AMD Family 10h Desktop Processor Power and Thermal Data Sheet

AMD Family 10h
Desktop Processor
Power and Thermal Data Sheet
Publication # 43375
Revision: 3.46
Issue Date: September 2010
Advanced Micro Devices
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PID: 43375 Rev 3.46 - September 2010
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
Table of Contents
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
1
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
1.1 Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
1.1.1 Ordering Part Number Description Section Overview . . . . . . . . . . . . . . . . . . 8
1.1.2 Thermal and Power Table Guide Overview . . . . . . . . . . . . . . . . . . . . . . . . . . 8
1.1.3 Thermal and Power Table Section Overview . . . . . . . . . . . . . . . . . . . . . . . . . 9
1.1.4 Power Supply Specification Chapter Overview . . . . . . . . . . . . . . . . . . . . . . . 9
1.2 Conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
1.3 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2
AMD Phenom™ Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.1 AMD Phenom™ Processor Ordering Part Number Description . . . . . . . . . . . . . . . . 12
2.2 AMD Phenom Processor Thermal and Power Table Guide . . . . . . . . . . . . . . . . . . . 24
2.3 AMD Phenom Processor Thermal and Power Specifications . . . . . . . . . . . . . . . . . . 25
2.3.1 HD mmmm OB pnc GD (65 W, DT, AM2r2) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
2.3.2 HD mmmm WC pnc GD (95 W, DT, AM2r2) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
2.3.3 HD mmmm XA pnc GD (125 W, DT, AM2r2) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
2.3.4 HD mmmm WC pnc GH (95 W, DT, AM2r2) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
2.3.5 HD mmmm XA pnc GH (125 W, DT, AM2r2) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
2.3.6 HD mmmm FA pnc GH (140 W, DT, AM2r2) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
2.3.7 HD mmmm OD pnc GH (65 W, DT, AM2r2) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
2.3.8 HD mmmm WC pnc HH (95 W, DT, AM2r2) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
2.3.9 HD mmmm WC pnc HI (95 W, DT, AM2r2) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
2.3.10 HD mmmm XC pnc GI (125 W, DT, AM2r2) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
2.3.11 HD mmmm WF pnc GI (95 W, DT, AM3) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
2.3.12 HD mmmm OC pnc GI (65 W, DT, AM3) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
2.3.13 HD mmmm WF pnc GM (95 W, DT, AM3) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
2.3.14 HD mmmm FB pnc GM (125 W, 140 W, DT, AM3) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
2.3.15 HD mmmm WF pnc GR (95 W, DT, AM3) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
2.3.16 HD mmmm FB pnc GR (125 W, DT, AM3) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Contents
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AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
3
AMD Athlon™ Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
3.1 AMD Athlon™ Processor Ordering Part Number Description . . . . . . . . . . . . . . . . . 62
3.2 AMD Athlon Processor Thermal and Power Table Guide . . . . . . . . . . . . . . . . . . . . 68
3.3 AMD Athlon Processor Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . 69
3.3.1 AD mmmm OC pnc GQ (65 W, DT, AM3) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
3.3.2 AD mmmm WF pnc GM (95 W, DT, AM3) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
3.3.3 AD mmmm OC pnc GM (65 W, DT, AM3) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
3.3.4 AD mmmm HD pnc GM (45 W, DT, AM3) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
3.3.5 AD mmmm SC pnc GM (25 W, DT, AM3) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
4
AMD Sempron™ Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
4.1 AMD Sempron™ Processor Ordering Part Number Description . . . . . . . . . . . . . . . 82
4.2 AMD Sempron Processor Thermal and Power Table Guide . . . . . . . . . . . . . . . . . . . 85
4.3 AMD Sempron Processor Thermal and Power Specifications . . . . . . . . . . . . . . . . . 86
4.3.1 SD mmmm HB pnc GM (45 W, DT, AM3) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
5
Power Supply Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
5.1 bsmmmmrr J ncdd – AM2r2 Power Supply Operating Conditions . . . . . . . . . . . . . . 89
5.2 bsmmmmrr K ncdd – AM3 Power Supply Operating Conditions . . . . . . . . . . . . . . . 92
6
MTOPS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
7
APP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
Contents
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AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
List of Figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
AMD Phenom™ Processor Ordering Part Number Diagram . . . . . . . . . . . . . . 12
AMD Phenom Processor Ordering Part Number Example . . . . . . . . . . . . . . . 12
AMD Athlon™ Processor Ordering Part Number Diagram . . . . . . . . . . . . . . . 62
AMD Athlon Processor Ordering Part Number Example . . . . . . . . . . . . . . . . 62
AMD Sempron™ Processor Ordering Part Number Diagram . . . . . . . . . . . . . 82
AMD Sempron Processor Ordering Part Number Example . . . . . . . . . . . . . . . 82
Socket AM2 AC and DC Transient Limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
Socket AM3 AC and DC Transient Limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
List of Figures
5
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AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
List of Tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Table 20.
Table 21.
Table 22.
Table 23.
Table 24.
Table 25.
Table 26.
Table 27.
Table 28.
Table 29.
Table 30.
Table 31.
Table 32.
Table 33.
Table 34.
AMD Phenom™ Processor Part Definition Options . . . . . . . . . . . . . . . . . . . . 13
AMD Phenom Processor Cache Size Options . . . . . . . . . . . . . . . . . . . . . . . . . 13
AMD Phenom Processor Number of Cores . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
AMD Phenom Processor Package Options . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
AMD Phenom Processor Roadmap Options . . . . . . . . . . . . . . . . . . . . . . . . . . 14
AMD Phenom Processor Model Number Options . . . . . . . . . . . . . . . . . . . . . . 15
AMD Phenom Processor Thermal Profiles
. . . . . . . . . . . . . . . . . . . . . . . . . 17
AMD Phenom Processor Thermal and Power Table Guide . . . . . . . . . . . . . . . 24
AMD Athlon™ Processor Part Definition Options . . . . . . . . . . . . . . . . . . . . . 63
AMD Athlon Processor Cache Size Options . . . . . . . . . . . . . . . . . . . . . . . . . . 63
AMD Athlon Processor Number of Cores . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
AMD Athlon Processor Package Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
AMD Athlon Processor Roadmap Options . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
AMD Athlon Processor Model Number Options . . . . . . . . . . . . . . . . . . . . . . . 64
AMD Athlon Processor Thermal Profiles . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
AMD Athlon Processor Thermal and Power Table Guide . . . . . . . . . . . . . . . . 68
AMD Sempron™ Processor Part Definition Options . . . . . . . . . . . . . . . . . . . . 83
AMD Sempron Processor Cache Size Options . . . . . . . . . . . . . . . . . . . . . . . . . 83
AMD Sempron Processor Number of Cores . . . . . . . . . . . . . . . . . . . . . . . . . . 83
AMD Sempron Processor Package Options . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
AMD Sempron Processor Roadmap Options . . . . . . . . . . . . . . . . . . . . . . . . . . 83
AMD Sempron Processor Model Number Options . . . . . . . . . . . . . . . . . . . . . 83
AMD Sempron Processor Thermal Profiles . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
AMD Sempron Processor Thermal and Power Table Guide . . . . . . . . . . . . . . 85
bsmmmmrr J ncdd DC Operating Conditions for VDD Power Supply . . . . . 89
bsmmmmrr J ncdd AC Operating Conditions for VDD Power Supply . . . . . 89
bsmmmmrr J ncdd Maximum Power-Up and Power-Down Conditions
for Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
bsmmmmrr J ncdd AC and DC Operating Conditions for non-VDD
Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
bsmmmmrr K ncdd DC Operating Conditions for VDD Power Supply . . . . . 92
bsmmmmrr K ncdd AC Operating Conditions for VDD Power Supply . . . . . 92
bsmmmmrr K ncdd Maximum Power-Up and Power-Down Conditions
for Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
bsmmmmrr K ncdd AC and DC Operating Conditions for non-VDD
Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
Composite Theoretical Performance (CTP) Calculation . . . . . . . . . . . . . . . . . 95
Adjusted Peak Performance (APP) Calculation . . . . . . . . . . . . . . . . . . . . . . . 96
List of Tables
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PID: 43375 Rev 3.46 - September 2010
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
Revision History
Date
Revision
Description
September 2010
3.46
Seventh public release.
• Added OPNs to the AMD Phenom™ Processor, AMD Athlon™ Processor,
and AMD Sempron™ Processor sections.
• Added Thermal Profile W on page 66.
• Updated thermal and power specifications for ADX445WFK32GM on
page 72.
• Updated Table 33 on page 95 (CTP) and Table 34 on page 96 (APP).
April 2010
3.40
Sixth public release.
• Added OPNs to the AMD Phenom™ Processor section and to the
AMD Athlon™ Processor section.
• Added the AMD Sempron™ Processor section.
September 2009
3.33
Fifth public release.
• Updated note to Table 28 on page 91 and Table 32 on page 94 in the Power
Supply Specifications section.
June 2009
3.28
Fourth public release.
• Added new OPNs to the AMD Phenom™ processor section.
• Added the AMD Athlon™ processor section.
• Added Section 5.2, AM3 Power Supply Operating Conditions.
• Updated Table 34 on page 96 (APP).
January 2009
3.18
Third public release.
• Added new 95-W, AM3 OPNs to the AMD Phenom™ Processor section.
January 2009
3.14
Second public release.
• Added new OPNs to the AMD Phenom™ Processor section.
• Added Table 27 on page 90.
October 2008
3.00
Initial public release.
Revision History
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PID: 43375 Rev 3.46 - September 2010
1
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
Overview
This document contains processor thermal specifications and power specifications. The specifications
in this document supersede those found in the power roadmaps. For all other electrical specifications,
refer to the appropriate product data sheet and the AMD Family 10h Processor Electrical Data Sheet,
order# 40014.
1.1 Organization
This document is organized into the following sections:
• Document overview (Section 1)
• One section for each brand represented in the desktop segment, containing the following
subsections:
• Ordering Part Number (OPN) description (content overview in Section 1.1.1)
• Thermal and power specification tables (content overview in Section 1.1.3 on page 9)
• Power supply specifications (content overview in Section 1.1.4 on page 9)
• MTOPS section in Table 33 on page 95
• APP section in Table 34 on page 96
1.1.1
Ordering Part Number Description Section Overview
The Ordering Part Number (OPN) Description section contains a depiction and description of a valid
OPN for the brand contained in that chapter. Each character or group of characters within an OPN has
a specific meaning (for example, model number, socket compatibility). The meaning of each OPN
character is detailed in the OPN description section. Each OPN identifies a processor with a unique
thermal and power specification table entry.
The OPN description section also contains a full description of the Subsection Ordering Part Number
(SOPN) abstraction characters for the brand contained in that chapter. SOPNs are used to group and
organize OPNs into subsections for the thermal and power tables and power supply specifications. A
definition of SOPNs is contained in Section 1.3 on page 10.
1.1.2
Thermal and Power Table Guide Overview
The thermal and power table guide section contains a table mapping SOPNs and the properties
associated with their defined characters to the proper thermal and power table subsections and page
numbers. This table is designed to be used as a quick reference for finding the appropriate subsection
for the thermal and power tables corresponding to an SOPN.
Overview
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1.1.3
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
Thermal and Power Table Section Overview
The thermal and power specification tables contain the thermal and power requirements for each
OPN. This includes the information necessary for thermal management (for example, heat sink
requirements, ambient temperature assumptions) and power delivery (for example, voltage and
current, and power dissipation for each P-state).
The thermal and power specification tables are organized into subsections that correspond to
Subsection Ordering Part Numbers (SOPNs). SOPNs for the thermal and power tables have the
brand, power limit, and part definition characters defined. They are of the form AB mmmmrrpnc GH.
Each chapter provides a guide table that maps the SOPNs in the thermal and power tables within that
chapter to the appropriate subsection number and page number. Within each subsection the OPNs are
sorted by model number, socket compatibility, voltage, temperature, and cache size, respectively.
1.1.4
Power Supply Specification Chapter Overview
The power supply specification chapter contains the operating conditions and requirements for all
voltage planes required by the processor. Power supply requirements are organized into subsections
that correspond to socket infrastructure. The socket infrastructure of a particular OPN can be found in
Table 5 on page 14.
1.2 Conventions
Following are conventions used with numbers.
• Binary numbers. Binary numbers are indicated by appending a “b” at the end, for example: 0110b.
• Decimal numbers. Unless specified otherwise, all numbers are decimal.
• Hexadecimal numbers. Hexadecimal numbers are indicated by appending an “h” to the end, for
example: 45F8h.
• Underscores in numbers. Underscores are used to break up numbers to make them more readable,
for example: 0110_1100b. They do not imply any operation.
Overview
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AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
1.3 Definitions
Following are some key definitions.
• CPU COF. CPU Current Operating Frequency.
• CTP. Composite Theoretical Performance.
• Dual-plane. Platforms in which the VDD and VDDNB (Northbridge) planes are isolated on the
platform and controlled as separate voltages.
• DP. Dual Processor. Each link on DP models supports connections to I/O devices, and any one link
or any sub-link can connect to another MP or DP processor.
• MP. Multiprocessor. Each link on MP models supports connections to I/O devices or an MP or DP
processor. Systems are limited to the number of nodes supported by all the processors. Refer to the
BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 10h Processors, order# 31116, for
more details.
• MTOPS. Millions Of Theoretical Operations Per Second.
• NB COF. Northbridge Current Operating Frequency.
• OPN. Ordering Part Number. An OPN uniquely identifies a processor and its associated
specifications in the thermal and power tables and power supply specifications section.
• P-state. Processor Performance State. P-states are valid combinations of CPU voltage, CPU COF,
Northbridge voltage, and NB COF.
• Single-plane. Platforms in which all the VDD and VDDNB power planes are connected together
on the platform and controlled as a single power plane.
• SOPN. Subsection Ordering Part Number. An SOPN is an OPN with a subset of defined characters.
All defined characters in an SOPN are bolded and capitalized. All abstracted characters in an SOPN
are in non-bolded lowercase. Information for any OPN that matches all of the defined characters in
an SOPN is contained in that subsection. For example, OPN AB12344CDE5FGH appears under the
subsection for SOPN AB mmmmmrrpnc GH. The abstracted (lowercase) character definitions for
SOPNs are contained in the OPN description section of each chapter.
• State. Indicates the ACPI defined sleep state, power state, and performance state for the related
specifications. 'x' indicates the related specifications are independent of the associated ACPI state.
For example, S0.C0.P0 indicates sleep state 0, power state 0, and performance state 0. S3.Cx.Px
indicates sleep state 3 entered from any power and performance state combination.
• TDP. Thermal Design Power. The thermal design power is the maximum power a processor can
draw for a thermally significant period while running commercially useful software. The
constraining conditions for TDP are specified in the notes in the thermal and power tables.
• UP. Uniprocessor. Each link on UP models supports connections to I/O devices.
Overview
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AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
• VID_VDD. The VID_VDD voltage is the VID-requested VDD supply level. Refer to the BIOS and
Kernel Developer’s Guide (BKDG) for AMD Family 10h Processors, order# 31116, for VID to
voltage translation specifications.
• VID_VDDNB. The VID_VDDNB voltage is the VID-requested VDD Northbridge supply level.
Refer to the BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 10h Processors,
order# 31116, for VID to voltage translation specifications.
Overview
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2
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
AMD Phenom™ Processor
The following sections contain the OPN description and thermal and power specifications for the
AMD Phenom™ processor. Each column in the thermal and power tables represents a specific
Ordering Part Number (OPN). Section 2.1 provides an example of the OPN structure for this
processor family.
2.1 AMD Phenom™ Processor Ordering Part Number Description
b s mmmm rr p n c dd
Part Definition
Cache Size
Number of Cores
Package
Roadmap
Model
Segment
Brand
Figure 1.
AMD Phenom™ Processor Ordering Part Number Diagram
H D 9100 OB J 4 B GD
Part Definition: GD (see Table 1)
Cache Size: B (see Table 2)
Number of Cores: 4 (see Table 3)
Package: J (see Table 4)
Roadmap: OB (see Table 5)
Model Number: 9100 (see Table 6)
Segment: D = Desktop
Brand: H = AMD Phenom™ Processor
Figure 2.
AMD Phenom™ Processor Ordering Part Number Example
AMD Phenom™ Processor
12
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AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
Table 1. AMD Phenom™ Processor Part Definition Options
Part
Definition
Revision
CPUID 8000_0001h EAX [31:0]
(CPUID)
GD
Rev B2
00100F22h
GH
Rev B3
00100F23h
HH
Rev B2
00100F22h
HI
Rev B3
00100F23h
GI
Rev C2
00100F42h
GM
Rev C3
00100F43h
GR
Rev E0
00100FA0h
Table 2. AMD Phenom™ Processor Cache Size Options
OPN
Character
L2 Cache Size
L3 Cache Size
B
512 KB
2048 KB
F
512 KB
4096 KB
D
512 KB
6144 KB
Table 3. AMD Phenom™ Processor Number of Cores
OPN
Character
Number of
Cores
2
2
3
3
4
4
6
6
Table 4. AMD Phenom™ Processor Package Options
OPN
Character
Package
J
AM2r2
K
AM3
AMD Phenom™ Processor
13
PID: 43375 Rev 3.46 - September 2010
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
Table 5. AMD Phenom™ Processor Roadmap Options
OPN
Character
Max TDP
Socket
IDD Max
Infrastructure (VDD)
IDD Max
HS Class
(NB)
OB
65 W
AM2r2
60 A
20 A
HS 65
WC
95 W
AM2r2
80 A
20 A
HS 65
WF
95 W
AM3
80 A
20 A
HS 65
XA
125 W
AM2r2
95 A
20 A
HS 78
FA
140 W
AM2r2
110 A
20 A
HS 78
FB
125 W, 140 W
AM3
110 A
20 A
HS 78
OD
65 W
AM2r2
60 A
20 A
HS 55
XC
125 W, Dual-Plane
AM2r2
95 A
20 A
HS 78
OC
65 W
AM3
60 A
20 A
HS 55
AMD Phenom™ Processor
14
PID: 43375 Rev 3.46 - September 2010
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
Table 6. AMD Phenom™ Processor Model Number Options
Model
Number
Core
Single-Plane
Frequency NB Frequency
Dual-Plane NB Number
Frequency
of Cores
Max DDR
Speed
Max HT Link
Speed
9100
1800 MHz
1600 MHz
1600 MHz
4
800 MT/s
3200 MT/s
9150
1800 MHz
1600 MHz
1600 MHz
4
800 MT/s
3200 MT/s
9350
2000 MHz
1800 MHz
1800 MHz
4
800 MT/s
3600 MT/s
8250
1900 MHz
1800 MHz
1800 MHz
3
800 MT/s
3600 MT/s
8400
2100 MHz
1800 MHz
1800 MHz
3
800 MT/s
3600 MT/s
8450
2100 MHz
1800 MHz
1800 MHz
3
800 MT/s
3600 MT/s
9450
2100 MHz
1800 MHz
1800 MHz
4
800 MT/s
3600 MT/s
9500
2200 MHz
1800 MHz
1800 MHz
4
800 MT/s
3600 MT/s
9550
2200 MHz
1800 MHz
1800 MHz
4
800 MT/s
3600 MT/s
8550
2200 MHz
1800 MHz
1800 MHz
3
800 MT/s
3600 MT/s
8600
2300 MHz
1800 MHz
1800 MHz
3
800 MT/s
3600 MT/s
860B
2300 MHz
1800 MHz
1800 MHz
3
800 MT/s
3600 MT/s
9600
2300 MHz
1800 MHz
1800 MHz
4
800 MT/s
3600 MT/s
960B
2300 MHz
1800 MHz
1800 MHz
4
800 MT/s
3600 MT/s
960Z
2300 MHz
1800 MHz
1800 MHz
4
800 MT/s
3600 MT/s
9650
2300 MHz
1800 MHz
1800 MHz
4
800 MT/s
3600 MT/s
8650
2300 MHz
1800 MHz
1800 MHz
3
800 MT/s
3600 MT/s
8750
2400 MHz
1800 MHz
1800 MHz
3
800 MT/s
3600 MT/s
875B
2400 MHz
1800 MHz
1800 MHz
3
800 MT/s
3600 MT/s
875Z
2400 MHz
1800 MHz
1800 MHz
3
800 MT/s
3600 MT/s
9700
2400 MHz
2000 MHz
2000 MHz
4
800 MT/s
4000 MT/s
9750
2400 MHz
1800 MHz
1800 MHz
4
800 MT/s
3600 MT/s
975B
2400 MHz
1800 MHz
1800 MHz
4
800 MT/s
3600 MT/s
700E
2400 MHz
1600 MHz
2000 MHz
3
1333 MT/s
4000 MT/s
900E
2400 MHz
1600 MHz
2000 MHz
4
1333 MT/s
4000 MT/s
8850
2500 MHz
1800 MHz
1800 MHz
3
800 MT/s
3600 MT/s
9850
2500 MHz
1800 MHz
1800 MHz
4
800 MT/s
3600 MT/s
985B
2500 MHz
1800 MHz
1800 MHz
4
800 MT/s
3600 MT/s
985Z
2500 MHz
2000 MHz
2000 MHz
4
800 MT/s
4000 MT/s
X805
2500 MHz
1600 MHz
2000 MHz
4
1333 MT/s
4000 MT/s
705E
2500 MHz
1600 MHz
2000 MHz
3
1333 MT/s
4000 MT/s
905E
2500 MHz
1600 MHz
2000 MHz
4
1333 MT/s
4000 MT/s
AMD Phenom™ Processor
15
PID: 43375 Rev 3.46 - September 2010
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
Table 6. AMD Phenom™ Processor Model Number Options (Continued)
Model
Number
Core
Single-Plane
Frequency NB Frequency
Dual-Plane NB Number
Frequency
of Cores
Max DDR
Speed
Max HT Link
Speed
995Z
2600 MHz
2000 MHz
2000 MHz
4
800 MT/s
4000 MT/s
X810
2600 MHz
1600 MHz
2000 MHz
4
1333 MT/s
4000 MT/s
X910
2600 MHz
1600 MHz
2000 MHz
4
1333 MT/s
4000 MT/s
X710
2600 MHz
1600 MHz
2000 MHz
3
1333 MT/s
4000 MT/s
T35T
2600 MHz
2000 MHz
2000 MHz
6
1333 MT/s
4000 MT/s
T45T
2700 MHz
2000 MHz
2000 MHz
6
1333 MT/s
4000 MT/s
X920
2800 MHz
1600 MHz
1800 MHz
4
1066 MT/s
3600 MT/s
Z720
2800 MHz
1600 MHz
2000 MHz
3
1333 MT/s
4000 MT/s
X925
2800 MHz
1600 MHz
2000 MHz
4
1333 MT/s
4000 MT/s
T55T
2800 MHz
2000 MHz
2000 MHz
6
1333 MT/s
4000 MT/s
Z940
3000 MHz
1600 MHz
1800 MHz
4
1066 MT/s
3600 MT/s
X545
3000 MHz
1600 MHz
2000 MHz
2
1333 MT/s
4000 MT/s
T75T
3000 MHz
2000 MHz
2000 MHz
6
1333 MT/s
4000 MT/s
Z550
3100 MHz
1600 MHz
2000 MHz
2
1333 MT/s
4000 MT/s
T90Z
3200 MHz
2000 MHz
2000 MHz
6
1333 MT/s
4000 MT/s
Z560
3300 MHz
1600 MHz
2000 MHz
2
1333 MT/s
4000 MT/s
Z970
3500 MHz
1600 MHz
2000 MHz
4
1333 MT/s
4000 MT/s
AMD Phenom™ Processor
16
PID: 43375 Rev 3.46 - September 2010
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
Table 7. AMD Phenom™ Processor Thermal Profiles
Thermal Profile
Heat S ink Thermal
Resistance
Heat S ink Local
Ambient
Profile Thermal
Resistance
Profile Ambient
TDP
0.0 W
5.0 W
10.0 W
15.0 W
20.0 W
25.0 W
30.0 W
35.0 W
40.0 W
45.0 W
50.0 W
55.0 W
60.0 W
65.0 W
70.0 W
75.0 W
80.0 W
85.0 W
90.0 W
95.0 W
A
0.29°C/W
42°C
0.232°C/W
48°C
Tcase Max
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
56.1°C
57.3°C
58.4°C
59.6°C
60.8°C
61.9°C
63.1°C
64.2°C
65.4°C
66.6°C
67.7°C
68.9°C
70.0°C
Thermal Profile
Heat S ink Thermal
Resistance
Heat S ink Local
Ambient
Profile Thermal
Resistance
Profile Ambient
TDP
0.0 W
5.0 W
10.0 W
15.0 W
20.0 W
25.0 W
30.0 W
35.0 W
40.0 W
45.0 W
50.0 W
55.0 W
60.0 W
65.0 W
70.0 W
75.0 W
80.0 W
85.0 W
90.0 W
95.0 W
100.0 W
105.0 W
110.0 W
115.0 W
120.0 W
125.0 W
B
0.18°C/W
38°C
0.136°C/W
44°C
Tcase Max
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.6°C
56.2°C
56.9°C
57.6°C
58.3°C
59.0°C
59.6°C
60.3°C
61.0°C
Note: The thermal profile is used to define the relationship between Tcase max and device-specific Thermal
Design Power. The heat sink thermal resistance and heat sink local ambient values specify heat sink design
targets. The profile thermal resistance and profile ambient values specify the relationship between part-specific
power and part-specific Tcase Max. If the heat sink design targets are met, the thermal profile specifications
are met.
AMD Phenom™ Processor
17
PID: 43375 Rev 3.46 - September 2010
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
Table 7. AMD Phenom™ Processor Thermal Profiles (Continued)
Thermal Profile
Heat S ink Class
Heat S ink Thermal
Resistance
Heat S ink Local
Ambient
Profile Thermal
Resistance
Profile Ambient
TDP
0.0 W
5.0 W
10.0 W
15.0 W
20.0 W
25.0 W
30.0 W
35.0 W
40.0 W
45.0 W
50.0 W
55.0 W
60.0 W
65.0 W
70.0 W
75.0 W
80.0 W
85.0 W
90.0 W
95.0 W
C
HS65
0.30°C/W
42°C
0.242°C/W
48°C
Tcase Max
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.3°C
56.5°C
57.7°C
58.9°C
60.1°C
61.3°C
62.5°C
63.7°C
64.9°C
66.2°C
67.4°C
68.6°C
69.8°C
71.0°C
Thermal Profile
Heat S ink Thermal
Resistance
Heat S ink Local
Ambient
Profile Thermal
Resistance
Profile Ambient
TDP
0.0 W
5.0 W
10.0 W
15.0 W
20.0 W
25.0 W
30.0 W
35.0 W
40.0 W
45.0 W
50.0 W
55.0 W
60.0 W
65.0 W
D
0.29°C/W
42°C
0.200°C/W
48°C
Tcase Max
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
56.0°C
57.0°C
58.0°C
59.0°C
60.0°C
61.0°C
Note: The thermal profile is used to define the relationship between Tcase max and device-specific Thermal
Design Power. The heat sink thermal resistance and heat sink local ambient values specify heat sink design
targets. The profile thermal resistance and profile ambient values specify the relationship between part-specific
power and part-specific Tcase Max. If the heat sink design targets are met, the thermal profile specifications
are met.
AMD Phenom™ Processor
18
PID: 43375 Rev 3.46 - September 2010
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
Table 7. AMD Phenom™ Processor Thermal Profiles (Continued)
Thermal Profile
Heat S ink Thermal
Resistance
Heat S ink Local
Ambient
Profile Thermal
Resistance
Profile Ambient
TDP
0.0 W
5.0 W
10.0 W
15.0 W
20.0 W
25.0 W
30.0 W
35.0 W
40.0 W
45.0 W
50.0 W
55.0 W
60.0 W
65.0 W
70.0 W
75.0 W
80.0 W
85.0 W
90.0 W
95.0 W
100.0 W
105.0 W
110.0 W
115.0 W
120.0 W
125.0 W
130.0 W
135.0 W
140.0 W
E
0.18°C/W
38°C
0.143°C/W
44°C
Tcase Max
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.4°C
56.2°C
56.9°C
57.6°C
58.3°C
59.0°C
59.7°C
60.4°C
61.2°C
61.9°C
62.6°C
63.3°C
64.0°C
Thermal Profile
Heat S ink Thermal
Resistance
Heat S ink Local
Ambient
Profile Thermal
Resistance
Profile Ambient
TDP
0.0 W
5.0 W
10.0 W
15.0 W
20.0 W
25.0 W
30.0 W
35.0 W
40.0 W
45.0 W
50.0 W
55.0 W
60.0 W
65.0 W
F
0.42°C/W
42°C
0.338°C/W
48°C
Tcase Max
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
56.5°C
58.1°C
59.8°C
61.5°C
63.2°C
64.9°C
66.6°C
68.3°C
70.0°C
Note: The thermal profile is used to define the relationship between Tcase max and device-specific Thermal
Design Power. The heat sink thermal resistance and heat sink local ambient values specify heat sink design
targets. The profile thermal resistance and profile ambient values specify the relationship between part-specific
power and part-specific Tcase Max. If the heat sink design targets are met, the thermal profile specifications
are met.
AMD Phenom™ Processor
19
PID: 43375 Rev 3.46 - September 2010
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
Table 7. AMD Phenom™ Processor Thermal Profiles (Continued)
Thermal Profile
Heat S ink Class
Heat S ink Thermal
Resistance
Heat S ink Local
Ambient
Profile Thermal
Resistance
Profile Ambient
TDP
0.0 W
5.0 W
10.0 W
15.0 W
20.0 W
25.0 W
30.0 W
35.0 W
40.0 W
45.0 W
50.0 W
55.0 W
60.0 W
65.0 W
G
HS65
0.44°C/W
42°C
0.354°C/W
48°C
Tcase Max
55.0°C
55.0°C
55.0°C
55.0°C
55.1°C
56.9°C
58.6°C
60.4°C
62.2°C
63.9°C
65.7°C
67.5°C
69.2°C
71.0°C
Thermal Profile
Heat S ink Class
Heat S ink Thermal
Resistance
Heat S ink Local
Ambient
Profile Thermal
Resistance
Profile Ambient
TDP
0.0 W
5.0 W
10.0 W
15.0 W
20.0 W
25.0 W
30.0 W
35.0 W
40.0 W
45.0 W
50.0 W
55.0 W
60.0 W
65.0 W
70.0 W
75.0 W
80.0 W
85.0 W
90.0 W
95.0 W
H
HS65
0.32°C/W
42°C
0.263°C/W
48°C
Tcase Max
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.9°C
57.2°C
58.5°C
59.8°C
61.2°C
62.5°C
63.8°C
65.1°C
66.4°C
67.7°C
69.0°C
70.4°C
71.7°C
73.0°C
Note: The thermal profile is used to define the relationship between Tcase max and device-specific Thermal
Design Power. The heat sink thermal resistance and heat sink local ambient values specify heat sink design
targets. The profile thermal resistance and profile ambient values specify the relationship between part-specific
power and part-specific Tcase Max. If the heat sink design targets are met, the thermal profile specifications
are met.
AMD Phenom™ Processor
20
PID: 43375 Rev 3.46 - September 2010
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
Table 7. AMD Phenom™ Processor Thermal Profiles (Continued)
Thermal Profile
Heat S ink Thermal
Resistance
Heat S ink Local
Ambient
Profile Thermal
Resistance
Profile Ambient
TDP
0.0 W
5.0 W
10.0 W
15.0 W
20.0 W
25.0 W
30.0 W
35.0 W
40.0 W
45.0 W
50.0 W
55.0 W
60.0 W
65.0 W
70.0 W
75.0 W
80.0 W
85.0 W
90.0 W
95.0 W
100.0 W
105.0 W
110.0 W
115.0 W
120.0 W
125.0 W
I
0.19°C/W
38°C
0.144°C/W
44°C
Tcase Max
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.5°C
56.2°C
57.0°C
57.7°C
58.4°C
59.1°C
59.8°C
60.6°C
61.3°C
62.0°C
Thermal Profile
Heat S ink Class
Heat S ink Thermal
Resistance
Heat S ink Local
Ambient
Profile Thermal
Resistance
Profile Ambient
TDP
0.0 W
5.0 W
10.0 W
15.0 W
20.0 W
25.0 W
30.0 W
35.0 W
40.0 W
45.0 W
50.0 W
55.0 W
60.0 W
65.0 W
J
HS55
0.43°C/W
42°C
0.338°C/W
48°C
Tcase Max
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
56.5°C
58.1°C
59.8°C
61.5°C
63.2°C
64.9°C
66.6°C
68.3°C
70.0°C
Note: The thermal profile is used to define the relationship between Tcase max and device-specific Thermal
Design Power. The heat sink thermal resistance and heat sink local ambient values specify heat sink design
targets. The profile thermal resistance and profile ambient values specify the relationship between part-specific
power and part-specific Tcase Max. If the heat sink design targets are met, the thermal profile specifications
are met.
AMD Phenom™ Processor
21
PID: 43375 Rev 3.46 - September 2010
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
Table 7. AMD Phenom™ Processor Thermal Profiles (Continued)
Thermal Profile
Heat S ink Class
Heat S ink Thermal
Resistance
Heat S ink Local
Ambient
Profile Thermal
Resistance
Profile Ambient
TDP
0.0 W
5.0 W
10.0 W
15.0 W
20.0 W
25.0 W
30.0 W
35.0 W
40.0 W
45.0 W
50.0 W
55.0 W
60.0 W
65.0 W
K
HS55
0.45°C/W
42°C
0.369°C/W
48°C
Tcase Max
55.0°C
55.0°C
55.0°C
55.0°C
55.4°C
57.2°C
59.1°C
60.9°C
62.8°C
64.6°C
66.5°C
68.3°C
70.1°C
72.0°C
Thermal Profile
Heat S ink Class
Heat S ink Thermal
Resistance
Heat S ink Local
Ambient
Profile Thermal
Resistance
Profile Ambient
TDP
0.0 W
5.0 W
10.0 W
15.0 W
20.0 W
25.0 W
30.0 W
35.0 W
40.0 W
45.0 W
50.0 W
55.0 W
60.0 W
65.0 W
70.0 W
75.0 W
80.0 W
P
HS65
0.35°C/W
42°C
0.275°C/W
48°C
Tcase Max
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
56.3°C
57.6°C
59.0°C
60.4°C
61.8°C
63.1°C
64.5°C
65.9°C
67.3°C
68.6°C
70.0°C
Note: The thermal profile is used to define the relationship between Tcase max and device-specific Thermal
Design Power. The heat sink thermal resistance and heat sink local ambient values specify heat sink design
targets. The profile thermal resistance and profile ambient values specify the relationship between part-specific
power and part-specific Tcase Max. If the heat sink design targets are met, the thermal profile specifications
are met.
AMD Phenom™ Processor
22
PID: 43375 Rev 3.46 - September 2010
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
Table 7. AMD Phenom™ Processor Thermal Profiles (Continued)
Thermal Profile
Heat S ink Class
Heat S ink Thermal
Resistance
Heat S ink Local
Ambient
Profile Thermal
Resistance
Profile Ambient
TDP
0W
10 W
20 W
30 W
40 W
50 W
60 W
70 W
80 W
90 W
95 W
AD
HS 65
0.30°C/W
42.0°C
0.242°C/W
48.0°C
Tcase Max
55.0°C
55.0°C
55.0°C
55.3°C
57.7°C
60.1°C
62.5°C
64.9°C
67.4°C
69.8°C
71.0°C
Thermal Profile
Heat S ink Class
Heat S ink Thermal
Resistance
Heat S ink Local
Ambient
Profile Thermal
Resistance
Profile Ambient
TDP
0W
10 W
20 W
30 W
40 W
50 W
60 W
70 W
80 W
90 W
95 W
100 W
105 W
110 W
115 W
120 W
125 W
AE
HS 78
0.19°C/W
38.0°C
0.144°C/W
44.0°C
Tcase Max
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.5°C
57.0°C
57.7°C
58.4°C
59.1°C
59.8°C
60.6°C
61.3°C
62.0°C
Note: The thermal profile is used to define the relationship between Tcase max and device-specific Thermal
Design Power. The heat sink thermal resistance and heat sink local ambient values specify heat sink design
targets. The profile thermal resistance and profile ambient values specify the relationship between part-specific
power and part-specific Tcase Max. If the heat sink design targets are met, the thermal profile specifications
are met.
AMD Phenom™ Processor
23
PID: 43375 Rev 3.46 - September 2010
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
2.2 AMD Phenom™ Processor Thermal and Power Table Guide
The thermal and power table guide shown in Table 8 maps SOPNs and the properties associated with
their defined characters to the proper thermal and power table subsections and page numbers. This
table is designed to be used as a quick reference for finding the appropriate subsection for the thermal
and power tables corresponding to an SOPN.
Table 8. AMD Phenom™ Processor Thermal and Power Table Guide
SOPN
Power
Revision
Thermal/Power Tables
HD mmmm OB pnc GD
65 W
B2
Section 2.3.1 on page 26
HD mmmm WC pnc GD
95 W
B2
Section 2.3.2 on page 27
HD mmmm XA pnc GD
125 W
B2
Section 2.3.3 on page 30
HD mmmm WC pnc GH
95 W
B3
Section 2.3.4 on page 31
HD mmmm XA pnc GH
125 W
B3
Section 2.3.5 on page 39
HD mmmm FA pnc GH
140 W
B3
Section 2.3.6 on page 41
HD mmmm OD pnc GH
65 W
B3
Section 2.3.7 on page 42
HD mmmm WC pnc HH
95 W
B2
Section 2.3.8 on page 45
HD mmmm WC pnc HI
95 W
B3
Section 2.3.9 on page 46
HD mmmm XC pnc GI
125 W
C2
Section 2.3.10 on page 47
HD mmmm WF pnc GI
95 W
C2
Section 2.3.11 on page 48
HD mmmm OC pnc GI
65 W
C2
Section 2.3.12 on page 52
HD mmmm WF pnc GM
95 W
C3
Section 2.3.13 on page 54
HD mmmm FB pnc GM
125 W, 140 W
C3
Section 2.3.14 on page 55
HD mmmm WF pnc GR
95 W
E0
Section 2.3.15 on page 56
HD mmmm FB pnc GR
125 W
E0
Section 2.3.16 on page 58
AMD Phenom™ Processor
24
PID: 43375 Rev 3.46 - September 2010
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
2.3 AMD Phenom™ Processor Thermal and Power Specifications
The thermal and power specification tables contain the thermal and power requirements for each
OPN. This includes the information necessary for thermal management (for example, heat sink
requirements, temperature assumptions) and power delivery (for example, voltage, current, and
power dissipation for each P-state). Refer to the AMD Family 10h Processor Electrical Data Sheet,
order# 40014, for all other electrical specifications for the processor. Refer to the BIOS and Kernel
Developer’s Guide (BKDG) for AMD Family 10h Processors, order# 31116, for power management
BIOS requirements.
Section 2.1 on page 12 provides an example of the OPN structure for processors documented in this
chapter and Table 8 on page 24 provides a guide to OPN organization in the following subsections.
Refer to Section 1.2 on page 9 and Section 1.3 on page 10 for numbering conventions and
terminology definitions used in these tables.
AMD Phenom™ Processor
25
PID: 43375 Rev 3.46 - September 2010
2.3.1
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
HD mmmm OB pnc GD (65 W, DT, AM2r2) Thermal and Power Specifications
OPN
Specification8
State
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
HD9100OBJ4BGD
Notes Single-Plane Dual-Plane
Tcase Max
1
55 oC to 61 oC
Tctl Max
2
70 oC
Tambient Min
5 oC
Thermal Profile
D
S0.C0.P1
Startup P-State
5
HTC P-State
4
NB COF
6,7
1600 MHz
1600 MHz
VID_VDDNB
11,7
N/A
1.150 V
IDDNB Max
12
N/A
9.6 A
S0.C0.P1
1800 MHz
CPU COF
6
TDP
3
65.0 W
65.0 W
VID_VDD Min
9
1.100 V
1.100 V
VID_VDD Max
9
1.150 V
1.150 V
IDD Max
3,10
53.8 A
44.9 A
CPU COF
6
TDP
3
46.3 W
39.3 W
VID_VDD Min
9
1.100 V
1.000 V
VID_VDD Max
9
1.150 V
1.000 V
IDD Max
3,10
38.0 A
23.7 A
3,10,14
14.6 A
3.5 A
S0.C1.Pmin IDD Max
900 MHz
S0
I/O Power
13
7.2 W
7.2 W
S3
I/O Power
13
350 mW
350 mW
The notes for this table are on page 60 and page 61.
AMD Phenom™ Processor
26
PID: 43375 Rev 3.46 - September 2010
2.3.2
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
HD mmmm WC pnc GD (95 W, DT, AM2r2) Thermal and Power Specifications
HD8600WCJ3BGD
HD860BWCJ3BGD
OPN
Specification8
State
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
Notes Single-Plane
Dual-Plane
o
o
HD8400WCJ3BGD
Single-Plane
Dual-Plane
o
Tcase Max
1
55 C to 71 C
55 C to 71 oC
Tctl Max
2
70 oC
70 oC
Tambient Min
o
5 C
5 oC
Thermal Profile
C
C
S0.C0.P1
S0.C0.P1
Startup P-State
5
HTC P-State
4
NB COF
6,7
1800 MHz
1800 MHz
1800 MHz
1800 MHz
VID_VDDNB
11,7
N/A
1.250 V
N/A
1.250 V
IDDNB Max
12
N/A
14.5 A
N/A
15.2 A
CPU COF
6
TDP
3
95.0 W
95.0 W
95.0 W
95.0 W
VID_VDD Min
9
1.200 V
1.200 V
1.200 V
1.200 V
VID_VDD Max
9
1.250 V
1.250 V
1.250 V
1.250 V
IDD Max
3,10
73.4 A
60.3 A
73.3 A
59.6 A
CPU COF
6
TDP
3
72.2 W
54.6 W
74.2 W
55.6 W
VID_VDD Min
9
1.200 V
1.050 V
1.200 V
1.050 V
VID_VDD Max
9
1.250 V
1.050 V
1.250 V
1.050 V
IDD Max
3,10
56.3 A
30.5 A
57.7 A
30.6 A
3,10,14
26.1 A
6.7 A
28.1 A
7.4 A
S0.C1.Pmin IDD Max
S0.C0.P1
S0.C0.P1
2300 MHz
1150 MHz
2100 MHz
1050 MHz
S0
I/O Power
13
7.2 W
7.2 W
7.2 W
7.2 W
S3
I/O Power
13
350 mW
350 mW
350 mW
350 mW
The notes for this table are on page 60 and page 61.
AMD Phenom™ Processor
27
PID: 43375 Rev 3.46 - September 2010
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
HD9600WCJ4BGD
HD960BWCJ4BGD
OPN
Specification8
State
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
Notes Single-Plane
Dual-Plane
o
o
HD9500WCJ4BGD
Single-Plane
Dual-Plane
o
Tcase Max
1
55 C to 70 C
55 C to 70 oC
Tctl Max
2
70 oC
70 oC
Tambient Min
5 oC
5 oC
Thermal Profile
A
A
Startup P-State
5
S0.C0.P1
S0.C0.P1
HTC P-State
4
S0.C0.P1
S0.C0.P1
NB COF
6,7
1800 MHz
1800 MHz
1800 MHz
1800 MHz
VID_VDDNB
11,7
N/A
1.250 V
N/A
1.250 V
IDDNB Max
12
N/A
12 A
N/A
15 A
CPU COF
6
2300 MHz
2200 MHz
TDP
3
95 W
95 W
95 W
95 W
VID_VDD Min
9
1.150 V
1.150 V
1.150 V
1.150 V
VID_VDD Max
9
1.250 V
1.250 V
1.250 V
1.250 V
IDD Max
3,10
75.2 A
65.6 A
75.6 A
65.3 A
CPU COF
6
TDP
3
66.3 W
56.7 W
67.2 W
66.1 W
VID_VDD Min
9
1.150 V
1.050 V
1.150 V
1.050 V
VID_VDD Max
9
1.250 V
1.050 V
1.250 V
1.050 V
IDD Max
3,10
53.7 A
35.5 A
56.4 A
40.8 A
3,10,14
37.6 A
17.3 A
44.4 A
24.1 A
S0.C1.Pmin IDD Max
1150 MHz
1100 MHz
S0
I/O Power
13
7.2 W
7.2 W
7.2 W
7.2 W
S3
I/O Power
13
350 mW
350 mW
350 mW
350 mW
The notes for this table are on page 60 and page 61.
AMD Phenom™ Processor
28
PID: 43375 Rev 3.46 - September 2010
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
OPN
Specification8
State
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
HD960ZWCJ4BGD
Notes Single-Plane Dual-Plane
Tcase Max
1
55 oC to 70 oC
Tctl Max
2
70 oC
Tambient Min
5 oC
Thermal Profile
A
Startup P-State
5
S0.C0.P1
HTC P-State
4
S0.C0.P1
NB COF
6,7
1800 MHz
1800 MHz
VID_VDDNB
11,7
N/A
1.250 V
IDDNB Max
12
N/A
12.0 A
CPU COF
6
2300 MHz
TDP
3
95.0 W
95.0 W
VID_VDD Min
9
1.150 V
1.150 V
VID_VDD Max
9
1.250 V
1.250 V
IDD Max
3,10
75.2 A
65.6 A
1150 MHz
CPU COF
6
TDP
3
66.3 W
56.7 W
VID_VDD Min
9
1.150 V
1.050 V
VID_VDD Max
9
1.250 V
1.050 V
IDD Max
S0.C1.Pmin IDD Max
3,10
53.7 A
35.5 A
3,10,14
37.6 A
17.3 A
S0
I/O Power
13
7.2 W
7.2 W
S3
I/O Power
13
350 mW
350 mW
The notes for this table are on page 60 and page 61.
AMD Phenom™ Processor
29
PID: 43375 Rev 3.46 - September 2010
2.3.3
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
HD mmmm XA pnc GD (125 W, DT, AM2r2) Thermal and Power Specifications
OPN
Specification8
State
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
HD9700XAJ4BGD
Notes Single-Plane Dual-Plane
Tcase Max
1
55 oC to 61 oC
Tctl Max
2
70 oC
Tambient Min
5 oC
Thermal Profile
B
S0.C0.P1
Startup P-State
5
HTC P-State
4
NB COF
6,7
2000 MHz
2000 MHz
VID_VDDNB
11,7
N/A
1.300 V
IDDNB Max
12
N/A
16.8 A
CPU COF
6
TDP
3
125.0 W
125.0 W
VID_VDD Min
9
1.200 V
1.200 V
VID_VDD Max
9
1.300 V
1.300 V
IDD Max
3,10
95.4 A
82.3 A
CPU COF
6
TDP
3
90.8 W
69.4 W
VID_VDD Min
9
1.200 V
1.050 V
VID_VDD Max
9
1.300 V
1.050 V
IDD Max
3,10
71.6 A
41.1 A
3,10,14
57.6 A
39.4 A
S0.C1.Pmin IDD Max
S0.C0.P1
2400 MHz
1200 MHz
S0
I/O Power
13
7.2 W
7.2 W
S3
I/O Power
13
350 mW
350 mW
The notes for this table are on page 60 and page 61.
AMD Phenom™ Processor
30
PID: 43375 Rev 3.46 - September 2010
2.3.4
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
HD mmmm WC pnc GH (95 W, DT, AM2r2) Thermal and Power Specifications
OPN
State
S0.C0.Px
Specification8
Notes Single-Plane
Dual-Plane
o
Single-Plane
Dual-Plane
1
55 C to 71 C
55 C to 71 oC
Tctl Max
2
70 oC
70 oC
o
5 C
5 oC
C
C
S0.C0.P1
S0.C0.P1
Tambient Min
Thermal Profile
5
o
HD8550WCJ3BGH
Tcase Max
Startup P-State
S0.Cx.Px
HD8450WCJ3BGH
o
S0.C0.P1
HTC P-State
4
NB COF
6,7
1800 MHz
1800 MHz
1800 MHz
1800 MHz
VID_VDDNB
11,7
N/A
1.250 V
N/A
1.250 V
IDDNB Max
12
N/A
15.2 A
N/A
14.9 A
2100 MHz
S0.C0.P1
2200 MHz
CPU COF
6
TDP
3
95.0 W
95.0 W
95.0 W
95.0 W
VID_VDD Min
9
1.200 V
1.200 V
1.200 V
1.200 V
VID_VDD Max
9
1.250 V
1.250 V
1.250 V
1.250 V
IDD Max
3,10
73.3 A
59.6 A
73.4 A
59.9 A
CPU COF
6
TDP
3
74.2 W
55.6 W
73.2 W
55.1 W
VID_VDD Min
9
1.200 V
1.050 V
1.200 V
1.050 V
VID_VDD Max
9
1.250 V
1.050 V
1.250 V
1.050 V
IDD Max
3,10
57.7 A
30.6 A
57.0 A
30.5 A
Core Power
15,18
15.5 W
7.8 W
14.7 W
7.4 W
S0.C1.Pmin NB Power
17
16.5 W
19.0 W
16.1 W
18.6 W
I/O Power
S0.C1E.Pmin TDP
S3
I/O Power
13
7.2 W
7.2 W
7.2 W
7.2 W
16
12.9 W
12.9 W
12.4 W
12.4 W
13
350 mW
350 mW
350 mW
350 mW
S0.C0.P0
S0.C0.P1
1050 MHz
1100 MHz
The notes for this table are on page 60 and page 61.
AMD Phenom™ Processor
31
PID: 43375 Rev 3.46 - September 2010
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
OPN
Specification8
State
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
HD8650WCJ3BGH
Notes Single-Plane
Dual-Plane
o
o
HD860BWCJ3BGH
Single-Plane
Dual-Plane
o
Tcase Max
1
55 C to 71 C
55 C to 71 oC
Tctl Max
2
70 oC
70 oC
Tambient Min
5 oC
5 oC
Thermal Profile
C
C
Startup P-State
5
S0.C0.P1
S0.C0.P1
HTC P-State
4
S0.C0.P1
S0.C0.P1
NB COF
6,7
1800 MHz
1800 MHz
1800 MHz
1800 MHz
VID_VDDNB
11,7
N/A
1.250 V
N/A
1.250 V
IDDNB Max
12
N/A
14.5 A
N/A
12.8 A
CPU COF
6
2300 MHz
2300 MHz
TDP
3
95.0 W
95.0 W
95.0 W
95.0 W
VID_VDD Min
9
1.200 V
1.200 V
1.250 V
1.250 V
VID_VDD Max
9
1.250 V
1.250 V
1.250 V
1.250 V
IDD Max
3,10
73.4 A
60.3 A
72.4 A
59.6 A
1150 MHz
1150 MHz
CPU COF
6
TDP
3
72.2 W
54.6 W
72.2 W
48.7 W
VID_VDD Min
9
1.200 V
1.050 V
1.250 V
1.050 V
VID_VDD Max
9
1.250 V
1.050 V
1.250 V
1.050 V
IDD Max
3,10
56.3 A
30.5 A
54.2 A
26.9 A
Core Power
15,18
13.8 W
7.0 W
12.0 W
5.0 W
S0.C1.Pmin NB Power
17
15.8 W
18.2 W
16.0 W
16.0 W
I/O Power
S0.C1E.Pmin TDP
S3
I/O Power
13
7.2 W
7.2 W
7.2 W
7.2 W
16
12.0 W
12.0 W
9.7 W
9.7 W
13
350 mW
350 mW
350 mW
350 mW
The notes for this table are on page 60 and page 61.
AMD Phenom™ Processor
32
PID: 43375 Rev 3.46 - September 2010
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
OPN
Specification8
State
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
HD8750WCJ3BGH
Notes Single-Plane
Dual-Plane
o
o
HD875BWCJ3BGH
Single-Plane
Dual-Plane
o
Tcase Max
1
55 C to 71 C
55 C to 71 oC
Tctl Max
2
70 oC
70 oC
Tambient Min
5 oC
5 oC
Thermal Profile
C
C
Startup P-State
5
S0.C0.P1
S0.C0.P1
HTC P-State
4
S0.C0.P1
S0.C0.P1
NB COF
6,7
1800 MHz
1800 MHz
1800 MHz
1800 MHz
VID_VDDNB
11,7
N/A
1.250 V
N/A
1.250 V
IDDNB Max
12
N/A
14.2 A
N/A
12.5 A
CPU COF
6
2400 MHz
2400 MHz
TDP
3
95.0 W
95.0 W
95.0 W
95.0 W
VID_VDD Min
9
1.200 V
1.200 V
1.250 V
1.250 V
VID_VDD Max
9
1.250 V
1.250 V
1.250 V
1.250 V
IDD Max
3,10
73.5 A
60.6 A
72.4 A
59.9 A
1200 MHz
1200 MHz
CPU COF
6
TDP
3
71.3 W
54.2 W
71.3 W
48.3 W
VID_VDD Min
9
1.200 V
1.050 V
1.250 V
1.050 V
VID_VDD Max
9
1.250 V
1.050 V
1.250 V
1.050 V
IDD Max
3,10
55.6 A
30.4 A
53.4 A
26.8 A
Core Power
15,18
13.1 W
6.6 W
11.1 W
4.6 W
S0.C1.Pmin NB Power
17
15.5 W
17.8 W
15.6 W
15.6 W
I/O Power
S0.C1E.Pmin TDP
S3
I/O Power
13
7.2 W
7.2 W
7.2 W
7.2 W
16
11.6 W
11.6 W
9.3 W
9.3 W
13
350 mW
350 mW
350 mW
350 mW
The notes for this table are on page 60 and page 61.
AMD Phenom™ Processor
33
PID: 43375 Rev 3.46 - September 2010
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
OPN
Specification8
State
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
HD875ZWCJ3BGH
Notes Single-Plane
Dual-Plane
o
o
HD8850WCJ3BGH
Single-Plane
Dual-Plane
o
Tcase Max
1
55 C to 71 C
55 C to 71 oC
Tctl Max
2
70 oC
70 oC
Tambient Min
5 oC
5 oC
Thermal Profile
C
C
Startup P-State
5
S0.C0.P1
S0.C0.P1
HTC P-State
4
S0.C0.P1
S0.C0.P1
NB COF
6,7
1800 MHz
1800 MHz
1800 MHz
1800 MHz
VID_VDDNB
11,7
N/A
1.250 V
N/A
1.250 V
IDDNB Max
12
N/A
14.2 A
N/A
13.9 A
CPU COF
6
2400 MHz
2500 MHz
TDP
3
95.0 W
95.0 W
95.0 W
95.0 W
VID_VDD Min
9
1.200 V
1.200 V
1.200 V
1.200 V
VID_VDD Max
9
1.250 V
1.250 V
1.250 V
1.250 V
IDD Max
3,10
73.5 A
60.6 A
73.6 A
61.0 A
1200 MHz
1250 MHz
CPU COF
6
TDP
3
71.3 W
54.2 W
70.4 W
53.7 W
VID_VDD Min
9
1.200 V
1.050 V
1.200 V
1.050 V
VID_VDD Max
9
1.250 V
1.050 V
1.250 V
1.050 V
IDD Max
3,10
55.6 A
30.4 A
54.9 A
30.3 A
Core Power
15,18
13.1 W
6.6 W
12.3 W
6.2 W
S0.C1.Pmin NB Power
17
15.5 W
17.8 W
15.1 W
17.4 W
I/O Power
S0.C1E.Pmin TDP
S3
I/O Power
13
7.2 W
7.2 W
7.2 W
7.2 W
16
11.6 W
11.6 W
11.1 W
11.1 W
13
350 mW
350 mW
350 mW
350 mW
The notes for this table are on page 60 and page 61.
AMD Phenom™ Processor
34
PID: 43375 Rev 3.46 - September 2010
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
OPN
Specification8
State
S0.C0.Px
S0.Cx.Px
HD9850WCJ4BGH
Notes Single-Plane
Dual-Plane
o
o
HD985BWCJ4BGH
Single-Plane
Dual-Plane
o
Tcase Max
1
55 C to 70 C
55 C to 70 oC
Tctl Max
2
70 oC
70 oC
Tambient Min
5 oC
5 oC
Thermal Profile
A
A
Startup P-State
5
S0.C0.P1
S0.C0.P1
HTC P-State
4
S0.C0.P1
S0.C0.P1
NB COF
6,7
1800 MHz
1800 MHz
1800 MHz
1800 MHz
VID_VDDNB Min
11,7
N/A
1.200 V
N/A
1.225 V
VID_VDDNB Max
11,7
N/A
1.250 V
N/A
1.250 V
IDDNB Max
12
N/A
11.1 A
N/A
10.1 A
CPU COF
6
TDP
3
95.0 W
95.0 W
95.0 W
95.0 W
VID_VDD Min
9
1.200 V
1.200 V
1.225 V
1.225 V
VID_VDD Max
9
1.250 V
1.250 V
1.250 V
1.250 V
IDD Max
3,10
74.1 A
63.8 A
73.9 A
63.8 A
CPU COF
6
TDP
3
63.6 W
49.6 W
63.6 W
46.6 W
VID_VDD Min
9
1.200 V
1.050 V
1.225 V
1.050 V
VID_VDD Max
9
1.250 V
1.050 V
1.250 V
1.050 V
IDD Max
3,10
49.3 A
29.7 A
48.3 A
28.3 A
Core Power
15,18
24.5 W
21.5 W
16.6 W
14.6 W
S0.C1.Pmin NB Power
17
12.5 W
16.3 W
12.3 W
12.3 W
I/O Power
S0.C1E.Pmin TDP
S3
I/O Power
13
7.2 W
7.2 W
7.2 W
7.2 W
16
10.0 W
10.0 W
12.3 W
12.3 W
13
350 mW
350 mW
350 mW
350 mW
S0.C0.P0
S0.C0.P1
2500 MHz
1250 MHz
2500 MHz
1250 MHz
The notes for this table are on page 60 and page 61.
AMD Phenom™ Processor
35
PID: 43375 Rev 3.46 - September 2010
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
OPN
Specification8
State
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
HD9750WCJ4BGH
Notes Single-Plane
Dual-Plane
o
o
HD975BWCJ4BGH
Single-Plane
Dual-Plane
o
Tcase Max
1
55 C to 70 C
55 C to 70 oC
Tctl Max
2
70 oC
70 oC
Tambient Min
5 oC
5 oC
Thermal Profile
A
A
Startup P-State
5
S0.C0.P1
S0.C0.P1
HTC P-State
4
S0.C0.P1
S0.C0.P1
NB COF
6,7
1800 MHz
1800 MHz
1800 MHz
1800 MHz
VID_VDDNB
11,7
N/A
1.250 V
N/A
1.250 V
IDDNB Max
12
N/A
13.5 A
N/A
11.6 A
CPU COF
6
2400 MHz
2400 MHz
TDP
3
95.0 W
95.0 W
95.0 W
95.0 W
VID_VDD Min
9
1.150 V
1.150 V
1.200 V
1.200 V
VID_VDD Max
9
1.250 V
1.250 V
1.250 V
1.250 V
IDD Max
3,10
75.2 A
64.0 A
74.0 A
63.4 A
1200 MHz
1200 MHz
CPU COF
6
TDP
3
65.3 W
56.9 W
64.7 W
50.3 W
VID_VDD Min
9
1.150 V
1.050 V
1.200 V
1.050 V
VID_VDD Max
9
1.250 V
1.050 V
1.250 V
1.050 V
IDD Max
3,10
52.8 A
33.8 A
50.2 A
29.8 A
Core Power
15,18
25.9 W
22.7 W
21.1 W
18.0 W
S0.C1.Pmin NB Power
17
12.9 W
16.9 W
12.8 W
14.5 W
I/O Power
S0.C1E.Pmin TDP
S3
I/O Power
13
7.2 W
7.2 W
7.2 W
7.2 W
16
10.6 W
10.6 W
8.1 W
8.1 W
13
350 mW
350 mW
350 mW
350 mW
The notes for this table are on page 60 and page 61.
AMD Phenom™ Processor
36
PID: 43375 Rev 3.46 - September 2010
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
OPN
Specification8
State
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
HD960BWCJ4BGH
Notes Single-Plane
Dual-Plane
o
o
HD9650WCJ4BGH
Single-Plane
Dual-Plane
o
Tcase Max
1
55 C to 70 C
55 C to 70 oC
Tctl Max
2
70 oC
70 oC
Tambient Min
5 oC
5 oC
Thermal Profile
A
A
Startup P-State
5
S0.C0.P1
S0.C0.P1
HTC P-State
4
S0.C0.P1
S0.C0.P1
NB COF
6,7
1800 MHz
1800 MHz
1800 MHz
1800 MHz
VID_VDDNB
11,7
N/A
1.250 V
N/A
1.250 V
IDDNB Max
12
N/A
12.0 A
N/A
14.0 A
CPU COF
6
2300 MHz
2300 MHz
TDP
3
95.0 W
95.0 W
95.0 W
95.0 W
VID_VDD Min
9
1.200 V
1.200 V
1.150 V
1.150 V
VID_VDD Max
9
1.250 V
1.250 V
1.250 V
1.250 V
IDD Max
3,10
73.9 A
62.9 A
75.1 A
63.5 A
1150 MHz
1150 MHz
CPU COF
6
TDP
3
65.8 W
50.9 W
66.1 W
57.6 W
VID_VDD Min
9
1.200 V
1.050 V
1.150 V
1.050 V
VID_VDD Max
9
1.250 V
1.050 V
1.250 V
1.050 V
IDD Max
3,10
51.1 A
29.9 A
53.6 A
34.0 A
Core Power
15,18
22.7 W
19.1 W
27.4 W
23.8 W
S0.C1.Pmin NB Power
17
13.2 W
15.0 W
13.3 W
17.5 W
I/O Power
S0.C1E.Pmin TDP
S3
I/O Power
13
7.2 W
7.2 W
7.2 W
7.2 W
16
8.7 W
8.7 W
11.2 W
11.2 W
13
350 mW
350 mW
350 mW
350 mW
The notes for this table are on page 60 and page 61.
AMD Phenom™ Processor
37
PID: 43375 Rev 3.46 - September 2010
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
OPN
Specification8
State
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
HD9550WCJ4BGH
Notes Single-Plane Dual-Plane
Tcase Max
1
55 oC to 70 oC
Tctl Max
2
70 oC
Tambient Min
5 oC
Thermal Profile
A
Startup P-State
5
S0.C0.P1
HTC P-State
4
S0.C0.P1
NB COF
6,7
1800 MHz
1800 MHz
VID_VDDNB
11,7
N/A
1.250 V
IDDNB Max
12
N/A
14.4 A
CPU COF
6
2200 MHz
TDP
3
95.0 W
95.0 W
VID_VDD Min
9
1.150 V
1.150 V
VID_VDD Max
9
1.250 V
1.250 V
IDD Max
3,10
74.9 A
63.0 A
CPU COF
6
TDP
3
67.0 W
58.3 W
VID_VDD Min
9
1.150 V
1.050 V
VID_VDD Max
9
1.250 V
1.050 V
1100 MHz
IDD Max
3,10
54.4 A
34.1 A
Core Power
15,18
28.9 W
24.9 W
S0.C1.Pmin NB Power
17
13.7 W
18.0 W
I/O Power
S0.C1E.Pmin TDP
13
7.2 W
7.2 W
S3
I/O Power
16
11.9 W
11.9 W
13
350 mW
350 mW
The notes for this table are on page 60 and page 61.
AMD Phenom™ Processor
38
PID: 43375 Rev 3.46 - September 2010
2.3.5
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
HD mmmm XA pnc GH (125 W, DT, AM2r2) Thermal and Power Specifications
OPN
Specification8
State
S0.C0.Px
S0.Cx.Px
HD985ZXAJ4BGH
Notes Single-Plane
Dual-Plane
o
o
HD9750XAJ4BGH
Single-Plane
Dual-Plane
o
Tcase Max
1
55 C to 61 C
55 C to 61 oC
Tctl Max
2
70 oC
70 oC
Tambient Min
o
5 C
5 oC
Thermal Profile
B
B
S0.C0.P1
S0.C0.P1
Startup P-State
5
HTC P-State
4
NB COF
6,7
2000 MHz
2000 MHz
1800 MHz
1800 MHz
VID_VDDNB
11,7
N/A
1.300 V
N/A
1.300 V
IDDNB Max
12
N/A
18.4 A
N/A
18.3 A
S0.C0.P1
S0.C0.P1
2400 MHz
CPU COF
6
TDP
3
125.0 W
125.0 W
125.0 W
125.0 W
VID_VDD Min
9
1.200 V
1.200 V
1.200 V
1.200 V
VID_VDD Max
9
1.300 V
1.300 V
1.300 V
1.300 V
IDD Max
3,10
95.0 A
80.1 A
95.0 A
80.2 A
CPU COF
6
TDP
3
89.4 W
69.7 W
90.7 W
70.2 W
VID_VDD Min
9
1.200 V
1.050 V
1.200 V
1.050 V
VID_VDD Max
9
1.300 V
1.050 V
1.300 V
1.050 V
IDD Max
3,10
70.2 A
39.4 A
71.2 A
39.9 A
Core Power
15,18
40.8 W
32.3 W
42.2 W
33.0 W
S0.C1.Pmin NB Power
17
17.9 W
23.9 W
17.7 W
23.8 W
I/O Power
S0.C1E.Pmin TDP
13
7.2 W
7.2 W
7.2 W
7.2 W
16
13.6 W
13.6 W
14.5 W
14.5 W
I/O Power
13
350 mW
350 mW
350 mW
350 mW
S0.C0.P0
S0.C0.P1
S3
2500 MHz
1250 MHz
1200 MHz
The notes for this table are on page 60 and page 61.
AMD Phenom™ Processor
39
PID: 43375 Rev 3.46 - September 2010
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
OPN
Specification8
State
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
HD9850XAJ4BGH
Notes Single-Plane
Dual-Plane
o
o
HD995ZXAJ4BGH
Single-Plane
Dual-Plane
o
Tcase Max
1
55 C to 61 C
55 C to 61 oC
Tctl Max
2
70 oC
70 oC
Tambient Min
5 oC
5 oC
Thermal Profile
B
B
Startup P-State
5
S0.C0.P1
S0.C0.P1
HTC P-State
4
S0.C0.P1
S0.C0.P1
NB COF
6,7
2000 MHz
2000 MHz
2000 MHz
2000 MHz
VID_VDDNB
11,7
N/A
1.300 V
N/A
1.300 V
IDDNB Max
12
N/A
18.4 A
N/A
17.8 A
CPU COF
6
2500 MHz
2600 MHz
TDP
3
125.0 W
125.0 W
125.0 W
125.0 W
VID_VDD Min
9
1.200 V
1.200 V
1.200 V
1.200 V
VID_VDD Max
9
1.300 V
1.300 V
1.300 V
1.300 V
IDD Max
3,10
95.0 A
80.1 A
95.0 A
80.5 A
1250 MHz
1300 MHz
CPU COF
6
TDP
3
89.4 W
69.7 W
88.2 W
68.9 W
VID_VDD Min
9
1.200 V
1.050 V
1.200 V
1.050 V
VID_VDD Max
9
1.300 V
1.050 V
1.300 V
1.050 V
IDD Max
3,10
70.2 A
39.4 A
69.2 A
39.3 A
Core Power
15,18
40.8 W
32.3 W
39.0 W
31.1 W
S0.C1.Pmin NB Power
17
17.9 W
23.9 W
17.5 W
22.2 W
I/O Power
S0.C1E.Pmin TDP
13
7.2 W
7.2 W
7.2 W
7.2 W
16
13.7 W
13.7 W
13.1 W
13.1 W
I/O Power
13
350 mW
350 mW
350 mW
350 mW
S3
The notes for this table are on page 60 and page 61.
AMD Phenom™ Processor
40
PID: 43375 Rev 3.46 - September 2010
2.3.6
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
HD mmmm FA pnc GH (140 W, DT, AM2r2) Thermal and Power Specifications
HD995ZFAJ4BGH19
OPN
Specification8
State
S0.C0.Px
Notes Single-Plane
Dual-Plane
o
Tcase Max
1
55 C to 64 oC
Tctl Max
2
70 oC
5 oC
Tambient Min
E
Thermal Profile
S0.C0.P1
Startup P-State
5
HTC P-State
4
NB COF
6,7
2000 MHz
2000 MHz
VID_VDDNB
11,7
N/A
1.300 V
IDDNB Max
12
N/A
18.1 A
CPU COF
6
TDP
3
140.0 W
140.0 W
VID_VDD Min
9
1.250 V
1.250 V
VID_VDD Max
9
1.300 V
1.300 V
IDD Max
3,10
105.9 A
89.6 A
CPU COF
6
TDP
3
102.6 W
69.8 W
VID_VDD Min
9
1.250 V
1.050 V
VID_VDD Max
9
1.300 V
1.050 V
IDD Max
3,10
78.5 A
39.8 A
Core Power
15,18
44.2 W
31.8 W
S0.C1.Pmin NB Power
17
20.4 W
23.5 W
I/O Power
S0.C1E.Pmin TDP
S3
I/O Power
13
7.2 W
7.2 W
16
13.4 W
13.4 W
13
350 mW
350 mW
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C0.P1
2600 MHz
1300 MHz
The notes for this table are on page 60 and page 61.
AMD Phenom™ Processor
41
PID: 43375 Rev 3.46 - September 2010
2.3.7
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
HD mmmm OD pnc GH (65 W, DT, AM2r2) Thermal and Power Specifications
OPN
Specification8
State
S0.C0.Px
S0.Cx.Px
HD8450ODJ3BGH
Notes Single-Plane
Dual-Plane
o
o
HD8250ODJ3BGH
Single-Plane
Dual-Plane
o
Tcase Max
1
55 C to 71 C
55 C to 71 oC
Tctl Max
2
70 oC
70 oC
Tambient Min
o
5 C
5 oC
Thermal Profile
G
G
S0.C0.P1
S0.C0.P1
Startup P-State
5
HTC P-State
4
NB COF
6,7
1800 MHz
1800 MHz
1800 MHz
1800 MHz
VID_VDDNB
11,7
N/A
1.200 V
N/A
1.200 V
IDDNB Max
12
N/A
11.0 A
N/A
11.6 A
S0.C0.P1
2100 MHz
S0.C0.P1
1900 MHz
CPU COF
6
TDP
3
65.0 W
65.0 W
65.0 W
65.0 W
VID_VDD Min
9
1.125 V
1.125 V
1.125 V
1.125 V
VID_VDD Max
9
1.200 V
1.200 V
1.200 V
1.200 V
IDD Max
3,10
51.8 A
42.1 A
51.6 A
41.4 A
CPU COF
6
TDP
3
46.7 W
39.1 W
48.2 W
40.1 W
VID_VDD Min
9
1.125 V
1.000 V
1.125 V
1.000 V
VID_VDD Max
9
1.200 V
1.000 V
1.200 V
1.000 V
IDD Max
3,10
37.5 A
21.5 A
38.7 A
21.6 A
Core Power
15,18
5.5 W
3.2 W
6.8 W
3.9 W
S0.C1.Pmin NB Power
17
10.9 W
13.2 W
11.4 W
13.9 W
I/O Power
S0.C1E.Pmin TDP
S3
I/O Power
13
7.2 W
7.2 W
7.2 W
7.2 W
16
8.6 W
8.6 W
9.6 W
9.6 W
13
350 mW
350 mW
350 mW
350 mW
S0.C0.P0
S0.C0.P1
1050 MHz
950 MHz
The notes for this table are on page 60 and page 61.
AMD Phenom™ Processor
42
PID: 43375 Rev 3.46 - September 2010
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
HD9150ODJ4BGH
OPN
Specification8
State
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
Notes Single-Plane
HD9350ODJ4BGH
Dual-Plane Single-Plane Dual-Plane
o
Tcase Max
1
55 C to 70 oC
55 oC to 70 oC
Tctl Max
2
70 oC
70 oC
Tambient Min
5 oC
5 oC
Thermal Profile
F
F
Startup P-State
5
S0.C0.P1
S0.C0.P1
HTC P-State
4
S0.C0.P1
S0.C0.P1
NB COF
6,7
1600 MHz
1600 MHz
1800 MHz
1800 MHz
VID_VDDNB
11,7
N/A
1.125 V
N/A
1.125 V
IDDNB Max
12
N/A
10.1 A
N/A
9.8 A
CPU COF
6
1800 MHz
2000 MHz
TDP
3
65.0 W
65.0 W
65.0 W
65.0 W
VID_VDD Min
9
1.075 V
1.075 V
1.075 V
1.075 V
VID_VDD Max
9
1.125 V
1.125 V
1.125 V
1.125 V
IDD Max
3,10
54.9 A
45.8 A
55.0 A
46.0 A
900 MHz
1000 MHz
CPU COF
6
TDP
3
47.2 W
41.7 W
45.5 W
40.5 W
VID_VDD Min
9
1.075 V
1.000 V
1.075 V
1.000 V
VID_VDD Max
9
1.125 V
1.000 V
1.125 V
1.000 V
IDD Max
3,10
39.7 A
25.9 A
38.1 A
25.0 A
Core Power
15,18
17.8 W
16.0 W
15.4 W
14.1 W
S0.C1.Pmin NB Power
17
9.9 W
11.3 W
9.2 W
10.5 W
I/O Power
S0.C1E.Pmin TDP
S3
I/O Power
13
7.2 W
7.2 W
7.2 W
7.2 W
16
10.6 W
10.6 W
8.8 W
8.8 W
13
350 mW
350 mW
350 mW
350 mW
The notes for this table are on page 60 and page 61.
AMD Phenom™ Processor
43
PID: 43375 Rev 3.46 - September 2010
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
OPN
Specification8
State
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
HD9450ODJ4BGH
Notes Single-Plane Dual-Plane
Tcase Max
1
55 oC to 70 oC
Tctl Max
2
70 oC
Tambient Min
5 oC
Thermal Profile
F
Startup P-State
5
S0.C0.P1
HTC P-State
4
S0.C0.P1
NB COF
6,7
1800 MHz
1800 MHz
VID_VDDNB
11,7
N/A
1.125 V
IDDNB Max
12
N/A
9.4 A
CPU COF
6
2100 MHz
TDP
3
65.0 W
65.0 W
VID_VDD Min
9
1.075 V
1.075 V
VID_VDD Max
9
1.125 V
1.125 V
IDD Max
3,10
55.1 A
46.4 A
CPU COF
6
TDP
3
44.7 W
39.9 W
VID_VDD Min
9
1.075 V
1.000 V
VID_VDD Max
9
1.125 V
1.000 V
1050 MHz
IDD Max
3,10
37.4 A
24.8 A
Core Power
15,18
14.5 W
13.5 W
S0.C1.Pmin NB Power
17
9.3 W
10.6 W
I/O Power
S0.C1E.Pmin TDP
13
7.2 W
7.2 W
S3
I/O Power
16
8.1 W
8.1 W
13
350 mW
350 mW
The notes for this table are on page 60 and page 61.
AMD Phenom™ Processor
44
PID: 43375 Rev 3.46 - September 2010
2.3.8
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
HD mmmm WC pnc HH (95 W, DT, AM2r2) Thermal and Power Specifications
OPN
Specification8
State
S0.C0.Px
HD8400WCJ3BHH
Notes Single-Plane Dual-Plane
Tcase Max
1
55 oC to 71 oC
Tctl Max
2
70 oC
Tambient Min
5 oC
Thermal Profile
C
Startup P-State
S0.C0.P1
5
S0.C0.P1
HTC P-State
4
NB COF
6,7
1800 MHz
1800 MHz
VID_VDDNB
11,7
N/A
1.250 V
IDDNB Max
12
N/A
15.2 A
CPU COF
6
TDP
3
95.0 W
95.0 W
VID_VDD Min
9
1.200 V
1.200 V
VID_VDD Max
9
1.250 V
1.250 V
IDD Max
3,10
73.3 A
59.6 A
CPU COF
6
TDP
3
74.2 W
55.6 W
VID_VDD Min
9
1.200 V
1.050 V
VID_VDD Max
9
1.250 V
1.050 V
IDD Max
3,10
57.7 A
30.6 A
Core Power
15,18
15.5 W
7.8 W
S0.C1.Pmin NB Power
17
16.5 W
19.0 W
I/O Power
S0.C1E.Pmin TDP
13
7.2 W
7.2 W
16
12.9 W
12.9 W
13
350 mW
350 mW
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S3
I/O Power
2100 MHz
1050 MHz
The notes for this table are on page 60 and page 61.
AMD Phenom™ Processor
45
PID: 43375 Rev 3.46 - September 2010
2.3.9
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
HD mmmm WC pnc HI (95 W, DT, AM2r2) Thermal and Power Specifications
OPN
Specification8
State
S0.C0.Px
HD8550WCJ3BHI
Notes Single-Plane Dual-Plane
Tcase Max
1
55 oC to 71 oC
Tctl Max
2
70 oC
Tambient Min
5 oC
Thermal Profile
C
Startup P-State
S0.C0.P1
5
S0.C0.P1
HTC P-State
4
NB COF
6,7
1800 MHz
1800 MHz
VID_VDDNB
11,7
N/A
1.250 V
IDDNB Max
12
N/A
14.9 A
CPU COF
6
TDP
3
95.0 W
95.0 W
VID_VDD Min
9
1.200 V
1.200 V
VID_VDD Max
9
1.250 V
1.250 V
IDD Max
3,10
73.4 A
59.9 A
CPU COF
6
TDP
3
73.2 W
55.1 W
VID_VDD Min
9
1.200 V
1.050 V
VID_VDD Max
9
1.250 V
1.050 V
IDD Max
3,10
57.0 A
30.5 A
Core Power
15,18
14.7 W
7.4 W
S0.C1.Pmin NB Power
17
16.1 W
18.6 W
I/O Power
S0.C1E.Pmin TDP
13
7.2 W
7.2 W
16
12.4 W
12.4 W
13
350 mW
350 mW
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S3
I/O Power
2200 MHz
1100 MHz
The notes for this table are on page 60 and page 61.
AMD Phenom™ Processor
46
PID: 43375 Rev 3.46 - September 2010
2.3.10
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
HD mmmm XC pnc GI (125 W, DT, AM2r2) Thermal and Power Specifications
HDX920XCJ4DGI19
OPN
State
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
Specification8
Tcase Max
Notes Single-Plane Dual-Plane
55 oC to 62 oC
1
Tctl Max
2
HDZ940XCJ4DGI19
Single-Plane Dual-Plane
55 oC to 62 oC
70 oC
70 oC
Tambient Min
5 oC
5 oC
Thermal Profile
I
I
S0.C0.P3
S0.C0.P3
Startup P-State
5
HTC P-State
4
NB COF
6,7
1600 MHz
1800 MHz
1600 MHz
1800 MHz
VID_VDDNB Min
11,7
N/A
1.150 V
N/A
1.150 V
VID_VDDNB Max
11,7
N/A
1.300 V
N/A
1.300 V
IDDNB Max
12
N/A
20.0 A
N/A
20.0 A
CPU COF
6
TDP
3,7
140.8 W
125.0 W
139.6 W
125.0 W
VID_VDD Min
9
1.225 V
1.225 V
1.225 V
1.225 V
VID_VDD Max
9
1.425 V
1.425 V
1.425 V
1.425 V
IDD Max
3,10
102.5 A
78.9 A
102.3 A
79.4 A
CPU COF
6
TDP
3,7
94.7 W
91.4 W
94.9 W
91.7 W
VID_VDD Min
9
1.150 V
1.125 V
1.150 V
1.125 V
VID_VDD Max
9
1.325 V
1.325 V
1.325 V
1.325 V
IDD Max
3,10
77.6 A
55.2 A
77.7 A
56.0 A
CPU COF
6
S0.C0.P3
S0.C0.P3
2800 MHz
2100 MHz
1600 MHz
3000 MHz
2300 MHz
1800 MHz
TDP
3,7
88.7 W
70.1 W
88.9 W
70.8 W
VID_VDD Min
9
1.150 V
1.025 V
1.150 V
1.025 V
VID_VDD Max
9
1.225 V
1.225 V
1.225 V
1.225 V
IDD Max
3,10
72.4 A
39.3 A
72.5 A
40.1 A
CPU COF
6
800 MHz
800 MHz
TDP
3,7
79.2 W
52.7 W
77.0 W
48.8 W
VID_VDD Min
9
1.150 V
0.925 V
1.150 V
0.875 V
VID_VDD Max
9
1.150 V
1.150 V
1.150 V
1.150 V
IDD Max
3,10
64.1 A
24.9 A
62.1 A
21.4 A
Core Power (Pre-Flush)
20
39.7 W
8.8 W
38.7 W
6.9 W
Core Power (Post-Flush) 20
36.8 W
6.3 W
35.8 W
4.8 W
NB Power
17
30.4 W
22.3 W
31.0 W
22.3 W
I/O Power
13
5.5 W
5.5 W
5.5 W
5.5 W
S0.C1E.Pmin TDP
S3
I/O Power
16
19.7 W
11.4 W
18.9 W
10.4 W
13
350 mW
350 mW
350 mW
350 mW
S0.C1.Pmin
The notes for this table are on page 60 and page 61.
AMD Phenom™ Processor
47
PID: 43375 Rev 3.46 - September 2010
2.3.11
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
HD mmmm WF pnc GI (95 W, DT, AM3) Thermal and Power Specifications
HDX805WFK4FGI19
OPN
State
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
Specification8
Tcase Max
Notes Single-Plane Dual-Plane
55 oC to 71 oC
1
Tctl Max
2
HDX810WFK4FGI19
Single-Plane Dual-Plane
55 oC to 71 oC
70 oC
70 oC
Tambient Min
5 oC
5 oC
Thermal Profile
C
C
S0.C0.P3
S0.C0.P3
Startup P-State
5
HTC P-State
4
NB COF
6,7
1600 MHz
2000 MHz
1600 MHz
2000 MHz
VID_VDDNB Min
11,7
N/A
1.150 V
N/A
1.150 V
VID_VDDNB Max
11,7
N/A
1.300 V
N/A
1.300 V
IDDNB Max
12
N/A
20.0 A
N/A
20.0 A
CPU COF
6
TDP
3,7
104.0 W
95.0 W
104.0 W
95.0 W
VID_VDD Min
9
1.150 V
1.150 V
1.150 V
1.150 V
VID_VDD Max
9
1.425 V
1.425 V
1.425 V
1.425 V
IDD Max
3,10
75.8 A
58.7 A
75.8 A
58.9 A
CPU COF
6
TDP
3,7
85.5 W
71.7 W
85.5 W
71.7 W
VID_VDD Min
9
1.150 V
1.050 V
1.150 V
1.050 V
VID_VDD Max
9
1.325 V
1.325 V
1.325 V
1.325 V
IDD Max
3,10
68.5 A
40.5 A
68.5 A
40.8 A
CPU COF
6
S0.C0.P3
2500 MHz
1800 MHz
1300 MHz
S0.C0.P3
2600 MHz
1900 MHz
1400 MHz
TDP
3,7
79.5 W
57.2 W
79.5 W
57.2 W
VID_VDD Min
9
1.150 V
0.950 V
1.150 V
0.950 V
VID_VDD Max
9
1.225 V
1.225 V
1.225 V
1.225 V
IDD Max
3,10
63.3 A
28.3 A
63.3 A
28.7 A
CPU COF
6
800 MHz
800 MHz
TDP
3,7
73.5 W
48.4 W
72.3 W
47.6 W
VID_VDD Min
9
1.150 V
0.875 V
1.150 V
0.875 V
VID_VDD Max
9
1.150 V
1.150 V
1.150 V
1.150 V
IDD Max
3,10
58.1 A
20.2 A
57.1 A
19.9 A
Core Power (Pre-Flush)
20
37.5 W
6.6 W
36.5 W
6.5 W
Core Power (Post-Flush) 20
34.6 W
4.4 W
33.5 W
4.3 W
NB Power
17
22.3 W
22.3 W
22.3 W
22.3 W
I/O Power
13
6.7 W
6.7 W
6.7 W
6.7 W
S0.C1E.Pmin TDP
S3
I/O Power
16
17.5 W
10.0 W
17.0 W
9.9 W
13
350 mW
350 mW
350 mW
350 mW
S0.C1.Pmin
The notes for this table are on page 60 and page 61.
AMD Phenom™ Processor
48
PID: 43375 Rev 3.46 - September 2010
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
HDX910WFK4DGI19
OPN
State
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
Specification8
Tcase Max
Notes Single-Plane Dual-Plane
1
55 oC to 71 oC
Tctl Max
2
HDX925WFK4DGI19
Single-Plane Dual-Plane
55 oC to 71 oC
70 oC
70 oC
Tambient Min
5 oC
5 oC
Thermal Profile
C
C
S0.C0.P3
S0.C0.P3
Startup P-State
5
HTC P-State
4
NB COF
6,7
1600 MHz
2000 MHz
1600 MHz
2000 MHz
VID_VDDNB Min
11,7
N/A
1.150 V
N/A
1.150 V
VID_VDDNB Max
11,7
N/A
1.300 V
N/A
1.300 V
IDDNB Max
12
N/A
20.0 A
N/A
20.0 A
S0.C0.P3
S0.C0.P3
2800 MHz
CPU COF
6
TDP
3,7
104.0 W
95.0 W
103.1 W
95.0 W
VID_VDD Min
9
1.150 V
1.150 V
1.150 V
1.150 V
VID_VDD Max
9
1.425 V
1.425 V
1.425 V
1.425 V
IDD Max
3,10
75.8 A
58.9 A
75.8 A
59.5 A
CPU COF
6
2600 MHz
1900 MHz
2100 MHz
TDP
3,7
85.5 W
71.7 W
85.5 W
72.2 W
VID_VDD Min
9
1.150 V
1.050 V
1.150 V
1.050 V
VID_VDD Max
9
1.325 V
1.325 V
1.325 V
1.325 V
IDD Max
3,10
68.5 A
40.8 A
68.5 A
41.6 A
CPU COF
6
1400 MHz
1600 MHz
TDP
3,7
79.5 W
57.2 W
79.5 W
58.0 W
VID_VDD Min
9
1.150 V
0.950 V
1.150 V
0.950 V
VID_VDD Max
9
1.225 V
1.225 V
1.225 V
1.225 V
IDD Max
3,10
63.3 A
28.7 A
63.3 A
29.6 A
CPU COF
6
TDP
3,7
72.3 W
47.6 W
70.0 W
46.1 W
VID_VDD Min
9
1.150 V
0.875 V
1.150 V
0.850 V
VID_VDD Max
9
1.150 V
1.150 V
1.150 V
1.125 V
800 MHz
800 MHz
IDD Max
3,10
57.1 A
19.9 A
55.0 A
18.1 A
Core Power (Pre-Flush)
20
36.5 W
6.5 W
35.5 W
5.6 W
Core Power (Post-Flush) 20
33.5 W
4.3 W
32.5 W
3.6 W
NB Power
17
22.3 W
22.3 W
22.3 W
22.3 W
I/O Power
13
6.7 W
6.7 W
6.7 W
6.7 W
S0.C1E.Pmin TDP
S3
I/O Power
16
17.0 W
9.9 W
16.1 W
9.5 W
13
350 mW
350 mW
350 mW
350 mW
S0.C1.Pmin
The notes for this table are on page 60 and page 61.
AMD Phenom™ Processor
49
PID: 43375 Rev 3.46 - September 2010
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
HDX710WFK3DGI19
OPN
State
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
Specification8
Tcase Max
Notes Single-Plane Dual-Plane
55 oC to 73 oC
1
Tctl Max
2
HDZ720WFK3DGI19
Single-Plane Dual-Plane
55 oC to 73 oC
70 oC
70 oC
Tambient Min
5 oC
5 oC
Thermal Profile
H
H
S0.C0.P3
S0.C0.P3
Startup P-State
5
HTC P-State
4
NB COF
6,7
1600 MHz
2000 MHz
1600 MHz
2000 MHz
VID_VDDNB Min
11,7
N/A
1.150 V
N/A
1.150 V
VID_VDDNB Max
11,7
N/A
1.300 V
N/A
1.300 V
IDDNB Max
12
N/A
20.0 A
N/A
20.0 A
S0.C0.P3
2600 MHz
S0.C0.P3
CPU COF
6
TDP
3,7
107.4 W
95.0 W
106.5 W
95.0 W
VID_VDD Min
9
1.150 V
1.150 V
1.150 V
1.150 V
VID_VDD Max
9
1.425 V
1.425 V
1.425 V
1.425 V
IDD Max
3,10
75.9 A
57.1 A
75.8 A
57.5 A
CPU COF
6
1900 MHz
2800 MHz
2100 MHz
TDP
3,7
87.6 W
72.2 W
87.6 W
72.6 W
VID_VDD Min
9
1.150 V
1.050 V
1.150 V
1.050 V
VID_VDD Max
9
1.325 V
1.325 V
1.325 V
1.325 V
IDD Max
3,10
70.3 A
40.0 A
70.3 A
40.5 A
CPU COF
6
1400 MHz
1600 MHz
TDP
3,7
83.1 W
57.8 W
83.1 W
58.5 W
VID_VDD Min
9
1.150 V
0.950 V
1.150 V
0.950 V
VID_VDD Max
9
1.225 V
1.225 V
1.225 V
1.225 V
IDD Max
3,10
66.4 A
28.5 A
66.4 A
29.1 A
CPU COF
6
TDP
3,7
77.7 W
48.8 W
75.9 W
47.2 W
VID_VDD Min
9
1.150 V
0.875 V
1.150 V
0.850 V
VID_VDD Max
9
1.150 V
1.150 V
1.150 V
1.125 V
800 MHz
800 MHz
IDD Max
3,10
61.8 A
20.5 A
60.2 A
18.7 A
Core Power (Pre-Flush)
20
39.6 W
7.9 W
38.7 W
6.9 W
Core Power (Post-Flush) 20
36.6 W
5.2 W
35.8 W
4.4 W
NB Power
17
22.3 W
22.3 W
22.3 W
22.3 W
I/O Power
13
6.7 W
6.7 W
6.7 W
6.7 W
S0.C1E.Pmin TDP
S3
I/O Power
16
19.6 W
10.5 W
19.0 W
10.4 W
13
350 mW
350 mW
350 mW
350 mW
S0.C1.Pmin
The notes for this table are on page 60 and page 61.
AMD Phenom™ Processor
50
PID: 43375 Rev 3.46 - September 2010
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
HDZ550WFK2DGI19
OPN
State
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
Specification8
Tcase Max
Notes Single-Plane Dual-Plane
55 oC to 70 oC
1
Tctl Max
2
HDX545WFK2DGI19
Single-Plane Dual-Plane
55 oC to 70 oC
70 oC
70 oC
Tambient Min
5 oC
5 oC
Thermal Profile
P
P
S0.C0.P3
S0.C0.P3
Startup P-State
5
HTC P-State
4
NB COF
6,7
1600 MHz
2000 MHz
1600 MHz
2000 MHz
VID_VDDNB Min
11,7
N/A
1.050 V
N/A
1.050 V
VID_VDDNB Max
11,7
N/A
1.150 V
N/A
1.150 V
IDDNB Max
12
N/A
15.1 A
N/A
15.3 A
S0.C0.P3
3100 MHz
S0.C0.P3
3000 MHz
CPU COF
6
TDP
3,7
94.0 W
80.0 W
94.3 W
80.0 W
VID_VDD Min
9
1.200 V
1.200 V
1.200 V
1.200 V
VID_VDD Max
9
1.425 V
1.425 V
1.425 V
1.425 V
IDD Max
3,10
67.8 A
50.1 A
67.9 A
50.0 A
CPU COF
6
2400 MHz
2300 MHz
TDP
3,7
65.6 W
60.7 W
65.6 W
60.7 W
VID_VDD Min
9
1.100 V
1.100 V
1.100 V
1.100 V
VID_VDD Max
9
1.325 V
1.325 V
1.325 V
1.325 V
IDD Max
3,10
49.2 A
35.8 A
49.1 A
35.6 A
CPU COF
6
1900 MHz
1800 MHz
TDP
3,7
49.8 W
48.3 W
49.7 W
48.3 W
VID_VDD Min
9
1.050 V
1.000 V
1.050 V
1.000 V
VID_VDD Max
9
1.225 V
1.225 V
1.225 V
1.225 V
IDD Max
3,10
41.1 A
26.1 A
41.0 A
25.9 A
CPU COF
6
TDP
3,7
44.5 W
35.4 W
44.9 W
36.8 W
VID_VDD Min
9
1.050 V
0.850 V
1.050 V
0.875 V
VID_VDD Max
9
1.075 V
1.075 V
1.100 V
1.100 V
800 MHz
800 MHz
IDD Max
3,10
36.0 A
14.4 A
36.4 A
15.6 A
Core Power (Pre-Flush)
20
23.9 W
5.7 W
24.2 W
6.3 W
Core Power (Post-Flush) 20
21.5 W
3.3 W
21.8 W
3.8 W
NB Power
17
14.9 W
14.9 W
15.1 W
15.1 W
I/O Power
13
6.7 W
6.7 W
6.7 W
6.7 W
S0.C1E.Pmin TDP
S3
I/O Power
16
9.2 W
6.7 W
9.4 W
7.0 W
13
350 mW
350 mW
350 mW
350 mW
S0.C1.Pmin
The notes for this table are on page 60 and page 61.
AMD Phenom™ Processor
51
PID: 43375 Rev 3.46 - September 2010
2.3.12
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
HD mmmm OC pnc GI (65 W, DT, AM3) Thermal and Power Specifications
HD900EOCK4DGI19
OPN
Specification8
State
Tcase Max
Tctl Max
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
Notes Single-Plane
1
Dual-Plane
o
o
55 C to 70 C
HD905EOCK4DGI19
Single-Plane
55 C to 70 oC
o
2
Tambient Min
Thermal Profile
Dual-Plane
o
70 C
70 oC
5 oC
5 oC
J
J
Startup P-State
5
S0.C0.P3
S0.C0.P3
HTC P-State
4
S0.C0.P3
S0.C0.P3
NB COF
6,7
1600 MHz
2000 MHz
1600 MHz
2000 MHz
VID_VDDNB Min
11,7
N/A
1.050 V
N/A
1.050 V
VID_VDDNB Max
11,7
N/A
1.100 V
N/A
1.100 V
IDDNB Max
12
N/A
14.6 A
N/A
14.3 A
CPU COF
6
TDP
3,7
69.5 W
65.0 W
69.2 W
65.0 W
VID_VDD Min
9
1.050 V
1.025 V
1.050 V
1.025 V
VID_VDD Max
9
1.250 V
1.250 V
1.250 V
1.250 V
IDD Max
3,10
58.0 A
43.0 A
58.0 A
43.2 A
CPU COF
6
2400 MHz
2500 MHz
1800 MHz
1900 MHz
TDP
3,7
60.8 W
51.7 W
60.6 W
54.2 W
VID_VDD Min
9
1.050 V
0.950 V
1.050 V
0.975 V
VID_VDD Max
9
1.175 V
1.175 V
1.200 V
1.200 V
IDD Max
3,10
49.5 A
31.9 A
49.5 A
34.0 A
CPU COF
6
1400 MHz
1400 MHz
TDP
3,7
55.7 W
44.7 W
54.4 W
44.0 W
VID_VDD Min
9
1.050 V
0.900 V
1.050 V
0.900 V
VID_VDD Max
9
1.125 V
1.125 V
1.125 V
1.125 V
IDD Max
3,10
45.9 A
25.6 A
45.1 A
25.1 A
CPU COF
6
TDP
3,7
48.9 W
37.7 W
47.8 W
35.9 W
VID_VDD Min
9
1.050 V
0.850 V
1.050 V
0.825 V
VID_VDD Max
9
1.075 V
1.075 V
1.050 V
1.050 V
IDD Max
3,10
40.6 A
18.6 A
39.8 A
17.3 A
Core Power (Pre-Flush)
20
24.1 W
5.6 W
23.6 W
5.0 W
Core Power (Post-Flush) 20
800 MHz
800 MHz
21.7 W
3.7 W
21.2 W
3.2 W
NB Power
17
N/A
14.8 W
N/A
14.5 W
I/O Power
S0.C1E.Pmin TDP
S3
I/O Power
13
16
6.7 W
10.4 W
6.7 W
7.0 W
6.7 W
10.1 W
6.7 W
6.6 W
13
350 mW
350 mW
350 mW
350 mW
S0.C1.Pmin
The notes for this table are on page 60 and page 61.
AMD Phenom™ Processor
52
PID: 43375 Rev 3.46 - September 2010
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
HD700EOCK3DGI19
OPN
State
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
S0.C1.Pmin
Specification8
Tcase Max
Notes Single-Plane Dual-Plane
1
55 oC to 72 oC
Tctl Max
2
HD705EOCK3DGI19
Single-Plane Dual-Plane
55 oC to 72 oC
70 oC
70 oC
Tambient Min
5 oC
5 oC
Thermal Profile
K
K
S0.C0.P3
S0.C0.P3
Startup P-State
5
HTC P-State
4
NB COF
6,7
1600 MHz
2000 MHz
1600 MHz
2000 MHz
VID_VDDNB Min
11,7
N/A
1.050 V
N/A
1.050 V
VID_VDDNB Max
11,7
N/A
1.100 V
N/A
1.100 V
IDDNB Max
12
N/A
16.4 A
N/A
16.1 A
S0.C0.P3
S0.C0.P3
CPU COF
6
TDP
3,7
71.3 W
65.0 W
71.0 W
65.0 W
VID_VDD Min
9
1.050 V
1.025 V
1.050 V
1.025 V
VID_VDD Max
9
1.250 V
1.250 V
1.250 V
1.250 V
IDD Max
3,10
58.1 A
41.3 A
58.1 A
41.6 A
CPU COF
6
2400 MHz
2500 MHz
1800 MHz
1900 MHz
TDP
3,7
64.7 W
52.8 W
64.5 W
55.4 W
VID_VDD Min
9
1.050 V
0.950 V
1.050 V
0.950 V
VID_VDD Max
9
1.175 V
1.175 V
1.175 V
1.175 V
IDD Max
3,10
50.7 A
31.2 A
50.7 A
33.4 A
CPU COF
6
1300 MHz
1300 MHz
TDP
3,7
59.2 W
44.1 W
58.0 W
45.4 W
VID_VDD Min
9
1.050 V
0.875 V
1.050 V
0.875 V
VID_VDD Max
9
1.100 V
1.100 V
1.100 V
1.100 V
IDD Max
3,10
47.3 A
23.4 A
46.7 A
24.6 A
CPU COF
6
TDP
3,7
54.2 W
39.0 W
53.1 W
37.3 W
VID_VDD Min
9
1.050 V
0.825 V
1.050 V
0.800 V
VID_VDD Max
9
1.050 V
1.050 V
1.050 V
1.025 V
800 MHz
800 MHz
IDD Max
3,10
44.0 A
18.4 A
43.4 A
17.1 A
Core Power (Pre-Flush)
20
27.4 W
6.3 W
26.9 W
5.6 W
Core Power (Post-Flush) 20
25.0 W
4.1 W
24.6 W
3.5 W
NB Power
17
N/A
16.5 W
N/A
16.3 W
I/O Power
S0.C1E.Pmin TDP
S3
I/O Power
13
16
6.7 W
12.3 W
6.7 W
7.8 W
6.7 W
12.0 W
6.7 W
7.4 W
13
350 mW
350 mW
350 mW
350 mW
The notes for this table are on page 60 and page 61.
AMD Phenom™ Processor
53
PID: 43375 Rev 3.46 - September 2010
2.3.13
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
HD mmmm WF pnc GM (95 W, DT, AM3) Thermal and Power Specifications
HDZ560WFK2DGM21
OPN
Specification8
State
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
Notes Single-Plane
Dual-Plane
Tcase Max
1
55 oC to 70 oC
Tctl Max
2
70 oC
5 oC
Tambient Min
P
Thermal Profile
S0.C0.P3
Startup P-State
5
HTC P-State
4
NB COF
6,7
1600 MHz
2000 MHz
VID_VDDNB Min
11,7
N/A
1.150 V
VID_VDDNB Max
11,7
N/A
1.250 V
IDDNB Max
12
N/A
15.4 A
CPU COF
6
800 MHz
3300 MHz
TDP
3,7
35.3 W
80.0 W
VID_VDD Min
9
1.150 V
1.225 V
VID_VDD Max
9
1.250 V
1.425 V
IDD Max
3,10
41.9 A
46.9 A
CPU COF
6
N/A
2600 MHz
S0.C0.P3
TDP
3,7
N/A
64.2 W
VID_VDD Min
9
N/A
1.150 V
VID_VDD Max
9
N/A
1.325 V
IDD Max
3,10
N/A
35.5 A
CPU COF
6
N/A
2200 MHz
TDP
3,7
N/A
53.9 W
VID_VDD Min
9
N/A
1.075 V
VID_VDD Max
9
N/A
1.250 V
IDD Max
3,10
N/A
27.8 A
CPU COF
6
N/A
800 MHz
TDP
3,7
N/A
35.3 W
VID_VDD Min
9
N/A
0.875 V
VID_VDD Max
9
N/A
1.050 V
IDD Max
3,10
N/A
12.3 A
Core Power (Pre-Flush)
20
N/A
5.0 W
Core Power (Post-Flush) 20
N/A
3.2 W
NB Power
17
N/A
10.7 W
I/O Power
13
N/A
6.7 W
S0.C1E.Pmin TDP
S3
I/O Power
16
N/A
6.6 W
13
N/A
350 mW
S0.C1.Pmin
The notes for this table are on page 60 and page 61.
AMD Phenom™ Processor
54
PID: 43375 Rev 3.46 - September 2010
2.3.14
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
HD mmmm FB pnc GM (125 W, 140 W, DT, AM3) Thermal and Power Specifications
HDZ970FBK4DGM 21
OPN
State
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
Specification8
Tcase Max
Notes Single-Plane Dual-Plane
1
55 oC to 62 oC
Tctl Max
2
70 oC
5 oC
Tambient Min
Thermal Profile
I
Startup P-State
5
HTC P-State
4
NB COF
6,7
1600 MHz
2000 MHz
VID_VDDNB Min
11,7
N/A
1.050 V
S0.C0.P0
S0.C0.P0
VID_VDDNB Max
11,7
N/A
1.150 V
IDDNB Max
12
N/A
17.0 A
CPU COF
6
800 MHz
3500 MHz
TDP
3,7
52.1 W
125.0 W
VID_VDD Min
9
1.050 V
1.225 V
VID_VDD Max
9
1.050 V
1.425 V
IDD Max
3,10
43.2 A
60.5 A
CPU COF
6
N/A
2800 MHz
TDP
3,7
N/A
94.1 W
VID_VDD Min
9
N/A
1.125 V
VID_VDD Max
9
N/A
1.350 V
IDD Max
3,10
N/A
60.5 A
CPU COF
6
N/A
2200 MHz
TDP
3,7
N/A
71.6 W
VID_VDD Min
9
N/A
1.050 V
VID_VDD Max
9
N/A
1.250 V
IDD Max
3,10
N/A
45.3 A
CPU COF
6
N/A
800 MHz
TDP
3,7
N/A
39.6 W
VID_VDD Min
9
N/A
0.825 V
VID_VDD Max
9
N/A
1.050 V
IDD Max
3,10
N/A
17.2 A
Core Power (Pre-Flush) 20
N/A
5.9 W
Core Power (Pos t-Flush) 20
N/A
4.7 W
NB Power
17
N/A
8.2 W
I/O Power
13
N/A
6.7 W
S0.C1E.Pmin TDP
S3
I/O Power
16
N/A
8.1 W
13
350 mW
350 mW
S0.C1.Pmin
The notes for this table are on page 60 and page 61.
AMD Phenom™ Processor
55
PID: 43375 Rev 3.46 - September 2010
2.3.15
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
HD mmmm WF pnc GR (95 W, DT, AM3) Thermal and Power Specifications
HDT35TWFK6DGR21
OPN
Specification8
Tcase Max
Tctl Max
S0.C0.Px Tambient Min
Thermal Profile
Startup P-State
HTC P-State
NB COF
VID_VDDNB Min
S0.Cx.Px
VID_VDDNB Max
IDDNB Max
CPU COF
C-State Count
TDP
S0.C0.Pb0
VID_VDD Min
VID_VDD Max
IDD Max
CPU COF
TDP
S0.C0.P0 VID_VDD Min
VID_VDD Max
IDD Max
CPU COF
TDP
S0.C0.P1 VID_VDD Min
VID_VDD Max
IDD Max
CPU COF
TDP
S0.C0.P2 VID_VDD Min
VID_VDD Max
IDD Max
CPU COF
TDP
S0.C0.P3 VID_VDD Min
VID_VDD Max
IDD Max
Core Power (Pre-Flush)
Core Power (Post-Flush)
S0.C1.Pmin
NB Power
I/O Power
S0.C1E.Pmin TDP
I/O Power
S3
State
Notes Single-Plane Dual-Plane
1
55 oC to 71 oC
70 oC
2
5 oC
AD
5
S0.C0.P0
S0.C0.P3
4
S0.C0.P0
S0.C0.P3
6,7
2000 MHz
2000 MHz
11,7
N/A
1.050 V
11,7
N/A
1.175 V
12
N/A
15.4 A
6
N/A
3100 MHz
23
N/A
3
22
N/A
95.0 W
9
N/A
1.225 V
9
N/A
1.425 V
3,10
N/A
80.0 A
6
800 MHz
2600 MHz
3,7
47.8 W
95.0 W
9
0.975 V
1.075 V
9
1.175 V
1.375 V
3,10
27.9 A
68.7 A
6
N/A
2000 MHz
3,7
N/A
78.3 W
9
N/A
1.050 V
9
N/A
1.350 V
3,10
N/A
54.8 A
6
N/A
1400 MHz
3,7
N/A
59.9 W
9
N/A
1.000 V
9
N/A
1.300 V
3,10
N/A
39.9 A
6
N/A
800 MHz
3,7
N/A
47.8 W
9
N/A
0.975 V
9
N/A
1.175 V
3,10
N/A
27.9 A
20
N/A
13.0 W
20
N/A
9.8 W
17
N/A
9.7 W
13
N/A
6.1 W
16
N/A
12.1 W
13
N/A
300 mW
HDT55TWFK6DGR21
Single-Plane Dual-Plane
55 oC to 71 oC
70 oC
5 oC
AD
S0.C0.P0
S0.C0.P3
S0.C0.P0
S0.C0.P3
2000 MHz
2000 MHz
N/A
1.050 V
N/A
1.175 V
N/A
14.9 A
N/A
3300 MHz
N/A
3
N/A
95.0 W
N/A
1.225 V
N/A
1.425 V
N/A
80.0 A
800 MHz
2800 MHz
46.3 W
95.0 W
0.975 V
1.075 V
1.175 V
1.375 V
26.9 A
70.0 A
N/A
2200 MHz
N/A
78.4 W
N/A
1.050 V
N/A
1.350 V
N/A
56.6 A
N/A
1500 MHz
N/A
58.5 W
N/A
1.000 V
N/A
1.300 V
N/A
40.2 A
N/A
800 MHz
N/A
46.3 W
N/A
0.975 V
N/A
1.175 V
N/A
26.9 A
N/A
12.4 W
N/A
9.2 W
N/A
9.4 W
N/A
6.1 W
N/A
11.4 W
N/A
300 mW
The notes for this table are on page 60 and page 61.
AMD Phenom™ Processor
56
PID: 43375 Rev 3.46 - September 2010
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
HDT45TWFK6DGR21
OPN
Specification8
Tcase Max
Tctl Max
S0.C0.Px Tambient Min
Thermal Profile
Startup P-State
HTC P-State
NB COF
VID_VDDNB Min
S0.Cx.Px
VID_VDDNB Max
IDDNB Max
CPU COF
C-State Count
TDP
S0.C0.Pb0
VID_VDD Min
VID_VDD Max
IDD Max
CPU COF
TDP
S0.C0.P0 VID_VDD Min
VID_VDD Max
IDD Max
CPU COF
TDP
S0.C0.P1 VID_VDD Min
VID_VDD Max
IDD Max
CPU COF
TDP
S0.C0.P2 VID_VDD Min
VID_VDD Max
IDD Max
CPU COF
TDP
S0.C0.P3 VID_VDD Min
VID_VDD Max
IDD Max
Core Power (Pre-Flush)
Core Power (Post-Flush)
S0.C1.Pmin
NB Power
I/O Power
S0.C1E.Pmin TDP
I/O Power
S3
State
Notes Single-Plane Dual-Plane
55 oC to 71 oC
1
2
70 oC
5 oC
AD
5
S0.C0.P0
S0.C0.P3
4
S0.C0.P0
S0.C0.P3
6,7
2000 MHz
2000 MHz
11,7
N/A
1.050 V
11,7
N/A
1.175 V
12
N/A
15.2 A
6
N/A
3200 MHz
23
N/A
3
22
N/A
95.0 W
9
N/A
1.225 V
9
N/A
1.425 V
3,10
N/A
80.0 A
6
800 MHz
2700 MHz
3,7
47.1 W
95.0 W
9
0.975 V
1.075 V
9
1.175 V
1.375 V
3,10
27.4 A
69.5 A
6
N/A
2000 MHz
3,7
N/A
76.4 W
9
N/A
1.050 V
9
N/A
1.350 V
3,10
N/A
54.0 A
6
N/A
1400 MHz
3,7
N/A
58.3 W
9
N/A
1.000 V
9
N/A
1.300 V
3,10
N/A
39.3 A
6
N/A
800 MHz
3,7
N/A
47.1 W
9
N/A
0.975 V
9
N/A
1.175 V
3,10
N/A
27.4 A
20
N/A
12.7 W
20
N/A
9.5 W
17
N/A
9.6 W
13
N/A
6.1 W
16
N/A
11.8 W
13
N/A
300 mW
The notes for this table are on page 60 and page 61.
AMD Phenom™ Processor
57
PID: 43375 Rev 3.46 - September 2010
2.3.16
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
HD mmmm FB pnc GR (125 W, DT, AM3) Thermal and Power Specifications
HDT55TFBK6DGR21
OPN
Specification8
Tcase Max
Tctl Max
S0.C0.Px Tambient Min
Thermal Profile
Startup P-State
HTC P-State
NB COF
VID_VDDNB Min
S0.Cx.Px
VID_VDDNB Max
IDDNB Max
CPU COF
C-State Count
TDP
S0.C0.Pb0
VID_VDD Min
VID_VDD Max
IDD Max
CPU COF
TDP
S0.C0.P0 VID_VDD Min
VID_VDD Max
IDD Max
CPU COF
TDP
S0.C0.P1 VID_VDD Min
VID_VDD Max
IDD Max
CPU COF
TDP
S0.C0.P2 VID_VDD Min
VID_VDD Max
IDD Max
CPU COF
TDP
S0.C0.P3 VID_VDD Min
VID_VDD Max
IDD Max
Core Power (Pre-Flush)
Core Power (Post-Flush)
S0.C1.Pmin
NB Power
I/O Power
S0.C1E.Pmin TDP
I/O Power
S3
State
Notes Single-Plane Dual-Plane
1
55 oC to 62 oC
70 oC
2
5 oC
AE
5
S0.C0.P0
S0.C0.P3
4
S0.C0.P0
S0.C0.P3
6,7
2000 MHz
2000 MHz
11,7
N/A
1.050 V
11,7
N/A
1.175 V
12
N/A
17.0 A
6
N/A
3300 MHz
23
N/A
3
22
N/A
125.0 W
9
N/A
1.250 V
9
N/A
1.475 V
3,10
N/A
95.0 A
6
800 MHz
2800 MHz
3,7
55.4 W
125.0 W
9
1.000 V
1.150 V
9
1.225 V
1.475 V
3,10
32.9 A
89.7 A
6
N/A
2200 MHz
3,7
N/A
101.0 W
9
N/A
1.100 V
9
N/A
1.400 V
3,10
N/A
69.5 A
6
N/A
1500 MHz
3,7
N/A
77.3 W
9
N/A
1.050 V
9
N/A
1.325 V
3,10
N/A
50.9 A
6
N/A
800 MHz
3,7
N/A
55.4 W
9
N/A
1.000 V
9
N/A
1.225 V
3,10
N/A
32.9 A
20
N/A
16.4 W
20
N/A
12.9 W
17
N/A
10.8 W
13
N/A
6.1 W
16
N/A
15.8 W
13
N/A
300 mW
HDT90ZFBK6DGR21
Single-Plane Dual-Plane
55 oC to 62 oC
70 oC
5 oC
AE
S0.C0.P0
S0.C0.P3
S0.C0.P0
S0.C0.P3
2000 MHz
2000 MHz
N/A
1.050 V
N/A
1.175 V
N/A
16.2 A
N/A
3600 MHz
N/A
3
N/A
125.0 W
N/A
1.250 V
N/A
1.475 V
N/A
95.0 A
800 MHz
3200 MHz
53.1 W
125.0 W
1.000 V
1.150 V
1.225 V
1.475 V
31.4 A
92.8 A
N/A
2400 MHz
N/A
98.5 W
N/A
1.100 V
N/A
1.400 V
N/A
69.9 A
N/A
1600 MHz
N/A
75.7 W
N/A
1.050 V
N/A
1.325 V
N/A
50.4 A
N/A
800 MHz
N/A
53.1 W
N/A
1.000 V
N/A
1.225 V
N/A
31.4 A
N/A
15.4 W
N/A
12.0 W
N/A
10.3 W
N/A
6.1 W
N/A
14.8 W
N/A
300 mW
The notes for this table are on page 60 and page 61.
AMD Phenom™ Processor
58
PID: 43375 Rev 3.46 - September 2010
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
HDT75TFBK6DGR21
OPN
State
Specification8
Tcase Max
Tctl Max
S0.C0.Px Tambient Min
Thermal Profile
Startup P-State
HTC P-State
NB COF
VID_VDDNB Min
S0.Cx.Px
VID_VDDNB Max
IDDNB Max
CPU COF
C-State Count
TDP
S0.C0.Pb0
VID_VDD Min
VID_VDD Max
IDD Max
CPU COF
TDP
S0.C0.P0 VID_VDD Min
VID_VDD Max
IDD Max
CPU COF
TDP
S0.C0.P1 VID_VDD Min
VID_VDD Max
IDD Max
CPU COF
TDP
S0.C0.P2 VID_VDD Min
VID_VDD Max
IDD Max
CPU COF
TDP
S0.C0.P3 VID_VDD Min
VID_VDD Max
IDD Max
Core Power (Pre-Flush)
Core Power (Post-Flush)
S0.C1.Pmin
NB Power
I/O Power
S0.C1E.Pmin TDP
I/O Power
S3
Notes Single-Plane Dual-Plane
1
55 oC to 62 oC
2
70 oC
5 oC
AE
5
S0.C0.P0
S0.C0.P3
4
S0.C0.P0
S0.C0.P3
6,7
2000 MHz
2000 MHz
11,7
N/A
1.050 V
11,7
N/A
1.175 V
12
N/A
16.5 A
6
N/A
3500 MHz
23
N/A
3
22
N/A
125.0 W
9
N/A
1.250 V
9
N/A
1.475 V
3,10
N/A
95.0 A
6
800 MHz
3000 MHz
22
53.8 W
125.0 W
9
1.000 V
1.150 V
9
1.225 V
1.475 V
3,10
31.9 A
91.5 A
6
N/A
2300 MHz
22
N/A
99.5 W
9
N/A
1.100 V
9
N/A
1.400 V
3,10
N/A
69.5 A
6
N/A
1600 MHz
22
N/A
77.0 W
9
N/A
1.050 V
9
N/A
1.325 V
3,10
N/A
51.2 A
6
N/A
800 MHz
22
N/A
53.8 W
9
N/A
1.000 V
9
N/A
1.225 V
3,10
N/A
31.9 A
20
N/A
15.7 W
20
N/A
12.1 W
17
N/A
10.3 W
13
N/A
6.1 W
16
N/A
14.4 W
13
N/A
300 mW
The notes for this table are on page 60 and page 61.
AMD Phenom™ Processor
59
PID: 43375 Rev 3.46 - September 2010
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
AMD Phenom™ Processor Thermal and Power Specification Table Notes:
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
19.
20.
21.
Tcase Max is the maximum case temperature specification which is a physical value in degrees
Celsius. Tcase Max can be any valid Tcase Max value in the range specified for the corresponding
OPN.
Tctl Max (maximum control temperature) is a non-physical temperature on an arbitrary scale that can be
used for system thermal management policies. Refer to the BIOS and Kernel Developer’s Guide (BKDG)
for AMD Family 10h Processors, order# 31116.
The processor thermal solution should be designed to accommodate thermal design power (TDP) at
Tcase Max. TDP is measured under the conditions of all cores operating at CPU COF, Tcase Max, and
VDD at the voltage requested by the processor. TDP includes all power dissipated on-die from VDD,
VDDNB, VDDIO, VLDT, VTT, and VDDA. TDP is not the maximum power of the processor.
P-state limit when HTC is active. Refer to the BIOS and Kernel Developer’s Guide (BKDG) for AMD
Family 10h Processors, order# 31116 for more information.
Hardware transitions the part to startup P-state at cold boot. During initialization, the startup NB COF
and VID_VDDNB values may differ from those of the startup P-state. Please see the BIOS and Kernel
Developer's Guide (BKDG) for AMD Family 10h Processors, order# 31116 for detailed power sequencing
information.
Frequency reported to the OS is rounded to the nearest 100-MHz boundary.
During initialization, the startup NB COF and VID_VDDNB values may differ from those of the startup
P-state. Please see the BIOS and Kernel Developer’s Guide (BKDG) For AMD Family 10h Processors,
order# 31116 for specific power sequencing information.
Specifications for multi-core processors assume equivalent P-states (voltage and frequency) and
equivalent Tcase conditions for all cores. Refer to the BIOS and Kernel Developer’s Guide (BKDG) for
AMD Family 10h Processors, order #31116, for details on P-state operation for multi-core processors.
Variable voltage, any valid voltage between VID_VDD Min and VID_VDD Max is allowed.
TDP IDD conditions: single-plane platforms supply IDD and IDDNB tied together and use the IDD Max
specification.
Single-plane platforms have VID_VDD and VID_VDDNB tied together, and use the VID_VDD
specification.
TDP IDDNB conditions: single-plane platforms supply IDD and IDDNB tied together and use the IDDNB
Max specification.
Thermal Design Power dissipated by the processor VDDIO and VTT power planes only. Assumes
VDDIO = 1.8 V and VTT = VDDIO / 2.
Refer to erratum 308 in the Revision Guide for AMD Family 10h Processors, order# 41322 for the
appropriate clock divisor setting.
Assumes 50°C, Min P-state VID_VDD, core clock divider set to 128, and L2 and data cache scrubbing
disabled. Refer to the BIOS and Kernel Developer's Guide (BKDG) for AMD Family 10h Processors,
order# 31116 for recommended settings.
Assumes 35°C, min P-state VID_VDD, core clock divider set to 16, HyperTransport™ link s
disconnected, memory in self-refresh mode, and DDR2 SDRAM interface tristated. Recommended
settings in the BIOS and Kernel Developer's Guide (BKDG) for AMD Family 10h Processors, order#
31116, provide improved power values.
Thermal Design Power dissipated by the processor at min P-state VID_VDDNB.
Thermal Design Power dissipated by the processor at min P-state VID_VDD.
This product is recommended for dual-plane platforms only.
Core Power (Pre-Flush) and (Post-Flush) refers to the Cache Flush On Halt feature described in the
BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 10h Processors, order# 31116. Core Power
pre-flush and post-flush values are based on the recommended BKDG settings. Actual C1 idle core
power varies with system usage according to the following equation:
C1 idle Core Power = F3xDC[CashFlushOnHaltTmr]/OS timer tick interval * Core Power (Pre-Flush) +
(1 - F3xDC[CachFlushOnHaltTmr]/OS timer tick interval * Core Power (Post-Flush))
The default Microsoft ® Windows Vista ® timer tick interval is 15.6 ms. This interval varies between
operating systems and within an operating system depending on usage.
Valid for dual-plane operation only.
AMD Phenom™ Processor
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AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
AMD Phenom™ Processor Thermal and Power Specification Table Notes (Continued):
22. The processor thermal solution should be designed to accommodate thermal design power (TDP) at
Tcase Max. TDP in this state is measured at Tcase Max and VDD at the voltage requested by the
processor with the number of cores in the C1 state specified by C-State Count. TDP includes all power
dissipated on-die from VDD, VDDNB, VDDIO, VLDT, VTT, and VDDA. Due to increased power density
in the state, the processor has an increased probability of hardware thermal control (HTC) activation
compared to S0.C0.P1 at the same ambient temperature. TDP is not the maximum power of the
processor.
23. C-State Count indicates the minimum number of cores in the C1 state required for the remaining cores
to enter this P-state. Refer to F4x164[CstateCnt] in the BIOS and Kernel Developer's Guide (BKDG) for
AMD Family 10h Processors, order# 31116, for more details about the entry requirements into this
P-state.
AMD Phenom™ Processor
61
PID: 43375 Rev 3.46 - September 2010
3
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
AMD Athlon™ Processor
The following sections contain the OPN description and thermal and power specifications for the
AMD Athlon™ Processor. Each column in the thermal and power tables represents a specific
Ordering Part Number (OPN). Section 3.1 provides an example of the OPN structure for this
processor family.
3.1 AMD Athlon™ Processor Ordering Part Number Description
b s mmmm rr p n c dd
Part Definition
Cache Size
Number of Cores
Package
Roadmap
Model
Segment
Brand
Figure 3.
AMD Athlon™ Processor Ordering Part Number Diagram
A D 6500 WC J 2 B GH
Part Definition: GH (see Table 9)
Cache Size: B (see Table 10)
Number of Cores: 2 (see Table 11)
Package: J (see Table 12)
Roadmap: WC (see Table 13)
Model Number: 6500 (see Table 14)
Segment: D = Desktop
Brand: A = AMD Athlon™ Processor
Figure 4.
AMD Athlon™ Processor Ordering Part Number Example
AMD Athlon™ Processor
62
PID: 43375 Rev 3.46 - September 2010
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
Table 9. AMD Athlon™ Processor Part Definition Options
Part
Definition
Revision
CPUID 8000_0001h EAX [31:0]
(CPUID)
GQ
Rev C2
00100F62h
GM
Rev C3
00100F43h, 00100F53h, 00100F63h
Table 10. AMD Athlon™ Processor Cache Size Options
OPN
Character
L2 Cache Size
L3 Cache Size
2
512 KB
0 KB
3
1024 KB
0 KB
Table 11. AMD Athlon™ Processor Number of Cores
OPN
Character
Number of
Cores
2
2
3
3
4
4
Table 12. AMD Athlon™ Processor Package Options
OPN
Character
Package
K
AM3
Table 13. AMD Athlon™ Processor Roadmap Options
OPN
Character
Max TDP
Socket
Infrastructure
IDD Max
(VDD)
IDD Max
(NB)
HS Class
HD
45 W
AM3
45 A
20 A
HS 44
OC
65 W
AM3
60 A
20 A
HS 55
WF
95 W
AM3
80 A
20 A
HS 65
SC
25 W
AM3
20 A
20 A
HS 27
AMD Athlon™ Processor
63
PID: 43375 Rev 3.46 - September 2010
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
Table 14. AMD Athlon™ Processor Model Number Options
Model
Number
Core
Single-Plane
Frequency NB Frequency
Dual-Plane NB Number
Frequency
of Cores
Max DDR
Speed
Max HT Link
Speed
270U
2000 MHz
1800 MHz
1800 MHz
2
1333 MT/s
3600 MT/s
610E
2400 MHz
1600 MHz
2000 MHz
4
1333 MT/s
4000 MT/s
415E
2500 MHz
1600 MHz
2000 MHz
3
1333 MT/s
4000 MT/s
615E
2500 MHz
1600 MHz
2000 MHz
4
1333 MT/s
4000 MT/s
420E
2600 MHz
1600 MHz
2000 MHz
3
1333 MT/s
4000 MT/s
X220
2800 MHz
1600 MHz
2000 MHz
2
1066 MT/s
4000 MT/s
245E
2900 MHz
1600 MHz
2000 MHz
2
1333 MT/s
4000 MT/s
X250
3000 MHz
1600 MHz
2000 MHz
2
1066 MT/s
4000 MT/s
X640
3000 MHz
1600 MHz
2000 MHz
4
1333 MT/s
4000 MT/s
X645
3100 MHz
1600 MHz
2000 MHz
4
1333 MT/s
4000 MT/s
250E
3000 MHz
1600 MHz
2000 MHz
2
1333 MT/s
4000 MT/s
X445
3100 MHz
1600 MHz
2000 MHz
3
1333 MT/s
4000 MT/s
X260
3200 MHz
1600 MHz
2000 MHz
2
1333 MT/s
4000 MT/s
X450
3200 MHz
1600 MHz
2000 MHz
3
1333 MT/s
4000 MT/s
X265
3300 MHz
1600 MHz
2000 MHz
2
1333 MT/s
4000 MT/s
AMD Athlon™ Processor
64
PID: 43375 Rev 3.46 - September 2010
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
Table 15. AMD Athlon™ Processor Thermal Profiles
Thermal Profile
Heat S ink Class
Heat S ink Thermal
Resistance
Heat S ink Local
Ambient
Profile Thermal
Resistance
Profile Ambient
TDP
0.0 W
5.0 W
10.0 W
15.0 W
20.0 W
25.0 W
30.0 W
35.0 W
40.0 W
45.0 W
50.0 W
55.0 W
60.0 W
65.0 W
N
HS55
0.48°C/W
42°C
0.400°C/W
48°C
Tcase Max
55.0°C
55.0°C
55.0°C
55.0°C
56.0°C
58.0°C
60.0°C
62.0°C
64.0°C
66.0°C
68.0°C
70.0°C
72.0°C
74.0°C
Thermal Profile
Heat S ink Class
Heat S ink Thermal
Resistance
Heat S ink Local
Ambient
Profile Thermal
Resistance
Profile Ambient
TDP
0.0 W
5.0 W
10.0 W
15.0 W
20.0 W
25.0 W
30.0 W
35.0 W
40.0 W
45.0 W
S
HS44
0.66°C/W
42°C
0.533°C/W
48°C
Tcase Max
55.0°C
55.0°C
55.0°C
56.0°C
58.7°C
61.3°C
64.0°C
66.7°C
69.3°C
72.0°C
Note: The thermal profile is used to define the relationship between Tcase max and device-specific Thermal
Design Power. The heat sink thermal resistance and heat sink local ambient values specify heat sink design
targets. The profile thermal resistance and profile ambient values specify the relationship between partspecific
power and part-specific Tcase Max. If the heat sink design targets are met, the thermal profile specifications
are met.
AMD Athlon™ Processor
65
PID: 43375 Rev 3.46 - September 2010
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
Table 15: AMD Athlon™ Processor Thermal Profiles (Continued)
Thermal Profile
Heat S ink Class
Heat S ink Thermal
Resistance
Heat S ink Local
Ambient
Profile Thermal
Resistance
Profile Ambient
TDP
0.0 W
5.0 W
10.0 W
15.0 W
20.0 W
25.0 W
W
HS27
1.56°C/W
42°C
1.320°C/W
48°C
Tcase Max
55.0°C
55.0°C
61.2°C
67.8°C
74.4°C
81.0°C
Thermal Profile
Heat S ink Class
Heat S ink Thermal
Resistance
Heat S ink Local
Ambient
Profile Thermal
Resistance
Profile Ambient
TDP
0.0 W
5.0 W
10.0 W
15.0 W
20.0 W
25.0 W
30.0 W
35.0 W
40.0 W
45.0 W
50.0 W
55.0 W
60.0 W
65.0 W
70.0 W
75.0 W
80.0 W
85.0 W
90.0 W
95.0 W
Z
HS65
0.34°C/W
42°C
0.284°C/W
48°C
Tcase Max
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.1°C
56.5°C
57.9°C
59.4°C
60.8°C
62.2°C
63.6°C
65.0°C
66.5°C
67.9°C
69.3°C
70.7°C
72.1°C
73.6°C
75.0°C
Note: The thermal profile is used to define the relationship between Tcase max and device-specific Thermal
Design Power. The heat sink thermal resistance and heat sink local ambient values specify heat sink design
targets. The profile thermal resistance and profile ambient values specify the relationship between partspecific
power and part-specific Tcase Max. If the heat sink design targets are met, the thermal profile specifications are
met.
AMD Athlon™ Processor
66
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AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
Table 15: AMD Athlon™ Processor Thermal Profiles (Continued)
Thermal Profile
Heat S ink Class
Heat S ink Thermal
Resistance
Heat S ink Local
Ambient
Profile Thermal
Resistance
Profile Ambient
TDP
0.0 W
5.0 W
10.0 W
15.0 W
20.0 W
25.0 W
30.0 W
35.0 W
40.0 W
45.0 W
50.0 W
55.0 W
60.0 W
65.0 W
70.0 W
75.0 W
80.0 W
85.0 W
90.0 W
95.0 W
AA
HS65
0.30°C/W
42°C
0.242°C/W
48°C
Tcase Max
55.0 °C
55.0 °C
55.0 °C
55.0 °C
55.0 °C
55.0 °C
55.3 °C
56.5 °C
57.7 °C
58.9 °C
60.1 °C
61.3 °C
62.5 °C
63.7 °C
64.9 °C
66.2 °C
67.4 °C
68.6 °C
69.8 °C
71.0 °C
Thermal Profile
Heat S ink Class
Heat S ink Thermal
Resistance
Heat S ink Local
Ambient
Profile Thermal
Resistance
Profile Ambient
TDP
0.0 W
5.0 W
10.0 W
15.0 W
20.0 W
25.0 W
30.0 W
35.0 W
40.0 W
45.0 W
AB
HS44
0.65°C/W
42°C
0.533°C/W
48°C
Tcase Max
55.0 °C
55.0 °C
55.0 °C
56.0 °C
58.7 °C
61.3 °C
64.0 °C
66.7 °C
69.3 °C
72.0 °C
Note: The thermal profile is used to define the relationship between Tcase max and device-specific Thermal
Design Power. The heat sink thermal resistance and heat sink local ambient values specify heat sink design
targets. The profile thermal resistance and profile ambient values specify the relationship between partspecific
power and part-specific Tcase Max. If the heat sink design targets are met, the thermal profile specifications
are met.
AMD Athlon™ Processor
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AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
3.2 AMD Athlon™ Processor Thermal and Power Table Guide
The thermal and power table guide shown in Table 16 maps SOPNs and the properties associated
with their defined characters to the proper thermal and power table subsections and page numbers.
This table is designed to be used as a quick reference for finding the appropriate subsection for the
thermal and power tables corresponding to an SOPN.
Table 16. AMD Athlon™ Processor Thermal and Power Table Guide
Thermal/Power
Tables
SOPN
Power
Revision
AD mmmm OC pnc GQ
65 W
C2
Section 3.3.1 on
page 70
AD mmmm WF pnc GM 95 W
C3
Section 3.3.2 on
page 71
AD mmmm OC pnc GM 65 W
C3
Section 3.3.3 on
page 73
AD mmmm HD pnc GM 45 W
C3
Section 3.3.4 on
page 76
AD mmmm SC pnc GM
C3
Section 3.3.5 on
page 80
25 W
AMD Athlon™ Processor
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AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
3.3 AMD Athlon™ Processor Thermal and Power Specifications
The thermal and power specification tables contain the thermal and power requirements for each
OPN. This includes the information necessary for thermal management (for example, heat sink
requirements, temperature assumptions) and power delivery (for example, voltage, current, and
power dissipation for each P-state). Refer to the AMD Family 10h Processor Electrical Data Sheet,
order# 40014, for all other electrical specifications for the processor. Refer to the BIOS and Kernel
Developer’s Guide (BKDG) for AMD Family 10h Processors, order# 31116, for power management
BIOS requirements.
Section 3.1 on page 62 provides an example of the OPN structure for processors documented in this
chapter and Table 16 on page 68 provides a guide to OPN organization in the following subsections.
Refer to Section 1.2 on page 9 and Section 1.3 on page 10 for numbering conventions and
terminology definitions used in these tables.
AMD Athlon™ Processor
69
PID: 43375 Rev 3.46 - September 2010
3.3.1
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
AD mmmm OC pnc GQ (65 W, DT, AM3) Thermal and Power Specifications
ADX250OCK23GQ19
OPN
State
S0.C0.Px
Specification8
Tcase Max
Notes Single-Plane Dual-Plane
1
55 oC to 74 oC
Tctl Max
2
5 oC
Tambient Min
Thermal Profile
N
Startup P-State
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
S0.C1.Pmin
70 oC
S0.C0.P3
5
S0.C0.P3
HTC P-State
4
NB COF
6,7
1600 MHz
2000 MHz
VID_VDDNB Min
11,7
N/A
1.150 V
VID_VDDNB Max
11,7
N/A
1.200 V
IDDNB Max
12
N/A
3.7 A
CPU COF
6
TDP
3,7
61.8 W
60.2 W
VID_VDD Min
9
1.200 V
1.200 V
VID_VDD Max
9
1.425 V
1.425 V
IDD Max
3,10
45.0 A
41.6 A
CPU COF
6
3000 MHz
2300 MHz
TDP
3,7
55.4 W
51.2 W
VID_VDD Min
9
1.125 V
1.100 V
VID_VDD Max
9
1.325 V
1.325 V
IDD Max
3,10
40.7 A
30.2 A
CPU COF
6
1800 MHz
TDP
3,7
51.7 W
37.2 W
VID_VDD Min
9
1.125 V
1.000 V
VID_VDD Max
9
1.225 V
1.225 V
IDD Max
3,10
37.7 A
21.8 A
CPU COF
6
TDP
3,7
44.3 W
23.1 W
VID_VDD Min
9
1.125 V
0.850 V
VID_VDD Max
9
1.125 V
1.075 V
800 MHz
IDD Max
3,10
31.5 A
11.8 A
Core Power (Pre-Flush)
20
18.8 W
3.7 W
Core Power (Post-Flush) 20
17.6 W
2.9 W
NB Power
17
N/A
1.7 W
I/O Power
13
6.5 W
6.5 W
S0.C1E.Pmin TDP
S3
I/O Power
16
13.4 W
3.5 W
13
350 mW
350 mW
The notes for this table are on page 81.
AMD Athlon™ Processor
70
PID: 43375 Rev 3.46 - September 2010
3.3.2
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
AD mmmm WF pnc GM (95 W, DT, AM3) Thermal and Power Specifications
ADX640WFK42GM19
OPN
State
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
S0.C1.Pmin
Specification8
Tcase Max
Notes Single-Plane Dual-Plane
1
55 oC to 71 oC
Tctl Max
2
ADX645WFK42GM19
Single-Plane Dual-Plane
55 oC to 71 oC
70 oC
70 oC
Tambient Min
5 oC
5 oC
Thermal Profile
AA
AA
S0.C0.P3
S0.C0.P3
Startup P-State
5
HTC P-State
4
NB COF
6,7
1600 MHz
2000 MHz
1600 MHz
2000 MHz
VID_VDDNB Min
11,7
N/A
1.125 V
N/A
1.125 V
VID_VDDNB Max
11,7
N/A
1.175 V
N/A
1.175 V
IDDNB Max
12
N/A
12.8 A
N/A
12.4 A
CPU COF
6
TDP
3,7
99.4 W
95.0 W
99.0 W
95.0 W
VID_VDD Min
9
1.200 V
1.200 V
1.200 V
1.200 V
VID_VDD Max
9
1.400 V
1.400 V
1.400 V
1.400 V
IDD Max
3,10
75.9 A
70.1 A
75.7 A
63.7 A
CPU COF
6
S0.C0.P3
S0.C0.P3
3000 MHz
3100 MHz
2400 MHz
2300 MHz
TDP
3,7
70.8 W
68.5 W
70.9 W
68.6 W
VID_VDD Min
9
1.125 V
1.100 V
1.125 V
1.100 V
VID_VDD Max
9
1.300 V
1.300 V
1.300 V
1.300 V
IDD Max
3,10
57.0 A
49.2 A
57.1 A
44.9 A
CPU COF
6
1900 MHz
1800 MHz
TDP
3,7
64.1 W
51.6 W
64.2 W
51.8 W
VID_VDD Min
9
1.125 V
1.000 V
1.125 V
1.000 V
VID_VDD Max
9
1.200 V
1.200 V
1.200 V
1.200 V
IDD Max
3,10
51.0 A
34.8 A
51.1 A
31.9 A
CPU COF
6
TDP
3,7
50.6 W
33.4 W
49.3 W
32.7 W
VID_VDD Min
9
1.125 V
0.850 V
1.125 V
0.850 V
VID_VDD Max
9
1.150 V
1.050 V
1.150 V
1.050 V
800 MHz
800 MHz
IDD Max
3,10
39.0 A
17.2 A
37.9 A
14.8 A
Core Power (Pre-Flush)
20
20.1 W
5.5 W
19.4 W
4.5 W
Core Power (Post-Flush) 20
17.6 W
3.9 W
16.9 W
3.0 W
NB Power
17
N/A
9.4 W
N/A
2.4 W
I/O Power
13
6.7 W
6.7 W
6.7 W
6.7 W
S0.C1E.Pmin TDP
S3
I/O Power
16
10.9 W
5.1 W
9.4 W
4.5 W
13
350 mW
350 mW
350 mW
350 mW
The notes for this table are on page 81.
AMD Athlon™ Processor
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AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
ADX445WFK32GM19
OPN
Specification8
State
S0.C0.Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
S0.C1.Pmin
Dual-Plane
Single-Plane
Dual-Plane
Tcase Max
1
55 oC to 75 oC
55 oC to 75 oC
Tctl Max
2
70 oC
70 oC
o
5 oC
5 C
Tambient Min
Z
Z
S0.C0.P3
S0.C0.P3
Thermal Profile
Startup P-State
S0.Cx.Px
Notes Single-Plane
ADX450WFK32GM19
5
S0.C0.P3
S0.C0.P3
HTC P-State
4
NB COF
6,7
1600 MHz
2000 MHz
1600 MHz
2000 MHz
VID_VDDNB Min
11,7
N/A
1.125 V
N/A
1.125 V
VID_VDDNB Max
11,7
N/A
1.200 V
N/A
1.175 V
IDDNB Max
12
N/A
16.4 A
N/A
14.9 A
3200 MHz
3100 MHz
CPU COF
6
TDP
3,7
103.4 W
95.0 W
VID_VDD Min
9
1.200 V
1.200 V
1.200 V
1.200 V
VID_VDD Max
9
1.500 V
1.500 V
1.500 V
1.500 V
IDD Max
3,10
77.1 A
59.3 A
77.0 A
59.6 A
103.0 W
2400 MHz
95.0 W
2500 MHz
CPU COF
6
TDP
3,7
75.4 W
70.7 W
VID_VDD Min
9
1.125 V
1.100 V
1.125 V
1.100 V
VID_VDD Max
9
1.400 V
1.400 V
1.400 V
1.400 V
IDD Max
3,10
59.7 A
41.9 A
59.4 A
42.3 A
CPU COF
6
73.5 W
1900 MHz
70.7 W
2000 MHz
TDP
3,7
70.0 W
55.1 W
69.1 W
57.3 W
VID_VDD Min
9
1.125 V
1.000 V
1.125 V
1.025 V
VID_VDD Max
9
1.300 V
1.300 V
1.325 V
1.325 V
IDD Max
3,10
55.4 A
30.0 A
55.4 A
32.1 A
CPU COF
6
800 MHz
800 MHz
TDP
3,7
59.3 W
38.1 W
58.5 W
37.4 W
VID_VDD Min
9
1.125 V
0.850 V
1.125 V
0.850 V
VID_VDD Max
9
1.175 V
1.150 V
1.150 V
1.150 V
IDD Max
3,10
46.8 A
15.4 A
46.0 A
15.2 A
Core Power (Pre-Flush)
20
26.9 W
5.2 W
26.5 W
5.1 W
Core Power (Post-Flush) 20
24.2 W
3.7 W
23.7 W
3.7 W
N/A
11.8 W
N/A
11.6 W
NB Power
17
I/O Power
S0.C1E.Pmin TDP
S3
I/O Power
13
6.7 W
6.7 W
6.7 W
6.7 W
16
14.9 W
7.6 W
14.6 W
7.4 W
13
350 mW
350 mW
350 mW
350 mW
The notes for this table are on page 81.
AMD Athlon™ Processor
72
PID: 43375 Rev 3.46 - September 2010
3.3.3
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
AD mmmm OC pnc GM (65 W, DT, AM3) Thermal and Power Specifications
ADX260OCK23GM19
OPN
Specification8
State
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
S0.C1.Pmin
Notes Single-Plane
Dual-Plane
Tcase Max
1
55 oC to 74 oC
Tctl Max
2
70 oC
5 oC
Tambient Min
N
Thermal Profile
S0.C0.P3
Startup P-State
5
HTC P-State
4
NB COF
6,7
1600 MHz
2000 MHz
VID_VDDNB Min
11,7
N/A
1.150 V
VID_VDDNB Max
11,7
N/A
1.175 V
IDDNB Max
12
N/A
4.0 A
S0.C0.P3
3200 MHz
CPU COF
6
TDP
3,7
61.8 W
60.2 W
VID_VDD Min
9
1.200 V
1.200 V
VID_VDD Max
9
1.400 V
1.400 V
IDD Max
3,10
44.9 A
41.1 A
CPU COF
6
2500 MHz
TDP
3,7
45.0 W
43.5 W
VID_VDD Min
9
1.100 V
1.100 V
VID_VDD Max
9
1.300 V
1.300 V
IDD Max
3,10
34.2 A
29.5 A
CPU COF
6
1900 MHz
TDP
3,7
41.1 W
31.9 W
VID_VDD Min
9
1.100 V
1.000 V
VID_VDD Max
9
1.200 V
1.200 V
IDD Max
3,10
30.8 A
20.8 A
CPU COF
6
TDP
3,7
34.0 W
19.3 W
VID_VDD Min
9
1.100 V
0.825 V
VID_VDD Max
9
1.125 V
1.025 V
IDD Max
3,10
24.5 A
9.9 A
Core Power (Pre-Flush)
20
15.1 W
3.4 W
Core Power (Post-Flush) 20
13.2 W
2.5 W
800 MHz
NB Power
17
N/A
2.1 W
I/O Power
13
6.5 W
6.5 W
S0.C1E.Pmin TDP
S3
I/O Power
16
9.4 W
4.4 W
13
350 mW
350 mW
The notes for this table are on page 81.
AMD Athlon™ Processor
73
PID: 43375 Rev 3.46 - September 2010
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
ADX265OCK23GM19
OPN
Specification8
State
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
S0.C1.Pmin
Notes Single-Plane
Dual-Plane
Tcase Max
1
55 oC to 74 oC
Tctl Max
2
70 oC
5 oC
Tambient Min
N
Thermal Profile
S0.C0.P3
Startup P-State
5
HTC P-State
4
NB COF
6,7
1800 MHz
2000 MHz
VID_VDDNB Min
11,7
N/A
1.175 V
VID_VDDNB Max
11,7
N/A
1.175 V
IDDNB Max
12
N/A
4.2 A
S0.C0.P3
CPU COF
6
TDP
3,7
62.1 W
60.2 W
VID_VDD Min
9
1.200 V
1.200 V
VID_VDD Max
9
1.500 V
1.500 V
IDD Max
3,10
44.9 A
40.9 A
CPU COF
6
3300 MHz
2600 MHz
TDP
3,7
48.4 W
43.6 W
VID_VDD Min
9
1.150 V
1.100 V
VID_VDD Max
9
1.400 V
1.400 V
IDD Max
3,10
36.4 A
29.5 A
CPU COF
6
1900 MHz
TDP
3,7
43.7 W
31.5 W
VID_VDD Min
9
1.150 V
1.000 V
VID_VDD Max
9
1.300 V
1.300 V
IDD Max
3,10
32.3 A
20.4 A
CPU COF
6
TDP
3,7
36.7 W
19.1 W
VID_VDD Min
9
1.150 V
0.825 V
VID_VDD Max
9
1.150 V
1.125 V
IDD Max
3,10
26.3 A
9.6 A
Core Power (Pre-Flush)
20
19.7 W
3.8 W
Core Power (Post-Flush) 20
18.1 W
3.0 W
800 MHz
NB Power
17
N/A
2.1 W
I/O Power
13
6.5 W
6.5 W
S0.C1E.Pmin TDP
S3
I/O Power
16
12.1 W
4.3 W
13
350 mW
350 mW
The notes for this table are on page 81.
AMD Athlon™ Processor
74
PID: 43375 Rev 3.46 - September 2010
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
ADX220OCK22GM19
OPN
Specification8
State
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
S0.C1.Pmin
Notes Single-Plane
Dual-Plane
Tcase Max
1
55 oC to 74 oC
Tctl Max
2
70 oC
5 oC
Tambient Min
N
Thermal Profile
S0.C0.P3
Startup P-State
5
HTC P-State
4
NB COF
6,7
1600 MHz
2000 MHz
VID_VDDNB Min
11,7
N/A
1.125 V
VID_VDDNB Max
11,7
N/A
1.200 V
IDDNB Max
12
N/A
17.4 A
S0.C0.P3
2800 MHz
CPU COF
6
TDP
3,7
69.7 W
65.0 W
VID_VDD Min
9
1.100 V
1.050 V
VID_VDD Max
9
1.400 V
1.400 V
IDD Max
3,10
56.9 A
43.6 A
CPU COF
6
2100 MHz
TDP
3,7
64.8 W
55.5 W
VID_VDD Min
9
1.100 V
1.000 V
VID_VDD Max
9
1.250 V
1.250 V
IDD Max
3,10
52.9 A
35.0 A
CPU COF
6
1600 MHz
TDP
3,7
61.6 W
50.6 W
VID_VDD Min
9
1.100 V
0.975 V
VID_VDD Max
9
1.150 V
1.150 V
IDD Max
3,10
49.9 A
28.4 A
CPU COF
6
TDP
3,7
56.5 W
41.7 W
VID_VDD Min
9
1.100 V
0.900 V
VID_VDD Max
9
1.100 V
0.950 V
IDD Max
3,10
45.3 A
18.7 A
Core Power (Pre-Flush)
20
27.2 W
7.8 W
Core Power (Post-Flush) 20
25.1 W
6.4 W
800 MHz
NB Power
17
N/A
12.7 W
I/O Power
13
6.7 W
6.7 W
S0.C1E.Pmin TDP
S3
I/O Power
16
14.9 W
8.7 W
13
350 mW
350 mW
The notes for this table are on page 81.
AMD Athlon™ Processor
75
PID: 43375 Rev 3.46 - September 2010
3.3.4
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
AD mmmm HD pnc GM (45 W, DT, AM3) Thermal and Power Specifications
AD415EHDK32GM19
OPN
State
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
S0.C1.Pmin
Specification8
Tcase Max
Notes Single-Plane Dual-Plane
1
55 oC to 72 oC
Tctl Max
2
AD420EHDK32GM19
Single-Plane Dual-Plane
55 oC to 72 oC
70 oC
70 oC
Tambient Min
5 oC
5 oC
Thermal Profile
AB
AB
S0.C0.P3
S0.C0.P3
Startup P-State
5
HTC P-State
4
NB COF
6,7
1600 MHz
2000 MHz
1600 MHz
2000 MHz
VID_VDDNB Min
11,7
N/A
1.100 V
N/A
1.100 V
VID_VDDNB Max
11,7
N/A
1.100 V
N/A
1.100 V
IDDNB Max
12
N/A
3.9 A
N/A
3.1 A
CPU COF
6
TDP
3,7
50.0 W
45.0 W
45.4 W
45.0 W
VID_VDD Min
9
1.050 V
1.000 V
1.050 V
1.000 V
VID_VDD Max
9
1.250 V
1.250 V
1.250 V
1.250 V
IDD Max
3,10
41.2 A
34.4 A
35.7 A
33.3 A
S0.C0.P3
S0.C0.P3
2600 MHz
2500 MHz
2200 MHz
CPU COF
6
TDP
3,7
46.7 W
35.5 W
40.9 W
35.6 W
VID_VDD Min
9
1.050 V
0.925 V
1.050 V
0.925 V
VID_VDD Max
9
1.175 V
1.175 V
1.175 V
1.175 V
IDD Max
3,10
38.1 A
26.7 A
32.6 A
25.9 A
CPU COF
6
2100 MHz
1900 MHz
1800 MHz
TDP
3,7
44.2 W
28.8 W
38.5 W
29.0 W
VID_VDD Min
9
1.050 V
0.850 V
1.050 V
0.850 V
VID_VDD Max
9
1.100 V
1.100 V
1.100 V
1.100 V
IDD Max
3,10
35.8 A
21.0 A
30.3 A
20.5 A
CPU COF
6
800 MHz
800 MHz
TDP
3,7
36.1 W
20.5 W
29.5 W
19.3 W
VID_VDD Min
9
1.050 V
0.775 V
1.050 V
0.775 V
VID_VDD Max
9
1.050 V
1.025 V
1.050 V
1.025 V
IDD Max
3,10
28.0 A
12.3 A
21.7 A
11.2 A
Core Power (Pre-Flush)
20
13.6 W
3.7 W
10.4 W
3.6 W
Core Power (Post-Flush) 20
11.5 W
2.5 W
8.2 W
2.2 W
NB Power
17
N/A
2.9 W
N/A
2.2 W
I/O Power
13
6.7 W
6.7 W
6.7 W
6.7 W
S0.C1E.Pmin TDP
S3
I/O Power
16
7.3 W
2.6 W
4.9 W
2.1 W
13
350 mW
350 mW
350 mW
350 mW
The notes for this table are on page 81.
AMD Athlon™ Processor
76
PID: 43375 Rev 3.46 - September 2010
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
AD610EHDK42GM19
OPN
State
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
S0.C1.Pmin
Specification8
Tcase Max
Notes Single-Plane Dual-Plane
1
55 oC to 72 oC
Tctl Max
2
AD615EHDK42GM19
Single-Plane Dual-Plane
55 oC to 72 oC
70 oC
70 oC
Tambient Min
5 oC
5 oC
Thermal Profile
AB
AB
S0.C0.P3
S0.C0.P3
Startup P-State
5
HTC P-State
4
NB COF
6,7
1600 MHz
2000 MHz
1600 MHz
2000 MHz
VID_VDDNB Min
11,7
N/A
1.100 V
N/A
1.100 V
VID_VDDNB Max
11,7
N/A
1.100 V
N/A
1.100 V
IDDNB Max
12
N/A
3.2 A
N/A
2.5 A
CPU COF
6
TDP
3,7
49.6 W
45.0 W
45.0 W
45.0 W
VID_VDD Min
9
1.050 V
1.000 V
1.050 V
1.000 V
VID_VDD Max
9
1.250 V
1.250 V
1.250 V
1.250 V
IDD Max
3,10
40.9 A
35.1 A
35.8 A
33.9 A
S0.C0.P3
S0.C0.P3
2500 MHz
2400 MHz
2100 MHz
CPU COF
6
TDP
3,7
44.2 W
34.2 W
40.0 W
35.2 W
VID_VDD Min
9
1.050 V
0.925 V
1.050 V
0.925 V
VID_VDD Max
9
1.175 V
1.175 V
1.175 V
1.175 V
IDD Max
3,10
35.7 A
26.1 A
31.7 A
26.2 A
CPU COF
6
1900 MHz
1800 MHz
1700 MHz
TDP
3,7
42.0 W
28.2 W
36.7 W
28.4 W
VID_VDD Min
9
1.050 V
0.850 V
1.050 V
0.850 V
VID_VDD Max
9
1.100 V
1.100 V
1.100 V
1.100 V
IDD Max
3,10
33.6 A
21.1 A
28.6 A
20.6 A
CPU COF
6
800 MHz
800 MHz
TDP
3,7
32.2 W
19.3 W
25.9 W
17.9 W
VID_VDD Min
9
1.050 V
0.775 V
1.050 V
0.775 V
VID_VDD Max
9
1.050 V
1.025 V
1.050 V
1.025 V
IDD Max
3,10
24.3 A
11.7 A
18.3 A
10.3 A
Core Power (Pre-Flush)
20
10.7 W
3.0 W
7.5 W
2.8 W
Core Power (Post-Flush) 20
8.4 W
1.8 W
5.2 W
1.3 W
NB Power
17
N/A
2.4 W
N/A
1.8 W
I/O Power
13
6.7 W
6.7 W
6.7 W
6.7 W
S0.C1E.Pmin TDP
S3
I/O Power
16
5.2 W
1.9 W
2.9 W
1.3 W
13
350 mW
350 mW
350 mW
350 mW
The notes for this table are on page 81.
AMD Athlon™ Processor
77
PID: 43375 Rev 3.46 - September 2010
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
AD245EHDK23GM19
OPN
Specification8
State
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
S0.C1.Pmin
Notes Single-Plane
Dual-Plane
Tcase Max
1
55 oC to 72 oC
Tctl Max
2
70 oC
5 oC
Tambient Min
Thermal Profile
S
S0.C0.P3
Startup P-State
5
HTC P-State
4
NB COF
6,7
1600 MHz
2000 MHz
VID_VDDNB Min
11,7
N/A
1.125 V
VID_VDDNB Max
11,7
N/A
1.125 V
IDDNB Max
12
N/A
3.1 A
S0.C0.P3
CPU COF
6
TDP
3,7
46.0 W
45.0 W
VID_VDD Min
9
1.150 V
1.150 V
VID_VDD Max
9
1.400 V
1.400 V
IDD Max
3,10
33.3 A
30.4 A
CPU COF
6
2900 MHz
2100 MHz
TDP
3,7
34.9 W
31.9 W
VID_VDD Min
9
1.100 V
1.050 V
VID_VDD Max
9
1.250 V
1.250 V
IDD Max
3,10
25.8 A
20.8 A
CPU COF
6
1500 MHz
TDP
3,7
31.2 W
24.6 W
VID_VDD Min
9
1.100 V
0.975 V
VID_VDD Max
9
1.150 V
1.150 V
IDD Max
3,10
22.5 A
15.0 A
CPU COF
6
TDP
3,7
26.9 W
18.0 W
VID_VDD Min
9
1.100 V
0.875 V
VID_VDD Max
9
1.100 V
1.000 V
IDD Max
3,10
16.9 A
8.4 A
Core Power (Pre-Flush)
20
10.7 W
3.2 W
9.0 W
2.3 W
Core Power (Post-Flush) 20
800 MHz
NB Power
17
N/A
1.7 W
I/O Power
13
6.5 W
6.5 W
S0.C1E.Pmin TDP
S3
I/O Power
16
6.5 W
3.7 W
13
350 mW
350 mW
The notes for this table are on page 81.
AMD Athlon™ Processor
78
PID: 43375 Rev 3.46 - September 2010
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
AD250EHDK23GM 19
OPN
State
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
S0.C1.Pmin
Specification8
Tcase Max
Notes Single-Plane Dual-Plane
1
55 oC to 72 oC
Tctl Max
2
70 oC
5 oC
Tambient Min
S
Thermal Profile
Startup P-State
5
HTC P-State
4
NB COF
6,7
1600 MHz
2000 MHz
VID_VDDNB Min
11,7
N/A
1.125 V
VID_VDDNB Max
11,7
N/A
1.125 V
IDDNB Max
12
N/A
3.1 A
CPU COF
6
TDP
3,7
45.9 W
45.0 W
VID_VDD Min
9
1.150 V
1.150 V
VID_VDD Max
9
1.400 V
1.400 V
IDD Max
3,10
33.3 A
30.5 A
CPU COF
6
TDP
3,7
34.9 W
32.0 W
VID_VDD Min
9
1.100 V
1.050 V
VID_VDD Max
9
1.250 V
1.250 V
IDD Max
3,10
25.9 A
20.9 A
CPU COF
6
S0.C0.P3
S0.C0.P3
3000 MHz
2200 MHz
1700 MHz
TDP
3,7
31.9 W
25.5 W
VID_VDD Min
9
1.100 V
0.975 V
VID_VDD Max
9
1.150 V
1.150 V
IDD Max
3,10
23.1 A
15.6 A
CPU COF
6
800 MHz
TDP
3,7
26.4 W
17.1 W
VID_VDD Min
9
1.100 V
0.850 V
VID_VDD Max
9
1.100 V
0.975 V
IDD Max
3,10
16.4 A
7.7 A
Core Power (Pre-Flush)
20
10.3 W
2.8 W
8.7 W
2.0 W
Core Power (Post-Flush) 20
NB Power
17
N/A
1.7 W
I/O Power
13
6.5 W
6.5 W
S0.C1E.Pmin TDP
S3
I/O Power
16
6.3 W
3.4 W
13
350 mW
350 mW
The notes for this table are on page 81.
AMD Athlon™ Processor
79
PID: 43375 Rev 3.46 - September 2010
3.3.5
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
AD mmmm SC pnc GM (25 W, DT, AM3) Thermal and Power Specifications
AD270USCK23GM19
OPN
Specification8
State
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C1.Pmin
Notes Single-Plane
Dual-Plane
o
Tcase Max
1
55 C to 81 oC
Tctl Max
2
70 oC
5 oC
Tambient Min
Thermal Profile
W
Startup P-State
5
HTC P-State
4
NB COF
6,7
1800 MHz
1800 MHz
VID_VDDNB Min
11,7
N/A
1.050 V
VID_VDDNB Max
11,7
N/A
1.050 V
IDDNB Max
12
N/A
CPU COF
6
TDP
3,7
25.0 W
25.0 W
VID_VDD Min
9
1.050 V
1.000 V
VID_VDD Max
9
1.150 V
1.150 V
IDD Max
3,10
17.7 A
15.7 A
CPU COF
6
TDP
3,7
22.4 W
20.7 W
VID_VDD Min
9
1.050 V
0.950 V
VID_VDD Max
9
1.100 V
1.100 V
IDD Max
3,10
15.3 A
12.2 A
CPU COF
6
S0.C0.P2
S0.C0.P2
2.0 A
2000 MHz
1600 MHz
800 MHz
TDP
3,7
17.3 W
13.8 W
VID_VDD Min
9
1.050 V
0.825 V
VID_VDD Max
9
1.050 V
0.975 V
IDD Max
3,10
10.4 A
6.1 A
Core Power (Pre-Flush)
20
4.8 W
1.7 W
Core Power (Post-Flush) 20
3.4 W
0.8 W
NB Power
17
N/A
1.2 W
I/O Power
S0.C1E.Pmin TDP
S3
I/O Power
13
6.4 W
6.4 W
16
2.4 W
1.8 W
13
350 mW
350 mW
The notes for this table are on page 81.
AMD Athlon™ Processor
80
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AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
AMD Athlon™ Processor Thermal and Power Specification Table Notes:
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
19.
20.
21.
Tcase Max is the maximum case temperature specification which is a physical value in degrees
Celsius. Tcase Max can be any valid Tcase Max value in the range specified for the corresponding
OPN.
Tctl Max (maximum control temperature) is a non-physical temperature on an arbitrary scale that can be
used for system thermal management policies. Refer to the BIOS and Kernel Developer’s Guide (BKDG)
for AMD Family 10h Processors, order# 31116.
The processor thermal solution should be designed to accommodate thermal design power (TDP) at
Tcase Max. TDP is measured under the conditions of all cores operating at CPU COF, Tcase Max, and
VDD at the voltage requested by the processor. TDP includes all power dissipated on-die from VDD,
VDDNB, VDDIO, VLDT, VTT, and VDDA. TDP is not the maximum power of the processor.
P-state limit when HTC is active. Refer to the BIOS and Kernel Developer’s Guide (BKDG) for AMD
Family 10h Processors, order# 31116 for more information.
Hardware transitions the part to startup P-state at cold boot. During initialization, the startup NB COF
and VID_VDDNB values may differ from those of the startup P-state. Please see the BIOS and Kernel
Developer's Guide (BKDG) for AMD Family 10h Processors, order# 31116 for detailed power sequencing
information.
Frequency reported to the OS is rounded to the nearest 100-MHz boundary.
During initialization, the startup NB COF and VID_VDDNB values may differ from those of the startup
P-state. Please see the BIOS and Kernel Developer’s Guide (BKDG) For AMD Family 10h Processors,
order# 31116 for specific power sequencing information.
Specifications for multi-core processors assume equivalent P-states (voltage and frequency) and
equivalent Tcase conditions for all cores. Refer to the BIOS and Kernel Developer’s Guide (BKDG) for
AMD Family 10h Processors, order #31116, for details on P-state operation for multi-core processors.
Variable voltage, any valid voltage between VID_VDD Min and VID_VDD Max is allowed.
TDP IDD conditions: single-plane platforms supply IDD and IDDNB tied together and use the IDD Max
specification.
Single-plane platforms have VID_VDD and VID_VDDNB tied together, and use the VID_VDD
specification.
TDP IDDNB conditions: single-plane platforms supply IDD and IDDNB tied together and use the IDDNB
Max specification.
Thermal Design Power dissipated by the processor VDDIO and VTT power planes only. Assumes
VDDIO = 1.8 V and VTT = VDDIO / 2.
Refer to erratum 308 in the Revision Guide for AMD Family 10h Processors, order# 41322 for the
appropriate clock divisor setting.
Assumes 50°C, Min P-state VID_VDD, core clock divider set to 128, and L2 and data cache scrubbing
disabled. Refer to the BIOS and Kernel Developer's Guide (BKDG) for AMD Family 10h Processors,
order# 31116 for recommended settings.
Assumes 35°C, min P-state VID_VDD, core clock divider set to 16, HyperTransport™ link s
disconnected, memory in self-refresh mode, and DDR2 SDRAM interface tristated. Recommended
settings in the BIOS and Kernel Developer's Guide (BKDG) for AMD Family 10h Processors, order#
31116, provide improved power values.
Thermal Design Power dissipated by the processor at min P-state VID_VDDNB.
Thermal Design Power dissipated by the processor at min P-state VID_VDD.
This product is recommended for dual-plane platforms only.
Core Power (Pre-Flush) and (Post-Flush) refers to the Cache Flush On Halt feature described in the
BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 10h Processors, order# 31116. Core Power
pre-flush and post-flush values are based on the recommended BKDG settings. Actual C1 idle core
power varies with system usage according to the following equation:
C1 idle Core Power = F3xDC[CashFlushOnHaltTmr]/OS timer tick interval * Core Power (Pre-Flush) +
(1 - F3xDC[CachFlushOnHaltTmr]/OS timer tick interval * Core Power (Post-Flush))
The default Microsoft ® Windows Vista ® timer tick interval is 15.6 ms. This interval varies between
operating systems and within an operating system depending on usage.
Valid for dual-plane operation only.
AMD Athlon™ Processor
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4
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
AMD Sempron™ Processor
The following sections contain the OPN description and thermal and power specifications for the
AMD Sempron™ Processor. Each column in the thermal and power tables represents a specific
Ordering Part Number (OPN). Section 4.1 provides an example of the OPN structure for this
processor family.
4.1 AMD Sempron™ Processor Ordering Part Number Description
b s mmmm rr p n c dd
Part Definition
Cache Size
Number of Cores
Package
Roadmap
Model
Segment
Brand
Figure 5.
AMD Sempron™ Processor Ordering Part Number Diagram
S D X145 HB K 1 3 GM
Part Definition: GM (see Table 17)
Cache Size: 3 (see Table 18)
Number of Cores: 1 (see Table 19)
Package: K (see Table 20)
Roadmap: HB (see Table 21)
Model Number: X145 (see Table 22)
Segment: D = Desktop
Brand: S = AMD Sempron™ Processor
Figure 6.
AMD Sempron™ Processor Ordering Part Number Example
AMD Sempron™ Processor
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Power and Thermal Data Sheet
Table 17. AMD Sempron™ Processor Part Definition Options
Part
Definition
Revision
CPUID 8000_0001h EAX [31:0]
(CPUID)
GM
Rev C3
00100F63h
Table 18. AMD Sempron™ Processor Cache Size Options
OPN
Character
L2 Cache Size
L3 Cache Size
3
1024 KB
0 KB
Table 19. AMD Sempron™ Processor Number of Cores
OPN
Character
Number of
Cores
1
1
Table 20. AMD Sempron™ Processor Package Options
OPN
Character
Package
K
AM3
Table 21. AMD Sempron™ Processor Roadmap Options
OPN
Character
Max TDP
Socket
Infrastructure
IDD Max
(VDD)
IDD Max
(NB)
HS Class
HB
45 W
AM3
45 A
20 A
HS 55
Table 22. AMD Sempron™ Processor Model Number Options
Model
Number
Core
Single-Plane
Frequency NB Frequency
Dual-Plane NB Number
Frequency
of Cores
Max DDR
Speed
Max HT Link
Speed
X145
2800 MHz
2000 MHz
1066 MT/s
4000 MT/s
1600 MHz
1
AMD Sempron™ Processor
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Power and Thermal Data Sheet
Table 23. AMD Sempron™ Processor Thermal Profiles
Thermal Profile
Heat S ink Class
Heat S ink Thermal
Resistance
Heat S ink Local
Ambient
Profile Thermal
Resistance
Profile Ambient
TDP
0.0 W
5.0 W
10.0 W
15.0 W
20.0 W
25.0 W
30.0 W
35.0 W
41.0 W
R
HS55
0.51°C/W
42°C
0.366°C/W
48°C
Tcase Max
55.0°C
55.0°C
55.0°C
55.0°C
55.3°C
57.2°C
59.0°C
60.8°C
63.0°C
Note: The thermal profile is used to define the relationship between Tcase max and device-specific Thermal
Design Power. The heat sink thermal resistance and heat sink local ambient values specify heat sink design
targets. The profile thermal resistance and profile ambient values specify the relationship between part-specific
power and part-specific Tcase Max. If the heat sink design targets are met, the thermal profile specifications
are met.AMD Athlon™ Processor Thermal Profiles
AMD Sempron™ Processor
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Power and Thermal Data Sheet
4.2 AMD Sempron™ Processor Thermal and Power Table Guide
The thermal and power table guide shown in Table 24 maps SOPNs and the properties associated
with their defined characters to the proper thermal and power table subsections and page numbers.
This table is designed to be used as a quick reference for finding the appropriate subsection for the
thermal and power tables corresponding to an SOPN.
Table 24. AMD Sempron™ Processor Thermal and Power Table Guide
SOPN
Power
SD mmmm HB pnc GM 45 W
Revision
C3
Thermal/Power
Tables
Section 4.3.1 on
page 87
AMD Sempron™ Processor
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AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
4.3 AMD Sempron™ Processor Thermal and Power Specifications
The thermal and power specification tables contain the thermal and power requirements for each
OPN. This includes the information necessary for thermal management (for example, heat sink
requirements, temperature assumptions) and power delivery (for example, voltage, current, and
power dissipation for each P-state). Refer to the AMD Family 10h Processor Electrical Data Sheet,
order# 40014, for all other electrical specifications for the processor. Refer to the BIOS and Kernel
Developer’s Guide (BKDG) for AMD Family 10h Processors, order# 31116, for power management
BIOS requirements.
Section 4.1 on page 82 provides an example of the OPN structure for processors documented in this
chapter and Table 24 on page 85 provides a guide to OPN organization in the following subsections.
Refer to Section 1.2 on page 9 and Section 1.3 on page 10 for numbering conventions and
terminology definitions used in these tables.
AMD Sempron™ Processor
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4.3.1
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
SD mmmm HB pnc GM (45 W, DT, AM3) Thermal and Power Specifications
SDX145HBK13GM19
OPN
State
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
S0.C1.Pmin
Specification
Notes Single-Plane
Dual-Plane
Tcase Max
1
55 oC to 63 oC
Tctl Max
2
70 oC
5 oC
Tambient Min
R
Thermal Profile
S0.C0.P3
Startup P-State
5
HTC P-State
4
NB COF
6,7
1600 MHz
2000 MHz
VID_VDDNB Min
11,7
N/A
1.175 V
VID_VDDNB Max
11,7
N/A
1.175 V
IDDNB Max
12
N/A
4.4 A
S0.C0.P3
CPU COF
6
TDP
3,7
42.0 W
41.0 W
VID_VDD Min
9
1.100 V
1.100 V
VID_VDD Max
9
1.350 V
1.350 V
IDD Max
3,10
30.1 A
26.7 A
CPU COF
6
2800 MHz
2000 MHz
TDP
3,7
36.9 W
30.3 W
VID_VDD Min
9
1.050 V
1.000 V
VID_VDD Max
9
1.250 V
1.250 V
IDD Max
3,10
27.6 A
18.7 A
CPU COF
6
1600 MHz
TDP
3,7
35.5 W
23.9 W
VID_VDD Min
9
1.050 V
0.900 V
VID_VDD Max
9
1.150 V
1.150 V
IDD Max
3,10
26.4 A
13.6 A
CPU COF
6
TDP
3,7
32.7 W
19.4 W
VID_VDD Min
9
1.050 V
0.825 V
VID_VDD Max
9
1.075 V
1.075 V
IDD Max
3,10
23.9 A
9.5 A
Core Power (Pre-Flush)
20
15.9 W
4.1 W
Core Power (Post-Flush) 20
14.1 W
2.9 W
800 MHz
NB Power
17
N/A
2.2 W
I/O Power
13
6.5 W
6.5 W
S0.C1E.Pmin TDP
S3
I/O Power
16
9.8 W
4.9 W
13
350 mW
350 mW
The notes for this table are on page 88.
AMD Sempron™ Processor
87
PID: 43375 Rev 3.46 - September 2010
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
AMD Sempron™ Processor Thermal and Power Specification Table Notes:
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
19.
20.
Tcase Max is the maximum case temperature specification which is a physical value in degrees
Celsius. Tcase Max can be any valid Tcase Max value in the range specified for the corresponding
OPN.
Tctl Max (maximum control temperature) is a non-physical temperature on an arbitrary scale that can be
used for system thermal management policies. Refer to the BIOS and Kernel Developer’s Guide (BKDG)
for AMD Family 10h Processors, order# 31116.
The processor thermal solution should be designed to accommodate thermal design power (TDP) at
Tcase Max. TDP is measured under the conditions of all cores operating at CPU COF, Tcase Max, and
VDD at the voltage requested by the processor. TDP includes all power dissipated on-die from VDD,
VDDNB, VDDIO, VLDT, VTT, and VDDA. TDP is not the maximum power of the processor.
P-state limit when HTC is active. Refer to the BIOS and Kernel Developer’s Guide (BKDG) for AMD
Family 10h Processors, order# 31116 for more information.
Hardware transitions the part to startup P-state at cold boot. During initialization, the startup NB COF
and VID_VDDNB values may differ from those of the startup P-state. Please see the BIOS and Kernel
Developer's Guide (BKDG) for AMD Family 10h Processors, order# 31116 for detailed power sequencing
information.
Frequency reported to the OS is rounded to the nearest 100-MHz boundary.
During initialization, the startup NB COF and VID_VDDNB values may differ from those of the startup
P-state. Please see the BIOS and Kernel Developer’s Guide (BKDG) For AMD Family 10h Processors,
order# 31116 for specific power sequencing information.
Specifications for multi-core processors assume equivalent P-states (voltage and frequency) and
equivalent Tcase conditions for all cores. Refer to the BIOS and Kernel Developer’s Guide (BKDG) for
AMD Family 10h Processors, order #31116, for details on P-state operation for multi-core processors.
Variable voltage, any valid voltage between VID_VDD Min and VID_VDD Max is allowed.
TDP IDD conditions: single-plane platforms supply IDD and IDDNB tied together and use the IDD Max
specification.
Single-plane platforms have VID_VDD and VID_VDDNB tied together, and use the VID_VDD
specification.
TDP IDDNB conditions: single-plane platforms supply IDD and IDDNB tied together and use the IDDNB
Max specification.
Thermal Design Power dissipated by the processor VDDIO and VTT power planes only. Assumes
VDDIO = 1.8 V and VTT = VDDIO / 2.
Refer to erratum 308 in the Revision Guide for AMD Family 10h Processors, order# 41322 for the
appropriate clock divisor setting.
Assumes 50°C, Min P-state VID_VDD, core clock divider set to 128, and L2 and data cache scrubbing
disabled. Refer to the BIOS and Kernel Developer's Guide (BKDG) for AMD Family 10h Processors,
order# 31116 for recommended settings.
Assumes 35°C, min P-state VID_VDD, core clock divider set to 16, HyperTransport™ link s
disconnected, memory in self-refresh mode, and DDR2 SDRAM interface tristated. Recommended
settings in the BIOS and Kernel Developer's Guide (BKDG) for AMD Family 10h Processors, order#
31116, provide improved power values.
Thermal Design Power dissipated by the processor at min P-state VID_VDDNB.
Thermal Design Power dissipated by the processor at min P-state VID_VDD.
This product is recommended for dual-plane platforms only.
Core Power (Pre-Flush) and (Post-Flush) refers to the Cache Flush On Halt feature described in the
BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 10h Processors, order# 31116. Core Power
pre-flush and post-flush values are based on the recommended BKDG settings. Actual C1 idle core
power varies with system usage according to the following equation:
C1 idle Core Power = F3xDC[CashFlushOnHaltTmr]/OS timer tick interval * Core Power (Pre-Flush) +
(1 - F3xDC[CachFlushOnHaltTmr]/OS timer tick interval * Core Power (Post-Flush))
The default Microsoft ® Windows Vista ® timer tick interval is 15.6 ms. This interval varies between
operating systems and within an operating system depending on usage.
AMD Sempron™ Processor
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5
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
Power Supply Specifications
For socket infrastructures not covered by this document refer to the AMD Infrastructure Roadmap,
order# 41842.
5.1 bsmmmmrr J ncdd – AM2r2 Power Supply Operating Conditions
Table 25. bsmmmmrr J ncdd DC Operating Conditions for VDD Power Supply
Symbol
Parameter
Units
VID_VDD
VID-Requested VDD
Supply Level
V
VDD_PON
DC Tolerance - VDD
Supply Voltage
Metal Mask VID
V
VDDNB_dc
VDDNB Supply voltage
V
VID_VDDNB
VDDNB Supply voltage
V
VDD_dc
V
Min
Typ
Max
Notes
Refer to the thermal/power tables under the
appropriate SOPN section for this OPN-specific
parameter.
VID_VDD
VID_VDD
VID_VDD
– 50 mV
+ 50 mV
0.95
1.00
MaxVID_VDD
1,2
VID_VDDNB VID_VDDNB VID_VDDNB
– 50 mV
+ 50 mV
Refer to the thermal/power tables under the
appropriate SOPN section for this OPN-specific
parameter.
0.95
1.00
MaxVID_VDDNB 1,2
VDDNB_PON
Metal Mask VDDNB
V
Notes:
1) After PWROK assertion, the VID signals change from the Metal Mask VID to the value programmed during device
manufacturing.
2) MaxVID is reported in MSRC001_0071 (COFVID_STATUS).
Table 26. bsmmmmrr J ncdd AC Operating Conditions for VDD Power Supply
Symbol
Parameter
Units
VDD_ac
VDD Supply Voltage
V
VDDNB_ac
VDDNB Supply Voltage
V
Min
Typ
VID_VDD –
VID_VDD
140 mV
VID_VDDNB
VID_VDDNB
– 140 mV
Max
VID_VDD + 150
mV
VID_VDDNB
+ 150 mV
Notes
1
1
Notes:
1) The voltage set-point must be contained within the DC specification in order to ensure proper operation.
Voltage ripple and transient events outside the DC specification must remain within the AC specification at all
times. Transients above dc max must return to within the DC specification within 30 μS and must stay under a
triangle described by the AC limit at one end and the DC limit at the other, as shown in Figure 7 on page 90.
Power Supply Specifications
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Power and Thermal Data Sheet
Table 27. bsmmmmrr J ncdd Maximum Power-Up and Power-Down Conditions for Power
Supplies
Symbol
VDDIO
VDDIO
VLDT
VDDA
VDD, VDDNB
Parameter
VDDIO Supply Voltage for
DDR2 electricals
VDDIO Supply Voltage for
DDR3 electricals
VLDT Supply Voltage
VDDA Supply Voltage
VDD, VDDNB Supply
Voltage
Units
Max
V
2.05
V
1.65
V
V
1.32
2.70
Max AC
Voltage
V
VID + 1 50 mV
VID + 50 mV
VID
VID – 50 mV
VID – 140 mV
30 μs
Figure 7.
Socket AM2 AC and DC Transient Limits
Power Supply Specifications
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Power and Thermal Data Sheet
Table 28. bsmmmmrr J ncdd AC and DC Operating Conditions for non-VDD Power Supplies
Symbol
VDDIO_dc
Parameter
Units
VDDIO Supply Voltage for
V
DDR2 electricals
Min
Typ
Max
Notes
1.70
1.80
1.90
1
VDDIO_ac
VDDIO Supply voltage
V
VLDT
VLDT Supply Voltage
VTT Supply Voltage for
DDR2 electricals
V
VDDIO_dc –
150 mV
1.14
V
0.85
VTT_dc
VTT_ac
VTT Supply Voltage
V
VDDA
VDDA Supply Voltage
VDDIO Power Supply
Current
V
IDDIO1
ITT1
ILDT
IDDA
VTT_dc –
75mV
2.40
1.20
VDDIO_dc + 150
2, 3
mV
1.26
12
0.90
0.95
VTT_dc
VTT_dc + 75mV 2, 3
2.50
2.60
VDDIO_dc
4
A
3.60
7, 9
VTT Power Supply Current A
1.75
6, 8, 9
VLDT Power Supply
Current
VDDA Power Supply
Current
A
1.40/ link
0.65/ link
5, 9
9,10,11
mA
250
9
Notes:
1) All voltages are referenced to VSS. In order to ensure proper functionality, DC voltage regulator must be
set accordingly to ensure that VDDIO_dc level measured at the VDDIO_FB_H/L pins does not exceed the
specified maximum and minimum range. As such, factors such as voltage regulator inaccuracy and IR drop must
be carefully considered and compensated for. For example, if the inaccuracy and IR drop amounts to 50 mV, then
the voltage regulator setting for VDDIO should not be lower than 1.75 V to avoid violating the VDDIO_dc
minimum spec of 1.70 V.
2) VDDIO_ac and VTT_ac parameters are measured over 60 seconds time frame with all
data bus bits switching.
3) Power supply A/C measurements use a 20-MHz scope bandwidth limit.
4) All voltages are referenced to VSS. Voltage regulator for VTT must be set accordingly so that VTT_dc level
measured at the processor VTT_SENSE pin tracks 0.5*VDDIO_dc and stays within the specified maximum and
minimum range. Factors such as voltage regulator inaccuracy and IR drop must be carefully considered and
compensated for. For example, if the inaccuracy and IR drop amounts to 20 mV, the voltage regulator setting
must be set 20 mV higher so that VTT still tracks 0.5*VDDIO_dc and stays within the range
of 0.85 V and 0.95 V.
5) ILDT is specified for one 16x16-bit Gen3 link.
6) VTT must both sink and source current.
7) VDDIO current is consumed by I, O, I/O switching current and on-chip functions (PDL, DLL, level-shifters, etc.).
8) VTT current is consumed by I, O, I/O switching current and on-chip functions (PDL, DLL, level-shifters, etc.).
9) This specification reflects the values published in the appropriate power roadmap document.
10) ILDT is specified for each unconnected HyperTransport™ link or for each 16x16 bit Gen1
HyperTransport link operating at max 2.0 GT/s or less.
11) Please refer to erratum 396.
12) Tolerances apply to both VLDT_dc and VLDT_ac conditions.
Power Supply Specifications
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Power and Thermal Data Sheet
5.2 bsmmmmrr K ncdd – AM3 Power Supply Operating Conditions
Table 29. bsmmmmrr K ncdd DC Operating Conditions for VDD Power Supply
Symbol
Parameter
Units
VID_VDD
VID-Requested VDD
Supply Level
V
VDD_dc
DC Tolerance - VDD
Supply Voltage
V
VDD_PON
Metal Mask VID
V
VDDNB_dc
VDDNB Supply voltage
V
VID_VDDNB
VDDNB Supply voltage
V
Min
Typ
Max
Refer to the thermal/power tables under the
appropriate SOPN section for this OPNspecific parameter.
VID_VDD
VID_VDD
VID_VDD
–50 mV
+ 50 mV
0.95
1.00
Notes
MaxVID_VDD 1,2
VID_VDDNB VID_VDDNB VID_VDDNB
–50 mV
+ 50 mV
Refer to the thermal/power tables under the
appropriate SOPN section for this OPNspecific parameter.
0.95
1.00
MaxVID_VDD 1,2
VDDNB_PON
Metal Mask VDDNB
V
Notes:
1) After PWROK assertion, the VID signals change from the Metal Mask VID to the value programmed during
device manufacturing.
2) MaxVID is reported in MSRC001_0071 (COFVID_STATUS).
Table 30. bsmmmmrr K ncdd AC Operating Conditions for VDD Power Supply
Symbol
Parameter
Units
VDD_ac
VDD Supply Voltage
V
VDDNB_ac
VDDNB Supply Voltage
V
Min
Typ
VID_VDD
VID_VDD
–140 mV
VID_VDDNB
VID_VDDNB
–140 mV
Max
VID_VDD +
150 mV
VID_VDDNB
+ 150 mV
Notes
1
1
Notes:
1) The voltage set-point must be contained within the DC specification in order to ensure proper operation.
Voltage ripple and transient events outside the DC specification must remain within the AC specification at all.
times. Transients above dc max must return to within the DC specification within 30 μS and must stay under a
triangle described by the AC limit at one end and the DC limit at the other, as shown in Figure 8 on page 93.
Power Supply Specifications
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Power and Thermal Data Sheet
Table 31. bsmmmmrr K ncdd Maximum Power-Up and Power-Down Conditions for Power
Supplies
Symbol
VDDIO
VDDIO
VLDT
VDDA
VDD, VDDNB
Parameter
VDDIO Supply Voltage for
DDR2 electricals
VDDIO Supply Voltage for
DDR3 electricals
VLDT Supply Voltage
VDDA Supply Voltage
VDD, VDDNB Supply
Voltage
Units
Max
V
2.05
V
1.65
V
V
1.32
2.70
Max AC
Voltage
V
VID + 1 50 mV
VID + 50 mV
VID
VID – 50 mV
VID – 140 mV
30 μs
Figure 8.
Socket AM3 AC and DC Transient Limits
Power Supply Specifications
93
PID: 43375 Rev 3.46 - September 2010
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
Table 32. bsmmmmrr K ncdd AC and DC Operating Conditions for non-VDD Power Supplies
Symbol
VDDIO_dc
Parameter
Units
VDDIO Supply Voltage for
V
DDR3 electricals
VDDIO_ac
VDDIO Supply voltage
VLDT
VLDT Supply Voltage
V
VDDR Supply Voltage for
V
DDR3 electricals
VDDR_dc
V
VDDR_ac
VDDR Supply Voltage
V
VDDA
VDDA Supply Voltage
VDDIO Power Supply
Current
VDDR Power Supply
Current
VLDT Power Supply
Current
VDDA Power Supply
Current
V
IDDIO1
IDDR
ILDT
IDDA
Min
Typ
Max
Notes
1.375
1.500
1.625
1
VDDIO_dc –
VDDIO_dc
125 mV
1.14
1.20
VDDIO_dc +
125 mV
1.26
1.14
1.26
VDDR_dc
–60mV
2.40
1.20
VDDR_dc
2.50
VDDR_dc +
60mV
2.60
2, 3
12
4
2, 3
A
3.60
7, 9
A
1.75
6, 8, 9
A
1.40/ link
0.65/ link
5, 9
9,10,11
mA
9
Notes:
1) All voltages are referenced to VSS. In order to ensure proper functionality, DC voltage regulator must be
set accordingly to ensure that VDDIO_dc level measured at the VDDIO_FB_H/L pins does not exceed the
specified maximum and minimum range. As such, factors such as voltage regulator inaccuracy and IR drop must
be carefully considered and compensated for. For example, if the inaccuracy and IR drop amounts to 50 mV, then
the voltage regulator setting for VDDIO should not be lower than 1.425 V to avoid violating the VDDIO_dc
minimum spec of 1.375 V.
2) VDDIO_ac and VDDR_ac parameters are measured over 60 seconds time frame with all data bus bits switching.
3) Power supply A/C measurements use a 20-MHz scope bandwidth limit.
4) All voltages are referenced to VSS. Voltage regulator for VDDR must be set accordingly so that VDDR_dc level
measured at the processor with VDDR_SENSE pin stay within the specified maximum and minimum DC tolerance
limits. Factors such as voltage regulator inaccuracy and IR drop must be carefully considered and compensated
for to ensure the VDDR stays within the specified DC tolerance limits.
5) ILDT is specified for one 16x16-bit Gen3 link.
6) VDDR must both sink and source current.
7) VDDIO current is consumed by I, O, I/O switching current and on-chip functions (PDL, DLL, level-shifters, etc.).
8) VDDR current is consumed by I, O, I/O switching current and on-chip functions (PDL, DLL, level-shifters, etc.).
9) This specification reflects the values published in the appropriate power roadmap document.
10) ILDT is specified for one 16x16-bit HyperTransport™ link operating at 2.0 GT/s.
11) Please refer to erratum 396.
12) Tolerances apply to both VLDT_dc and VLDT_ac conditions.
Power Supply Specifications
94
PID: 43375 Rev 3.46 - September 2010
6
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
MTOPS
Table 33 shows Composite Theoretical Performance (CTP) calculations. The calculations are stated
in Millions of Theoretical Operations per Second (MTOPS) and are based upon a formula in the
United States Department of Commerce Export Administration Regulations 15 CFR 774 (Advisory
Note 4 for Category 4).
All calculations contained herein are subject to change without notice. AMD makes no representation
or warranty as to the accuracy or reliability of such calculations.
THESE CALCULATIONS ARE PROVIDED “AS IS” AND AMD MAKES NO WARRANTIES
WHATSOEVER, EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO ANY
WARRANTY OF MERCHANTABILITY, NONINFRINGEMENT, FITNESS FOR ANY
PARTICULAR PURPOSE OR ANY WARRANTY OTHERWISE ARISING OUT OF AMD
PROVIDING OR ANY PARTY'S USE OF THE CALCULATIONS.
Furthermore, AMD shall have no liability for any losses or damages including direct, indirect,
special, punitive, incidental, or consequential, such as but not limited to, loss of anticipated profits or
other economic loss occurring in connection with use of the calculations, even if AMD has been
advised in advance of the possibility of such damages. No license, express or implied, by estoppel or
otherwise, to any intellectual property rights is granted herein.
Table 33. Composite Theoretical Performance (CTP) Calculation
Frequency
1600
1700
1800
1900
2000
2100
2200
2300
2400
2500
2600
2700
2800
2900
3000
3100
3200
3300
3400
MTOPS
MTOPS
MTOPS
MTOPS
S ingle-Core Dual-Core Triple-Core Quad-Core
8,667
16,267
23,867
31,467
9,209
17,284
25,359
33,434
9,750
18,300
26,850
35,400
10,292
19,317
28,342
37,367
10,834
20,334
29,834
39,334
11,375
21,350
31,325
41,300
11,917
22,367
32,817
43,267
12,459
23,384
34,309
45,234
13,000
24,400
35,800
47,200
13,542
25,417
37,292
49,167
14,084
26,434
38,784
51,134
14,625
27,450
40,275
53,100
15,167
28,467
41,767
55,067
15,709
29,484
43,259
57,034
16,250
30,500
44,750
59,000
16,792
31,517
46,242
60,967
17,334
32,534
47,734
62,934
17,875
33,550
49,225
64,900
18,417
34,567
50,717
66,867
MTOPS
S ix-Core
46,667
49,584
52,500
55,417
58,334
61,250
64,167
67,084
70,000
72,917
75,834
78,750
81,667
84,584
87,500
90,417
93,334
96,250
99,167
MTOPS
95
PID: 43375 Rev 3.46 - September 2010
7
AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
APP
Table 34 shows the Adjusted Peak Performance (APP) calculations for the
AMD Phenom™ processor and the AMD Athlon™ processor. The calculations are stated in millions
of Weighted Teraflops (WT) and are based upon a formula in the United States Department of
Commerce Export Administration Regulations 15 CFR 774 (Advisory Note 4 for Category 4).
All calculations contained herein are subject to change without notice. AMD makes no representation
or warranty as to the accuracy or reliability of such calculations.
THESE CALCULATIONS ARE PROVIDED “AS IS” AND AMD MAKES NO WARRANTIES
WHATSOEVER, EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO ANY
WARRANTY OF MERCHANTABILITY, NONINFRINGEMENT, FITNESS FOR ANY
PARTICULAR PURPOSE OR ANY WARRANTY OTHERWISE ARISING OUT OF AMD
PROVIDING OR ANY PARTY'S USE OF THE CALCULATIONS.
Furthermore, AMD shall have no liability for any losses or damages including direct, indirect,
special, punitive, incidental, or consequential, such as but not limited to, loss of anticipated profits or
other economic loss occurring in connection with use of the Calculations, even if AMD has been
advised in advance of the possibility of such damages. No license, express or implied, by estoppel or
otherwise, to any intellectual property rights is granted herein.
Table 34. Adjusted Peak Performance (APP) Calculation
Frequency
APP
S ingle-Core
APP
Dual-Core
APP
Triple-Core
APP
Quad-Core
APP
S ix-Core
1600
1700
1800
1900
2000
2100
2200
2300
2400
2500
2600
2700
2800
2900
3000
3100
3200
3300
3400
0.0019
0.0020
0.0022
0.0023
0.0024
0.0025
0.0026
0.0028
0.0029
0.0030
0.0031
0.0032
0.0034
0.0035
0.0036
0.0037
0.0038
0.0040
0.0041
0.0038
0.0041
0.0043
0.0046
0.0048
0.0050
0.0053
0.0055
0.0058
0.0060
0.0062
0.0065
0.0067
0.0070
0.0072
0.0074
0.0077
0.0079
0.0082
0.0058
0.0061
0.0065
0.0068
0.0072
0.0076
0.0079
0.0083
0.0086
0.0090
0.0094
0.0097
0.0101
0.0104
0.0108
0.0112
0.0115
0.0119
0.0122
0.0077
0.0082
0.0086
0.0091
0.0096
0.0101
0.0106
0.0110
0.0115
0.0120
0.0125
0.0130
0.0134
0.0139
0.0144
0.0149
0.0154
0.0158
0.0163
0.0115
0.0122
0.0130
0.0137
0.0144
0.0151
0.0158
0.0166
0.0173
0.0180
0.0187
0.0194
0.0202
0.0209
0.0216
0.0223
0.0230
0.0238
0.0245
APP
96