DIPIPM™ Bootstrap Circuit Design Manual

<Dual-In-Line Package Intelligent Power Module>
DIPIPM APPLICATION NOTE
Bootstrap Circuit Design Manual
Table of contents
CHAPTER 1 Bootstrap Circuit Design...................................................................................... 2
1.1 Bootstrap Circuit Operation................................................................................................2
1.2 Initial charging ...................................................................................................................2
1.2.1 Initial charging procedure ............................................................................................................2
1.2.2 Initial charging time......................................................................................................................3
1.2.3 Voltage drop while suspending operation....................................................................................4
1.3 Charging in operation ........................................................................................................5
1.3.1 Basic charging scheme ...............................................................................................................5
1.3.2 Charging scheme in the three phase modulation sine wave control operation...........................7
1.3.3 Effects on charging situation due to driving conditions ...............................................................9
1.3.4 Estimation method of capacitance of BSC ................................................................................13
1.3.5 Design for current limiting resistor .............................................................................................13
1.3.6 Note for designing the bootstrap circuit .....................................................................................15
1.4 Circuit currents in the case of other control methods .......................................................16
-End partRevision record
Note about safety design and using this material
Publication Date: October 2012
1
<Dual-In-Line Package Intelligent Power Module> Application Note
Bootstrap Circuit Design Manual
CHAPTER 1 Bootstrap Circuit Design
1.1 Bootstrap Circuit Operation
For three phase inverter circuit driving, normally four isolated control supplies (three for P-side driving and one for
N-side driving) are necessary. But using floating control supply with bootstrap circuit can reduce the number of
isolated control supplies from four to one (N-side control supply).
Bootstrap circuit consists of a bootstrap diode(BSD), a bootstrap capacitor(BSC) and a current limiting resistor.
(Fig.1-1) It uses the BSC as a control supply for driving P-side device such as IGBT and MOSFET. The BSC supplies
gate charge when P-side device turning ON and circuit current of logic circuit on P-side driving IC. (Fig.1-2) Since a
capacitor is used as substitute for isolated supply, its supply capability is limited. This floating supply driving with
bootstrap circuit is suitable for small supply current products like DIPIPM.
Charge consumed by driving circuit is re-charged from N-side 15V control supply to BSC via current limiting
resistor and BSD when voltage of output terminal (U, V or W) goes down to GND potential in inverter operation. But
there is the possibility that enough charge doesn't perform due to the conditions such as switching sequence,
capacitance of BSC, current limiting resistance and so on. Deficient charge leads to low voltage of BSC and might
work under voltage protection (UV). This situation makes the loss of P-side device increase by low gate voltage or
stop switching. So it is necessary to consider and evaluate enough for designing bootstrap circuit.
Current limiting
resistor
Bootstrap diode
(BSD)
VFB
BSC
+
P-side
IGBT
VP1
N-side
IGBT
VN1
LVIC
N-side
FWDi
VPC
P(Vcc)
+
Gate Drive
VD=15V
Logic & UV
protection
U,V,W
VFS
↑High voltage area
VFB
Level Shift
P-side
FWDi
Low voltage area
Level Shift
VPC
BSD
15V
P(Vcc)
HVIC
VP1
Bootstrap capacitor
(BSC)
P-side
IGBT
P-side
FWDi
VFS
U,V,W
Voltage of VFS that is reference voltage of BSC swings between
VCC and GND level. If voltage of BSC is lower than 15V when
VFS becomes to GND potential, BSC is charged from 15V N-side
control supply.
VNC
N(GND)
Fig.1-1 Bootstrap Circuit Diagram
Fig.1-2 Bootstrap Circuit Diagram
1.2 Initial charging
1.2.1 Initial charging procedure
In the case of applying bootstrap circuit, it is necessary to charge to the BSC initially because voltage of BSC is 0V at
initial state or it may go down to the trip level of under voltage protection after long suspending period (even 1s). BSC
charging is performed by turning on all N-side IGBT normally.(Fig. 1-3) When outer load (e.g. motor) is connected to
DIPIPM, BSC charging may be performed by turning on only one phase N-side IGBT since potential of all output
terminals will go down to GND level through the wiring in the motor. But its charging efficiency might become lower
due to some reason. (e.g. wiring resistance of motor) (Fig. 1-4)
There are mainly two procedures for BSC charging. One is performed by one long pulse, and another is conducted
by multiple short pulses. Multi pulse method is used when there are some restriction like control supply capability,
forward surge current of BSD, power rating of current limiting resistor and so on. Enough long pulse is needed for
initial charge.
Publication Date: October 2012
2
<Dual-In-Line Package Intelligent Power Module> Application Note
Bootstrap Circuit Design Manual
BSD
VFB
VP1
+
VNC
VPC
N-side
FWDi
ON
15V
+
VFS
U
V
HVIC
N-side
IGBT
+
HVIC
U,V,W
+
HVIC
VFS
VN1
VFB
VP1
VDB
HVIC
15V
P(Vcc)
BSD
Level Shift
Level Shift
VPC
P(Vcc)
P-side
IGBT
ON
VN1
W
OFF
OFF
LVIC
VNC
LVIC
N(GND)
N(GND)
Fig.1-3 Initial charging root
VD
Fig.1-4 Charging root at turning on one phase
15V
VD
15V
0V
0V
N-side
input
N-side
input
0V
0V
Charge
current
Charge
current
0
0
Voltage of
BSC VDB
0
Voltage of
BSC VDB
0
Fig.1-5 Example of waveform by one charging pulse
Fig.1-6 Example of waveform by multiple charging pulses
1.2.2 Initial charging time
Time required for initial charge depends on capacitance of BSC, forward voltage of BSD and limiting resistance.
Charge is performed with time constant that is roughly calculated from capacitance of BSC and limiting resistance.
Example of calculated charging waveform is described in Fig.1-7. Sample: Super mini DIPIPM Ver.5 PS219B2
(5A/600V, BSD and limiting resistor(100Ω) are integrated), Condition: BSC=22μF or 100μF, VD=15V
16
14
Voltage of BSC(V)
12
10
8
Saturates at sixfold period of
time constant in each case.
6
4
2
22μF
Time
constant
0
0
0.01
100μF
0.02
0.03
0.04
0.05
0.06
0.07
Time(s)
Fig.1-7 Example of initial charging
As above figure, voltage of BSC doesn't saturate (about 60%) by charging up to time constant (e.g. τ=C x R=22μF x
100Ω=2.2ms). For saturated charge, about sixfold period of time constant will be needed. Saturated voltage doesn't
reach to the control voltage VD. It will become about 1.2V lower than control supply voltage (typ. 15V) due to voltage
drops of N-side IGBT (VCE(sat)) and BSD (VF) which are in charging path. Refer Fig.1-3
Publication Date: October 2012
3
<Dual-In-Line Package Intelligent Power Module> Application Note
Bootstrap Circuit Design Manual
Initial charging needs to be performed until voltage of BSC exceeds recommended minimum supply voltage 13V. (It
is recommended to charge as high as possible with consideration for voltage drop between the end of charging and
start of inverter operation.)
After BSC was charged, it is recommended to input one ON pulse to the P-side input for reset of internal IC state
before starting system. Necessary width is allowable minimum input pulse width PWIN(on) or more. (e.g. 0.7μs or
more for Super mini DIP Ver.5 PS219B2. Refer the datasheet for each product. )
1.2.3 Voltage drop while suspending operation
Voltage of BSC also drops gradually due to circuit current of control IC while suspending operation. Its drop rate will
be estimated by the calculation from capacitance C of BSC and steady circuit current IDB of P-side control IC (e.g.
maximum 0.1mA for Super mini DIP Ver.5 PS219B2. It is different by products. Refer the datasheet for each product.)
Voltage drop ΔV= IDB x t / C (t: discharging time)
Voltage of BSC(V)
When stopped state continues for long time and VDB drops below 13V (=recommended minimum control voltage for
VDB), it is necessary to recharge to BSC before starting operation. Example of voltage drop calculation for Super mini
DIP Ver.5 is shown in Fig.1-8. Conditions: Initial voltage of BSC=15V, Circuit current IDB=0.1mA, BSC=22 and 100μF
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
0.0
22μF
100μF
0.44
0.5
1.0
1.5
2.0
Stop time(s)
Fig.1-8 Example of voltage drop of BSC in suspended time
When stopped state continues over 0.44s in the case of 22μF, recharging will be required before restart. If it
continues over 0.7s, VDB will drop below 12V and under voltage protection may work. This example is the calculation
result. It is necessary to evaluate in the real system finally.
Publication Date: October 2012
4
<Dual-In-Line Package Intelligent Power Module> Application Note
Bootstrap Circuit Design Manual
1.3 Charging in operation
1.3.1 Basic charging scheme
Charge of bootstrap capacitor (BSC), which was consumed by circuit current (e.g. gate charge for P-side IGBT) in
the inverter operation by PWM signal like three phase modulation sine wave control, is recharged through bootstrap
diode (BSD) when voltage VDB of BSC becomes lower than 15V control supply due to the output terminal (U,V,W)
drops to about GND level in the case of N-side IGBT turning on period or free whiling period after P-side IGBT turning
off.
But practically the charge current starts flowing when voltage of BSC VDB is about 0.6V lower than N-side control
supply 15V because BSD needs to turn on. (Fig. 1-9, 10)
BSC cannot be charged,
VDB=Vcc+VBSC because VDB is higher than
control supply 15V.
P(Vcc)
BSD
15V
VFB
VP1
VBSC
Level Shift
Vcc
+
BSC
VPC
VFS
HVIC
BSC is charged when VDB is
about 0.6V lower than control
supply.
VDB
15V
≈0V
VN1
VNC
LVIC
U,V,W
VDB≈VBSC
Potential of output terminal
becomes about GND level in
the case of N-side IGBT or
N-side FWDi turning on by
free wheeling
VBSC
GND
N(GND)
Control
supply
BSC
Control
supply
BSC
≈GND
N-side IGBT ON
P-side IGBT ON
N-side FWDi ON
P-side FWDi ON
Transition by switching
Fig.1-9 Charging situation
Charge current
VF-IF curve of
BSD
VF-IF curve + R x i
(Voltage drop by
limiting resistor is
added to VF-IF curve)
Charge current flows depending
on the voltage between both
ends of BSD and resistor.
≈0.6V
・Charge current flows when voltage of both
ends exceeds about 0.6V.
・Charge efficiency boosts up increasingly
when voltage of both ends becomes
larger since charge current increases.
Voltage between both ends
of BSD and resistor
Fig.1-10 Charge current with limiting resistor
Because potential of output terminal varies depending on the direction of motor current flow i.e. the device (IGBT or
FWDi of N-side) into which current flows, potential of BSC VDB which goes by potential of output terminal also varies.
So BSC is not always charged when IGBT or FWDi of N-side turns on. Charging situation is explained below.
There are below two modes of charging situation in inverter operation.


Mode 1: Free wheeling situation of N-side FWDi after P-side turning off
Mode 2: Current flowing situation into N-side IGBT
Current flows chart at both modes is illustrated in Fig.1-11. Charge mode is decided by output current direction.
(Fig.1-12)
Publication Date: October 2012
5
<Dual-In-Line Package Intelligent Power Module> Application Note
Bootstrap Circuit Design Manual
BSD
VFB
VP1
HVIC
VPC
VD=15V
BSD
P(Vcc)
VFS
+
P-side
IGBT
P-side
IGBT
VDB
VDB
U
ONOFF
VN1
V
M
VEC(i)
LVIC
+
VFB
VP1
HVIC
VPC
VFS
VN1
VCEsat(i)
LVIC
ON
VNC
VNC
Rxi
Shunt resistor R
[Mode1]
Potential of U terminal drops to about GND level and
charge starts when N-side FWDi turns on due to free
wheeling current after P-side IGBT turning off.
VD=15V
N(GND)
[Mode 2]
Potential of V terminal drops to about GND
level and charge starts when N-side IGBT
turns on.
Fig.1-11 Charging mode in the case that currents flows from U to V pahse
Mode1 charging status
Current flows out from output terminal.
time
0
Mode 2 charging status
Current flows into output terminal.
Fig.1-12 Relation between output current waveform and charging mode
The potential voltage of output terminal (i.e. reference voltage of BSC) depends on forward voltage VEC(i) at mode1
or saturation voltage of IGBT VCEsat(i) and voltage drop by shunt resistor R x i at mode2 as below.
Mode 1: Voltage of output terminal=GND potential (0V) - VEC(i)
Mode 2: Voltage of output terminal=GND potential (0V) + VCEsat(i) + R x i
<0V
>0V
Because VDB (voltage by charge stored in BSC) goes by voltage of output terminal, voltage potential VBSC of BSC
becomes as below. (Refer Fig. 1-13 too.)
Mode 1 : VBSC=VDB - VEC(i)
Mode 2 : VBSC=VDB + VCEsat(i) + R x i
If difference between control supply voltage 15V and VBSC is
about 0.6V or more, BSD turns on and charging starts.
15V
VBSC(Change by VCE(sat)(i), R x i)
Control
supply
VBSC
Control
supply
(Change by VEC(i))
BSC
VCEsat(i)
VDB
Voltage potential of
Output terminal
(Change by current)
GND
Voltage potential of
Output terminal
VDB
Rxi
Voltage drop by shunt resistor
VEC(i)
(Change by current)
BSC
(Change by current)
Mode 1
Mode 2
Fig.1-13 Difference of potential VBSC due to charging modes
Publication Date: October 2012
6
<Dual-In-Line Package Intelligent Power Module> Application Note
Bootstrap Circuit Design Manual
When voltage difference between control supply voltage15V and VBSC becomes to about 0.6V or larger, BSD turns
on and charge currents starts flowing. So VDB voltage, at which BSC can start to be charged, is calculated by below.
Mode 1 : 15-VBSC ≥ 0.6
15 + VEC(i) - 0.6 ≥ VDB
Mode 2 : 15-VBSC ≥ 0.6
15 - VCEsat(i) - R x i - 0.6 ≥ VDB
For example, in the case of Super mini DIPIPM Ver.5 PS219B2 (5A/600V) at about 0A and 5A current, maximum VDB
(voltage by charge stored in BSC), at which BSC can start to be charged, is roughly estimated at each modes as
below.
Conditions: At i=5A, VEC=1.7V, VCE(sat)=1.5V and Shunt resistance=50mΩ
At i≈0A, VEC=0.6V, VCE(sat)=0.6V and Shunt resistance=50mΩ
(But voltage drop by shunt resistor can be ignored because current is almost 0.)
Table 1-1 Estimated maximum VDB (Charge starts when VDB drops to this value.)
i=5A
i≈0A
Mode 1
16.1V
15.0V
Mode 2
12.65V
13.8V
It is recognized from this table that charging at mode 1 condition can start at higher VDB than one at mode 2. (i.e. It is
necessary to drop VDB more for starting charge at mode 2 condition.) Since BSC can start to be charged under this
maximum voltage, it also means the maximum charged voltage by bootstrap circuit depends on output current and
characteristics of power chips like IGBT, MOSFET and FWDi.
Calculated charge starting voltage is described in Fig. 1-14 on the condition of AC currents (peak current 5A and
0.5A, frequency 60Hz) and PS219B2. It can be confirmed that the voltage depends on output current.
Charge starting
voltage
16.0
17.5
2.5
4
17.0
2.0
3
16.5
2
15.5
1
Range of VDB in which
BSC can be charged
at mode2.
15.0
14.5
0
-1
Range of V DB in which
BSC can be charged
at mode1.
14.0
13.5
-2
-3
12.5
-0.5
-1.0
-1.5
-2.0
-2.5
0
Time(ms)
0.0
Range of VDB in which
BSC can be charged
at mode1.
13.5
-5
20
Range of VDB in which
BSC can be charged
at mode2.
14.0
12.5
15
Charge starting
voltage
14.5
13.0
10
0.5
15.0
-4
5
1.0
15.5
13.0
0
1.5
Current
16.0
Output current(A)
Charge starting max. VDB(V)
16.5
5
Charge starting max. VDB(V)
Current
17.0
Output current(A)
17.5
5
10
15
20
Time(ms)
Io=5A peak
Io=0.5A peak
Fig.1-14 Estimated charge starting voltage (fo=60Hz)
1.3.2 Charging scheme in the three phase modulation sine wave control operation
This section explains the detail of charging scheme in the case of three phase modulation sine wave control.
Fig. 1-15 is VDB and output current waveforms of Super mini DIPIPM Ver.5 PS219B2 (5A/600V) on the real operation
with below conditions.
Conditions: VD=15V, fc=15kHz, Io=5A (peak), fo=60Hz, BSC=4.7μF, integrated BSD and current limiting resistor
(100Ω), three phase modulation sine wave PWM control
At this example, BSC takes smaller value purposely for easy confirmation of voltage drop behavior of BSC in real
operation.
From this figure, it can be confirmed that charging was only performed at mode1 period (current is positive) and
discharging continued for mode2 period (current is negative).
Fig.1-16 is that VDB (voltage of BSC) waveform was overlapped on the Fig.1-14 at 5A.
Publication Date: October 2012
7
<Dual-In-Line Package Intelligent Power Module> Application Note
Bootstrap Circuit Design Manual
BSC cannot be charged
since VDB exceeds charge
starting voltage.
VDB
17.5
0A
5
Current
Charging
Charge starting max. VDB(V)
17.0
Discharging
15V
Voltage of BSC VDB(1V/div)
 Charging period
16.5
4
3
Charge starting
voltage
16.0
15.5
2
1
A
15.0
14.5
0
-1
Measured VDB
B
14.0
-2
13.5
-3
13.0
-4
12.5
Output current(A)
Output current(5A/div)
-5
0
5
10
15
20
Time(ms)
Fig.1-15 Example waveform in charging
Fig.1-16 Charging situation
Fig. 1-16 suggests that BSC can be charged at positive current period (Mode 1) but for negative current period, it
cannot be charged because voltage of BSC VDB is higher than charge starting voltage. So BSC will be almost
charged in Mode 1 region (Positive current and free wheeling to N-side FWDi) except for particular condition like
quite small BSC capacitance. Here there are the not-charged periods despite VDB is lower than charge starting voltage.
(part A & B in Fig.1-16) The reasons are estimated as below.
At part A, the voltage difference between voltage of BSC VDB and charge starting voltage becomes smaller (i.e. the
voltage applied to BSD becomes small), hence charging current that flows into BSC also decreases. It leads to VDB
drop because discharge amount exceeds charge amount.
At part B, the voltage difference between voltage of BSC VDB and charge starting voltage is enough large, so
charging current that flows into BSC enough large. But charging time is quit short because ON duty of N-side FWDi
(=OFF duty of P-side IGBT) is almost 0 in this moment. It leads to small charge amount per one switching operation.
So efficiency of charge is also affected by duty of PWM control signal (i.e. power factor (phase delay between
current and voltage) and modulation rate). (Fig.1-17)
Output voltage
Output current
Mode1
reagion
Power factor
cos Φ
0
time
Charge amount per every carrier frequency
in positive current region is calculated by
below formula.
Charge
Charge current x ON time of N-side FWDi
Discharge
So charge amount becomes small in this
region.
VDB
1
P-side IGBT input OFF duty
=N-side FWDi ON duty
0.5
P-side IGBT input ON duty
0
Fig.1-17 Effect on charging due to the phase difference between PWM signal and current
Charging to BSC is also affected by other inverter driving conditions. From here effects on charging situation due to
driving condition by three phase modulation sine wave control are explained with simulation waveforms.
Publication Date: October 2012
8
<Dual-In-Line Package Intelligent Power Module> Application Note
Bootstrap Circuit Design Manual
1.3.3 Effects on charging situation due to driving conditions
To consider effects on charging situation by driving conditions, the results of simulation of VDB with various conditions
are described as below. Those conditions are
[Common conditions]
IPM: Super mini DIPIPM Ver.5 PS219B2 (5A/600V), BSC=4.7μF, Io=5A(peak), fc=15kHz, fo=20Hz, P.F=0.8,
Modulation rate=0.7, VD=15V, Shunt resistance 50mΩ, three phase modulation sine wave control
[Comparative conditions] (Common conditions are used if not otherwise noted.)
(1) Output frequency
: fo=20Hz, 60Hz and 120Hz
(2) Carrier frequency
: fc=15kHz and 5kHz
(3) Capacitance of BSC : BSC=1μF, 4.7μF and 22μF
(4) Output current
: Io=5A peak and 2A peak (fo=60Hz and 20Hz)
(1) Comparison of output frequency: fo=20Hz, 60Hz and 120Hz
The results of simulation with three conditions of output frequency are charted in Fig.1-18, 19 and 20. At 20Hz, time
of one cycle becomes long and the period of Mode 2, at which charging is not performed easily, becomes long too.
Then voltage VDB drops to under 13V: recommended minimum control voltage for VDB of DIPIPM. (In this case
charging at Mode 2 is performed partly because VDB drops excessively. part A in Fig.1-19)
On the other hand at 120Hz, time of one cycle is short, so VDB drop becomes small. But charging time at Mode 1
becomes short in parallel. Then maximum charged voltage is lower than one at 20Hz. But the ripple of voltage
becomes smaller than one at 20Hz.
If there is the low output frequency operation in your system and capacitance of BSC isn't suitable value,
there is the possibility of increasing loss or system stop by working under voltage protection due to
excessive drop of VDB. It is necessary to evaluate well when designing circuit.
17
15
Voltage of BSC
5
15
0
14
-5
-10
13
Max 15.68V
Ave 15.08V
Min 14.40V
Ripple 1.28V
-15
0.000
0.010
0.020
10
12
0.030
0.040
0.050
11
0.060
Voltage of BSC
15
0
14
-5
13
Max 15.56V
Ave 15.23V
Min 14.94V
Ripple 0.62V
Voltage of BSC(V)
Output current(A)
16
5
0.020
12
0.030
14
-5
13
Max 15.81V
Ave 14.51V
Min 12.77V
Ripple 3.04V
0.010
0.020
A
0.030
0.040
Fig.1-19 fo=20Hz
17
0.010
0
Time(s)
15
-15
0.000
15
-15
0.000
Fig.1-18 fo=60Hz
-10
5
-10
Time(s)
10
Output current(A)
16
Voltage of BSC(V)
Output current(A)
Voltage of BSC
10
Because discharging
17
time is long, voltage
drop becomes large.
16
0.040
0.050
11
0.060
Time(s)
Fig.1-20 fo=120Hz
Publication Date: October 2012
9
0.050
12
11
0.060
Voltage of BSC(V)
15
<Dual-In-Line Package Intelligent Power Module> Application Note
Bootstrap Circuit Design Manual
(2) Comparison of carrier frequency: fc=15kHz and 5kHz
The results of simulation with two conditions of carrier frequency are charted in Fig.1-21 and 22. When carrier
frequency increases, amount of gate charge (circuit current) increases according to frequency. Then voltage drop of
BSC also increases depending on carrier frequency fc. So it is necessary to increase the capacitance of BSC
generally in the case of high frequency operation.
15
17
15
17
16
5
15
0
14
-5
-10
13
Max 15.81V
Ave 14.51V
Min 12.77V
Ripple 3.04V
-15
0.000
0.010
12
0.020
0.030
0.040
0.050
10
16
5
15
0
14
-5
-10
11
0.060
13
Max 15.94V
Ave 15.19V
Min 14.13V
Ripple 1.81V
-15
0.000
0.010
0.020
Time(s)
Voltage of BSC(V)
10
Output current(A)
Voltage of BSC
Voltage of BSC(V)
Output current(A)
Voltage of BSC
12
0.030
0.040
0.050
11
0.060
Time(s)
Fig.1-21 fc=15kHz
Fig.1-22 fc=5kHz
Typical circuit current vs. carrier frequency characteristics of Super mini DIPIPM Ver.5 PS219B2 (5A/600V), which is
used to above simulations, is charted in Fig.1-23. It indicates circuit current is large at high frequency.
Since circuit current increases according to amount of gate charge, the high current rating products (i.e. they have
large gate capacitance) generally consume larger circuit current and it is necessary to consider the capacitance of
BSC.
This circuit current vs. carrier frequency characteristics is prepared for all DIPIPM series. Please refer the application
note for each product.
Conditions: VD=VDB=15V, Tj=125°C, IGBT ON Duty=10, 30, 50, 70, 90%
800
Circuit current (μA)
700
600
500
10%
400
30%
300
50%
200
70%
100
90%
0
0
5
10
Carrier frequency (kHz)
15
20
Fig.1-23 Circuit current IDB vs. carrier frequency characteristics for PS219B2 (Typical data)
Publication Date: October 2012
10
<Dual-In-Line Package Intelligent Power Module> Application Note
Bootstrap Circuit Design Manual
(3) Comparison of capacitance of BSC: BSC=1μF, 4.7μF and 22μF
The results of simulation with three conditions of capacitance of BSC are charted in Fig.1-24~1-26. When
capacitance of BSC is quite small, voltage drop of BSC increases considerably. Then the lower limit voltage of VDB
drops extremely and its ripple voltage becomes larger. For DIPIPM recommended value of VDB ripple is within 2Vp-p.
15
17
15
17
10
16
10
16
5
15
5
15
0
14
0
14
-10
13
Max 15.81V
Ave 14.51V
Min 12.77V
Ripple 3.04V
-15
0.000
0.010
0.020
12
0.030
0.040
0.050
-10
11
0.060
17
10
16
5
15
0
14
-5
13
Max 15.60V
Ave 15.19V
Min 14.80V
Ripple 0.80V
Voltage of BSC(V)
Output current(A)
Voltage of BSC
0.020
12
0.030
0.020
0.030
0.040
Fig.1-25 BSC=1.0μF
15
0.010
0.010
12
Time(s)
Fig.1-24 BSC=4.7μF
-15
0.000
13
Max 15.83V
Ave 14.22V
Min 12.56V
Ripple 3.27V
-15
0.000
Time(s)
-10
-5
0.040
0.050
11
0.060
Time(s)
Fig.1-26 BSC=22μF
Publication Date: October 2012
11
0.050
11
0.060
Voltage of BSC(V)
-5
Output current(A)
Voltage of BSC
Voltage of BSC(V)
Output current(A)
Voltage of BSC
<Dual-In-Line Package Intelligent Power Module> Application Note
Bootstrap Circuit Design Manual
(4) Comparison of output current: Io=5A peak and 2A peak (fo=60Hz and 20Hz)
The results of simulation with four conditions of output current are charted in Fig.1-27~1-30. As described above
section 1.3.1, charge starting voltage changes depending on output current. When output current is small, charge
starting voltage drops at Mode 1 region (positive current area) and rise at Mode 2 region (negative current area). So
upper and lower limit of voltage of BSC change according to it. At low current condition, maximum charged voltage will
drop. (Fig.1-27 and 1-28) In the case of the condition, on which there is charging at Mode 2, minimum voltage will rise
since charge starting voltage rises and charging becomes easily. (Fig.1-29 and 1-30)
17
15
10
16
10
5
15
0
14
17
-10
13
Max 15.68V
Ave 15.08V
Min 14.40V
Ripple 1.28V
-15
0.000
0.010
0.020
Output current(A)
-5
Voltage of BSC(V)
Output current(A)
Voltage of BSC
12
0.030
0.040
0.050
15
0
14
-5
13
Max 15.26V
Ave 14.71V
Min 14.02V
Ripple 1.24V
-15
0.000
11
0.060
16
5
-10
No charging at Mode 2
Voltage of BSC
0.010
0.020
12
0.030
0.040
0.050
11
0.060
Time(s)
Time(s)
Fig.1-27 Io=5Apeak, fo=60Hz
Fig.1-28 Io=2Apeak, fo=60Hz
15
17
15
10
16
10
5
15
0
14
Voltage of BSC(V)
15
17
-10
-15
0.000
0.010
0.020
Charging at Mode122
0.030
0.040
0.050
15
0
14
-5
13
Max 15.36V
Ave 14.35V
Min 13.11V
Ripple 2.25V
-15
0.000
Time(s)
16
5
-10
11
0.060
Voltage of BSC
0.010
0.020
Voltage of BSC(V)
13
Max 15.81V
Ave 14.51V
Min 12.77V
Ripple 3.04V
Output current(A)
-5
Voltage of BSC(V)
Output current(A)
Voltage of BSC
Charging at Mode122
0.030
0.040
0.050
11
0.060
Time(s)
Fig.1-29 Io=5Apeak, fo=20Hz
Fig.1-30 Io=2Apeak, fo=20Hz
As mentioned above (1)~(4), charging state of BSC changes according to ever-changing condition. Except for
capacitance of BSC, the conditions on which charging state is affected especially are


Output frequency fo
Carrier frequency fc
It is necessary to conduct enough confirmation and evaluation at system design stage since charging state is also
affected by other conditions such as PWM control method (e.g. two phase modulation sine wave control), power factor,
modulation, characteristics of BSC (e.g. tolerance of capacitance, temperature, DC bias and life time) and IGBT.
Above all simulations are performed with condition of control supply VD=15V. If VD varies and drops to 14V, it leads
to one voltage down of all above results of VDB directly. So the consideration of variation of control supply VD is
also important.
Publication Date: October 2012
12
<Dual-In-Line Package Intelligent Power Module> Application Note
Bootstrap Circuit Design Manual
1.3.4 Estimation method of capacitance of BSC
Because charging state of BSC changes according to ever-changing condition, it is uneasy to estimate absolute
value of VDB (voltage of BSC). But the variation (ripple) of VDB can be roughly estimated under the conditions without
charging at Mode 2. In this section, the estimation method of ripple voltage of VDB under the condition in Fig.1-16 is
explained.
Conditions: VD=15V, fc=15kHz, Io=5A (peak), fo=60Hz, BSC=4.7μF, three phase modulation sine wave control
Voltage drop ΔV=
Dropping for about 60% of one cycle
5
17.5
17.0
4
Voltage of BSC(V)
16.5
Consumed charge for
the dropping period
3
Current
16.0
15.5
1
15.0
0
14.5
-1
1.3V
14.0
-2
BSC voltage
13.5
Capacitance of BSC
2
Output current(A)
The waveform on the conditions is charted in Fig.1-31.
As mentioned above, charge is performed for period of
positive current basically. Its voltage drop time is about
60% of output current cycle. The voltage drop for this
period equals to the ripple voltage on this condition.
The ripple voltage can be estimated from circuit current
for the dropping time and capacitance of BSC.
-3
13.0
-4
12.5
-5
0
5
10
15
20
Time(ms)
Consumed charge is calculated as below.
Consumed charge = Circuit current X output current cycle X 60%
Fig.1-31 Charging waveform
Circuit current can be obtained from above circuit current IDB vs. carrier frequency characteristics. (Fig.1-23)
So the ripple voltage under the conditions is estimated from
Voltage drop ΔV=610μA X 16.6ms X 60% / 4.7μF = 1.3V
Recommended value of VDB ripple is within 2Vp-p for DIPIPM. When designing capacitance of BSC, it is necessary
to consider various conditions such as using condition, tolerance of capacitance, change of capacitance due to
temperature characteristics, DC bias and life time, tolerance of circuit current and so on. And also minimum voltage of
BSC in the operation should keep above 13V that is recommended minimum control supply voltage for VDB. For
example, two or three times of capacitance that makes 1V voltage drop under the typical conditions will become rough
standard. In the above case when typ. 5.6μF capacitor is used, its typical ripple voltage becomes 1V. So above 10μF
~ 15μF, which is two or three times of 5.6μF, will be target value.
This estimation is rough method only as guide in the case of three phase modulation sine wave control.
There is a possibility that drop time (60%) may be extended more. And it may be necessary to increase the
capacitance due to the characteristics of BSC. So enough evaluation in real system is needed finally.
1.3.5 Design for current limiting resistor
It is necessary to design current limiting resistor depending on current supply capability of 15V control supply,
forward surge current of BSD, power rating of current limiting resistor in the initial charging state. This resistor also
affects charge efficiency in inverter operation.
Since charge current depends on the voltage difference between control supply 15V and VDB (voltage of BSC) as
described in I-V curve of forward voltage of BSD + voltage drop by limiting resistor (Fig.1-32), VDB should rise and fall
in response to voltage drop by limiting resistor for getting same charge current when limiting resistance is changed.
When limiting resistance is increased, it will lead to voltage drop of BSC and it is important to evaluate well under the
assumed worst-case condition for confirming excessive voltage drop doesn't occur.
Estimated comparison result of VDB between typical limiting resistance (100Ω) integrated in Super mini DIPIPM Ver.5
PS219B2 and the case that it is changed to 50Ω temporarily are described in Fig.1-33 and 1-34. It indicates VDB at
50Ω is higher than one at 100Ω. (Limiting resistance cannot be changed in practice in the case of DIPIPM that
integrates BSD.)
Publication Date: October 2012
13
<Dual-In-Line Package Intelligent Power Module> Application Note
Bootstrap Circuit Design Manual
Resistance increases
VF-IF curve
of BSD only
Charge current
VF-IF curve of BSD + R x i
(Add voltage drop by limiting resistor
to VF-IF curve of BSD)
・ When resistance increases, voltage difference between
control supply 15V and voltage of BSC needs to be larger for
getting same charge current. (i.e. Voltage of BSC needs to
drop more.)
Voltage difference between 15V and VDB
(=Voltage difference both ends of BSD and limiting resistor)
Fig.1-32 Difference of charge current characteristics due to limiting resistance
17
15
10
16
10
5
15
0
14
17
-10
13
Max 15.68V
Ave 15.08V
Min 14.40V
Ripple 1.28V
-15
0.000
0.010
0.020
12
0.030
0.040
0.050
Output current(A)
-5
Voltage of BSC(V)
Output current(A)
Voltage of BSC
15
0
14
-5
13
Max 15.88V
Ave 15.26V
Min 14.49V
Ripple 1.38V
-15
0.000
Time(s)
16
5
-10
11
0.060
Voltage of BSC
0.010
0.020
Voltage of BSC(V)
15
12
0.030
0.040
0.050
11
0.060
Time(s)
[Conditions] BSC=4.7μF, Io=5A(peak) ,fc=15kHz, fo=20Hz, P.F=0.8, Modulation rate=0.7, VD=15V, Shunt resistance=50mΩ,
three phase modulation sine wave control, Limiting resistance 100Ω and 50Ω
Fig.1-33 limiting resistance 100Ω
Fig.1-34 limiting resistance 50Ω
When charge current increases more due to limiting resistance, the impact to voltage of BSC becomes bigger. So
larger current rating product is further affected since it has larger gate charge (circuit current) generally. (Especially It
is necessary to pay attention in the case of development of series with same PCB.)
As mentioned above section, it is necessary to consider and evaluate under the various operating conditions and
design to keep minimum voltage of BSC in the operation above recommended minimum control supply voltage 13V
for VDB.
Publication Date: October 2012
14
<Dual-In-Line Package Intelligent Power Module> Application Note
Bootstrap Circuit Design Manual
1.3.6 Note for designing the bootstrap circuit
When each device for bootstrap circuit is designed, it is necessary to consider various conditions such as
temperature characteristics, change by lifetime, variation and so on. Note for designing these devices are listed as
below.
(1) Bootstrap capacitor
Electrolytic capacitors are used for BSC generally. And recently ceramic capacitors with large capacitance are also
applied. But DC bias characteristic of the ceramic capacitor when applying DC voltage is considerably different from
that of electrolytic capacitor. (Especially large capacitance type) In the case of some ceramic capacitor its
capacitance drops to about 30% of rating capacitance when applying DC 15V.
Some differences of capacitance characteristics between electrolytic and ceramic capacitors are listed in Table 1-2.
Table 1-2 Differences of capacitance characteristics between electrolytic and ceramic capacitors
Ceramic capacitor
Electrolytic capacitor
(large capacitance type)
 Aluminum type:
Different due to temp. characteristics rank
Temperature
Low temp.: -10% High temp: +10%
Low temp.: -5%~0%
characteristics
 Conductive polymer aluminum solid type:
High temp.: -5%~-10%
(Ta:-20~ 85°C)
Low temp.: -5% High temp: +10%
(in the case of B,X5R,X7R ranks)
DC bias
characteristics
(Applying DC15V)
Different due to temp. characteristics,
rating voltage, package size and so on
-70%~-15%
Nothing within rating voltage
DC bias characteristic of electrolytic capacitor is not matter. But it is necessary to note ripple capability by repetitive
charge and discharge, life time which is greatly affected by ambient temperature and so on. Above characteristics are
just example data which are obtained from the WEB, please refer to the capacitor manufacturers about detailed
characteristics.
(2) Bootstrap diode
It is recommended for BSD to have same or higher blocking voltage with collector-emitter voltage VCES of IGBT in
DIPIPM. (i.e. 600V or more is needed in the case of 600V DIPIPM.) And its recovery time trr should be less than
100ns. (Fast recovery type)
Also it is highly recommended to apply the high quality product such as small variations of blocking voltage.
If BSD broke by impressed overvoltage and shorted, it leads to the control ICs over voltage destruction because
DC-link voltage (Vcc) is impressed upon low voltage area of control ICs. Then DIPIPM will lose various functions like
protection and gate driving and it may lead to serious system destruction.
(3) Current limiting resistor
When designing limiting resistor, it is important to note its power rating, surge withstand capability (there is the
possibility that surge may be impressed on the resistor when switching ON or OFF timing) and so on.
Especially if small chip type resistor is applied, it is recommended to select anti-surge designed type. For detailed
information, please refer to the resistor manufacturer.
Publication Date: October 2012
15
<Dual-In-Line Package Intelligent Power Module> Application Note
Bootstrap Circuit Design Manual
1.4 Circuit currents in the case of other control methods
P-side driving circuit current that applies bootstrap circuit varies according to the control method. Above Fig.1-23
described the circuit current in the case of three phase modulation sine wave control (always switching). In this
section approximation method of circuit current in the case of two phase modulation sine wave control and 120
degree conduction square wave control will be explained.
Circuit current IDB vs. carrier frequency characteristics for PS219B2 (Typical data) described in Fig.1-23 is
re-described in Fig.1-35. (Condition: ON duty 50% only, Frequency range is outspread from 1kHz to 0Hz.)
800
Circuit current (μA)
700
600
500
400
300
200
Consum ption current due to gate charge operation
100
Steady consum ption current
0
0
5
10
Carrier frequency (kHz)
15
20
Fig.1-35 Circuit current IDB vs. carrier frequency characteristics for PS219B2 (Typical data)
Circuit current at each frequency consists of the steady current and the current due to gate charge operation. Circuit
current at 0 Hz is the steady consumption current which is consumed at IC regardless whether with or without
switching. At over 0Hz, sum of steady consumption current at 0Hz and consumption current due to gate charge
operation by switching becomes total circuit current. To estimate circuit current in the case of two phase modulation
sine wave control, which has each 60 degree period of continuous ON and OFF state and 120 degree conduction
square wave control (P-side chopping), the difference between three phase modulation control and these two control
method is described in Fig.1-36.
0
Three phase modulation
60
120
180
240
300
360
Switching
Two phase modulation
Continuous ON
Continuous OFF
120 degree conduction
Continuous OFF
Fig.1-36 Difference of switching state due to control method
As indicated by this figure, the difference of circuit current between these three methods equals to the difference of
switching times. Switching times at the case of two phase modulation becomes two-thirds times at three phase
modulation and switching times at 120 degree conduction becomes one-thirds at three phase modulation. So each
circuit current is sum of steady consumption current and two-thirds or one thirds of switching current respectively in
Fig.1-35. The calculated result of circuit currents at each control method is charted in Fig.1-37.
800
Three phase modulation
Circuit current (μA)
700
600
500
400
Tw o phase modulation
300
200
120 degree conduction
100
Steady consumption current
0
0
5
10
Carrier frequency (kHz)
15
20
Fig.1-37 Circuit current IDB vs. carrier frequency characteristics at each control method (Estimated data)
Publication Date: October 2012
16
<Dual-In-Line Package Intelligent Power Module> Application Note
Bootstrap Circuit Design Manual
Example of calculated results of charging state at three phase modulation and two phase modulation are described
in Fig.1-38~41.
Conditions:
IPM: Super mini DIPIPM Ver.5 PS219B2, BSC=4.7μF, Io=5A(peak), fc=15kHz and 5kHz, fo=60Hz, P.F=0.8,
Modulation rate=0.7, VD=15V, Shunt resistance 50mΩ, three phase or two phase modulation sine wave control
10
5
15
0
14
-5
-10
13
Max 15.68V
Ave 15.08V
Min 14.40V
Ripple 1.28V
-15
0.000
0.010
12
0.020
0.030
0.040
0.050
15
0
14
-5
13
Max 15.83V
Ave 15.53V
Min 15.23V
Ripple 0.60V
-15
0.000
0.010
12
0.020
Time(s)
Output current(A)
0
14
-5
13
0.010
0.020
There is no charging for
continuous ON period.
Voltage drops by steady
consumption current.
0.030
11
0.060
0.040
0.050
17
Voltage of BSC
16
15
-15
0.000
0.050
15
Output current(A)
Voltage of BSC
There is no switching
17 for
continuous OFF period.
Voltage drop rate is low.
5
-10
0.040
Fig.1-39 Three phase modulation fc=5kHz
Voltage of BSC(V)
15
Max 15.76V
Ave 15.25V
Min 14.76V
Ripple 1.00V
0.030
Time(s)
Fig.1-38 Three phase modulation fc=15kHz
10
16
5
-10
11
0.060
Voltage of BSC
Voltage of BSC(V)
16
17
12
10
16
5
15
0
14
-5
-10
11
0.060
13
Max 15.87V
Ave 15.59V
Min 14.32V
Ripple 0.55V
-15
0.000
Time(s)
0.010
0.020
Voltage of BSC(V)
Output current(A)
15
Output current(A)
Voltage of BSC
10
17
Voltage of BSC(V)
15
12
0.030
0.040
0.050
11
0.060
Time(s)
Fig.1-40 Two phase modulation fc=15kHz
Fig.1-41 Two phase modulation fc=5kHz
In the case of two phase modulation control, since gate charging isn't performed and voltage drop depends on
steady consumption current for continuous OFF period, voltage drop rate becomes low. On the other hand, charging
isn't performed for continuous ON period in the positive current region which charging will be normally performed well
in. (Charging efficiency will go down.) But in this result, since total circuit current in the case of two phase modulation
control was smaller than one at three phase modulation, absolute and ripple voltage became little better.
Publication Date: October 2012
17
<Dual-In-Line Package Intelligent Power Module> Application Note
Bootstrap Circuit Design Manual
Revision Record
Rev.
Date
Page
-
10/15/2012
-
Points
New
Publication Date: October 2012
18
<Dual-In-Line Package Intelligent Power Module> Application Note
Bootstrap Circuit Design Manual
Keep safety first in your circuit designs!
Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more
reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors
may lead to personal injury, fire or property damage. Remember to give due consideration to safety when
making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary
circuits, (ii) use of non-flammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
•These materials are intended as a reference to assist our customers in the selection of the Mitsubishi
semiconductor product best suited to the customer’s application; they do not convey any license under any
intellectual property rights, or any other rights, belonging to Mitsubishi Electric Corporation or a third party.
•Mitsubishi Electric Corporation assumes no responsibility for any damage, or infringement of any
third-party’s rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or
circuit application examples contained in these materials.
•All information contained in these materials, including product data, diagrams, charts, programs and
algorithms represents information on products at the time of publication of these materials, and are subject
to change by Mitsubishi Electric Corporation without notice due to product improvements or other reasons. It
is therefore recommended that customers contact Mitsubishi Electric Corporation or an authorized
Mitsubishi Semiconductor product distributor for the latest product information before purchasing a product
listed herein.
The information described here may contain technical inaccuracies or typographical errors. Mitsubishi
Electric Corporation assumes no responsibility for any damage, liability, or other loss rising from these
inaccuracies or errors.
Please also pay attention to information published by Mitsubishi Electric Corporation by various means,
including the Mitsubishi Semiconductor home page (http://www.MitsubishiElectric.com/).
•When using any or all of the information contained in these materials, including product data, diagrams,
charts, programs, and algorithms, please be sure to evaluate all information as a total system before making
a final decision on the applicability of the information and products. Mitsubishi Electric Corporation assumes
no responsibility for any damage, liability or other loss resulting from the information contained herein.
•Mitsubishi Electric Corporation semiconductors are not designed or manufactured for use in a device or
system that is used under circumstances in which human life is potentially at stake. Please contact
Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor when
considering the use of a product contained herein for any specific purposes, such as apparatus or systems
for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.
•The prior written approval of Mitsubishi Electric Corporation is necessary to reprint or reproduce in whole or
in part these materials.
•If these products or technologies are subject to the Japanese export control restrictions, they must be
exported under a license from the Japanese government and cannot be imported into a country other than
the approved destination.
Any diversion or re-export contrary to the export control laws and regulations of Japan and/or the country of
destination is prohibited.
•Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor
for further details on these materials or the products contained therein.
© 2012 MITSUBISHI ELECTRIC CORPORATION. ALL RIGHTS RESERVED.
DIPIPM and CSTBT are registered trademarks of MITSUBISHI ELECTRIC CORPORATION.
Publication Date: October 2012
19