SPI Flash Part Numbering System FM X XX XXXX XX X - X X X X X X Fidelix Memory Packing Type Product Family T : Tube T b (Standard) (St d d) R : Tape and Reel Y : Tray * Package NO Marking 25 : SPI Business Package Type Organization S : Single D : Dual Q : Quad Y : Single E : Dual M : Quad - 3.0V 3 0V - 3.0V - 3.0V - 1.8V - 1.8V - 1.8V Device Depth 04 : 4M 08 : 8M 16 : 16M 32 : 32M 64 : 64M 4A : 128M 1 : 8 Pin 208 mil SOIC 2 : 16 Pin 300 mil SOIC 3 : 8 Pin 300 mil PDIP 4 : 8 Contact 6x5 WSON 5 : 8 Pin 150 mil SOIC 6 : 8 Contact 8x6 WSON 7 : 8 Pin VSOP 8 : 24 ball TFBGA W : Wafer Core / IO Voltage A : 3.0V / 3.0V B : 1.8V / 1.8V Temperature I (Industrial) : -40℃~85℃ C (Commercial) : 0℃~70℃ Generation Speed A : 1st B : 2nd C : 3rd 85 : 85MHz 1A : 104MHz Nov. ’2011 Rev. 05