PSRAM Part Numbering System_rev05

PSRAM Part Numbering System
FM P XX XX X X X - X XX X
Fidelix
Memory
Product Family
P : Async. PSRAM
Device Depth
04 : 4M
08 : 8M
16 :16M
32 : 32M
64 : 64M
12 :128M
Temperature
C : 0℃~70℃
S : -10℃~60℃(70℃)
E : -25℃~85℃
I : -40℃~85℃
Speed
45 : 45ns
55 : 55ns
60 : 60ns
70 : 70ns
85 : 85ns
Data Width
08 : x8, TOE
09 : x8, TCS
16 : x16, TOE
17 : x16, TCS
32 : x32, TOE
33 : x32, TCS
Generation
A : 1st
B : 2nd
C : 3rd
Core/IO Voltage
A : 3.0V/3.0V
B : 2.5V/2.5V
C : 1.8V/1.8V
D : 3.0V/2.5V
E : 3.0V/1.8V
F : 2.5V/1.8V
*FM: FM will be applied to new products. Previous marked CM will be remained unchanged.
June. ’2006
Rev. 05
Package Type
F : FBGA
P : TSOP(Pb-Free)
G : FBGA(Pb-Free)
H : FBGA(Pb-Free & Halogen Free)
T : TSOP
W : Wafer
Mode
0 : Dual CS
1 : PASR, MRS DPD
2 : Direct DPD
3 : Reserved
4 : PASR, MRS DPD, PAGE
5 : Direct DPD, PAGE
6 : Reserved
7 : Page with Dual CS
8 : Single CS