AMD Family 11h Processor Power and Thermal Data

AMD Family 11h Processor
Power and Thermal Data Sheet
for Notebooks
Publication # 43373
Revision: 3.00
Issue Date: September 2008
Advanced Micro Devices
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AMD Family 11h Processor
Power and Thermal Data Sheet for Notebooks
PID: 43373 Rev 3.00 - September 2008
Contents
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
1
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
1.1 Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
1.1.1 Ordering Part Number Description Section Overview . . . . . . . . . . . . . . . . . . 8
1.1.2 Thermal and Power Table Guide Overview . . . . . . . . . . . . . . . . . . . . . . . . . . 8
1.1.3 Thermal and Power Table Section Overview . . . . . . . . . . . . . . . . . . . . . . . . . 9
1.1.4 Power Supply Specification Chapter Overview . . . . . . . . . . . . . . . . . . . . . . . 9
1.2 Conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
1.3 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2
AMD Turion™ X2 Ultra Dual-Core Mobile Processor . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.1 AMD Turion™ X2 Ultra Dual-Core Mobile Processor Ordering Part Number
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.2 AMD Turion X2 Ultra Dual-Core Mobile Processor Thermal and Power
Table Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.3 AMD Turion X2 Ultra Dual-Core Mobile Processor Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.3.1 TM mmmm DA pnc GG (35 W Mobile, S1g2) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3
AMD Turion™ X2 Dual-Core Mobile Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.1 AMD Turion X2 Dual-Core Mobile Processor Ordering Part Number
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.2 AMD Turion X2 Dual-Core Mobile Processor Thermal and Power
Table Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.3 AMD Turion X2 Dual-Core Mobile Processor Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.3.1 TM mmmm DA pnc GG (35 W Mobile, S1g2) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.3.2 TM mmmm DA pnc GK (35 W Mobile, S1g2) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4
AMD Athlon™ X2 Dual-Core Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
4.1 AMD Athlon™ X2 Dual-Core Processor Ordering Part Number Description . . . . . 26
4.2 AMD Athlon X2 Dual-Core Processor Thermal and Power Table Guide . . . . . . . . 28
4.3 AMD Athlon X2 Dual-Core Processor Thermal and Power Specifications . . . . . . . 29
4.3.1 AM mmmm DA pnc GG (35 W Mobile, S1g2) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
5
AMD Sempron™ Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
5.1 AMD Sempron™ Processor Ordering Part Number Description . . . . . . . . . . . . . . . 33
5.2 AMD Sempron Processor Thermal and Power Table Guide . . . . . . . . . . . . . . . . . . . 35
5.3 AMD Sempron Processor Thermal and Power Specifications . . . . . . . . . . . . . . . . . 36
5.3.1 SM mmmm SA pnc GG (25 W Mobile, S1g2) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
5.3.2 SM mmmm DA pnc GG (35 W Mobile, S1g2) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Contents
3
AMD Family 11h Processor
Power and Thermal Data Sheet for Notebooks
PID: 43373 Rev 3.00 - September 2008
6
Power Supply Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
6.1 bsmmmmrr M ncdd - Socket S1 Power Supply Operating Conditions . . . . . . . . . . . 40
7
Power Limit Encoding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
8
MTOPS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
9
APP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Contents
4
AMD Family 11h Processor
Power and Thermal Data Sheet for Notebooks
PID: 43373 Rev 3.00 - September 2008
List of Figures
Figure 1. AMD Turion™ X2 Ultra Dual-Core Mobile Processor Ordering Part Number
Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 2. AMD Turion X2 Ultra Dual-Core Mobile Processor Ordering Part Number
Example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 3. AMD Turion X2 Dual-Core Mobile Processor Ordering Part Number Diagram . . . .
Figure 4. AMD Turion X2 Dual-Core Mobile Processor Ordering Part Number Example . . . .
Figure 5. AMD Athlon™ X2 Dual-Core Processor Ordering Part Number Diagram . . . . . . . . .
Figure 6. AMD Athlon X2 Dual-Core Processor Ordering Part Number Example . . . . . . . . . .
Figure 7. AMD Sempron™ Processor Ordering Part Number Diagram . . . . . . . . . . . . . . . . . . .
Figure 8. AMD Sempron Processor Ordering Part Number Example . . . . . . . . . . . . . . . . . . . . .
List of Figures
11
11
18
18
26
26
33
33
5
AMD Family 11h Processor
Power and Thermal Data Sheet for Notebooks
PID: 43373 Rev 3.00 - September 2008
List of Tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Table 20.
Table 21.
Table 22.
Table 23.
Table 24.
Table 25.
Table 26.
Table 27.
Table 28.
Table 29.
Table 30.
Table 31.
Table 32.
Table 33.
AMD Turion™ X2 Ultra Dual-Core Mobile Processor Part Definition
Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
AMD Turion X2 Ultra Dual-Core Mobile Processor L2 Cache Size
Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
AMD Turion X2 Ultra Dual-Core Mobile Processor Number of Cores . . . . . 12
AMD Turion X2 Ultra Dual-Core Mobile Processor Package Options . . . . . . 12
AMD Turion X2 Ultra Dual-Core Mobile Processor Roadmap Options . . . . . 12
AMD Turion X2 Ultra Dual-Core Mobile Processor Model Number
Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
AMD Turion X2 Ultra Dual-Core Mobile Processor Thermal and Power
Table Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
AMD Turion X2 Dual-Core Mobile Processor Part Definition Options . . . . . 19
AMD Turion X2 Dual-Core Mobile Processor L2 Cache Size Options . . . . . 19
AMD Turion X2 Dual-Core Mobile Processor Number of Cores . . . . . . . . . . 19
AMD Turion X2 Dual-Core Mobile Processor Package Options . . . . . . . . . . 19
AMD Turion X2 Dual-Core Mobile Processor Roadmap Options . . . . . . . . . 19
AMD Turion X2 Dual-Core Mobile Processor Model Number Options . . . . . 19
AMD Turion X2 Dual-Core Mobile Processor Thermal and Power
Table Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
AMD Athlon™ X2 Dual-Core Processor Part Definition Options . . . . . . . . . 27
AMD Athlon X2 Dual-Core Processor L2 Cache Size Options . . . . . . . . . . . . 27
AMD Athlon X2 Dual-Core Processor Number of Cores . . . . . . . . . . . . . . . . 27
AMD Athlon X2 Dual-Core Processor Package Options . . . . . . . . . . . . . . . . . 27
AMD Athlon X2 Dual-Core Processor Roadmap Options . . . . . . . . . . . . . . . . 27
AMD Athlon X2 Dual-Core Processor Model Number Options . . . . . . . . . . . 27
AMD Athlon X2 Dual-Core Processor Thermal and Power Table Guide . . . . 28
AMD Sempron™ Processor Part Definition Options . . . . . . . . . . . . . . . . . . . . 34
AMD Sempron Processor L2 Cache Size Options . . . . . . . . . . . . . . . . . . . . . . 34
AMD Sempron Processor Number of Cores . . . . . . . . . . . . . . . . . . . . . . . . . . 34
AMD Sempron Processor Package Options . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
AMD Sempron Processor Roadmap Options . . . . . . . . . . . . . . . . . . . . . . . . . . 34
AMD Sempron Processor Model Number Options . . . . . . . . . . . . . . . . . . . . . 34
AMD Sempron Processor Thermal and Power Table Guide . . . . . . . . . . . . . . 35
bsmmmmrr M ncdd VDD0 and VDD1 Power Supply DC
Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
bsmmmmrr M ncdd VDD0 and VDD1 Power Supply AC
Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
bsmmmmrr M ncdd AC and DC Operating Conditions for non-VDD
Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Composite Theoretical Performance (CTP) Calculations . . . . . . . . . . . . . . . . 43
Adjusted Peak Performance (APP) Calculations . . . . . . . . . . . . . . . . . . . . . . . 44
List of Tables
6
AMD Family 11h Processor
Power and Thermal Data Sheet for Notebooks
PID: 43373 Rev 3.00 - September 2008
Revision History
Date
Revision
Description
September 2008
3.00
Initial public release
Revision History
7
AMD Family 11h Processor
Power and Thermal Data Sheet for Notebooks
PID: 43373 Rev 3.00 - September 2008
1
Overview
This document contains processor thermal specifications and power specifications. The specifications
in this document supersede those found in the power roadmaps. For all other electrical specifications,
refer to the appropriate product data sheet and the AMD Family 11h Processor Electrical Data Sheet,
order# 40683.
1.1 Organization
This document is organized into the following sections:
• Document overview (Section 1)
• One section for each brand represented in the mobile segment containing the following subsections:
• Ordering Part Number (OPN) description (content overview in Section 1.1.1)
• Thermal and power specification tables (content overview in Section 1.1.3 on page 9)
• Power supply specifications (content overview in Section 1.1.4 on page 9)
• MTOPS section in Table 32 on page 43
• APP section in Table 33 on page 44
1.1.1
Ordering Part Number Description Section Overview
The Ordering Part Number (OPN) description section contains a depiction and description of a valid
OPN for the brand contained in that chapter. Each character or group of characters within an OPN has
a specific meaning (for example, model number, socket compatibility). The meaning of each OPN
character is detailed in the OPN description section. Each OPN identifies a processor with a unique
thermal and power specification table entry.
The OPN description section also contains a full description of the Subsection Ordering Part Number
(SOPN) abstraction characters for the brand contained in that chapter. SOPNs are used to group and
organize OPNs into subsections for the thermal and power tables and power supply specifications. A
definition of SOPNs is contained in Section 1.3 on page 9.
1.1.2
Thermal and Power Table Guide Overview
The thermal and power table guide section contains a table mapping SOPNs and the properties
associated with their defined characters to the proper thermal and power table subsections and page
numbers. This table is designed to be used as a quick reference for finding the appropriate subsection
for the thermal and power tables corresponding to an SOPN.
Overview
8
AMD Family 11h Processor
Power and Thermal Data Sheet for Notebooks
PID: 43373 Rev 3.00 - September 2008
1.1.3
Thermal and Power Table Section Overview
The thermal and power specification tables contain the thermal and power requirements for each
OPN. This includes the information necessary for thermal management (for example, heat sink
requirements, ambient temperature assumptions) and power delivery (for example, voltage and
current, and power dissipation for each P-state).
The thermal and power specification tables are organized into subsections that correspond to
Subsection Ordering Part Numbers (SOPNs). SOPNs for the thermal and power tables have the
brand, power limit, and part definition characters defined in the form ABmmmmrrpnc GH. Each
chapter provides a guide table that maps the SOPNs in the thermal and power tables within that
chapter to the appropriate subsection number and page number. Within each subsection the OPNs are
sorted by model number, socket compatibility, voltage, temperature, and cache size, respectively.
1.1.4
Power Supply Specification Chapter Overview
The power supply specification chapter contains the operating conditions and requirements for all
voltage planes required by the processor.
1.2 Conventions
Following are conventions used with numbers.
• Binary numbers. A “b” appended to the end of a number indicates that it is a binary number, for
example: 0110b.
• Decimal numbers. Unless specified otherwise, all numbers are decimal.
• Hexadecimal numbers. An “h” appended to the end of a number indicates that it is a hexadecimal
number, for example: 45F8h.
• Underscores in numbers. Underscores are used to break up numbers to make them more readable,
for example: 0110_1100b. They do not imply any operation.
1.3 Definitions
Following are some key definitions.
• CPU COF. CPU Current Operating Frequency.
• NB COF. Northbridge (NB) Current Operating Frequency.
• OPN. Ordering Part Number. An OPN uniquely identifies a processor and its associated
specifications in the thermal and power tables and power supply specifications section.
• P-state. Processor Performance State. P-states are valid combinations of CPU voltage, CPU COF,
Northbridge voltage, and NB COF.
Overview
9
AMD Family 11h Processor
Power and Thermal Data Sheet for Notebooks
PID: 43373 Rev 3.00 - September 2008
• SOPN. Subsection Ordering Part Number. An SOPN is an OPN with a subset of defined characters.
All defined characters in an SOPN are bolded and capitalized. All abstracted characters in an SOPN
are in non-bolded lowercase. Information for any OPN that matches all of the defined characters in
an SOPN is contained in that subsection. For example, OPN AB1234CDE5FGH appears under the
subsection for SOPN ABmmmmrrpncGH. The abstracted (lower-case) character definitions for
SOPNs are contained in the OPN description section of each chapter.
• State. Indicates the ACPI defined sleep state, power state, and performance state for the related
specifications. An ‘x’ indicates the related specifications are independent of the associated ACPI
state. For example, S0.C0.P0 indicates Sleep state 0, Power state 0, and Performance state 0.
S3.Cx.Px indicates Sleep state 3 entered from any power and performance state combination.
• TDC. Thermal Design Current. The thermal design current is the sustained current limit as
measured under the same conditions as TDP.
• TDP. Thermal Design Power. The thermal design power is the maximum power a processor can
draw for a thermally significant period while running commercially useful software. The
constraining conditions for TDP are specified in the notes in the thermal and power tables.
• Triple-plane. Platforms in which the VDD0 (core 0), VDD1 (core 1) and VDDNB (Northbridge)
planes are isolated on the platform and controlled as separate voltages through the SVI interface.
• VID_VDD. The VID_VDD voltage is the VID-requested VDD supply level. Refer to the BIOS and
Kernel Developer’s Guide (BKDG) for AMD Family 11h Processors, order# 41256, for VID-tovoltage translation specifications.
Overview
10
AMD Family 11h Processor
Power and Thermal Data Sheet for Notebooks
PID: 43373 Rev 3.00 - September 2008
2
AMD Turion™ X2 Ultra Dual-Core Mobile Processor
The following sections contain the OPN description and thermal and power specifications for the
AMD Turion™ X2 Ultra dual-core mobile processor. Each column in the thermal and power tables
represents a specific Ordering Part Number (OPN). Section 2.1 provides an example of the OPN
structure for this processor family.
2.1 AMD Turion™ X2 Ultra Dual-Core Mobile Processor Ordering Part Number Description
b s mmmm rr p n c dd
Part Definition
Cache Size
Number of Cores
Package
Roadmap
Model
Segment
Brand
Figure 1.
AMD Turion™ X2 Ultra Dual-Core Mobile Processor Ordering Part Number Diagram
T M ZM80 DA M 2 3 GG
Part Definition: GG (see Table 1)
Cache Size: 3 (see Table 2)
Number of Cores: 2 (see Table 3)
Package: M (see Table 4)
Roadmap: DA (see Table 5)
Model Number: ZM80 (see Table 6)
Segment: M = Mobile
Brand: T = AMD Turion™ Ultra Mobile Processor
Figure 2.
AMD Turion™ X2 Ultra Dual-Core Mobile Processor Ordering Part Number Example
AMD Turion™ X2 Ultra Dual-Core Mobile Processor
11
PID: 43373 Rev 3.00 - September 2008
AMD Family 11h Processor
Power and Thermal Data Sheet for Notebooks
Table 1. AMD Turion™ X2 Ultra Dual-Core Mobile Processor Part Definition Options
Part Definition Revision
CPUID 8000_0001h EAX [31:0] (CPUID)
GG
00200F31h
Rev B1
Table 2. AMD Turion™ X2 Ultra Dual-Core Mobile Processor L2 Cache Size Options
OPN
Character
L2 Cache Size
3
1024 KB
Table 3. AMD Turion™ X2 Ultra Dual-Core Mobile Processor Number of Cores
OPN
Character
Number of
Cores
2
2
Table 4. AMD Turion™ X2 Ultra Dual-Core Mobile Processor Package Options
OPN
Character
Package
M
S1g2
Table 5. AMD Turion™ X2 Ultra Dual-Core Mobile Processor Roadmap Options
OPN
Character
Power, Segment
Number of Cores
Socket Infrastructure
DA
35 W, Notebook
2
S1g2
Table 6. AMD Turion™ X2 Ultra Dual-Core Mobile Processor Model Number Options
Frequency L2 Cache Size
Model Number
2100 MHz
1024 KB
ZM80
2200 MHz
1024 KB
ZM82
2300 MHz
1024 KB
ZM84
2400 MHz
1024 KB
ZM86
AMD Turion™ X2 Ultra Dual-Core Mobile Processor
12
PID: 43373 Rev 3.00 - September 2008
2.2
AMD Family 11h Processor
Power and Thermal Data Sheet for Notebooks
AMD Turion™ X2 Ultra Dual-Core Mobile Processor Thermal and Power Table Guide
The thermal and power table guide shown in Table 7 maps SOPNs and the properties associated with
their defined characters to the proper thermal and power table subsections and page numbers. This
table is designed to be used as a quick reference for finding the appropriate subsection for the thermal
and power tables corresponding to an SOPN.
Table 7. AMD Turion™ X2 Ultra Dual-Core Mobile Processor Thermal and Power Table Guide
SOPN
Power
Revision
Thermal/Power
Tables
TM mmmm DA pnc GG
35 W
Rev B1
Section 2.3.1 on page 15
AMD Turion™ X2 Ultra Dual-Core Mobile Processor
13
PID: 43373 Rev 3.00 - September 2008
2.3
AMD Family 11h Processor
Power and Thermal Data Sheet for Notebooks
AMD Turion™ X2 Ultra Dual-Core Mobile Processor Thermal and Power Specifications
Refer to the AMD Family 11h Processor Electrical Data Sheet, order# 40683, for electrical
specifications for the processor. Refer to the BIOS and Kernel Developer’s Guide (BKDG) for
AMD Family 11h Processors, order# 41256, for power management BIOS requirements.
Section 2.1 on page 11 provides an example of the OPN structure for processors documented in this
chapter and Table 7 on page 13 provides a guide to OPN organization in the following subsections.
Refer to Section 1.2 on page 9 and Section 1.3 on page 9 for numbering conventions and terminology
definitions used in these tables.
AMD Turion™ X2 Ultra Dual-Core Mobile Processor
14
AMD Family 11h Processor
Power and Thermal Data Sheet for Notebooks
PID: 43373 Rev 3.00 - September 2008
S0.C0.HTC
S0.C0.P2
S0.C0.P1
S0.C0.P0
S0.C0.Px
State
2.3.1
TM mmmm DA pnc GG (35 W Mobile, S1g2) Thermal and Power Specifications
Specification7
Tdie Max
Tambient
TRise
Thermal Resistance (die-amb)
Startup P-state
HTC P-state Limit
IDDNB Max
VID_VDDNB
CPU COF
TDP
VID_VDD Min
VID_VDD Max
TDC
CPU COF
TDP
VID_VDD Min
VID_VDD Max
TDC
CPU COF
TDP
VID_VDD Min
VID_VDD Max
TDC
CPU COF
TDP
VID_VDD Min
VID_VDD Max
TDC
1
3,6
2
2
6
1
3,6
2
2
6
1
3,6
2
2
6
1
3,6
2
2
6
C1 Halt
9
Notes
13
5
IDD Max
I/O Power
4,10
C1E/S1 @ Min P-state
11
IDD Max
I/O Power
4,10
C1E/S1 Altvid
14
TMZM80DAM23GG
100 °C
0 °C to 35 °C
10 °C
1.72 °C/W
S0.C0.P2
S0.C0.HTC
1.61 A
0.900 V
2100 MHz
32.0 W
1.075 V
1.125 V
25.6 A
1050 MHz
15.3 W
0.950 V
0.950 V
11.4 A
525 MHz
9.2 W
0.800 V
0.800 V
5.9 A
800 MHz
22.6 W
1.200 V
1.200 V
15.1 A
TMZM82DAM23GG
100 °C
0 °C to 35 °C
10 °C
1.57 °C/W
S0.C0.P2
S0.C0.HTC
1.61 A
0.900 V
2200 MHz
35.0 W
1.100 V
1.125 V
27.8 A
1100 MHz
16.0 W
0.950 V
0.950 V
12.2 A
550 MHz
9.2 W
0.800 V
0.800 V
5.9 A
850 MHz
24.3 W
1.200 V
1.200 V
16.5 A
1.19 A
1.19 A
3.0 W
3.0 W
0.84 A
0.84 A
300 mW
300 mW
IDD Max
0.69 A
0.69 A
IDDNB Max
0.14 A
0.14 A
300 mW
300 mW
150 mW
150 mW
I/O Power
4,10
S3
12
I/O Power
8
The notes for this table are on page 17.
AMD Turion™ X2 Ultra Dual-Core Mobile Processor
15
AMD Family 11h Processor
Power and Thermal Data Sheet for Notebooks
S0.C0.HTC
S0.C0.P2
S0.C0.P1
S0.C0.P0
S0.C0.Px
State
PID: 43373 Rev 3.00 - September 2008
Specification7
Tdie Max
Tambient
TRise
Thermal Resistance (die-amb)
Startup P-state
HTC P-state Limit
IDDNB Max
VID_VDDNB
CPU COF
TDP
VID_VDD Min
VID_VDD Max
TDC
CPU COF
TDP
VID_VDD Min
VID_VDD Max
TDC
CPU COF
TDP
VID_VDD Min
VID_VDD Max
TDC
CPU COF
TDP
VID_VDD Min
VID_VDD Max
TDC
1
3,6
2
2
6
1
3,6
2
2
6
1
3,6
2
2
6
1
3,6
2
2
6
C1 Halt
9
Notes
13
TMZM84DAM23GG
100 °C
0 °C to 35 °C
10 °C
1.57 °C/W
S0.C0.P2
S0.C0.HTC
1.61 A
0.900 V
2300 MHz
35.0 W
1.100 V
1.125 V
27.8 A
1150 MHz
16.4 W
0.950 V
0.950 V
12.6 A
575 MHz
9.2 W
0.800 V
0.800 V
5.9 A
850 MHz
24.7 W
1.200 V
1.200 V
16.9 A
TMZM86DAM23GG
100 °C
0 °C to 35 °C
10 °C
1.57 °C/W
S0.C0.P2
S0.C0.HTC
1.61 A
0.900 V
2400 MHz
35.0 W
1.100 V
1.125 V
27.8 A
1200 MHz
16.4 W
0.950 V
0.950 V
12.6 A
600 MHz
9.2 W
0.800 V
0.800 V
5.9 A
900 MHz
24.7 W
1.200 V
1.200 V
16.9 A
1.19 A
1.19 A
3.0 W
3.0 W
0.84 A
0.84 A
300 mW
300 mW
IDD Max
0.69 A
0.69 A
IDDNB Max
0.14 A
0.14 A
300 mW
300 mW
150 mW
150 mW
5
IDD Max
I/O Power
4,10
C1E/S1 @ Min P-state
11
IDD Max
I/O Power
4,10
C1E/S1 Altvid
14
I/O Power
4,10
S3
12
I/O Power
8
The notes for this table are on page 17.
AMD Turion™ X2 Ultra Dual-Core Mobile Processor
16
PID: 43373 Rev 3.00 - September 2008
AMD Family 11h Processor
Power and Thermal Data Sheet for Notebooks
AMD Turion™ X2 Ultra Dual-Core Mobile Processor Thermal and Power Specification Table Notes:
1. Frequency reported to the OS is rounded to the nearest 100-MHz boundary.
2. Variable voltage—any valid voltage between VDD min and VDD max is allowed.
3. The processor thermal solution should be designed to accommodate thermal design power
(TDP) at Tdie,max. TDP is measured under the conditions of all cores operating at CPU COF,
Tdie Max, and VDD at the voltage requested by the processor. TDP includes all power dissipated
on-die from VDD0, VDD1, VDDNB, VDDIO, VLDT, VTT and VDDA. TDP is not the maximum
power of the processor. TDP values apply to operation in a triple-plane motherboard.
4. Power dissipated by the processor VDDIO, VTT, VLDT, and VDDA power planes only.
5. P-state limit when HTC is active. Refer to the BIOS and Kernel Developer’s Guide (BKDG) for
AMD Family 11h Processors, order# 41256 for more information.
6. Thermal Design Current (TDC) is the sustained current limit drawn by VDD0 and VDD1 as
measured under the same conditions as TDP. Platforms should be designed to the TDC defined in
the Socket S1g2 Processor Power and Thermal Roadmap, order# 41323 to ensure
compatibility with future processors.
7. Specifications for multi-core processors assume equivalent P-states (voltage and frequency) and
equivalent Tdie conditions for all cores. Refer to the BIOS and Kernel Developer’s Guide (BKDG)
for AMD Family 11h Processors, order# 41256, for details on P-state operation for multi-core
processors.
8. Thermal Design Power dissipated by the processor VDDIO and VTT power planes only.
9. Assumes 50°C, minimum P-state VID_VDD and minimum P-state and a core clock divisor of 16.
10. Assumes VDDIO = 1.8 V and VTT = VDDIO / 2.
11. Assumes 35°C, minimum P-state VID_VDD, clock s stopped, HyperTransport™ link s
disconnected, memory in self-refresh mode, DDR2 SDRAM interface tristated.
12. Assumes 35°C, VDD, VDDA, and VLDT supplies are off, VDDIO and VTT are powered, memory in
self-refresh mode and DDR2 SDRAM interface tristated.
13. Tdie Max is measured using the SB-TSI interface.
14. Assumes 35°C, AltVID, clock s stopped, HyperTransport™ link s disconnected, memory in selfrefresh mode, DDR2 SDRAM interface tristated. Not all systems are Altvid capable. Refer to the
BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 11h Processors, order# 41256, for
further details.
AMD Turion™ X2 Ultra Dual-Core Mobile Processor
17
AMD Family 11h Processor
Power and Thermal Data Sheet for Notebooks
PID: 43373 Rev 3.00 - September 2008
3
AMD Turion™ X2 Dual-Core Mobile Processor
The following sections contain the OPN description and thermal and power specifications for the
AMD Turion™ X2 dual-core mobile processor. Each column in the thermal and power tables
represents a specific Ordering Part Number (OPN). Section 3.1 provides an example of the OPN
structure for this processor family.
3.1
AMD Turion™ X2 Dual-Core Mobile Processor Ordering Part Number Description
b s mmmm rr p n c dd
Part Definition
Cache Size
Number of Cores
Package
Roadmap
Model
Segment
Brand
Figure 3.
AMD Turion™ X2 Dual-Core Mobile Processor Ordering Part Number Diagram
T M RM70 DA M 2 2 GG
Part Definition: GG (see Table 8)
Cache Size: 2 (see Table 9)
Number of Cores: 2 (see Table 10)
Package: M (see Table 11)
Roadmap: DA (see Table 12)
Model Number: RM70 (see Table 13)
Segment: M = Mobile
Brand: T = AMD Turion™ Mobile Processor
Figure 4.
AMD Turion™ X2 Dual-Core Mobile Processor Ordering Part Number Example
AMD Turion™ X2 Dual-Core Mobile Processor
18
PID: 43373 Rev 3.00 - September 2008
AMD Family 11h Processor
Power and Thermal Data Sheet for Notebooks
Table 8. AMD Turion™ X2 Dual-Core Mobile Processor Part Definition Options
Part Definition Revision
CPUID 8000_0001h EAX [31:0] (CPUID)
GG
Rev B1
00200F31h
GK
Rev B1
00200F31h
Table 9. AMD Turion™ X2 Dual-Core Mobile Processor L2 Cache Size Options
OPN
Character
L2 Cache Size
2
512 KB
Table 10. AMD Turion™ X2 Dual-Core Mobile Processor Number of Cores
OPN
Character
Number of
Cores
2
2
Table 11. AMD Turion™ X2 Dual-Core Mobile Processor Package Options
OPN
Character
Package
M
S1g2
Table 12. AMD Turion™ X2 Dual-Core Mobile Processor Roadmap Options
OPN
Character
Power, Segment
Number of Cores
Socket Infrastructure
DA
35 W, Notebook
2
S1g2
Table 13. AMD Turion™ X2 Dual-Core Mobile Processor Model Number Options
Frequency L2 Cache Size
Model Number
2000 MHz
512 KB
RM70
2100 MHz
512 KB
RM72
2200 MHz
512 KB
RM74
AMD Turion™ X2 Dual-Core Mobile Processor
19
PID: 43373 Rev 3.00 - September 2008
3.2
AMD Family 11h Processor
Power and Thermal Data Sheet for Notebooks
AMD Turion™ X2 Dual-Core Mobile Processor Thermal and Power Table Guide
The thermal and power table guide shown in Table 14 maps SOPNs and the properties associated
with their defined characters to the proper thermal and power table subsections and page numbers.
This table is designed to be used as a quick reference for finding the appropriate subsection for the
thermal and power tables corresponding to an SOPN.
Table 14. AMD Turion™ X2 Dual-Core Mobile Processor Thermal and Power Table Guide
SOPN
Power
Revision
Thermal/Power
Tables
TM mmmm DA pnc GG
35 W
Rev B1
Section 3.3.1 on page 22
TM mmmm DA pnc GK
35 W
Rev B1
Section 3.3.2 on page 24
AMD Turion™ X2 Dual-Core Mobile Processor
20
PID: 43373 Rev 3.00 - September 2008
3.3
AMD Family 11h Processor
Power and Thermal Data Sheet for Notebooks
AMD Turion™ X2 Dual-Core Mobile Processor Thermal and Power Specifications
Refer to the AMD Family 11h Processor Electrical Data Sheet, order# 40683, for electrical
specifications for the processor. Refer to the BIOS and Kernel Developer’s Guide (BKDG) for
AMD Family 11h Processors, order# 41256, for power management BIOS requirements.
Section 3.1 on page 18 provides an example of the OPN structure for processors documented in this
chapter and Table 14 on page 20 provides a guide to OPN organization in the following subsections.
Refer to Section 1.2 on page 9 and Section 1.3 on page 9 for numbering conventions and terminology
definitions used in these tables.
AMD Turion™ X2 Dual-Core Mobile Processor
21
AMD Family 11h Processor
Power and Thermal Data Sheet for Notebooks
PID: 43373 Rev 3.00 - September 2008
TM mmmm DA pnc GG (35 W Mobile, S1g2) Thermal and Power Specifications
State
3.3.1
S pe cifica tion 7
Tdie M ax
Note s
13
S0.C0.HTC
S0.C0.P2
S0.C0.P1
S0.C0.P0
S0.C0.Px
Tam bient
TRis e
TM RM 70DAM 22GG
TM RM 72DAM 22GG
100 °C
100 °C
0 °C to 35 °C
0 °C to 35 °C
10 °C
10 °C
Therm al Res is tanc e (die-am b)
1.77 °C/W
1.57 °C/W
S tartup P -s tate
S 0.C0.P 2
S 0.C0.P 2
S 0.C0.HTC
S 0.C0.HTC
HTC P -s tate Lim it
5
IDDNB M ax
1.61 A
1.61 A
V ID_V DDNB
0.900 V
0.900 V
2000 M Hz
2100 M Hz
CP U COF
1
TDP
3,6
31.0 W
35.0 W
V ID_V DD M in
2
1.075 V
1.075 V
V ID_V DD M ax
2
1.125 V
1.125 V
TDC
6
24.7 A
28.4 A
CP U COF
1
1000 M Hz
1050 M Hz
TDP
3,6
15.3 W
16.0 W
V ID_V DD M in
2
0.950 V
0.950 V
V ID_V DD M ax
2
0.950 V
0.950 V
TDC
6
11.4 A
12.2 A
CP U COF
1
500 M Hz
525 M Hz
TDP
3,6
V ID_V DD M in
9.2 W
9.1 W
2
0.800 V
0.800 V
V ID_V DD M ax
2
0.800 V
0.800 V
TDC
6
5.9 A
5.9 A
CP U COF
1
750 M Hz
800 M Hz
TDP
3,6
22.1 W
24.5 W
V ID_V DD M in
2
1.200 V
1.200 V
V ID_V DD M ax
2
1.200 V
1.200 V
TDC
6
14.7 A
16.7 A
C1 Halt
9
1.19 A
1.19 A
1.61 A
1.61 A
3.0 W
3.0 W
0.84 A
0.84 A
IDD M ax
IDDNB M ax
I/O P ower
4,10
C1E /S 1 @ M in P -s tate
11
IDD M ax
IDDNB M ax
0.14 A
0.14 A
300 m W
300 m W
IDD M ax
0.69 A
0.69 A
IDDNB M ax
0.14 A
0.14 A
300 m W
300 m W
150 m W
150 m W
I/O P ower
4,10
C1E /S 1 A ltvid
14
I/O P ower
4,10
S3
12
I/O P ower
8
The notes for this table are on page 25.
AMD Turion™ X2 Dual-Core Mobile Processor
22
AMD Family 11h Processor
Power and Thermal Data Sheet for Notebooks
State
PID: 43373 Rev 3.00 - September 2008
S pe cifica tion 7
Tdie M ax
Note s
13
S0.C0.HTC
S0.C0.P2
S0.C0.P1
S0.C0.P0
S0.C0.Px
Tam bient
TM RM 74DAM 22GG
100 °C
0 °C to 35 °C
TRise
10 °C
Therm al Res is tance (die-am b)
1.57 °C/W
S tartup P -state
S0.C0.P2
HTC P-s tate Lim it
5
S0.C0.HTC
IDDNB M ax
1.61 A
V ID_V DDNB
0.900 V
CPU COF
1
TDP
3,6
2200 M Hz
35.0 W
V ID_V DD M in
2
1.075 V
V ID_V DD M ax
2
1.125 V
TDC
6
28.4 A
CPU COF
1
1100 M Hz
TDP
3,6
16.1 W
V ID_V DD M in
2
0.950 V
V ID_V DD M ax
2
0.950 V
TDC
6
12.3 A
CPU COF
1
550 M Hz
TDP
3,6
V ID_V DD M in
2
0.800 V
9.1 W
V ID_V DD M ax
2
0.800 V
TDC
6
5.8 A
CPU COF
1
850 M Hz
TDP
3,6
24.5 W
V ID_V DD M in
2
1.200 V
V ID_V DD M ax
2
1.200 V
TDC
6
16.7 A
C1 Halt
9
IDD M ax
1.19 A
IDDNB M ax
1.61 A
I/O Power
4,10
C1E /S1 @ M in P-state
11
IDD M ax
3.0 W
0.84 A
IDDNB M ax
0.14 A
I/O Power
4,10
C1E /S1 Altvid
14
300 m W
IDD M ax
0.69 A
IDDNB M ax
0.14 A
I/O Power
4,10
S3
12
I/O Power
8
300 m W
150 m W
The notes for this table are on page 25.
AMD Turion™ X2 Dual-Core Mobile Processor
23
AMD Family 11h Processor
Power and Thermal Data Sheet for Notebooks
PID: 43373 Rev 3.00 - September 2008
TM mmmm DA pnc GK (35 W Mobile, S1g2) Thermal and Power Specifications
State
3.3.2
Spe cifica tion 7
Tdie M ax
Note s
13
S0.C0.Px
Tam bient
S0.C0.P0
S0.C0.P1
S0.C0.P2
100 °C
0 °C to 35 °C
TRis e
10 °C
Therm al Resistanc e (die-am b)
1.57 °C/W
Startup P-s tate
S 0.C0.P 2
HTC P -state Lim it
5
S 0.C0.HTC
IDDNB M ax
1.61 A
VID_VDDNB
0.900 V
CP U COF
S0.C0.HTC
TM RM 70DAM 22GK
1
2000 M Hz
TDP
3,6
35.0 W
VID_VDD M in
2
1.075 V
VID_VDD M ax
2
1.125 V
TDC
6
28.4 A
CP U COF
1
1000 M Hz
TDP
3,6
15.8 W
VID_VDD M in
2
0.950 V
VID_VDD M ax
2
0.950 V
TDC
6
11.9 A
CP U COF
1
500 M Hz
TDP
3,6
VID_VDD M in
2
0.800 V
9.1 W
VID_VDD M ax
2
0.800 V
TDC
6
5.8 A
CP U COF
1
750 M Hz
TDP
3,6
24.5 W
VID_VDD M in
2
1.200 V
VID_VDD M ax
2
1.200 V
TDC
6
16.7 A
C1 Halt
9
IDD M ax
1.19 A
IDDNB M ax
1.61 A
I/O P ower
4,10
C1E/S 1 @ M in P -state
11
3.0 W
IDD M ax
0.84 A
IDDNB M ax
0.14 A
I/O P ower
4,10
C1E/S 1 A ltvid
14
IDD M ax
300 m W
0.69 A
IDDNB M ax
0.14 A
I/O P ower
4,10
S3
12
I/O P ower
8
300 m W
150 m W
The notes for this table are on page 25.
AMD Turion™ X2 Dual-Core Mobile Processor
24
PID: 43373 Rev 3.00 - September 2008
AMD Family 11h Processor
Power and Thermal Data Sheet for Notebooks
AMD Turion™ X2 Dual-Core Mobile Processor Thermal and Power Specification Table Notes:
1. Frequency reported to the OS is rounded to the nearest 100-MHz boundary.
2. Variable voltage—any valid voltage between VDD min and VDD max is allowed.
3. The processor thermal solution should be designed to accommodate thermal design power
(TDP) at Tdie,max. TDP is measured under the conditions of all cores operating at CPU COF,
Tdie Max, and VDD at the voltage requested by the processor. TDP includes all power dissipated
on-die from VDD0, VDD1, VDDNB, VDDIO, VLDT, VTT and VDDA. TDP is not the maximum
power of the processor. TDP values apply to operation in a triple-plane motherboard.
4. Power dissipated by the processor VDDIO, VTT, VLDT, and VDDA power planes only.
5. P-state limit when HTC is active. Refer to the BIOS and Kernel Developer’s Guide (BKDG) for
AMD Family 11h Processors, order# 41256 for more information.
6. Thermal Design Current (TDC) is the sustained current limit drawn by VDD0 and VDD1 as
measured under the same conditions as TDP. Platforms should be designed to the TDC defined in
the Socket S1g2 Processor Power and Thermal Roadmap, order# 41323 to ensure
compatibility with future processors.
7. Specifications for multi-core processors assume equivalent P-states (voltage and frequency) and
equivalent Tdie conditions for all cores. Refer to the BIOS and Kernel Developer’s Guide (BKDG)
for AMD Family 11h Processors, order# 41256, for details on P-state operation for multi-core
processors.
8. Thermal Design Power dissipated by the processor VDDIO and VTT power planes only.
9. Assumes 50°C, minimum P-state VID_VDD and minimum P-state and a core clock divisor of 16.
10. Assumes VDDIO = 1.8 V and VTT = VDDIO / 2.
11. Assumes 35°C, minimum P-state VID_VDD, clock s stopped, HyperTransport™ link s
disconnected, memory in self-refresh mode, DDR2 SDRAM interface tristated.
12. Assumes 35°C, VDD, VDDA, and VLDT supplies are off, VDDIO and VTT are powered, memory in
self-refresh mode and DDR2 SDRAM interface tristated.
13. Tdie Max is measured using the SB-TSI interface.
14. Assumes 35°C, AltVID, clock s stopped, HyperTransport™ link s disconnected, memory in selfrefresh mode, DDR2 SDRAM interface tristated. Not all systems are Altvid capable. Refer to the
BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 11h Processors, order# 41256, for
further details.
AMD Turion™ X2 Dual-Core Mobile Processor
25
AMD Family 11h Processor
Power and Thermal Data Sheet for Notebooks
PID: 43373 Rev 3.00 - September 2008
4
AMD Athlon™ X2 Dual-Core Processor
The following sections contain the OPN description and thermal and power specifications for the
AMD Athlon™ X2 dual-core processor. Each column in the thermal and power tables represents a
specific Ordering Part Number (OPN). Section 4.1 provides an example of the OPN structure for this
processor family.
4.1 AMD Athlon™ X2 Dual-Core Processor Ordering Part Number Description
b s mmmm rr p n c dd
Part Definition
Cache Size
Number of Cores
Package
Roadmap
Model
Segment
Brand
Figure 5.
AMD Athlon™ X2 Dual-Core Processor Ordering Part Number Diagram
A M QL60 DA M 2 2 GG
Part Definition: GG (see Table 15)
Cache Size: 2 (see Table 16)
Number of Cores: 2 (see Table 17)
Package: M (see Table 18)
Roadmap: DA (see Table 19)
Model Number: QL60 (see Table 20)
Segment: M = Mobile
Brand: A = AMD Athlon™ Processor
Figure 6.
AMD Athlon™ X2 Dual-Core Processor Ordering Part Number Example
AMD Athlon™ X2 Dual-Core Processor
26
PID: 43373 Rev 3.00 - September 2008
AMD Family 11h Processor
Power and Thermal Data Sheet for Notebooks
Table 15. AMD Athlon™ X2 Dual-Core Processor Part Definition Options
Part Definition Revision
CPUID 8000_0001h EAX [31:0] (CPUID)
GG
00200F31h
Rev B1
Table 16. AMD Athlon™ X2 Dual-Core Processor L2 Cache Size Options
OPN
Character
L2 Cache Size
2
512 KB
Table 17. AMD Athlon™ X2 Dual-Core Processor Number of Cores
OPN
Character
Number of
Cores
2
2
Table 18. AMD Athlon™ X2 Dual-Core Processor Package Options
OPN
Character
Package
M
S1g2
Table 19. AMD Athlon™ X2 Dual-Core Processor Roadmap Options
OPN
Character
Power, Segment
Number of Cores
Socket Infrastructure
DA
35 W, Notebook
2
S1g2
Table 20. AMD Athlon™ X2 Dual-Core Processor Model Number Options
Frequency L2 Cache Size
Model Number
1900 MHz
512 KB
QL60
2000 MHz
512 KB
QL62
2100 MHz
512 KB
QL64
AMD Athlon™ X2 Dual-Core Processor
27
PID: 43373 Rev 3.00 - September 2008
AMD Family 11h Processor
Power and Thermal Data Sheet for Notebooks
4.2 AMD Athlon™ X2 Dual-Core Processor Thermal and Power Table Guide
The thermal and power table guide shown in Table 21 maps SOPNs and the properties associated
with their defined characters to the proper thermal and power table subsections and page numbers.
This table is designed to be used as a quick reference for finding the appropriate subsection for the
thermal and power tables corresponding to an SOPN.
Table 21. AMD Athlon™ X2 Dual-Core Processor Thermal and Power Table Guide
SOPN
Power
AM mmmm DA pnc GG 35 W
Revision
Thermal/Power
Tables
Rev B1
Section 4.3.1 on page 30
AMD Athlon™ X2 Dual-Core Processor
28
PID: 43373 Rev 3.00 - September 2008
AMD Family 11h Processor
Power and Thermal Data Sheet for Notebooks
4.3 AMD Athlon™ X2 Dual-Core Processor Thermal and Power Specifications
Refer to the AMD Family 11h Processor Electrical Data Sheet, order# 40683, for electrical
specifications for the processor. Refer to the BIOS and Kernel Developer’s Guide (BKDG) for
AMD Family 11h Processors, order# 41256, for power management BIOS requirements.
Section 4.1 on page 26 provides an example of the OPN structure for processors documented in this
chapter and Table 21 on page 28 provides a guide to OPN organization in the following subsections.
Refer to Section 1.2 on page 9 and Section 1.3 on page 9 for numbering conventions and terminology
definitions used in these tables.
AMD Athlon™ X2 Dual-Core Processor
29
AMD Family 11h Processor
Power and Thermal Data Sheet for Notebooks
PID: 43373 Rev 3.00 - September 2008
AM mmmm DA pnc GG (35 W Mobile, S1g2) Thermal and Power Specifications
State
4.3.1
Specification7
Notes
AMQL60DAM22GG
AMQL62DAM22GG
100 °C
100 °C
0 °C to 35 °C
0 °C to 35 °C
10 °C
10 °C
Thermal Resistance (die-amb)
1.57 °C/W
1.57 °C/W
Startup P-state
S0.C0.P1
S0.C0.P1
Tdie Max
13
S0.C0.Px
Tambient
TRise
HTC P-state Limit
S0.C0.HTC
S0.C0.HTC
IDDNB Max
5
1.61 A
1.61 A
VID_VDDNB
0.900 V
0.900 V
1900 MHz
2000 MHz
S0.C0.HTC
S0.C0.P1
S0.C0.P0
CPU COF
1
TDP
3,6
35.0 W
35.0 W
VID_VDD Min
2
1.075 V
1.075 V
VID_VDD Max
2
1.125 V
1.125 V
TDC
6
28.4 A
28.4 A
CPU COF
1
950 MHz
1000 MHz
TDP
3,6
18.3 W
15.8 W
VID_VDD Min
2
0.950 V
0.950 V
VID_VDD Max
2
0.950 V
0.950 V
TDC
6
14.5 A
11.9 A
CPU COF
1
700 MHz
750 MHz
TDP
3,6
24.8 W
24.5 W
VID_VDD Min
2
1.200 V
1.200 V
VID_VDD Max
2
1.200 V
1.200 V
TDC
6
17.0 A
16.7 A
C1 Halt
9
3.11 A
3.11 A
3.0 W
3.0 W
IDD Max
1.73 A
1.73 A
IDDNB Max
0.14 A
0.14 A
1.2 W
1.2 W
250 mW
250 mW
IDD Max
I/O Power
4,10
C1E/S1 @ Min P-state
11
I/O Power
4,10
S3
12
I/O Power
8
The notes for this table are on page 32.
AMD Athlon™ X2 Dual-Core Processor
30
AMD Family 11h Processor
Power and Thermal Data Sheet for Notebooks
State
PID: 43373 Rev 3.00 - September 2008
Specification7
Notes
Tdie Max
13
S0.C0.Px
Tambient
S0.C0.P0
S0.C0.P1
100 °C
0 °C to 35 °C
TRise
10 °C
Thermal Resistance (die-amb)
1.57 °C/W
Startup P-state
S0.C0.P1
HTC P-state Limit
5
S0.C0.HTC
IDDNB Max
1.61 A
VID_VDDNB
0.900 V
CPU COF
S0.C0.HTC
AMQL64DAM22GG
1
2100 MHz
TDP
3,6
35.0 W
VID_VDD Min
2
1.075 V
VID_VDD Max
2
1.125 V
TDC
6
28.4 A
CPU COF
1
1050 MHz
TDP
3,6
16.0 W
VID_VDD Min
2
0.950 V
VID_VDD Max
2
0.950 V
TDC
6
12.1 A
CPU COF
1
800 MHz
TDP
3,6
24.5 W
VID_VDD Min
2
1.200 V
VID_VDD Max
2
1.200 V
TDC
6
16.7 A
C1 Halt
9
IDD Max
3.11 A
I/O Power
4,10
C1E/S1 @ Min P-state
11
3.0 W
IDD Max
1.73 A
IDDNB Max
0.14 A
I/O Power
4,10
S3
12
I/O Power
8
1.2 W
250 mW
The notes for this table are on page 32.
AMD Athlon™ X2 Dual-Core Processor
31
PID: 43373 Rev 3.00 - September 2008
AMD Family 11h Processor
Power and Thermal Data Sheet for Notebooks
AMD Athlon™ X2 Dual-Core Processor Thermal and Power Specification Table Notes:
1. Frequency reported to the OS is rounded to the nearest 100-MHz boundary.
2. Variable voltage—any valid voltage between VDD min and VDD max is allowed.
3. The processor thermal solution should be designed to accommodate thermal design power
(TDP) at Tdie,max. TDP is measured under the conditions of all cores operating at CPU COF,
Tdie Max, and VDD at the voltage requested by the processor. TDP includes all power dissipated
on-die from VDD0, VDD1, VDDNB, VDDIO, VLDT, VTT and VDDA. TDP is not the maximum
power of the processor. TDP values apply to operation in a triple-plane motherboard.
4. Power dissipated by the processor VDDIO, VTT, VLDT, and VDDA power planes only.
5. P-state limit when HTC is active. Refer to the BIOS and Kernel Developer’s Guide (BKDG) for
AMD Family 11h Processors, order# 41256, for more information.
6. Thermal Design Current (TDC) is the sustained current limit drawn by VDD0 and VDD1 as
measured under the same conditions as TDP. Platforms should be designed to the TDC defined in
the Socket S1g2 Processor Power and Thermal Roadmap, order# 41323 to ensure
compatibility with future processors.
7. Specifications for multi-core processors assume equivalent P-states (voltage and frequency) and
equivalent Tdie conditions for all cores. Refer to the BIOS and Kernel Developer’s Guide (BKDG)
for AMD Family 11h Processors, order# 41256, for details on P-state operation for multi-core
processors.
8. Thermal Design Power dissipated by the processor VDDIO and VTT power planes only.
9. Assumes 50°C, minimum P-state VID_VDD and minimum P-state and a core clock divisor of 16.
10. Assumes VDDIO = 1.8 V and VTT = VDDIO / 2.
11. Assumes 35°C, minimum P-state VID_VDD, clock divider set to 512, HyperTransport™ link s
disconnected, memory in self-refresh mode, DDR2 SDRAM interface tristated.
12. Assumes 35°C, VDD, VDDA, and VLDT supplies are off, VDDIO and VTT are powered, memory in
self-refresh mode and DDR2 SDRAM interface tristated.
13. Tdie Max is measured using the SB-TSI interface.
AMD Athlon™ X2 Dual-Core Processor
32
AMD Family 11h Processor
Power and Thermal Data Sheet for Notebooks
PID: 43373 Rev 3.00 - September 2008
5
AMD Sempron™ Processor
The following sections contain the OPN description and thermal and power specifications for the
AMD Sempron™ processor. Each column in the thermal and power tables represents a specific
Ordering Part Number (OPN). Section 5.1 provides an example of the OPN structure for this
processor family.
5.1 AMD Sempron™ Processor Ordering Part Number Description
b s mmmm rr p n c dd
Part Definition
Cache Size
Number of Cores
Package
Roadmap
Model
Segment
Brand
Figure 7.
AMD Sempron™ Processor Ordering Part Number Diagram
S M SI40 SA M 1 2 GG
Part Definition: GG (see Table 22)
Cache Size: 2 (see Table 23)
Number of Cores: 1 (see Table 24)
Package: M (see Table 25)
Roadmap: SA (see Table 26)
Model Number: SI40 (see Table 27)
Segment: M = Mobile
Brand: S = AMD Sempron™ Processor
Figure 8.
AMD Sempron™ Processor Ordering Part Number Example
AMD Sempron™ Processor
33
PID: 43373 Rev 3.00 - September 2008
AMD Family 11h Processor
Power and Thermal Data Sheet for Notebooks
Table 22. AMD Sempron™ Processor Part Definition Options
Part Definition Revision
CPUID 8000_0001h EAX [31:0] (CPUID)
GG
00200F31h
Rev B1
Table 23. AMD Sempron™ Processor L2 Cache Size Options
OPN
Character
L2 Cache Size
1
256 KB
2
512 KB
Table 24. AMD Sempron™ Processor Number of Cores
OPN
Character
Number of
Cores
1
1
2
2
Table 25. AMD Sempron™ Processor Package Options
OPN
Character
Package
M
S1g2
Table 26. AMD Sempron™ Processor Roadmap Options
OPN
Character
Power, Segment
Number of Cores
Socket Infrastructure
SA
25 W, Notebook
1
S1g2
DA
35 W, Notebook
2
S1g2
Table 27. AMD Sempron™ Processor Model Number Options
Frequency L2 Cache Size
Model Number
1800 MHz
512 KB
NI52
2000 MHz
512 KB
SI40
AMD Sempron™ Processor
34
PID: 43373 Rev 3.00 - September 2008
AMD Family 11h Processor
Power and Thermal Data Sheet for Notebooks
5.2 AMD Sempron™ Processor Thermal and Power Table Guide
The thermal and power table guide shown in Table 28 maps SOPNs and the properties associated
with their defined characters to the proper thermal and power table subsections and page numbers.
This table is designed to be used as a quick reference for finding the appropriate subsection for the
thermal and power tables corresponding to an SOPN.
Table 28. AMD Sempron™ Processor Thermal and Power Table Guide
SOPN
Power
Revision
Thermal/Power
Tables
SM mmmm SA pnc GG
25 W
Rev B1
Section 5.3.1 on page 37
SM mmmm DA pnc GG
35 W
Rev B1
Section 5.3.2 on page 38
AMD Sempron™ Processor
35
PID: 43373 Rev 3.00 - September 2008
AMD Family 11h Processor
Power and Thermal Data Sheet for Notebooks
5.3 AMD Sempron™ Processor Thermal and Power Specifications
Refer to the AMD Family 11h Processor Electrical Data Sheet, order# 40683, for electrical
specifications for the processor. Refer to the BIOS and Kernel Developer’s Guide (BKDG) for
AMD Family 11h Processors, order# 41256, for power management BIOS requirements.
Section 5.1 on page 33 provides an example of the OPN structure for processors documented in this
chapter and Table 28 on page 35 provides a guide to OPN organization in the following subsections.
Refer to Section 1.2 on page 9 and Section 1.3 on page 9 for numbering conventions and terminology
definitions used in these tables.
AMD Sempron™ Processor
36
AMD Family 11h Processor
Power and Thermal Data Sheet for Notebooks
PID: 43373 Rev 3.00 - September 2008
SM mmmm SA pnc GG (25 W Mobile, S1g2) Thermal and Power Specifications
State
5.3.1
Specification
Tdie Max
Notes
13
S0.C0.HTC
S0.C0.P1
S0.C0.P0
S0.C0.Px
Tambient
TRise
SMSI40SAM12GG
SMSI42SAM12GG
100 °C
100 °C
0 °C to 35 °C
0 °C to 35 °C
10 °C
10 °C
Thermal Resistance (die-amb)
2.20 °C/W
2.20 °C/W
Startup P-state
S0.C0.P1
S0.C0.P1
S0.C0.HTC
S0.C0.HTC
HTC P-state Limit
5
IDDNB Max
1.61 A
1.61 A
VID_VDDNB
0.900 V
0.900 V
2000 MHz
2100 MHz
CPU COF
1
TDP
3,6,14
25.0 W
25.0 W
VID_VDD Min
2
1.075 V
1.075 V
VID_VDD Max
2
1.125 V
1.125 V
TDC
6
19.1 A
19.1 A
CPU COF
1
1000 MHz
1050 MHz
TDP
3,6,14
14.1 W
12.8 W
VID_VDD Min
2
0.950 V
0.950 V
VID_VDD Max
2
0.950 V
0.950 V
TDC
6
10.2 A
8.8 A
CPU COF
1
750 MHz
800 MHz
TDP
3,6,14
17.8 W
17.6 W
VID_VDD Min
2
1.200 V
1.200 V
VID_VDD Max
2
1.200 V
1.200 V
TDC
6
11.1 A
11.0 A
C1 Halt
9
1.53 A
1.53 A
3.0 W
3.0 W
1.09 A
1.09 A
1.2 W
1.2 W
250 mW
250 mW
IDD Max
I/O Power
4,10
C1E/S1 @ Min P-state
11
IDD Max
I/O Power
4,10
S3
12
I/O Power
8
The notes for this table are on page 39.
AMD Sempron™ Processor
37
AMD Family 11h Processor
Power and Thermal Data Sheet for Notebooks
PID: 43373 Rev 3.00 - September 2008
SM mmmm DA pnc GG (35 W Mobile, S1g2) Thermal and Power Specifications
State
5.3.2
Specification7
Tdie Max
Notes
13
S0.C0.Px
Tambient
TRise
10 °C
Thermal Resistance (die-amb)
1.57 °C/W
Startup P-state
S0.C0.P1
HTC P-state Limit
5
S0.C0.P0
S0.C0.HTC
1.61 A
VID_VDDNB
S0.C0.P1
100 °C
0 °C to 35 °C
IDDNB Max
S0.C0.HTC
SMNI52DAM21GG
0.900 V
CPU COF
1
1800 MHz
TDP
3,6
35.0 W
VID_VDD Min
2
1.075 V
VID_VDD Max
2
1.150 V
TDC
6
28.4 A
CPU COF
1
900 MHz
TDP
3,6
15.5 W
VID_VDD Min
2
0.950 V
VID_VDD Max
2
0.950 V
TDC
6
11.6 A
CPU COF
1
650 MHz
TDP
3,6
24.5 W
VID_VDD Min
2
1.200 V
VID_VDD Max
2
1.200 V
TDC
6
16.7 A
C1 Halt
9
IDD Max
3.32 A
I/O Power
4,10
C1E/S1 @ Min P-state
11
IDD Max
3.0 W
1.83 A
I/O Power
4,10
S3
12
I/O Power
8
1.2 W
250 mW
The notes for this table are on page 39.
AMD Sempron™ Processor
38
PID: 43373 Rev 3.00 - September 2008
AMD Family 11h Processor
Power and Thermal Data Sheet for Notebooks
AMD Sempron™ Processor Thermal and Power Specification Table Notes:
1. Frequency reported to the OS is rounded to the nearest 100-MHz boundary.
2. Variable voltage—any valid voltage between VDD min and VDD max is allowed.
3. The processor thermal solution should be designed to accommodate thermal design power
(TDP) at Tdie,max. TDP is measured under the conditions of all cores operating at CPU COF,
Tdie Max, and VDD at the voltage requested by the processor. TDP includes all power dissipated
on-die from VDD0, VDD1, VDDNB, VDDIO, VLDT, VTT and VDDA. TDP is not the maximum
power of the processor. TDP values apply to operation in a triple-plane motherboard.
4. Power dissipated by the processor VDDIO, VTT, VLDT, and VDDA power planes only.
5. P-state limit when HTC is active. Refer to the BIOS and Kernel Developer’s Guide (BKDG) for
AMD Family 11h Processors, order# 41256, for more information.
6. Thermal Design Current (TDC) is the sustained current limit drawn by VDD0 and VDD1 as
measured under the same conditions as TDP. Platforms should be designed to the TDC defined in
the Socket S1g2 Processor Power and Thermal Roadmap, order# 41323 to ensure
compatibility with future processors.
7. Specifications for multi-core processors assume equivalent P-states (voltage and frequency) and
equivalent Tdie conditions for all cores. Refer to the BIOS and Kernel Developer’s Guide (BKDG) for
AMD Family 11h Processors, order# 41256, for details on P-state operation for multi-core
processors.
8. Thermal Design Power dissipated by the processor VDDIO and VTT power planes only.
9. Assumes 50°C, minimum P-state VID_VDD and minimum P-state and a core clock divisor of 16.
10. Assumes VDDIO = 1.8 V and VTT = VDDIO / 2.
11. Assumes 35°C, minimum P-state VID_VDD, clock divider set to 512, HyperTransport™ links
disconnected, memory in self-refresh mode, DDR2 SDRAM interface tristated.
12. Assumes 35°C, VDD, VDDA, and VLDT supplies are off, VDDIO and VTT are powered, memory in
self-refresh mode and DDR2 SDRAM interface tristated.
13. Tdie Max is measured using the SB-TSI interface.
14. TDP values apply to operation in a triple-plane motherboard In which each voltage plane is running
at the voltage requested by the processor.
AMD Sempron™ Processor
39
AMD Family 11h Processor
Power and Thermal Data Sheet for Notebooks
PID: 43373 Rev 3.00 - September 2008
6
Power Supply Specifications
6.1 bsmmmmrr M ncdd - Socket S1 Power Supply Operating Conditions
Table 29. bsmmmmrr M ncdd VDD0 and VDD1 Power Supply DC Operating Conditions
Symbol
Parameter
Units
VID_VDD
VID-Requested VDD0, VDD1 Supply
V
Level
VDD_PON
DC Tolerance - VDD0, VDD1 Supply
V
Voltage
Metal Mask VID
V
VDDNB_dc
VDDNB Supply voltage
V
VID_VDDNB
VDDNB Supply voltage
V
VDD_dc
Min
Typ
Max
Refer to the thermal/power tables under the
appropriate SOPN section for this OPN specific
parameter.
VID_VDD
VID_VDD
VID_VDD
–25 mV
+ 25 mV
1.05
1.10
1.25
VID_VDDNB VID_VDDNB VID_VDDNB
–25 mV
+ 25 mV
Refer to the thermal/power tables under the
appropriate SOPN section for this OPN specific
parameter.
1.05
1.10
1.25
Notes
1
2
1
VDDNB_PON
Metal Mask VDDNB
V
2
Notes:
1) The processor drives a VID code corresponding to this voltage.
2) After PWROK assertion, the VID signals change from the Metal Mask VID to the value programmed during device
manufacturing.
Table 30. bsmmmmrr M ncdd VDD0 and VDD1 Power Supply AC Operating Conditions
VDD_ ac
VDD0, VDD1 Su p p ly Vo ltag e
V
VDDNB_ ac
VDDNB Su p p ly Vo ltag e
V
VID_ VDD
– 125 mV
VID_ VDDNB
– 100 mV
VID_ VDD
VID_ VDDNB
VID_ VDD
+ 125 mV
VID_ VDDNB
+ 100 mV
1
2
No tes:
1 ) Th e vo lta g e set-p o in t mu st b e co n ta in ed w ith in th e DC sp ecifica tio n in o rd er to h elp en su re p ro p er o p era tio n .
V o lta g e rip p le a n d tra n sien t even ts o u tsid e th e DC sp ecifica tio n mu st rema in w ith in th e AC sp ecifica tio n a t a ll
times. Tra n sien ts a b o ve V DD_ d c ma x mu st retu rn to w ith in th e DC sp ecifica tio n w ith in 2 0 μ S . Test b y d ifferen tia lly
p ro b in g th e VDD0 _ F B_ H/L a n d VDD1 _ FB _ H/L sig n a ls u sin g 2 0 -M Hz sco p e b a n d w id th limit.
2 ) Th e vo lta g e set-p o in t mu st b e co n ta in ed w ith in th e DC sp ecifica tio n in o rd er to h elp en su re p ro p er o p era tio n .
V o lta g e rip p le a n d tra n sien t even ts o u tsid e th e DC sp ecifica tio n mu st rema in w ith in th e AC sp ecifica tio n a t a ll
times. Tra n sien ts a b o ve V DDN B _ d c ma x mu st retu rn to w ith in th e DC sp ecifica tio n w ith in 2 0 μ S . Test b y d ifferen tia lly
p ro b in g th e VDDN B_ F B _ H/L sig n a ls u sin g 2 0 -M Hz sco p e b a n d w id th limit.
Power Supply Specifications
40
AMD Family 11h Processor
Power and Thermal Data Sheet for Notebooks
PID: 43373 Rev 3.00 - September 2008
Table 31. bsmmmmrr M ncdd AC and DC Operating Conditions for non-VDD Power Supplies
Symbol
VDDIO_dc
Parameter
VDDIO Supply Voltage for DDR2
electricals
Units
Min
Typ
Max
Notes
V
1.70
1.80
1.90
7
VDDIO_ac
VDDIO Supply voltage
V
VLDT
VLDT Supply Voltage
VTT Supply Voltage for DDR2
electricals
V
VDDIO_dc
–150 mV
1.14
V
0.85
VTT_dc
VTT_ac
VTT Supply Voltage
V
VDDA
IDDIO1
ITT1
ILDT
IDDA
VDDA Supply Voltage
VDDIO Power Supply Current
VTT Power Supply Current
VLDT Power Supply Current
VDDA Power Supply Current
V
A
mA
A
mA
VTT_dc
–75 mV
2.40
1.20
VDDIO_dc +150
5, 6
mV
1.26
0.90
0.95
VDDIO_dc
VTT_dc
2.50
VTT_dc
+75 mV
2.60
2.00
750
1.5
40
8
5, 6
3, 9
2, 4, 9
1, 9
9
Notes:
1) ILDT is specified for one 16x16-bit Gen3 link.
2) VTT must both sink and source current.
3) VDDIO current is consumed by I, O, I/O switching current and on-chip functions (PDL, DLL, level-shifters, etc.).
4) VTT current is consumed by I, O, I/O switching current and on-chip functions (PDL, DLL, level-shifters, etc.).
5) VDDIO_ac and VTT_ac parameters are measured over a 60 second time frame with all data bus bits switching.
6) Power supply A/C measurements use a 20-MHz scope bandwidth limit.
7) All voltages are referenced to VSS. In order to help ensure proper functionality, DC voltage regulator must be
set accordingly to ensure that VDDIO_dc level measured at the VDDIO_FB_H/L pins does not exceed the
specified maximum and minimum range. As such, factors such as voltage regulator inaccuracy and IR drop must
be carefully considered and compensated for. For example, if the inaccuracy and IR drop amounts to 50 mV, then
the voltage regulator setting for VDDIO should not be lower than 1.75 V to avoid violating the VDDIO_dc
minimum spec of 1.70 V.
8) All voltages are referenced to VSS. Voltage regulator for VTT must be set accordingly so that VTT_dc level
measured at the processor VTT_SENSE pin tracks 0.5*VDDIO_dc, and stays within the specified maximum and
minimum range. Factors such as voltage regulator inaccuracy and IR drop have to be carefully considered and
compensated for. For example, if the inaccuracy and IR drop amounts to 20 mV, the voltage regulator setting must
be set 20 mV higher so that VTT still tracks 0.5*VDDIO_dc and stays within the range of 0.85 V and 0.95 V.
9) This specification reflects the values published in the appropriate power roadmap document.
Power Supply Specifications
41
AMD Family 11h Processor
Power and Thermal Data Sheet for Notebooks
PID: 43373 Rev 3.00 - September 2008
7
Power Limit Encoding
IddValue and IddDiv are available for each P-state in Pstate registers MSRC001_00[6B:64]. For more
details, refer to the BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 11h Processors,
order# 41256.
Power Limit Encoding
42
AMD Family 11h Processor
Power and Thermal Data Sheet for Notebooks
PID: 43373 Rev 3.00 - September 2008
8
MTOPS
Table 32 shows the composite theoretical performance (CTP) calculations. The calculations are stated
in millions of theoretical operations per second (MTOPS) and are based upon a formula in the United
States Department of Commerce Export Administration Regulations 15 CFR 774 (Advisory Note 4
for Category 4).
All calculations contained herein are subject to change without notice. AMD makes no representation
or warranty as to the accuracy or reliability of such calculations.
THESE CALCULATIONS ARE PROVIDED “AS IS” AND AMD MAKES NO WARRANTIES
WHATSOEVER, EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO ANY
WARRANTY OF MERCHANTABILITY, NONINFRINGEMENT, FITNESS FOR ANY
PARTICULAR PURPOSE OR ANY WARRANTY OTHERWISE ARISING OUT OF AMD
PROVIDING OR ANY PARTY'S USE OF THE CALCULATIONS.
Furthermore, AMD shall have no liability for any losses or damages including direct, indirect,
special, punitive, incidental, or consequential, such as but not limited to, loss of anticipated profits or
other economic loss occurring in connection with use of the calculations, even if AMD has been
advised in advance of the possibility of such damages. No license, express or implied, by estoppel or
otherwise, to any intellectual property rights is granted herein.
Table 32. Composite Theoretical Performance (CTP) Calculations
Frequency
MTOPS
S ingle-Core
MTOPS
Dual-Core
800
900
1000
1100
1200
1300
1400
1500
1600
1700
1800
1900
2000
2100
2200
2300
2400
2500
2600
2700
2800
2900
3000
2,467
2,775
3,084
3,392
3,700
4,009
4,317
4,625
4,934
5,242
5,550
5,859
6,167
6,475
6,784
7,092
7,400
7,709
8,017
8,325
8,634
8,942
9,250
4,667
5,250
5,834
6,417
7,000
7,584
8,167
8,750
9,334
9,917
10,500
11,084
11,667
12,250
12,834
13,417
14,000
14,584
15,167
15,750
16,334
16,917
17,500
MTOPS
43
AMD Family 11h Processor
Power and Thermal Data Sheet for Notebooks
PID: 43373 Rev 3.00 - September 2008
9
APP
Table 33 shows the Adjusted Peak Performance (APP) calculations (“Calculations”) for the
AMD Turion™ X2 Ultra dual-core mobile processor, AMD Turion™ X2 dual-core mobile
processor, AMD Athlon™ X2 dual-core processor and Mobile AMD Sempron™ processor. The
Calculations are stated in Millions of Weighted Teraflops (WT) and are based upon a formula in the
United States Department of Commerce Export Administration Regulations 15 CFR 774 (Advisory
Note 4 for Category 4).
All Calculations contained herein are subject to change without notice. AMD makes no
representation or warranty as to the accuracy or reliability of such Calculations.
THESE CALCULATIONS ARE PROVIDED “AS IS” AND AMD MAKES NO WARRANTIES
WHATSOEVER, EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO ANY
WARRANTY OF MERCHANTABILITY, NONINFRINGEMENT, FITNESS FOR ANY
PARTICULAR PURPOSE OR ANY WARRANTY OTHERWISE ARISING OUT OF AMD
PROVIDING OR ANY PARTY'S USE OF THE CALCULATIONS.
Furthermore, AMD shall have no liability for any losses or damages including direct, indirect,
special, punitive, incidental, or consequential, such as but not limited to, loss of anticipated profits or
other economic loss occurring in connection with use of the Calculations, even if AMD has been
advised in advance of the possibility of such damages. No license, express or implied, by estoppel or
otherwise, to any intellectual property rights is granted herein.
Table 33. Adjusted Peak Performance (APP) Calculations
Frequency
APP
Single-Core
APP
Dual-Core
800
900
1000
1100
1200
1300
1400
1500
1600
1700
1800
1900
2000
2100
2200
2300
2400
2500
2600
2700
2800
2900
3000
0.0005
0.0005
0.0006
0.0007
0.0007
0.0008
0.0008
0.0009
0.0010
0.0010
0.0011
0.0011
0.0012
0.0013
0.0013
0.0014
0.0014
0.0015
0.0016
0.0016
0.0017
0.0017
0.0018
0.0010
0.0011
0.0012
0.0013
0.0014
0.0016
0.0017
0.0018
0.0019
0.0020
0.0022
0.0023
0.0024
0.0025
0.0026
0.0028
0.0029
0.0030
0.0031
0.0032
0.0034
0.0035
0.0036
APP
44