DATA SHEET SE2577L: Dual-Band 802.11n Wireless LAN Front-End Module Applications 802.11n, MIMO solutions IEEE 802.11g OFDM WLAN IEEE 802.11a OFDM WLAN Access points, PCMCIA, PC cards TXG RXG ANT RXA TXA Features Y0147 Passive front end, including two SPDT switches and diplexer Figure 1. SE2577L Block Diagram (RF Ports are DC Blocked) Integrated 2 GHz low pass filter Able to accept 20 dBm of linear input power in both bands with no EVM contribution Lead free, Halogen Free and RoHS compliant Thin lead-free plated QFN package (20-pin, 3 x 3 x 0.9 mm, (MSL1, 260 °C per JEDEC J-STD-020) GND GND VRX 14 13 1 17 RXG 2 RXA 3 VTX 8 GND 6 5 4 TXA GND 11 GND 10 ANT 9 GND The SE2577L is a dual-band passive 802.11n WLAN RF front-end module providing the functionality of spurious filters, switches and diplexer. All RF ports are matched to 50 Ω to simplify PCB layout and the interface to the transceiver RFIC. The Front End is packaged in a very compact RoHS compliant, Halogen Free, and Lead Free 3mm x 3mm x 0.9mm QFN style package. A functional block diagram of the SE2577L is provided in Figure 1. Figure 2 shows the pinout for the SE2577L. Table 1 lists the signal pin assignments and functional pin descriptions. 19 18 GND 12 20 GND 7 GND 15 16 TXG Skyworks Green™ products are compliant with all applicable legislation and are halogen-free. For additional information, refer to Skyworks Definition of Green™, document number SQ04-0074. Description Y0148 Figure 2. SE2577L Pinout – 20-Pin QFN (Top View) Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 202486C • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • December 11, 2014 1 DATA SHEET • SE2577L: DUAL-BAND 802.11N WIRELESS FRONT-END MODULE Table 1. SE2577L Signal Descriptions Pin Name Description Pin GND Ground 11 2 RXG 2 GHz Receive Output 3 RXA 5 GHz Receive Output 4 GND 5 Name Description GND Ground 12 GND Ground 13 VRX Receive Switch Control Ground 14 GND Ground TXA 5 GHz Transmit Input 15 GND Ground 6 GND Ground 16 TXG 2 GHz Transmit Input 7 GND Ground 17 GND Ground 8 VTX Transmit Switch Control 18 GND Ground 9 GND Ground 19 GND Ground 10 ANT Antenna 20 GND Ground 1 Electrical and Mechanical Specifications The absolute maximum ratings of the SE2577L are provided in Table 2. The recommended operating conditions are specified in Table 3 and electrical specifications are provided in Tables 4 through 7. Table 2. SE2577L Absolute Maximum Ratings (Note 1) Parameter Symbol Minimum Maximum Units High-level logic control voltage VCTL_ON 3.6 V CW power on port 2TX, 5TX, ANT terminated into 50 Ω match TXRF +33 dBm Operating temperature TA –40 +85 °C Storage temperature TS2TX –40 +150 °C Electrostatic discharge: ESD 200 1500 V V All pins Antenna pin with external 4 pF blocking capacitor Note 1: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device. CAUTION: Although this device is designed to be as robust as possible, electrostatic discharge (ESD) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times. Table 3. SE2577L Recommended Operating Conditions Parameter Ambient temperature Symbol TA Minimum Typical Maximum Units –40 +25 +85 °C Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 2 December 11, 2014 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 202486C DATA SHEET • SE2577L: DUAL-BAND 802.11 WIRELESS FRONT-END MODULE Table 4. SE2577L Electrical Specifications: RF Switch Characteristics (Note 1) (TA = +25 C, as Measured on the Evaluation Board [De-Embedded to the Device], All Unused Ports are Terminated with 50 Ω, Unless Otherwise Noted) Parameter Symbol Control voltage: ON state OFF state Test Condition VCTL_ON VCTL_OFF Min Typical Max Units 3.0 0 3.3 3.6 0.3 V V 0.5 0.5 1.5 1.5 mA mA 10 pF ICTL_ON Switch control bias circuit: RF applied No RF On pin (VTX, VRX) driven high On pin (VTX, VRX) driven high 10% to 90 % rise fall time Switch speed Control input capacitance CCTL 250 ns Note 1: Performance is guaranteed only under the conditions listed in this table. Table 5. SE2577L Electrical Specifications: RF Switch Logic and Function Characteristics RF Switch Logic RF Switch Function VTX VRX TXG, TXA <-> ANT RXG, RXA <-> ANT VCTL_OFF VCTL_OFF OFF OFF VCTL_ON VCTL_OFF ON OFF VCTL_OFF VCTL_ON OFF VCTL_ON VCTL_ON ON Not a supported state Table 6. SE2577L Electrical Specifications: 2.4 GHz AC Electrical Characteristics (1 of 2) (TA = +25 C, as Measured on the Evaluation Board [De-Embedded to Device], All Unused Ports Terminated at 50 Ω, Unless Otherwise Noted) Parameter Symbol Condition Frequency f Reference input impedance ΩL All RF ports RF input power PIN DSSS OFDM Input return loss S11 RxG ↔ ANT; TxG ↔ ANT Transmit insertion loss S21 TX Min Typ 2400 Max Unit 2485 MHz 50 Ω +23 +22 dBm 15 dB TxG ↔ ANT: Excluding external filter components Includes losses from external filter components Receive insertion loss S21 RX RxG ↔ ANT Output return loss S22 RxG ↔ ANT; TxG ↔ ANT 0.1dB compression P0.1dB rd 3 order intercept 1.8 2.1 1.1 1.4 15 +29 IIP3 1.5 1.8 dB dB dB dB +31 +50 dBm dBm TxG ↔ ANT: 2nd harmonics rejection 2fo 3rd harmonics rejection 3fo With external components on EK1 PCB Without external components 50 35 55 40 dB dB 50 25 55 28 dB dB TXG ↔ ANT: With external components on EK1 PCB Without external components Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 3 December 11, 2014 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 202486C DATA SHEET • SE2577L: DUAL-BAND 802.11N WIRELESS FRONT-END MODULE Table 6. SE2577L Electrical Specifications: 2.4 GHz AC Electrical Characteristics (2 of 2) (TA = +25 C, as Measured on the Evaluation Board [De-Embedded to Device], All Unused Ports Terminated at 50 Ω, Unless Otherwise Noted) Parameter Symbol Condition Min Typ Max Unit Output 2nd harmonic power generated at PIN = +22 dBm, CW PSD2 TXG ↔ ANT, no source contribution to harmonics –50 dBm Output 3rd harmonic power generated at PIN = +22 dBm, CW PSD3 TXG ↔ ANT, no source contribution to harmonics –50 dBm TXG ↔ ANT, Measure @RXA 40 50 dB TXG ↔ ANT, Measure @TXA 20 40 dB RXG to TXG TXG ↔ ANT, Measure @RXG 20 30 dB RXG to ANT TXG ↔ ANT, Measure @RXG; TXG is not terminated 20 27 RF to non-RF Any RF pin to VRX, VTX, with 1.6pF cap on control lines 40 Isol 5 to 2 GHz isolation 33 dB dB Table 7. Electrical Specifications: 5 GHz AC Electrical Characteristics (TA = 25 C, as Measured on the Evaluation Board [De-Embedded to Device], All Unused Ports Terminated with 50 Ω, Unless Otherwise Noted) Parameter Symbol Frequency f Reference input impedance ΩL Test Condition Min Typ 4900 All RF ports Max Unit 5875 MHz 50 Ω +21 dBm RF input power PIN OFDM Input return loss S11 RxA ↔ ANT; TxA ↔ ANT Transmit insertion loss S21 TX TxA ↔ ANT 2.1 dB Receive insertion loss S21 RX RxA ↔ ANT 2.1 dB Output return loss S22 RxA ↔ ANT; TxA ↔ ANT 15 dB 15 dB 0.1dB compression P0.1dB +29 3rd order intercept IIP3 +50 2nd harmonics rejection 2fo TxA ↔ ANT 20 dB 3 harmonics rejection 3fo TxA ↔ ANT 15 dB Output 2nd harmonic power generated at PIN = +22 dBm, OFDM PSD2 TxA ↔ ANT –50 dBm/MHz Output 3rd harmonic power generated at PIN = +22 dBm, OFDM PSD3 TxA ↔ ANT –50 dBm/MHz Isolation: 2 to 5 GHz ISOL TxA ↔ ANT, Measure @ RXG TxA ↔ ANT, Measure @ TXG 40 20 dB dB RXA to TXA ISOL TxA ↔ ANT, Measure @ RXA 20 dB RXG to ANT ISOL TxA ↔ ANT, Measure @ RXA; TXA is not terminated 20 RF to non-RF ISOL Any RF pin to VRX, VTX (with 1.6 pF cap on control lines) 40 rd +31 dBm dBm 33 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 4 December 11, 2014 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 202486C dB dB DATA SHEET • SE2577L: DUAL-BAND 802.11 WIRELESS FRONT-END MODULE Evaluation Board Description Evaluation Board Setup Procedure The SE2577L Evaluation Board is used to test the performance of the SE2577L FEM. A suggested application schematic diagram is shown in Figure 3. An Evaluation Board assembly diagram is shown in Figure 4. Component values for the SE2577L Evaluation Board are listed in the Bill of Materials (BOM) in Table 8. 1. Connect system ground to pin 2 of connectors J6 and J20. 2. Test the Antenna to Receive Port by applying the switch settings of RX – ANT as described in Table 5. Circuit Design Considerations 3. The RX to ANT performance can be monitored by applying an RF signal to J4 (ANT), and measuring the response from either J1 (5 GHz) or J5 (2 GHz) RX outputs. The following design considerations are general in nature and must be followed regardless of final use or configuration: 4. Test the Transmit to Antenna Port by applying the switch settings of TX – ANT as described in Table 5. Paths to ground should be made as short as possible. The ground pad of the SE2577L has special electrical and thermal grounding requirements. This pad is the main thermal conduit for heat dissipation. Since the circuit board acts as the heat sink, it must shunt as much heat as possible from the device. Therefore, design the connection to the ground pad to dissipate the maximum wattage produced by the circuit board. Multiple vias to the grounding layer are required. 5. Amplifier performance at 2.5 GHz can be monitored by applying an RF signal to connector J2 and monitoring the output power on the antenna port connector J4 (ANT). 6. Amplifier performance at 5 GHz can be monitored by applying an RF signal to connector J3 and monitoring the output power on the antenna port connector J4 (ANT). Caution: Care should be taken not to overdrive the amplifier by applying too much RF on the input to the device. A suitable starting input power for the device is +20 dBm. NOTE: A poor connection between the ground pad and ground increases junction temperature (TJ), which reduces the life of the device. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 5 December 11, 2014 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 202486C DATA SHEET • SE2577L: DUAL-BAND 802.11N WIRELESS FRONT-END MODULE J2 SMA J20 C6 1.2 pF 2X1 Header 15 GND 14 GND 13 VRX 16 SE2577L U1 12 GND 11 GND 10 ANT 9 GND C3 4.0 pF J4 SMA 5 TX_A 6 GND 7 GND 8 VTX 1 GND 2 RX_G 3 RX_A 4 GND TX_G 17 PAD J5 SMA 1 2 L1 2.7 nH C7 1.2 pF J1 SMA J3 SMA 1 2 NOTE: The PCB contains footprints for non-populated components that are not shown in this schematic. J6 2X1 Header Y1582 Figure 3. SE2577L Suggested Application Schematic Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 202486C • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • December 11, 2014 6 DATA SHEET • SE2577L: DUAL-BAND 802.11 WIRELESS FRONT-END MODULE Y1583 Figure 4. SE2577L Evaluation Board Assembly Diagram Table 8. SE2577L Evaluation Board Bill of Materials Component Value Manufacturer Mfr Part Number Package Description C3 4.0 pF Murata GRM1555C1H4R0CZ01 0402 Multilayer ceramic C6, C7 1.2 pF Murata GRM1555C1H1R2CZ01 0402 Thick film chip resistor J1, J2, J3, J4, J5 SMA Johnson Components 142-0701-851 End launch SMA end launch straight jack receptacle – tab contact J6, J20 2X1 Molex 22-28-4023 100 mil 100 mil header L1 2.7 nH Murata LQG15HN2N7S02D 0402 Monolithic Inductor (Air-core) Skyworks SE2577L SE2577L Dual band switch diplex FEM U1 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 7 December 11, 2014 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 202486C DATA SHEET • SE2577L: DUAL-BAND 802.11N WIRELESS FRONT-END MODULE Package Dimensions when the part is subjected to high temperature during solder assembly. The recommended land and solder patterns for the SE2577L are provided in Figure 5. Typical case markings are shown in Figure 6. Package dimensions for the are shown in Figure 7, and tape and reel dimensions are provided in Figure 8. The SE2577L is rated to Moisture Sensitivity Level 1 (MSL1) at 260 C. It can be used for lead or lead-free soldering. For additional information, refer to the Skyworks Application Note, Solder Reflow Information, document number 200164. Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. Production quantities of this product are shipped in a standard tape and reel format. Package and Handling Information Instructions on the shipping container label regarding exposure to moisture after the container seal is broken must be followed. Otherwise, problems related to moisture absorption may occur 3.20 0.25 Typ 16 15 13 14 0.50 Typ 1 12 20 17 0.500 Typ 2 3 10 18 3.20 0.10 11 19 0.675 Typ 9 4 5 0.10 6 7 8 0.675 Typ Stencil Pattern (Note 5) 63% Solder Coverage on Center Pad Package Outline 3.20 0.25 Typ 16 15 16 13 14 15 13 14 0.60 Typ 0.50 Typ 1 12 3.30 3.20 3.30 0.35 Typ Package Outline 1 12 20 17 2 11 3 10 1.80 18 19 0.58 Typ 9 4 20 17 0.500 Typ 2 11 3 10 1.70 18 19 9 4 0.500 Typ 5 6 7 8 5 9X Ø0.254 0.58 Typ 6 7 8 1.70 1.80 Board Metal and Via Pattern (Note 4) Solder Mask Pattern (Note 6) Notes: 1. 2. 3. 4. All dimensions are in millimeters. Dimensions and tolerances per ASME Y14.5M-1994. Unless specified, dimensions are symmetrical about center lines. Via hole recommendations: 30-35 µm Cu via wall plating; via holes should be tented with solder mask on the back side and filled with solder. 5. Stencil recommendations: 0.125 mm stencil thickness, laser cut apertures, trapezoidal walls and rounded corners offer better paste release. 6. Solder mask recommendations: Contact board fabricator for recommended solder mask offset and tolerance. Figure 5. SE2577L Recommended Land and Solder Patterns (Top View) Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 8 December 11, 2014 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 202486C Y0152 DATA SHEET • SE2577L: DUAL-BAND 802.11 WIRELESS FRONT-END MODULE Pin 1 Indicator Pin 1 Indicator SiGe 2577L XXXXX SKY 2577L XXXXX Part Number Lot Code Part Number Lot Code Y0141 Figure 6. Typical Case Markings (Top View) 2X A 3.000 ±0.050 0.15 C 1.700 ±0.050 0.10 M C A B 0.850 ±0.050 See Note 3 B 16 15 14 1 12 17 20 2 13 11 1.700 ±0.050 10 18 15 16 1 11 9 20 17 19 18 2 0.500 10 19 4 14 12 3.000 ±0.050 3 0.300 X 45° 0.203 Ref. 13 3 R0.075 Typ. 9 4 0.10 M C A B 2X 0.15 C 5 6 7 8 0.000 – 0.050 Seating Plane C 8 16X 0.250 ±0.050 0.10 M C A B 0.05 M C Top View 7 6 5 16X 0.350 ±0.050 Bottom View NOTES: 1. All measurements are in millimeters. 2. Dimensioning and tolerancing according to ASME Y14.5M-1994. Unless otherwise specified the following values apply: Decimal Tolerance: Angular Tolerance: X.X (1 place) ± 0.1 mm ±1° X.XX (2 places) ± 0.05 mm X.XXX (3 places) ± 0.025 mm 3. Terminal #1 identification mark located within marked area. 4. Coplanarity applies to the exposed heat sink ground pad as well as the terminals. 5. Unless specified, dimensions are symmetrical about center lines. Y0150 Figure 7. SE2577L Package Dimensions Pin 1 Corner Figure 8. SE2577L Tape and Reel Dimensions Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 9 December 11, 2014 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 202486C DATA SHEET • SE2577L: DUAL-BAND 802.11N WIRELESS FRONT-END MODULE Ordering Information Model Name SE2577L-S SE2577L-R Manufacturing Part Number Evaluation Board Part Number SE2577L-EK1 Copyright © 2013-2014 Skyworks Solutions, Inc. All Rights Reserved. Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products or services. These materials, including the information contained herein, are provided by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the information contained herein. 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