ADC) AVss(ADC) VRT Yin(ADC) VRB AVdd(VCXO) CVBSIN(ADC) Uin(ADC) FILTER AVdd(ADC) Vin(ADC) BIAS CSYNCS X'tal(NTSC) Pin Configuration of M65665CSP (Top View) X'tal(PAL-M) SWMG TESTEN 2 RESET X'tal(PAL-N) AVss(VCXO) HD VD Vdd(DAC) OSD_BIN V(B)OUT VZ OSD_GIN U(G)OUT AGnd(DAC) OSD_RIN Y(R)OUT 1 VRB Uin(ADC) Vin(ADC) AVdd(ADC) CSYNCS RESET SWMG TESTEN 1 OSD_SEL CIN(ADC) AVss(ADC) CVBSIN(ADC) AVdd(VCXO) FILTER BIAS X'tal(NTSC) X'tal(PAL-M) X'tal(PAL-N) AVss(VCXO) HD VD Vdd(DAC) OSD_BIN V(B)OUT VZ OSD_GIN U(G)OUT AGnd(DAC) OSD_RIN Y(R)OUT M65665CFP/SP Pin Configuration of M65665CFP (Top View) 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 M65665CFP XXXXXX 19 20 21 42 Pin SSOP Package : 42P2R 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 XXXXXX M65665CSP 19 20 21 42 Pin SDIP Package : 42P4B MUX Rev.2.00, Sep.04.2003, page 3 of 17 AVDD A/D 19 18 17 22 33 32 DEMUX & Encoder AGND Demod. & TINT B.P.F. 26 27 B.Gate & P.D. 28 SW VCXO 29 30 I2C BUS Analog Switch 37 RESET TESTEN 41 38 35 2 DVDD DGND V-CHIP Data Slicer Sync. Slice(analog) Sync. Auto Slice(analog) Sync. Sep.(digital) I2C BUS Sub-DAC DAC I2C BUS Sub-DAC DAC I2C BUS Sub-DAC DAC 1 4 3 SDA SW 36 SCL A/D Timing Gen. V U Y 39 Main HD 24 20 Comb Filter Main VD L.P.F. Sub picture(C) Vertical Filter 42 Sub picture(V) 21 Sub picture (Y(Y/U/V)) Sub picture(U) Sub picture (CVBS or Y(Y/C)) + OSD_SEL Bexttin Gextin Rextin PIP SW V/B OUTPUT U/G OUTPUT Y/R OUTPUT M65665CFP/SP Block Diagram 14 Output Control & RGB Matrix PIP Field Memory I 2C I/F 12 11 10 9 8 7 13 15 Ext. C-sync 6 5 40 31 23 34 25 16 M65665CFP/SP Absolute Maximum Ratings (Vss=0 V) Limits Parameter Symbol Min. Max. Unit Supply voltage (3.3V) Input voltage (except for 5V input) VDD3 VI3 −0.3 −0.3 4.2 VDD3+0.3 V V Input voltage (5V) Output voltage VI5 VO −0.3 −0.3 5.25 VDD3+0.3 V V Output current (*1) Operating temperature IO Topr IOH=−4 −10 IOL=4 70 mA deg. Storage temperature Tstg −50 125 deg. Conditions Note : 1. Output current per output terminal. But Pd limits all current. THERMAL DERATING (MAXIMUM RATING) POWER DISSIPATION Pd (mW) 2000 1600 1350 M 65 1200 1100 M6 5 800 750 600 66 5C 66 5C SP FP 400 0 0 25 50 70 75 100 125 AMBIENT TEMPERATURE Ta (deg.) Recommended Operating Conditions (Ta = 25 °C, unless otherwise noted) Parameter Symbol Min. Typ. Max. Unit Supply voltage Operating frequency VDD3 fopr 3.2 3.3 14.32 3.5 V MHz “H” Input voltage (CMOS interface) “L” Input voltage (CMOS interface) VIH VDD3×0.7 VDD3 V VIL 0 VDD3×0.3 V Output current (output buffer) Output load capacitance IO 2 mA COL 20 pF Rev.2.00, Sep.04.2003, page 4 of 17 Conditions Include pin capacitance (7pF) M65665CFP/SP DC Characteristics (Ta = 25 deg. unless otherwise noted) (VSS=0V) Limits Parameter Symbol Min. Typ. Max. Unit Conditions VIL 0 0.81 V VDD=2.7V VIH 2.52 3.6 V VDD=3.6V IIL3 −10 10 µA VDD=3.6V,VI=0V IIH3 −10 10 µA VDD=3.6V,VI=3.6V VT- 0.8 1.65 V VDD=3.3V VT+ 1.4 2.7 V Hysteresis L VH IIL5 0.3 −100 1.2 10 V µA VDD=3.6V,VI=0V CMOS output voltage H L IIH5 VOL −10 10 0.05 µA V VDD=3.6V,VI=3.6V VDD=3.3V,|IO|=1µA CMOS output current H L VOH IOL 3.25 2 V mA VDD=3.3V,VOL=0.4V Output leakage current H L IOH IOZL −10 −2 10 mA µA VDD=3.3V,VOL=2.6V VDD=3.6V,VO=0V H IOZH CI −10 7 10 15 µA pF VDD=3.6V,VO=3.6V f=1MHz,VDD=0V CO CIO 7 7 15 15 pF pF IDD 140 mA Input voltage (3.3V CMOS interface) L H Input current (3.3V CMOS interface) L H − + Input voltage schmitt (5.0V CMOS interface) Input current (5.0V CMOS interface) Input pin capacitance Output pin capacitance Bi-directional pin capacitance Operating current 3.3V supply Rev.2.00, Sep.04.2003, page 5 of 17 M65665CFP/SP Pin Description Pin No. Name I/O Function 1 SWM CMOS output PIP switch output 2 OSD_SEL CMOS input Output OSD select 3 4 SDATA SCLK CMOS input/output (5V)*1 CMOS input (5V)*1 IIC SDA input/output IIC SCL input 5 6 DVdd DVss Digital Vdd Digital Vss VDD for digital part VSS for digital part 7 8 BGPS SCK CMOS output CMOS input Test output Test input connect to GND 9 10 BGPM FSC CMOS output CMOS input Test output Test input connect to GND 11 12 TEST5 TESTEN CMOS input CMOS input Test input Test input connect to GND connect to GND 13 14 SWMG RESET CMOS input CMOS input PIP switch output enable Power on reset input connect to VDD 15 16 CSYNCS AVdd(ADC) CMOS input Analog Vdd Sub picture external c-sync input Vdd for internal ADC 17 18 VIN(ADC) UIN(ADC) Analog Analog Sub picture V input of ADC Sub picture U input of ADC 19 20 VRB YIN(ADC) Analog Analog Low level reference voltage output of ADC Sub picture Y input of ADC 21 22 VRT CIN(ADC) Analog Analog High level reference voltage output of ADC Sub picture C input of ADC 23 24 AVss(ADC) CVBSIN(ADC) Analog Vss Analog VSS for internal ADC Sub picture CVBS input of ADC 25 26 AVdd(VCXO) FILTER Analog Vdd Analog Vdd for VCXO VCXO filter voltage connection 27 28 BIAS X'tal(NTSC) Analog Analog VCXO bias voltage connection X'tal of NTSC connection 29 30 TEST TEST Analog Analog TEST TEST 31 32 AVss(VCXO) HD Analog Vss CMOS input (5V)*1 Vss for VCXO Main picture HD input 33 34 VD Vdd(DAC) CMOS input (5V)*1 Analog Vdd Main picture VD input Vdd for DAC 35 36 OSD_BIN V(B)OUT Analog Analog OSD input of B Sub picture V or B output 37 38 VZ OSD_GIN Analog Analog Voltage reference output of DAC OSD input of G 39 40 U(G)OUT AVss(DAC) Analog Analog Vss Sub picture U or G output Vss for DAC 41 42 OSD_RIN Y(R)OUT Analog Analog OSD input of R Sub picture Y or R output Note : 1. (5V) means 5V I/F tolerant Rev.2.00, Sep.04.2003, page 6 of 17 Remarks connect to GND connect to GND M65665CFP/SP Basic Application Example When using any or all of the information contained in this diagrams, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Dig. Ana. Digital +3.3V power supply Digital GND Analog +3.3V power supply Analog GND 20 pin input level Sub CVBS and Y(Y/C) input 24 pin input level 0.47u white peak 1.0Vpp (max) 0.66V(max) 3.3 K 0.033u Ana. 0.1u pedestal 18 p 0.01u 23 20 0.1u 24 19 0.01u 18 0.1u 17 0.1u 16 26 27 0.22u sync tip 21 25 3.3 M 0 X1 28 29 31 36 pin output level pedestal 33 OSD B input 0.1u PIP V(B) output 0.01u 0.7Vpp (typ) 0.01u 39 pin output level OSD G input PIP U(G) output 0.7Vpp (typ) 0.1u 0.01u 0.7V (typ) back ground pedestal 35 36 37 38 39 40 42 pin output level white peak 34 OSD R input PIP Y(R) output Rev.2.00, Sep.04.2003, page 7 of 17 0.1u 41 0.01u 42 Sub U input Sub V input pedestal 17 pin input level 0.7Vpp (typ) pedestal 10u 14 13 12 10K 11 10 15 pin input when CSYNC of sub picture is fed from external. 3.3V 9 0V 8 7 2 pin input level 6 5 Dig. pedestal 32 Main HD input Main VD input Ana. 32 pin /33 pin input level 3.3V-5.0V 0V 18 pin input level 0.7Vpp (typ) Dig. 30 sync tip Sub Y(Y/U/V) input 15 Dig. X1 : SIWARD 1-781-377-21(14.31818MHz) pedestal 22 + 0.01u M65665CFP/SP Sub C(Y/C) input Ana. 22 pin input level pedestal 0.7Vpp(typ) white peak 1.0Vpp (max) 0.66V (max) 3.3V 0V 4 I2C BUS Clock input 3 I2C BUS DATA input /output OSD selection input PIP SW output 1 pin output level 2 1 3.3V 0V M65665CFP/SP TV System Block Diagram < Y/U/V PIP Mixing system > Y Y/C Separation C Composite Video Signal Y Y Video Signal Processing C Y/C Separated Video Signal Y/U/V Component Video Signal U Y U V G B Deflection Unit M65665CFP/SP PIP Signal Processing Matrix V CV/Y Y C R Y U V SWM HD Yoke VD < R/G/B PIP&OSD Mixing system > Y Y/C Separation C Composite Video Signal Y R Video Signal Processing C Y/C Separated Video Signal Y/U/V Component Video Signal Y C Y U V Rev.2.00, Sep.04.2003, page 8 of 17 G B CV/Y M65665CFP/SP PIP Signal Processing OSD_R OSD_G OSD_B OSD_F.B. R G B SWM Deflection Unit HD VD Yoke M65665CFP/SP I2C Register Information When using any or all of the information contained in this table, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Address 00h Bit Symbol Read/ Write Reset Value 1/9 Ref. Value Remarks <7> DISP W/R 0 1h Sub picture display : [0] off , [1] on <6> SIZE_V W/R 0 0 Sub picture vertical size : [0] 1/9 , [1] 1/16 <5> SIZE_H W/R 0 0 Sub picture horizontal size : [0] 1/9 , [1] 1/16 <4> WEN W/R 0 1h Sub picture : [0] Still , [1] Moving <3> BGC W/R 0 0 Back ground display : [0] off , [1] on <2> BGCS W/R 0 0 Sub picture mute : [0] off , [1] on <1> FREE_RUN W/R 0 0 VCXO oscilation : [0] Lock , [1] Free run <0> W/R 0 0 For test : 0 set only 01h <7:0> VXA<7:0> W/R 0 20h Sub picture vertical position 02h <7:0> HXA<7:0> W/R 0 20h Sub picture horizontal position 03h <7> DECODE W/R 0 0 Sub picture color decoder reset : [1] reset <6:0> CONTRAST<6:0> W/R 0 32h Sub picture Y or R DAC output amplitude control <7> KILLER W/R 0 0 Sub picture color killer : [0] enable , [1] disable <6:0> U_DAC<6:0> W/R 0 32h Sub picture U or G DAC output amplitude control <7> GRC W/R 0 1h Frame display : [0] off , [1] on <6> YUVN_RGB_SEL W/R 0 0 PIP output mode selection : [0] YUV , [1] RGB <5:0> TINT<5:0> W/R 0 0 Sub picture TINT control <7:6> EXT_SC_SEL<1:0> W/R 0 1h Sub picture c-sync sep. selection : [0] int. digital , [1] int. auto slice , [2] ext.(18 pin) , [3] int. analog Sub picture int. c-sync sep. threshhold setting. 04h 05h 06h 07h 08h 09h 0Ah 0Bh <5:4> DCONT<1:0> W/R 0 0 <3:0> HT<3:0> W/R 0 Ah Sub picture display timing adjust <7:6> INPUT_SEL<1:0> W/R 0 2h Sub picture input selection : [0] YC , [1] N.A. , [2] CVBS , [3] YUV <5:0> BG_START<5:0> W/R 0 0Fh Sub picture Burst Gate Pulse position setting <7:4> ADJ<3:0> W/R 0 4h Main/Sub switch delay control <3:0> YDL<3:0> W/R 0 Ah Sub picture Y/C delay adjust <7:5> BGBY<2:0> W/R 0 0 Back ground U level setting <4:0> Y_OFFSET<4:0> W/R 0 0Fh Sub picture Y bright control <7> VCHIP ONLY W/R 0 1h V-chip decode mode : [0] off , [1] on <6:4> BGRY<2:0> W/R 0 0 Back ground V level setting <3:0> BGY<3:0> W/R 0 6h Back ground Y level setting <7:4> PEDESTV<3:0> W/R 0 0 Sub picture V pedestal level (2's comp) <3:0> PEDESTU<3:0> W/R 0 0 Sub picture U pedestal level (2's comp) Rev.2.00, Sep.04.2003, page 9 of 17 M65665CFP/SP Address Bit Symbol Read/ Write Reset Value 1/9 Ref. Value Remarks 0Ch <7> UV_FILTER_OFF W/R 0 1h Sub picture U,V output filter [0] on , [1] off <6> SET_ACC W/R 0 0 Address 0Dh,0Eh setting mode : [0] fixed value, [1] released to MCU <5:4> W/R 0 0 For test : 0 set only <3> SET_SIZE W/R 0 0 Address 11h<6:0>,12h-14h setting mode : [0] fixed value, [1] released to MCU <2> SET_VCHIP W/R 0 0 Address 15h-17h setting mode : [0] fixed value, [1] released to MCU <1:0> SYNC_DELAY<1:0> W/R 0 0 Sub picture sync. delay control Sub picture color control parameter when YUV input 0Dh 0Eh 0Fh <7:4> YUV_COL<3:0> W/R 0 0 <3> C_GAIN_SEL W/R 0 0 Sub picture chroma : [0] X1 , [1] X2 <2> WDOF_KILLER_ON W/R 0 0 Sub picture killer on when burst PLL is unlock : [0] off , [1] on <1> SET_YUV W/R 0 0 For test : 0 set only <0> CVF W/R 0 0 Internal chroma comb filter : [0] on , [1] off <7> BITSEL W/R 0 0 Sub picture Y clamp time constant : [0] X2 , [1] X1 <6> AFCBITSEL W/R 0 0 Sub picture AFC time constant : [0] X2 , [1] X1 <5:0> ACC_LEVEL<5:0> W/R 0 15h Sub picture color decoder amplitude <7> W/R 0 0 For test : 0 set only <6> W/R 0 0 For test : 0 set only <5> W/R 0 0 For test <4> INV_RFF W/R 0 0 Invert main picture field definition : [0] normal , [1] invert <3> INV_WFF W/R 0 0 Invert sub picture field definition : [0] normal , [1] invert <2> W/R 0 0 For test : 0 set only <1> RFF_FIX W/R 0 0 Main picture field fix : [0] not fix , [1] fix <0> W/R 0 1h For test Rev.2.00, Sep.04.2003, page 10 of 17 M65665CFP/SP Address Bit Symbol Read/ Write Reset Value 1/9 Ref. Value Remarks 10h <7:6> NO_BST_LVL<1:0> W/R 0 0 For test <5:4> BW_DET_LVL<1:0> W/R 0 0 BW det. threshold setting : [0] off , [1] 16mV , [2] 32mV , [3] 64mV <3:0> W/R 0 0 For test <7> W/R 0 0 For test : 0 set only <6:0> HYA<6:0> W/R 0 37h Sub picture horizontal display pixel <7:0> VYA<7:0> W/R 0 44h Sub picture vertical display line number 11h 12h 13h <7:2> HX<5:0> W/R 0 1Eh Sub picture horizontal capture position (coarse) <1:0> HP<1:0> W/R 0 0 Sub picture horizontal capture position (fine) <7:6> MVC<1:0> W/R 0 0 Sub picture c-sync input mask period : [0] 48usec , [1] 44usec , [2] 53usec , [3] off <5:0> VXS<5:0> W/R 0 29h Sub picture sample start line <7> W/R 0 0 For test : 0 set only <6> PLUS W/R 0 0 For test : 0 set only <5> W/R 0 0 For test : 0 set only <4:0> LINE_NUM<4:0> W/R 0 11h Data slicer line selection 16h <7:0> STB_DLY<7:0> W/R 0 40h Data slicer start bit detection parameter 17h <7:0> L_LEVEL<7:0> W/R 0 82h Data slicer data slice parameter 18h <7> EDGE_ON W/R 0 1h Frame data independent control : [0] disable , [1] enable <6:4> BGBY_EDGE<2:0> W/R 0 0 Frame data independent B-Y data setting <3:0> BGY_EDGE<3:0> W/R 0 Ch Frame data independent Y data setting 14h 15h 19h <7:5> BGRY_EDGE<2:0> W/R 0 0 Frame data independent R-Y data setting <4> HPFOFF W/R 0 0 Sub picture Y output HPF : [0] on , [1] off <3:0> FREE_RUN_ADJ<3:0> W/R 0 0 Frequency adjustment control when free run mode (2's comp) 1Ah <7:0> W/R 0 0 For test 1Bh <7:6> EXPORT<1:0> W/R 0 0 Ext. port (7 pin) : [0] "0" output , [1] "1" output , [2 or 3] Sub BGP <5> INV_UV W/R 0 0 Invert U,V output value : [0] normal , [1] invert <4> AFC_OFF W/R 0 0 Sub picture AFC : [0] on , [1] off <3:0> W/R 0 0 For test 1Ch <7> PINOE W/R 0 0 For test <6:0> V_DAC<6:0> W/R 0 32h Sub picture V or B DAC output amplitude control 1Dh <7:0> PINOE<7:0> W/R 0 E6h For test 1Eh <7:0> W/R 0 0 For test : 0 set only Rev.2.00, Sep.04.2003, page 11 of 17 M65665CFP/SP Address Bit Symbol Read/ Write 1Fh <7:6> R 20h Reset Value 1/9 Ref. Value Remarks Test use (Read only) <5> R Test use (Read only) <4> SUB_UNLOCK R VCXO is : [0] Lock , [1] Unlock (Read only) <3> R Test use (Read only) <2> RDOF R Main picture V sync is [0] present , [1] not present (Read only) <1> SUB_BW R Sub picture burst is : [0] not present , [1] present (Read only) <0> WDOF R Sub picture V sync is [0] present , [1] not present (Read only) <7> KILLERSTATUS R Sub picture killer status : [0] not active , [1] active (Read only) <6> R Test use (Read only) <5> WDOF R Sub picture V sync is [0] present , [1] not present (Read only) <4> EDS_ACK2 R EDS data flag of even field : [0] no EDS , [1] EDS (Read only) <3> EDS_ACK1 R EDS data flag of odd field : [0] no EDS , [1] EDS (Read only) <2> SIGNAL_OK R Test use (Read only) <1> READ_REQB R Read request of even field : [0] no , [1] requesting (Read only) <0> READ_REQA R Read request of odd field : [0] no , [1] requesting (Read only) 21h <7:0> PDB<15:8> R Even field Sliced data upper 8bit (Read only) 22h <7:0> PDB<7:0> R Even field Sliced data lower 8bit (Read only) 23h <7:0> PDA<15:8> R Odd field Sliced data upper 8bit (Read only) 24h <7:0> PDA<7:0> R Odd field Sliced data lower 8bit (Read only) Rev.2.00, Sep.04.2003, page 12 of 17 M65665CFP/SP The relation of input signal 32-pin (Main-HD) and 33-pin (Main-VD) is shown below prohibition time of changing 33-pin signal 0 32-pin input (Main-HD) 33-pin input -10µsec (Main-VD) [Even to Odd] +10µsec +41.75µsec +21.75µsec 33-pin input (Main-VD) [Odd to Even] 20µs +53.5µsec 20µs 20µs 20µs 20µs 20µs VD input 4H 1H end of vertical equalization pulse 20µs 20µs 20µs 20µs 20µs 20µs VD input 31.75µs Driving Method and Operating Specification for Serial Interface Data (1) Serial data transmission completion and start A low-to-high transition of the DATA (serial data) line while the CLK (serial clock) is high, that completes the serial transmission and makes the bus free. A high-to-low transition of the DATA line while the CLK is high, that starts the serial transmission and waits for the following CLK and DATA inputs. (2) Serial data transmission The data are transmitted in the most significant bit (MSB) first by one-byte unit on the DATA line successively. Onebyte data transmission is completed by 9 clock cycles, the former 8 cycles are for address/data and the latter one is for acknowledge detection. (In writing state, SDATA outputs ‘L' under these two conditions ; 1) the coincidence of two address data for the address data transmission, 2) the completion of 8-bit setting data transfer. In reading state, SDATA outputs ‘L' with the address coincidence and SDATA becomes high-impedance for detecting acknowledge input from the master (micro processor) after sending 8-bit setting data.) For address/data transmission, DATA must change while CLK is 'L'. (The data change while CLK is 'H' or the simultaneous change of CLK and DATA, that will be a false operation because of undistinguished condition from the completion / start of serial data transfer). After the beginning of serial data transmission, the total number of data bytes that can be transferred are not limited. (3) The byte format of data transmission (The sequence of data transmission) a. The byte format during data writing to M65665CFP/SP are shown as follows. In right after the forming of serial data transmitting state, the slave address 24h (00100100b) is transferred. Afterwards, the internal register address (1 byte) and writing data (by 1 byte unit) are transferred successively. Several bytes of Rev.2.00, Sep.04.2003, page 13 of 17 M65665CFP/SP writing data can be handled in the one transmission. In this operation, the setting data are written into the address register whose address is increased one in initially transferred internal register address. b. The byte format during data reading from M65665CFP/SP are shown as follows. Before data reading from M65665CFP/SP, whose internal address need to be set by the data reading/transmitting. After the data reading/transmitting, the operation of "serial data transmission completion and start" (described in (1)) is necessary. Continuously, the slave address 25h (00100101b) is sent, and then the read out data are available on SDATA as ‘L’/‘high-impedance’ pattern. Several bytes of reading data can be handled in the one transmission, too. In this operation, the setting data also are written into the address register whose address is increased one in initially transferred internal register address. The examples of serial byte transmission format (1) The writing operation of the setting data (AAh) into M65665CFP/SP internal address of 00h Transmission Activation Confirmation of bus free (DATA='H') S 24h A 00h A AAh A E S : Operation of serial transmission start A : Acknowledge detection E : Operation of serial transmission completion (2) The writing operation of the setting data (FFh, 80h, EEh) into M65665CFP/SP internal address of 04h to 06h Transmission Activation Confirmation of bus free (DATA='H') S 24h A 04h A FFh A 80h A EEh 25h A $$h A' A E (3) The reading operation of the setting data from M65665CFP/SP internal address of 00h Transmission Activation Confirmation of bus free (DATA='H') S 24h A 00h A E S A' : Bus free operation by the master (micro processor) Rev.2.00, Sep.04.2003, page 14 of 17 M65665CFP/SP (4) The reading operation of the setting data from M65665CFP/SP internal address of 04h to 06h. Transmission Activation Confirmation of bus free (DATA='H') S 24h A 04h A E S 25h A $$h A" $$h A" $$h A' A" : Output 'L' operation by the master (micro processor) Timing Diagram 1 2 3 4 5 6 7 8 9 1 Bit7 (MSB) Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 (LSB) ACK Detec. Bit7 (MSB) Bit7 (MSB) Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 (LSB) SCLK (4 pin) SDATA (3 pin) SDATA (3 pin) (Read data) Rev.2.00, Sep.04.2003, page 15 of 17 Bit7 (MSB) e SEATING PLANE D b1 b 21 Lead Material Alloy 42/Cu Alloy 1 Weight(g) 4.1 22 JEDEC Code − MMP 42 EIAJ Package Code SDIP42-P-600-1.78 A L b2 E A2 Rev.2.00, Sep.04.2003, page 16 of 17 A1 A A1 A2 b b1 b2 c D E e e1 L Symbol Plastic 42pin 600mil SDIP c Dimension in Millimeters Min Nom Max − − 5.5 0.51 − − − 3.8 − 0.35 0.45 0.55 0.9 1.0 1.3 0.63 0.73 1.03 0.22 0.27 0.34 36.5 36.7 36.9 12.85 13.0 13.15 − 1.778 − − 15.24 − 3.0 − − 0˚ − 15˚ e1 42P4B M65665CFP/SP Package Dimensions HE G 1 42 Z1 e z y Detail G D JEDEC Code − MMP b 21 22 Weight(g) − Detail F A2 Lead Material Cu Alloy+42 Alloy L1 EIAJ Package Code SSOP42-P-450-0.80 E Rev.2.00, Sep.04.2003, page 17 of 17 A c A1 F L A A1 A2 b c D E e HE L L1 z Z1 y Symbol e1 b2 e1 I2 b2 Dimension in Millimeters Min Nom Max − − 2.4 − 0.05 − − 2.0 − 0.4 0.25 0.3 0.2 0.13 0.15 17.3 17.7 17.5 8.2 8.4 8.6 − − 0.8 12.23 11.63 11.93 0.7 0.3 0.5 − − 1.765 − 0.75 − − 0.9 − 0.15 − − 0˚ 10˚ − − 0.5 − − − 11.43 − 1.27 − Recommended Mount Pad e Plastic 42pin 450mil SSOP I2 42P2R-E M65665CFP/SP Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. 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