A694B/SYGUY/S530-A3

LAMP
A694B/SYGUY/S530-A3
Features
•Low power consumption
•High efficiency and low cost
•Good control and free combinations on the colors of LED lamps
•Good lock and easy to assembly.
•Stackable and easy to assembly Stackable vertically and easy to assembly
•Versatile mounting on P.C board or panel
•Stackable horizontally and easy to assembly
•Pb free
•The product itself will remain within RoHS compliant version
• Compliance with EU REACH
• Compliance Halogen Free .(Br <900 ppm ,Cl <900 ppm , Br+Cl < 1500 ppm)
Description
•ARRAY=Plastic Holder+ Combinations of Lamps.
•The array will easily mount the applicable lamps on any panel up to.
Applications
•Used as indicators of indicating the Degree, Functions, Positions etc, in electronic instruments
1
Copyright © 2010, Everlight All Rights Reserved. Release Date : June .10 .2014 .Issue No: DAE-0000362_Rev.2
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DATASHEET
LAMP
A694B/SYGUY/S530-A3
Device Selection Guide
Chip
PART NO.
Materials
Emitted Color
Resin Color
234-10SYGD/S530-E2-L
AIGaInP
Brilliant Yellow Green
Green Diffused
234-10UYD/S530-A3-L
AlGaInP
Brilliant Yellow
Yellow Diffused
Absolute Maximum Ratings (Ta=25℃
℃)
Parameter
Symbol
Rating
Unit
SYG
25
UY
25
SYG
60
UY
60
Continuous Forward Current
IF
Peak Forward Current (Duty 1/10 @ 1KHZ)
IFP
Reverse Voltage
VR
Power Dissipation
Pd
Operating Temperature
Topr
-40 ~ +85
Storage Temperature
Tstg
-40 ~ +100
Soldering Temperature
Tsol
5
mA
V
SYG
60
UY
60
260
mA
mW
℃
℃
℃ for 5 sec.
Electro-Optical Characteristics (Ta=25℃
℃)
Parameter
Forward Voltage
Reverse Current
Luminous Intensity
Viewing Angle
Peak Wavelength
Dominant Wavelength
Spectrum Radiation
Bandwidth
2
Symbol
Min
Typ
Max
SYG
1.7
2.0
2.4
UY
1.7
2.0
2.4
SYG
-----
-----
10
UY
-----
-----
10
SYG
25
50
-----
UY
40
80
-----
SYG
-----
60
----
UY
-----
60
-----
SYG
-----
575
----
UY
-----
591
-----
SYG
-----
573
-----
UY
-----
589
-----
SYG
-----
20
-----
UY
-----
20
-----
VF
IR
IV
2θ1/2
λ
λ
p
d
△λ
Copyright © 2010, Everlight All Rights Reserved. Release Date : June .10 .2014 .Issue No: DAE-0000362_Rev.2
Unit
Condition
V
IF=20mA
µA
VR=5V
mcd
IF=20mA
deg
IF=20mA
nm
IF=20mA
nm
IF=20mA
nm
IF=20mA
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DATASHEET
LAMP
A694B/SYGUY/S530-A3
Typical Electro-Optical Characteristics Curves
SYG
℃)
℃)
Directivity (Ta=25
Radiation Angle
Relative Intensity (a.u.)
Relative Intensity vs. Wavelength (Ta=25
Wavelength (nm)
℃)
Forward Current vs. Forward Voltage (Ta=25
Relative Intensity (a.u.)
℃)
Relative Intensity vs. Forward Current (Ta=25
Forward Current (mA)
Relative Intensity(a.u.)
1.5
1.0
0.5
0.0
0
Forward Voltage (V)
Relative Intensity vs. Ambient Temp.
Forward Current (mA)
Relative Intensity(a.u.)
15
20
25
40
1.5
1.0
0.5
30
35
40
45
50
55
60
Ambient Temperature Ta(
3
10
Forward Current vs. Ambient Temp.
2.0
0.0
25
5
Forward Current (mA)
65
℃)
70
30
20
10
0
0
20
40
60
80
Ambient Temperature Ta(
Copyright © 2010, Everlight All Rights Reserved. Release Date : June .10 .2014 .Issue No: DAE-0000362_Rev.2
℃)
100
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DATASHEET
LAMP
A694B/SYGUY/S530-A3
UY
℃)
℃)
Directivity (Ta=25
Radiation Angle
Relative Intensity (a.u.)
Relative Intensity vs. Wavelength (Ta=25
Wavelength (nm)
℃)
Forward Current vs. Forward Voltage (Ta=25
Relative Intensity (a.u.)
℃)
Relative Intensity vs. Forward Current (Ta=25
Forward Current (mA)
Relative Intensity(a.u.)
1.5
1.0
0.5
0.0
0
Forward Voltage (V)
20
25
40
Forward Current (mA)
Relative Intensity(a.u.)
15
Forward Current vs. Ambient Temp.
2.0
1.5
1.0
0.5
30
35
40
45
50
55
60
Ambient Temperature Ta(
4
10
Forward Current (mA)
Relative Intensity vs. Ambient Temp.
0.0
25
5
65
℃)
70
30
20
10
0
0
20
40
60
80
Ambient Temperature Ta(
Copyright © 2010, Everlight All Rights Reserved. Release Date : June .10 .2014 .Issue No: DAE-0000362_Rev.2
℃)
100
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DATASHEET
LAMP
A694B/SYGUY/S530-A3
Package Dimension
Note: Note:
1. All dimensions are in millimeters, tolerance is 0.25mm except being specified
2. Lead spacing is measured where the lead emerge from the package.
5
Copyright © 2010, Everlight All Rights Reserved. Release Date : June .10 .2014 .Issue No: DAE-0000362_Rev.2
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DATASHEET
LAMP
A694B/SYGUY/S530-A3
Moisture Resistant Packing Materials
Label Explanation
Pb
EVERLIGHT
X
RoHS
‧CPN: Customer’s Production Number
‧P/N : Production Number
‧QTY: Packing Quantity
‧CAT: Ranks
‧HUE: Dominant Wavelength
‧REF: Forward Voltage
‧LOT No: Lot Number
A694B/SYGUY/S530-A3
Packing Specification
■Anti-electrostatic bag
■
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■ Inner Carton
■ Outside Carton
Packing Quantity
1. 270 PCS/1 Plate, 4 Plates/1 Inner Carton
2. 10 Inner Cartons/1 Outside Carton
Copyright © 2010, Everlight All Rights Reserved. Release Date : June .10 .2014 .Issue No: DAE-0000362_Rev.2
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DATASHEET
LAMP
A694B/SYGUY/S530-A3
Notes
1.
Lead Forming
During lead formation, the leads should be bent at a point at least 3mm from the base of the epoxy bulb.
Lead forming should be done before soldering.
Avoid stressing the LED package during leads forming. The stress to the base may damage the LED’s characteristics or it
may break the LEDs.
Cut the LED lead frames at room temperature. Cutting the lead frames at high temperatures may cause failure of the LEDs.
When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead position of the LED. If the LEDs
are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade the LEDs.
2.
Storage
The LEDs should be stored at 30°C or less and 70%RH or less after being shipped from Everlight and the storage life limits
are 3 months. If the LEDs are stored for 3 months or more, they can be stored for a year in a sealed container with a
nitrogen atmosphere and moisture absorbent material.
Please avoid rapid transitions in ambient temperature, especially, in high humidity environments where condensation can
occur.
3.
Soldering
Careful attention should be paid during soldering. When soldering, leave more then 3mm from solder joint to epoxy bulb,
and soldering beyond the base of the tie bar is recommended.
Recommended soldering conditions:
Hand Soldering
300 Max. (30W Max.)
Temp. at tip of iron
Soldering time
3 sec Max.
Distance
3mm Min.(From solder
joint to epoxy bulb)
Recommended soldering profile
℃
Preheat temp.
Bath temp. & time
Distance
DIP Soldering
100 Max. (60 sec Max.)
260 Max., 5 sec Max
3mm Min. (From solder
joint to epoxy bulb)
℃
laminar wave
Fluxing
Prehead
Avoiding applying any stress to the lead frame while the LEDs are at high temperature particularly when soldering.
Dip and hand soldering should not be done more than one time
After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration until the LEDs return to
room temperature.
7
Copyright © 2010, Everlight All Rights Reserved. Release Date : June .10 .2014 .Issue No: DAE-0000362_Rev.2
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DATASHEET
LAMP
A694B/SYGUY/S530-A3
A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.
Although the recommended soldering conditions are specified in the above table, dip or hand soldering at the lowest
possible temperature is desirable for the LEDs.
Wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the solder
wave.
4.
Cleaning
When necessary, cleaning should occur only with isopropyl alcohol at room temperature for a duration of no more than
one minute. Dry at room temperature before use.
Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs
depends on factors such as ultrasonic power and the assembled condition. Ultrasonic cleaning shall be pre-qualified to
ensure this will not cause damage to the LED
5.
Heat Management
Heat management of LEDs must be taken into consideration during the design stage of LED application. The current
should be de-rated appropriately by referring to the de-rating curve found in each product specification.
The temperature surrounding the LED in the application should be controlled. Please refer to the data sheet de-rating
curve.
6.
ESD (Electrostatic Discharge)
The products are sensitive to static electricity or surge voltage. ESD can damage a die and its reliability.
When handling the products, the following measures against electrostatic discharge are strongly recommended:
Eliminating the charge
Grounded wrist strap, ESD footwear, clothes, and floors
Grounded workstation equipment and tools
ESD table/shelf mat made of conductive materials
Proper grounding is required for all devices, equipment, and machinery used in product assembly.
Surge protection should be considered when designing of commercial products.
If tools or equipment contain insulating materials such as glass or plastic,
the following measures against electrostatic discharge are strongly recommended:
Dissipating static charge with conductive materials
Preventing charge generation with moisture
7.
Directions for use
The LEDs should be operated with forward bias. The driving circuit must be designed so that the LEDs are not subjected
to forward or reverse voltage while it is off. If reverse voltage is continuously applied to the LEDs, it may cause migration
resulting in LED damage.
8.
Other
Above specification may be changed without notice. EVERLIGHT will reserve authority on material change for above
specification.
When using this product, please observe the absolute maximum ratings and the instructions for using outlined in these
specification sheets. EVERLIGHT assumes no responsibility for any damage resulting from use of the product which does
not comply
with the absolute maximum ratings and the instructions included in these specification sheets.
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These specification sheets include materials protected under copyright of EVERLIGHT corporation. Please don’t
Copyright © 2010, Everlight All Rights Reserved. Release Date : June .10 .2014 .Issue No: DAE-0000362_Rev.2
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DATASHEET
LAMP
A694B/SYGUY/S530-A3
reproduce or cause anyone to reproduce them without EVERLIGHT’s consent.
9
Copyright © 2010, Everlight All Rights Reserved. Release Date : June .10 .2014 .Issue No: DAE-0000362_Rev.2
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